JP3040665B2 - Printed board design equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a printed circuit board design equipment for designing the print plate, in particular, with realizing high-density mounting, printed circuit board design that allows realizing an efficient printed circuit board design Ru regarding <br/> the printed board design equipment to realize.

[0002] When a printed board is manufactured, it is checked by an in-circuit tester whether or not a manufacturing failure occurs due to excessive solder rise or solder balls. In order to enable such a check, it is necessary to provide a probe point on each circuit net of the printed circuit board as a contact point of the probe of the in-circuit tester, but this probe point interferes with high-density mounting,
It causes manufacturing failure. From now on, it is necessary to devise this probe point to realize further high-density mounting and to reduce the manufacturing trouble.

[0003]

2. Description of the Related Art Basically, a probe point of an in-circuit tester is required to be one point per one circuit net. The setting needs to be made in consideration of interference between the components, the shape of the mounted component, and the like. And this probe point is a manufacturing obstacle in the component mounting process,
It is required that it should not be a factor that lowers the reliability of the printed board, such as insulation of the pattern due to corrosion.

In a conventional printed circuit board, when a component pin cannot be used as a probe point of an in-circuit tester, a test pad is prepared as a probe point.

That is, in a CAD system for designing a printed board, when the basic design of the printed board is completed, a circuit net without a probe point is searched for by interacting with an operator, and a test pad is placed on the circuit net as a virtual component. As a result, the probe point of the in-circuit tester is provided on the printed circuit board.

As described above, in the conventional printed board, test pads having a cross-sectional structure as shown in FIG. 8A are allocated to circuit nets having no probe points as shown in FIG. 8B. It is configured as follows. here,
The double circles in the figure are plated through-hole wiring vias that electrically connect the front and back surfaces of the printed board.

[0007]

However, if test pads are provided, there is a problem that high-density mounting of a printed board cannot be realized.

The test pad requires wiring between component pins and a relatively large area. Therefore, a great amount of time is required for the layout and wiring, and the layout and wiring are required. There is a problem that a change in component arrangement frequently occurs due to wiring, thereby increasing the number of repetitive operations of logic design and mounting design.

[0009] Defining a test pad for a virtual component that has no logical function and is not actually mounted is defined as follows.
There are also problems such as complicated drawing of the drawing and the processing of the CAD system.

[0010] The present invention was made in view of such circumstances, high-density mounting while realizing efficient printing plate feasible in the new printing to achieve the design of to Help lint plate design The purpose is to provide board design equipment.

[0011]

FIG. 1 shows the principle configuration of a printed board designing apparatus according to the present invention. In the drawing, reference numeral 1 denotes a printed board designing apparatus equipped with the present invention, which designs a printed board while interacting with an operator, and 2 denotes a terminal provided in the printed board designing apparatus 1 and means for interacting with an operator. It is what becomes.

The printed board designing apparatus 1 includes a library 10 for managing components to be mounted on the printed board, a basic designing means 11 for executing a basic design of the printed board while interacting with an operator to create printed board design information. And design information changing means 12 for changing the printed circuit board design information created by the basic design means 11.

The library 10 is a dedicated wiring for wiring in which the probe of the in-circuit tester cannot electrically contact.
In addition to the wiring via shown in FIG. 2A, the large non-covered area of the solder resist allows the probe of the in-circuit tester to be electrically contacted, as shown in FIG. 2B. Register

The design information change means 12 specifies a probe point of an in-circuit tester assigned to each circuit net included in the printed circuit board design information.
And a changer 14 for changing a specific wiring via included in the printed circuit board design information into a wiring test / shared via, and an adding means 15 for adding a wiring via to the printed circuit board design information.

[0015]

In the present invention, when the circuit information to be designed is provided from the operator via the terminal 2, the basic design means 11 implements the circuit information using the wiring vias registered in the library 10. The basic design of the printed board is executed to create printed board design information.

When the printed board design information is created,
The specifying unit 13 of the design information changing unit 12 regards the wiring via as being electrically connectable to the probe of the in-circuit tester, and assigns it to each circuit net included in the printed circuit board design information while giving priority to the component pins. Identify probe points for the in-circuit tester. That is, for a circuit net having a component pin as a probe point, the component pin is specified as a probe point, and for a circuit net having no component pin as a probe point, a wiring via serving as a probe point is specified.

At this time, when there is a circuit net in which neither the component pin nor the wiring via becomes a probe point, the adding means 15 adds a wiring via as a probe point to the circuit net in accordance with the interactive processing. .

In response to the probe point specifying process, the changing unit 14 sets the wiring via included in the specified probe point (including the probe point of the wiring via added by the adding unit 15). By changing to the test via, the printed board design information is changed to create printed board manufacturing information.

As described above, when the printed board designed by the printed board designing apparatus 1 of the present invention is manufactured,
A part of the wiring via is constituted by a wiring test dual-purpose via having a slightly different shape as a probe point of the in-circuit tester.

As described above, the printed board designing apparatus of the present invention
Print plate, which is designed by 1, the disuse of the test pad, it becomes it possible to realize high-density mounting, by allowing reduced iterations of the logic design and implementation design, efficient printing It makes the board design feasible.

[0021]

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. FIG. 3 shows a processing flow executed by the printed board designing apparatus 1 of the present invention shown in FIG. Next, the present invention will be described in detail according to this processing flow.

When starting to design a printed board, the printed board designing apparatus 1 of the present invention, as shown in the processing flow of FIG.
First, in step 1, entry processing of a circuit diagram to be designed is executed in accordance with dialogue processing with an operator. Subsequently, in step 2, in accordance with the dialog processing with the operator, it is determined which gate of the entered circuit is to be assigned to which package component and how the pins of each gate are to be connected. Execute the process.

Subsequently, in step 3, according to the dialogue with the operator, a component placement process for determining where to place the package component is executed. Subsequently, in step 4, according to the automation processing, wiring processing of a pattern corresponding to the allocation result so far is executed. At this time,
When it is necessary to electrically connect the front surface and the back surface of the printed board, a wiring via registered in the library 10 (a via that the probe of the in-circuit tester cannot electrically contact) is used, and the in-circuit tester is used. The pattern wiring is executed without considering the probe points at all.

In this manner, when the basic design information of the printed board is completed according to the processing of steps 1 to 4, the probe of the in-circuit tester can be contacted in step 5 according to the automatic processing. Identifying the probe points of the in-circuit tester assigned to each circuit net included in the created printed circuit board design information while evaluating whether or not the attribute is the attribute information of the probe points (information on the front and back surfaces, etc.) Is output.

The process of specifying the probe points is executed by giving priority to the component pins and also regarding the wiring vias to which the probe of the in-circuit tester cannot be electrically contacted as the probe vias. That is, for a circuit net where a component pin becomes a probe point, the component pin is specified as a probe point, and for a circuit net where a component pin does not become a probe point, execution is performed by specifying a wiring via which becomes a probe point. become.

Subsequently, in step 6, it is determined whether or not the probe points have been specified for all the circuit nets by the processing of step 5, and if there is any circuit net that cannot be specified, the dialog processing with the operator is performed. According to
A process of adding a wiring via serving as a probe point to those circuit nets is executed. Here, if the probe points can be specified for all the circuit nets by the processing of step 5, the processing of step 6 will be omitted.

Subsequently, in step 7, according to the automation processing, the probe points of all the specified circuit nets are
It is checked whether probe points using wiring vias (including wiring vias added in step 6) are included, and if they are included, attribute information (coordinates, surface, Output back side information).

Subsequently, in step 8, when it is checked by the processing in step 7 that probe points using wiring vias are included, the wiring vias serving as those probe points (the wiring vias added in step 6) are checked. (Including vias) are converted into wiring test dual vias registered in the library 10. In other words, the wiring via which the probe of the in-circuit tester determined as the probe point cannot be electrically contacted is connected to the wiring via which the probe of the in-circuit tester can be electrically contacted due to the large non-covered area of the solder resist. The process of converting the data into a test via is executed. Here, step 7
In the case where it is checked that the probe point using the wiring via is not included in the process of (1), the process of step 8 is omitted.

In this way, the final printed circuit board design information is completed by changing the printed circuit board design information created by the processing of steps 1 to 4 according to the processing of steps 5 to 8. In step 9, printed board manufacturing information is created from the completed printed board design information, and the entire process ends.

The printed board is composed of a signal layer / power supply layer / ground layer / solder resist layer as shown in FIG. 4, and is manufactured by a manufacturing process such as a subtractive method as shown in FIG. become. That is, the copper-clad laminate is drilled, followed by electrical copper plating to electrically connect the front and back surfaces of the printed board, followed by coating a dry film on the area not subjected to solder plating,
Subsequently, solder plating is applied to parts other than the dry film, and then the dry film is removed by etching,
Finally, a solder resist is applied.

From this, the printed board manufacturing information created in step 9 gives such manufacturing information. However, the present invention differs from the prior art in that the solder resist layer in the wiring via portion has a certain size. In some cases, instead of having an uncovered area, there may be a small uncovered area or a large uncovered area. That is, the solder resist layer in the wiring via portion prepared exclusively for wiring has a small uncovered area as shown in FIG. 2A, and is used for both the wiring and the wiring test prepared for the probe point of the in-circuit tester. The solder resist layer of the via has a large uncovered area as shown in FIG.

That is, as shown in FIG. 6, the printed circuit board manufactured by the printed circuit board manufacturing information has a wiring test in which a part of the wiring via has a large non-covered area of the solder resist serving as a probe point of the in-circuit tester. The dual-purpose via is used, and the test by the in-circuit tester is realized using the wiring test dual-purpose via and the component pin set as the probe point.

By using the wiring test dual-purpose via, a function as a wiring via and a function as a probe point of an in-circuit tester can be realized.
As shown in (1), it is conceivable to adopt a configuration in which only the wiring test and shared via is used without using any wiring via.
However, if such a method is used, the wiring test via also has a large non-covered area of the solder resist. Therefore, as shown in FIG. Is more likely to occur. Hence, the present invention employs a configuration in which wiring vias are used as much as possible, and a configuration in which the number of wiring test vias is minimized.

[0035]

As described above, according to the printing method of the present invention ,
Print plate, which is designed by the plate design apparatus 1, the disuse of the test pad, it becomes it possible to realize high-density mounting, by allowing reduced iterations of the logic design and implementation design, efficiency It is possible to realize a realistic printed board design.

[0036]

[Brief description of the drawings]

FIG. 1 is a principle configuration diagram of the present invention.

FIG. 2 is an explanatory diagram of a wiring via / wiring test combined via.

FIG. 3 is a processing flow executed by the printed board designing apparatus of the present invention.

FIG. 4 is an explanatory diagram of a layer structure of a printed board.

FIG. 5 is an explanatory view of a printed board manufacturing process.

FIG. 6 is an explanatory diagram of a printed board according to the present invention.

FIG. 7 is an explanatory diagram of a problem when all of the vias are used as wiring test vias.

FIG. 8 is an explanatory diagram of a test pad.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed board design apparatus 2 Terminal 10 Library 11 Basic design means 12 Design information change means 13 Identification means 14 Change means 15 Add means

Claims (2)

(57) [Claims] A library for managing a component to be mounted on a printed board, in a printed board designing apparatus for designing a printed board.
In addition to the wiring via, the untested area of the solder resist is large, so that the wiring test dual use via that the probe of the in-circuit tester can electrically contact is registered and is registered in the library (10). The printed circuit board is designed using the wiring vias, and the wiring vias are considered to be electrically accessible by the probe of the in-circuit tester. Specifying means (13) for specifying a probe point of an in-circuit tester assigned to each circuit net having the same, and changing a wiring via included in the specified probe point of the specifying means (13) to the wiring test / via. And a changing means (14) for changing the designed printed circuit board. 2. The printed board designing apparatus according to claim 1 , wherein the specifying means (13) adds a wiring via as a probe point to a circuit net in which the probe point cannot be specified according to the interactive processing. Additional means (15) for changing the printed circuit board, wherein the changing means (14) performs processing to change the wiring via added by the additional means (15) to a wiring test dual-purpose via. Printed board design equipment.