JPH0836013A - Device and method for inspecting wiring board - Google Patents

Abstract

PURPOSE:To detect a short circuit in a range, in which detection of short circuit has been impossible with a conventional measuring device, and to detect short circuit defect of the short circuit resistance at a level, which has not been able to be measured by a conventional device. CONSTITUTION:The device has a first probe terminal 15 connected to a protecting short circuit wiring, a second probe terminal 16 connected to one of wirings 1 to be measured, a third probe terminal 17 connected to the other one of the wirings to be measured, and a first voltage measuring means 20 for measuring voltage between the first probe terminal 15 and the second probe terminal 16. Furthermore, the device is also provided with a first current source 21, which is connected to the second probe terminal 16, and a second current source 23, which is connected to the third probe terminal 17. Polarity of the first current source 21 and the second current source 23 are made to be opposite to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring inspection device and a wiring inspection method in which a large number of wirings are formed on a substrate such as a liquid crystal driving substrate.

[0002]

2. Description of the Related Art FIG. 16 shows an example of a wiring structure before completion of a generally known simple matrix type liquid crystal driving substrate. In the wiring structure before completion shown in FIG. 16, an electrode circuit K is formed on a transparent substrate, and a rectangular frame-shaped guard ring (protective short circuit for protection) is further provided around the electrode circuit K on the transparent substrate. This is an example in which a wiring) G is formed. The guard ring G of this example is cut off from the electrode circuit K by discarding the electrode circuit K along with the substrate along the two-dot chain line S in FIG. 16 at the final stage of the manufacturing process, and the remaining electrode circuit K is discarded. A liquid crystal driving substrate is manufactured by using. The electrode circuit K of this example is
A large number of horizontally long strip-shaped electrode wirings 1 ... Are vertically arranged in parallel on a transparent substrate, and lead-out wirings 2 connected to the guard ring G are formed at the end portions of each electrode wiring 1.
The electrode circuit K of this example is manufactured in a pair with another vertically elongated strip-shaped electrode circuit formed on another transparent substrate (not shown), and a liquid crystal display is obtained by enclosing a liquid crystal between the pair of transparent substrates. The panel is designed to be constructed.

Generally, in a liquid crystal display device, high definition of display is required, and therefore, when the electrode circuit K having the above-mentioned structure is formed on a transparent substrate, dozens of tens are formed on one substrate. It is necessary to form electrode wirings of several hundreds or more. Therefore, when forming electrode wiring of a desired shape on a substrate by using a film forming method such as sputtering and a photolithography technique, the electrodes may be short-circuited due to factors such as film forming failure, etching failure, or contamination of foreign matter. However, there is a high possibility that manufacturing defects such as defective electrode shape may occur. Therefore, various devices for inspecting a defective electrode circuit for this type of liquid crystal display device have been proposed. As one example of the inspection apparatus, as shown in FIG. 17, there is known one having a configuration in which probe terminals 3 and 4 are provided and a constant current source 6 and a voltmeter 7 are connected in parallel to one probe terminal 4. Has been.

In order to inspect the electrode circuit K using the inspection apparatus having the configuration shown in FIG. 17, one probe terminal 3 is connected to the one shown in FIG.
6 is connected to a part of the guard ring G on one end side of the electrode wiring 1, the other probe terminal 4 is connected to the other end side of the electrode wiring 1, the probe terminal 3 is grounded, and the constant current source 6 The electrode was grounded and a predetermined current was passed through the electrode wiring 1 to measure the resistance value of the electrode wiring 1. Based on this value, the disconnection and short circuit of the electrode wiring 1 were judged. The resistance value in this case is the voltage value of the voltmeter 7 connected to the probe terminal 4 and the constant current source 6
It can be easily calculated from the current value of. Further, in this case, if the current value is kept constant, the resistance value can be obtained only from the voltage value of the voltmeter 7, and disconnection or short circuit of the electrode wiring 1 can be easily determined.

Now, an inspection method in the case where a short circuit defect occurs between any one electrode wiring 1 shown in FIG. 18 and the electrode wiring 1'adjacent thereto will be described below. As shown in FIG. 18, when a short circuit defect having a resistance value of R _s occurs between any one electrode wiring 1 and the electrode wiring 1 ′ adjacent thereto, the inspection is performed using the apparatus shown in FIG. , The probe terminal 3 is connected to a part of the guard ring G, and the probe terminal 4 is connected to the opposite end of the electrode wiring 1. Here, in FIG. 18, the probe terminal 3 is connected to CO
M and the probe terminal 4 are indicated by O to distinguish them. FIG.
In the state shown in FIG. 8, the length of the electrode wiring 1 in the display area is L _o , and the distance from the end of the display area (the end on the lead-out wiring side of the electrode wiring 1) to the short portion is L _s , L _s / L _o
X, and the resistance of the electrode wiring in the display area is R _o (R _o ≤R ₁
+ R ₂ ), the resistance from the contact point of the probe terminal 4 to the short-circuited portion is R ₁ (R ₁ = (1-X) · R _o ), from the display area end (the end on the lead-out wiring side of the electrode wiring 1) It is assumed that the resistance up to the short circuit portion is R ₂ = X · R _o , the resistance of the guard ring portion in the short circuit path is R _G , the short circuit resistance is R _s , and the resistance of the lead wiring is R ₃ .

Assuming such a relationship, when an electrode that does not cause a short circuit is inspected, the resistance as shown in FIG. 19 is measured, so the total resistance value R between the probe terminals 3 and 4 is , R = R ₁ + R ₂ + R ₃ = R _o + R ₃ (1), and V = iR = i (R _o + R ₃ ) (2). On the other hand, if a short circuit occurs, the combined resistance as shown in FIG. 20 is to be measured. Therefore, the total resistance value R between the probe terminals 3 and 4 is R = R ₁ + [(R ₂ + R ₃ ) · (R _s + R ₂ + R ₃ + R _G ) / {(R ₂ + R ₃ ) + (R _s + R ₂ + R ₃ + R _G )}] = (1-X) R _o + [(XR _o + R ₃ ). (R _s + R _G + XR _o + R ₃ ) / {R _s + R _G +2 (XR _o + R ₃ )}] (3), and V = iR = i · [(1-X) -R _o + {(XR _o + R ₃ )-(R _s + R _G + XR _o + R ₃ ) / (R _s + R _G + 2XR _o + 2R ₃ )}] ... (4).

[0007]

When the resistance value of the material used for the actual liquid crystal driving substrate is determined based on the above relationship, an ITO (indium tin oxide) film is formed on the transparent glass substrate. When an electrode having an average thickness of 0.2 μm is formed, R _o = 2220 Ω (R _o = R ₁ +
R ₂ ), R ₃ = 780Ω, R _G = 0 (negligibly small), and the measured current is set to i = 1.7 mA. From the equation (1), the resistance R between the probe terminals 3 and 4 when no short circuit occurs is R = Ro + R3 = 3 ×
Since it is 10 ³ Ω, the measured voltage V is V = i · R = 1.7 × 10 ⁻³ × 3 × 10 ³ = 5.1V. At this time, the short-circuit judgment criterion is 2 × 10 ^{3 in} consideration of variations in wiring resistance due to variations in the thickness of the ITO film.
If it is Ω or less, the measured voltage will be 3.4 V or less.
When a wire break occurs, the measured voltage increases and the determination can be easily performed. Further, since there is no problem in detection sensitivity, the wire break will be omitted. FIG. 21 shows the relationship between the measured voltage of the electrode in which a short circuit has occurred and the short circuit position when measured under the above conditions.

As shown in FIG. 21, the short resistance Rs is 0.
In the case of Ω, the short-circuit detectable area is 4 on the right side of FIG.
The area is about 5%, and the area on the left side 55% cannot be detected. That is, in the case of the electrode wiring 1 in FIG. 18, a short circuit defect of 0Ω resistance can be detected within a range of about 45% on the right side of the electrode wiring 1, but about 55% on the left side of the electrode wiring 1 in FIG. When a short-circuit defect occurs within the range, there is a problem that measurement is impossible regardless of the magnitude of resistance. Further, there is a problem that a short circuit defect having a short circuit resistance of 3 kΩ or more cannot be detected even within the range of 45% on the right side of the electrode wiring 1.

The present invention has been made in view of the above circumstances, and it is possible to detect a short circuit to a range where a short circuit cannot be detected by a conventional measuring apparatus, and a short circuit of a short resistance having a size that cannot be measured by the conventional apparatus. An object of the present invention is to provide a measuring device and a measuring method that can detect defects.

[0010]

In order to solve the above-mentioned problems, the present invention provides a substrate, a plurality of wirings to be measured formed on the substrate, and a plurality of wirings to be measured. An inspection device for inspecting a wiring board comprising a short-circuited wiring for protection which is short-circuited and is formed on a board, wherein a first probe terminal and a wiring to be measured which are connected to the short-circuited wiring for protection are provided. A second probe terminal connected to one of the two wirings, a third probe terminal connected to another one of the wirings to be measured, and a first voltage for measuring a voltage between the first probe terminal and the second probe terminal. The measuring means, a first current source connected to the second probe terminal, and a second current source connected to the third probe terminal. It has the opposite polarity.

According to a second aspect of the present invention, in order to solve the above problems, a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured are short-circuited on the substrate. An inspection device for inspecting a wiring board comprising the formed protective short-circuit wiring, which is connected to one of a first probe terminal connected to the protective short-circuit wiring and a wiring to be measured. A second probe terminal, a third probe terminal connected to another one of the measured wirings, a fourth probe terminal connected to the protective short-circuit wiring, and a first probe terminal and a second probe terminal. First voltage measuring means for measuring a voltage between them, second voltage measuring means for measuring a voltage between the third probe terminal and the fourth probe terminal, and a first current source connected to the second probe terminal And connected to the third probe terminal It comprises a and second current source is made with the polarity of the first current source and the second current source to the reverse.

According to a third aspect of the present invention, in order to solve the above problems, a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured are short-circuited on the substrate. An inspection apparatus for inspecting a wiring board comprising a formed protective short-circuit wiring, comprising: a first probe terminal connected to the protective short-circuit wiring and one of the measured wirings. Two probe terminals, a third probe terminal connected to another one of the wirings to be measured, a means for grounding the first probe terminal, and a voltage between the second probe terminal and the ground plane is measured. A first voltage measuring means, a first current source connected to the second probe terminal, and a second current source connected to the third probe terminal, and the first current source and the second current source. The polarity of the current source is reversed.

According to a fourth aspect of the present invention, in order to solve the above-mentioned problems, the wiring under test according to the first, second or third aspect is
It is a plurality of strip-shaped electrode wirings formed in an array on a substrate, and the end portions of these electrode wirings are connected to a protective short-circuit wiring via a lead wiring.

According to a fifth aspect of the present invention, in order to solve the above-mentioned problems, the substrate according to the first, second or third aspect is cut at the lead-out wiring portion as a boundary, and the measured wiring portion side is used as an electrode. It is a substrate for a simple matrix liquid crystal display device.

According to a sixth aspect of the present invention, in order to solve the above problems, the substrate according to the first, second or third aspect is a transparent substrate, and the wiring is formed from an indium tin oxide film.

According to a seventh aspect of the present invention, in order to solve the above-mentioned problems, the wiring to be measured according to the first, second or third aspect,
The wiring is formed in a matrix on the substrate, switch elements are formed at each intersection of the matrix wiring,
The end portion of the matrix-shaped wiring is connected to the short-circuit wiring for protection through the lead wiring.

In order to solve the above-mentioned problems, the invention according to claim 8 is characterized in that the wiring for measurement under claim 1, 2 or 3 is
The wiring is formed in a matrix on the substrate, a thin film transistor is formed at each intersection of the matrix wiring, the end of the matrix wiring is connected to the short-circuit wiring for protection through the lead wiring, It is characterized in that the substrate is a thin film transistor array substrate which is cut at the lead-out wiring portion as a boundary and the measured wiring portion side is used as wiring.

According to a ninth aspect of the present invention, in order to solve the above problems, a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured are short-circuited on the substrate. An inspection device for inspecting a wiring board comprising a formed protection short-circuit wiring, which is connected to a first probe terminal and a first wiring under test which are connected to the protection short-circuit wiring. A second probe terminal, a third probe terminal connected to the second wiring for measurement adjacent to the first wiring for measurement, and a fourth probe terminal connected to a short-circuit wiring for protection, A fifth probe terminal connected to the short-circuit wiring for protection and a sixth probe terminal connected to the third wiring to be measured adjacent to the second wiring to be measured, and the third probe terminal. 4th adjacent to measurement wiring
A seventh probe terminal connected to the second wiring for measurement and an eighth probe terminal connected to a short-circuit wiring for protection;
First voltage measuring means for measuring a voltage between the first probe terminal and the second probe terminal; second voltage measuring means for measuring a voltage between the third probe terminal and the fourth probe terminal; Third voltage measuring means for measuring the voltage between the fifth probe terminal and the sixth probe terminal, fourth voltage measuring means for measuring the voltage between the seventh probe terminal and the eighth probe terminal, and the second probe A first current source connected to the terminal, a second current source connected to the third probe terminal, and a third current source connected to the sixth probe terminal,
A fourth current source connected to the seventh probe terminal, wherein the first current source and the second current source have opposite polarities, and the second current source and the third current source have opposite polarities. And the third
The current source and the fourth current source have opposite polarities.

According to a tenth aspect of the invention, in order to solve the above-mentioned problems, a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured are short-circuited on the substrate. An inspection device for inspecting a wiring board comprising a formed short circuit wiring for protection, the second probe terminal being connected to an end of the first non-short-circuited wiring to be measured. And a third probe terminal connected to the end of the second non-short-circuited side of the wiring to be measured, and a third probe terminal connected to the end of the third non-short-circuited side of the wiring to be measured. A sixth probe terminal and a seventh probe terminal connected to an end portion of the fourth measured wiring, which is not short-circuited,
A voltage measuring unit that measures a voltage across at least one of the measured wires; a first current source connected to the second probe terminal; and a second current source connected to the third probe terminal. A third current source connected to the sixth probe terminal and a fourth current source connected to the seventh probe terminal, wherein the first current source and the second current source have opposite polarities. The polarities of the second current source and the third current source are opposite, and the polarities of the third current source and the fourth current source are opposite.

According to an eleventh aspect of the present invention, in order to solve the above-mentioned problems, the wirings to be measured according to the ninth or tenth aspect are aligned and formed in at least two rows on a substrate, and the wirings to be measured in each row are connected to each other. Each column is short-circuited by the short-circuit wiring.

In order to solve the above-mentioned problems, the invention according to claim 12 is such that the wirings to be measured according to claim 9 or 10 are aligned and formed in one row on the substrate, and the wirings to be measured are arranged one by one. It is short-circuited by one short-circuit wire, and the other every other measured wire is short-circuited by another short-circuit wire.

According to a thirteenth aspect of the present invention, in order to solve the above-mentioned problems, the substrate according to the ninth or tenth aspect is cut at the lead-out wiring portion as a boundary, and the measured wiring portion side is used as an electrode. This is a substrate for a simple matrix liquid crystal display device.

According to a fourteenth aspect of the present invention, in order to solve the above-mentioned problems, the substrate according to the ninth or tenth aspect is a transparent substrate, and the wiring is formed from an indium tin oxide film.

In order to solve the above-mentioned problems, the invention according to claim 15 is characterized in that the wiring under test according to claim 9 or 10 is
The wiring is formed in a matrix on the substrate, switch elements are formed at each intersection of the matrix wiring,
The end portion of the matrix-shaped wiring is connected to the short-circuit wiring for protection through the lead wiring.

In order to solve the above-mentioned problems, the invention according to claim 16 is characterized in that the wiring for measurement according to claim 9 or 10 is
The wiring is formed in a matrix on the substrate, a thin film transistor is formed at each intersection of the matrix wiring, the end of the matrix wiring is connected to the short-circuit wiring for protection through the lead wiring, The substrate is a thin film transistor array that is cut at the lead-out wiring portion as a boundary and the measured wiring portion side is used as wiring.

In order to solve the above-mentioned problems, the invention according to claim 17 short-circuits a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured on the substrate. A method of inspecting a wiring board comprising a formed protection short-circuit wiring, wherein a predetermined current is applied between the protection short-circuit wiring and the end of the first wiring and protection is performed. A voltage between the short-circuit wiring for protection and the end of the first wiring while applying a predetermined current having a polarity opposite to the above between the short-circuit wiring for protection and the end of the second wiring. Is measured
A disconnection and a short circuit between the first wiring and the second wiring are determined from the measured voltage value.

In order to solve the above-mentioned problems, the invention as set forth in claim 18 short-circuits a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured on the substrate. A method of inspecting a wiring board comprising a formed protective short-circuit wiring, wherein a predetermined current is applied between the protective short-circuit wiring and the end of the first wiring. The voltage between the short-circuit wiring for protection and the end of the first wiring is measured, and a predetermined polarity opposite to the above is provided between the short-circuit wiring for protection and the end of the second wiring. The voltage between the short-circuited wiring for protection and the end of the second wiring is measured while applying a current, and the measured value of each voltage is used to measure the voltage between the first wiring and the second wiring. It is to judge disconnection and short circuit between.

In order to solve the above-mentioned problems, the nineteenth aspect of the present invention uses a plurality of strip-shaped electrode wirings aligned and formed on a substrate as the wiring to be measured according to the seventeenth or eighteenth aspect. The one in which the end portion of the electrode wiring is connected to the short-circuit wiring for protection through the lead wiring is used.

In order to solve the above-mentioned problems, the invention according to claim 20 is, as the substrate according to claim 17 or 18, cut at a portion of a lead-out wiring as a boundary, and the measured wiring portion side is used as an electrode. A simple matrix liquid crystal display device substrate is used.

In order to solve the above-mentioned problems, a twenty-first aspect of the present invention uses a transparent substrate as the substrate of the seventeenth or eighteenth aspect and uses an indium tin oxide film as the wiring.

In order to solve the above-mentioned problems, the invention according to claim 22 uses, as the wiring for measurement according to claim 17 or 18, wiring formed in a matrix on a substrate, and each intersection of the matrix wiring. A switch element is used in a part thereof, and an end portion of a matrix wiring is connected to a short circuit wiring for protection through a lead wiring.

In order to solve the above-mentioned problems, the invention of claim 23 uses, as the wiring for measurement according to claim 17 or 18, wirings formed in a matrix on a substrate, and each intersection of the wirings in matrix. A thin film transistor is formed in the part, and the end of the matrix wiring is connected to the short-circuit wiring for protection through the lead wiring.The substrate is cut with the lead wiring portion as the boundary. The wiring portion for measurement is used as wiring.

In order to solve the above-mentioned problems, a twenty-fourth aspect of the present invention is that a substrate, a plurality of wirings to be measured formed on the substrate, and the plurality of wirings to be measured are short-circuited on the substrate. A method of inspecting a wiring board comprising a formed protective short-circuit wiring, wherein a predetermined current is applied between the protective short-circuit wiring and the end of the first wiring. The voltage between the short-circuit wiring for protection and the end of the first wiring is measured, and a predetermined polarity opposite to the above is provided between the short-circuit wiring for protection and the end of the second wiring. While applying a current, the voltage between the protective short-circuit wiring and the end of the second wiring is measured, and further, a predetermined value is provided between the protective short-circuit wiring and the end of the third wiring. While applying the current, the voltage between the protective short-circuit wire and the end of the third wire is measured. Between the protective short-circuit wiring and the end of the fourth wiring while applying a predetermined current having a polarity opposite to the above between the protective short-circuit wiring and the end of the fourth wiring. Voltage is measured, and a disconnection and a short circuit between the first wiring, the second wiring, the third wiring, and the fourth wiring are determined from the measured values of each voltage. is there.

[0034]

According to the invention described in claim 1, 2 or 3, 2
A short-circuit defect can be inspected by passing currents of opposite polarities simultaneously through one of the wirings to be measured and reading the voltage change due to the resistance change that occurs when a short circuit occurs between the two wirings to be measured. In this case, it is possible to easily detect a defect having a large short circuit resistance as well as a defect having a small short circuit resistance. Therefore, the inspection accuracy is improved. Furthermore, since two wirings to be measured can be inspected at the same time, the inspection efficiency is improved as compared with the conventional device in which the wirings are inspected one by one.

Next, it is preferable that the first current source and the second current source are each grounded. Further, the device according to the present invention is
This is convenient when the wiring to be measured is a strip-shaped wiring, and can also be applied to a configuration in which the wiring to be measured is connected to a short-circuit wiring via a lead wiring. Furthermore, the present invention can be applied to the case where the wiring to be measured is an electrode wiring for a simple matrix liquid crystal substrate and can be easily applied to the case where the wiring to be measured is an indium tin oxide film. Furthermore, as the wiring for measurement, at least two rows are formed aligned on the substrate,
It can also be applied to those in which the measured wirings in each column are short-circuited for each column by the short-circuited wiring, and the measured wirings are formed in line in one row on the substrate, and every other measured wiring is arranged. It is also possible to apply it to one in which one short circuit wiring is short-circuited, and the remaining every other measurement wiring is short-circuited with another short circuit wiring.

The device of the present invention can also be applied to a thin film transistor array substrate in which a thin film transistor is formed on a substrate and a source wiring and a gate wiring are formed. In that case, of the wirings to be measured arranged on the substrate, two source wirings or two gate wirings can be efficiently inspected in pairs. Also in the inspection in that case, as in the case described above, it is possible to easily detect not only a defect having a short resistance, but also a defect having a large short resistance.

Next, if the first to fourth probe terminals are used to contact and inspect the first to fourth wirings to be measured, four wirings to be measured can be inspected at one time. Efficiency is further improved. Moreover, by performing such an inspection, it is possible to inspect a short-circuit defect between arbitrary first to fourth wirings to be measured.

[0038]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a wiring K ₁ to be measured which is inspected by an inspection apparatus according to the present invention. Wiring for measurement K _{1 of} this example
Is formed on the transparent substrate 9 for a simple matrix liquid crystal display device, and is composed of a plurality of horizontally long strip-shaped electrode wirings 10 ... At the same time, the lead-out wiring 11 is formed at each left end of the left-side row of electrode wirings 10 ..., and the lead-out wiring 11 is formed at each right-side of the right side of the row electrode wirings 10 ... · A rectangular frame-shaped guard ring (protective short-circuit wiring) 12 is formed around these, and each extraction electrode 11 is formed.
Are connected to the guard ring 12.

FIG. 2 is a diagram showing a main part of the inspection device according to the present invention. The inspection device of this example has a first probe terminal 15
And second probe terminal 16, third probe terminal 17 and fourth
The probe terminal 18 is provided. Furthermore, the first
A first voltmeter (first voltage measuring means) 20 for measuring the voltage therebetween is provided between the probe terminal 15 and the second probe terminal 16, and the second probe terminal 16 is also provided.
Is connected to a first current source 21, and the other pole of the first current source 21 is further grounded. Further, between the third probe terminal 17 and the fourth probe terminal 18, a second voltmeter (second voltage measuring means) 22 for measuring the voltage between them is provided,
Furthermore, the first current source 23 is connected to the third probe terminal 17, and the other pole of the first current source 23 is further grounded. The first current source 21 and the second current source 23 are connected so as to have opposite polarities.

Next, the case of inspecting the wiring under test K ₁ having the structure shown in FIG. 1 by using the apparatus shown in FIG. 2 will be described. First, the electrode wirings 10 in the two columns on the left and right of the wiring K ₁
··· Of the left side column, the first and second electrode wirings 10 and 10 from the top are inspected. To this end, the first probe terminal 15 is brought into contact with the left guard ring 12 of the first electrode wiring 10 and the fourth probe terminal 18 is brought into contact with the left guard ring 12 of the second electrode wiring 10, and further, The second probe terminal 16 is brought into contact with the right end of the first electrode wiring 10, and the third probe terminal 17 is brought into contact with the right end of the second electrode wiring 10. In the drawing, the contact point of the first probe terminal 15 is COM ₁ ,
The contact point of the probe terminal 18 is described as COM ₂ , the contact point of the second probe terminal 16 is described as O ₁ , and the contact point of the third probe terminal 17 is described as O ₂ . Then, a predetermined current is applied from the first current source 21 and the second current source 22 to the electrode wirings 10 and 10 so as to have opposite polarities.

In this state, a case where a short circuit defect does not occur between the first electrode wiring 10 and the second electrode wiring 10 and a case where it occurs will be described below with reference to FIGS. 3 and 4. explain. In FIG. 3, the electrode wiring 10
Alternatively, the resistance and length of each part of the lead-out wiring 11 are basically the same as those of the conventional example described above with reference to FIG.
That is, the first electrode wiring 10 and the second electrode wiring 1
When a short-circuit defect having a resistance value Rs between 0 and 0, the length of the electrode wiring 10 in the display area is _Lo , the end portion of the display area (the end portion of the electrode wiring 10 on the lead-out wiring side) From the contact point of the probe terminal 16 to the short-circuited portion, the distance from the contact point to the short-circuited portion is L _s , L _s / L _o is X, the resistance of the electrode wiring in the display area is _Ro (R _o = R ₁ + R ₂ ). Resistor R
₁ (R ₁ = (1−X) · R _o ), the resistance from the display area end (the end on the lead-out wiring side of the electrode wiring 10) to the short-circuited portion is R ₂ = X · R _o , in the short-circuit path. The resistance of the guard ring portion is R _G , the short resistance is R _s , and the resistance of the lead wiring 11 is R ₃ . Further, the current value of the first or second current source is i, the current flowing through the short resistance R _s is i _s , R _G
The current flowing through is i _x .

Here, when no short circuit defect occurs, the relation of R = R ₁ + R ₂ + R ₃ = R ₀ + R ₃ is established, and V ₁ = V ₂ = iR = i (R ₀ + R ₃ ) ... ( It becomes the relationship of 5). On the other hand, when a short defect has occurred, the resistance of the path through which i _x flows is set to R _x = 2 (R ₂ + R ₃ ) + R _G, and i _s
Is defined as R _s, and the combined resistance of the paths through which i _x and i _s flow is R _T = (R _x · R _s ) / (R _x + R _s ),
_Assuming that the voltage applied to R _x and R _s is V _s , the relationship is i = i _s + i _x = V _s / R _T (6), and i _x = V _s / R _x (7) It becomes a relationship.

[0043] from the equation _{(6), V s = i} · R T next,
Substituting this into equation (7), a relationship of _{i x = V x / R x} = (i · R T) / R x ··· (8). Here, since it is _{R T = (R x · R} s) / (R x + R s), i x = (i / R x) · (R x · R s) / (R x + R s) = ( i · R _s ) / (R _x + R _s ) = (I · R _s ) / {2 (R ₂ + R ₃ ) + R _G + R _s } ... (9). Measurement _{voltage, V 1 = V 2 = i} · R 1 + i x (R 2 + R 3) = i · R 1 + [(iR s) · (R 2 + R 3) / {2 (R 2 + R 3) + R _G + R _s }] ... (10).

Next, the preconditions are made equal to those in the case of the conventional example described above. That is, when the resistance value of the material used for the actual liquid crystal driving substrate is determined, the average thickness of the ITO (indium tin oxide) film on the transparent glass substrate is 0.1.
When a 2 μm electrode is formed, R _o = 2220 Ω (R _{o
= R 1 + 2), R} 3 = is 780Ω, R _G = 0 and (small enough to be ignored), the measured current and i = 1.7 mA. Then, when no short circuit occurs, the measured voltage becomes V = 5.1V from the relationship of the equation (5). Also, the short-circuit judgment standard is set to 3.4 V or less as in the conventional case. FIG. 5 shows the measured voltage when the wiring electrode having the short circuit is measured under the above conditions.

As is clear from the comparison between the measurement results shown in FIG. 5 and the conventional measurement results shown in FIG. 21, by using the apparatus and method according to the present invention, the area where the short circuit can be detected expands, The wiring part can detect short circuits in almost all areas.

The first electrode wiring 10 and the second electrode wiring 10 shown in FIG.
If the inspection of the third electrode wiring 10 is completed, next, the third and fourth electrode wirings are inspected by the same method as described above. Can be inspected, all the electrode wirings 10 shown in FIG. 1 can be inspected. In this case as well, the electrode wirings 10 can be inspected two by two, so that the inspection can be performed more efficiently than in the conventional device that had to inspect one by one. Further, as described above, the characteristics of the present invention are made effective by reversing the polarities of the adjacent current sources, and the short-circuit detection sensitivity is improved as described above. The detection sensitivity becomes equal to that of the device.

FIG. 6 shows a second embodiment of the inspection apparatus according to the present invention. The apparatus of the second embodiment is the fourth probe of the apparatus of the first embodiment described above with reference to FIG. The terminal 18 and the second voltmeter 22 are omitted. Other configurations are the same as those of the device of the first embodiment described above.
Using the device of the second embodiment, the first probe terminal 15 is brought into contact with the guard ring 12 and the second probe terminal 16 is
The third probe terminal 17 is brought into contact with one of the electrode wirings 10 and the other electrode wirings 10, respectively, and the electrode wirings 10 and 1 are connected from the first current source 21 and the second current source 23 in the same manner as in the first embodiment.
By applying a current of reverse polarity to 0 and measuring the voltage with the first voltmeter 20, it is possible to detect a short circuit with the same accuracy as in the previous embodiment. In the device of the second embodiment, the probe terminals and the voltmeter can be reduced by one each as compared with the device of the first embodiment, so that the size and weight of the inspection device can be reduced accordingly.

The first embodiment and the second embodiment described above
Although the apparatus of the embodiment is configured to be able to inspect two electrode wirings 10 at a time, the first electrode wiring can be inspected at a time so that four or more electrode wirings arranged vertically can be inspected at one time. A plurality of the apparatus of the embodiment or the apparatus of the second embodiment may be arranged in parallel to form one inspection apparatus. That is, a plurality of devices shown in FIG. 2 or FIG. 6 may be provided in parallel so that the inspection of all the electrode wirings 10 ... Can be completed several times or once. Such a configuration is particularly effective when a sufficient inspection space can be secured above the substrate on which the measured wiring 10 is formed. In addition, the wiring to be measured K ₁ tested in the first and second embodiments is
Although the strip-shaped electrode wirings 10 ... Are arranged in two rows, a simple matrix type liquid crystal substrate in which one strip-shaped electrode is arranged in one row is used for inspection. Of course, it is also good.

FIG. 7 shows four electrode wirings 10 arranged vertically and horizontally.
3 shows an inspection apparatus according to a third embodiment of the present invention, which is configured to inspect all at once. In the apparatus of the third embodiment, the inspection apparatus of the first embodiment is arranged side by side. That is, the device of this example has the same configuration as that of the device of the first embodiment, plus the fifth probe terminal 25 connected to the guard ring 12, the sixth probe terminal 26 connected to the electrode wiring 10, and the electrode wiring 10. And a seventh probe terminal 27 connected to the guard ring 12 and an eighth probe terminal 28 connected to the guard ring 12. Furthermore, the fifth probe terminal 25
A third voltmeter 30 for measuring a voltage between the second probe terminal 26 and the sixth probe terminal 26, and a seventh probe terminal 27 and an eighth probe terminal 2
And a fourth voltmeter 32 for measuring the voltage between the second and the third current source 31 connected to the sixth probe terminal 26 and grounded.
And a fourth terminal connected to the seventh probe terminal 27 and grounded.
It is configured to include a current source 33.

In the case of the device of this example, it is necessary that the first current source 21 and the third current source 31 have opposite polarities, and the second current source 23 and the fourth current source 33 have opposite polarities. . Also, regarding the relationship between the first current source 21 and the second current source 23, and the relationship between the third current source 31 and the fourth current source 33, the polarities are opposite when the current flows in or out. ing.

The device of the third embodiment is also used in the same manner as the device of the first embodiment described above to inspect for the presence of a short circuit. However, in the third embodiment, it is of course possible to detect a short-circuit defect between the upper and lower electrode wirings 10, 10 and, of course, a short-circuit defect between the electrode wirings 10, 10 arranged on the left and right and electrodes arranged obliquely. Wiring 10, 1
A short defect of 0 can also be detected.

FIG. 8, FIG. 9 and FIG. 10 show the first example when the inspection apparatus of the present invention is used for the inspection of the thin film transistor array substrate.
For explaining the example of. In the thin film transistor array substrate, source wirings (wirings to be measured) 41 on the vertical side and gate wirings (wirings to be measured) 42 on the horizontal side are wired in a matrix on a transparent substrate 40, and the source is further arranged. A thin film transistor 43 forming a switching element is provided at the intersection of the wiring 41 and the gate wiring 42. The thin film transistor 43 includes a gate electrode 45 connected to the gate line 42, a source electrode 46 connected to the source line 41, and a liquid crystal element 47 as a capacitor.
8 with a drain electrode 48 connected to
In these, these are shown in an equivalent circuit.

Also in this example, a guard ring (protective short-circuit electrode) 50 is provided on the outer peripheral side of the source wiring 41 and the gate wiring 42, and each source wiring 41 and each gate wiring 42 is connected to the guard ring by a lead wiring 51. It is connected to 50 and short-circuited. In this example, only one end of the source line 41 is connected to the guard ring 50, the other end is floated by the floating pad 41a, and only one end of the gate line 42 is connected to the guard ring 5.
0 and the other end is floated by the floating pad 42a.

When inspecting the gate wirings 42 ... Of the thin film transistor array substrate shown in this example, the device of the first embodiment shown in FIG.
5 and the fourth probe terminal 18 are in contact with the guard ring 50 on the left side of the gate wirings 42, 42 to be inspected,
The probe terminal 16 and the third probe terminal 17 may be brought into contact with the floating pads 42a of the gate wirings 42, 42. This connection state and the resistance of each part are shown in FIG. Then, a method similar to that of the first embodiment described above is carried out, the voltage between the first probe terminal 15 and the second probe terminal 16 is measured, and the third probe terminal 17 and the fourth probe terminal 18 are measured. By measuring the voltage between the gate wiring 42,
The presence or absence of a short circuit between 42 can be inspected.

When inspecting the source wiring of the thin film transistor array substrate shown in this example, the first wiring shown in FIG.
Using the apparatus of the embodiment as it is, the first probe terminal 15
And the fourth probe terminal 18 are in contact with the source wires 41, 41 above the guard ring 50 to be inspected, and the second probe terminal 16 and the third probe terminal 17 are connected to the source wire 4
It suffices to contact the floating pads 41a of Nos. 1 and 41. This connection state and the resistance of each part are shown in FIG. Then, it is possible to inspect whether or not there is a short circuit between the source wirings 41, 41 by implementing a method similar to that of the first embodiment described above.

Next, when the two source wirings and the two gate wirings of the thin film transistor array substrate shown in FIG. 8 are inspected at once, the apparatus of the third embodiment shown in FIG. 7 is used and the COM of FIG. a first probe terminal 15 with the second probe terminal 16 to respectively abut the fourth probe terminal 18 of the third probe terminal 17 to the position of the COM ₂ to the position of the O ₂ to the position of O ₁ to ₁ position, COM each fifth probe 25 to the position of the O ₃ to ₃ positions the seventh probe terminal 27 a sixth probe terminal 26 to the position of the O ₄ to the position of the COM ₄ eighth probe terminal 28 is brought into contact. From this state, as in the case of the third embodiment, by applying a current and observing the value of each voltmeter, two source wirings and two gate wirings at a time, that is, a total of four wirings are covered. The measurement wiring can be inspected.

FIG. 11 is for explaining a second example in which the inspection apparatus of the present invention is used to inspect a thin film transistor array substrate. In the thin film transistor array substrate of this example, source wirings 61 ... And gate wirings 62 ... Are formed in a matrix on a transparent substrate, and a guard ring 70 is provided around them. A thin film transistor 43 having the same configuration as the previous example is provided at the intersection of the source wiring 61 and the gate wiring 62. In the circuit of the thin film transistor array substrate of this example,
One end of the source wiring 61 is connected to the guard ring 70,
The other end is floating by the floating pad 61a, one end of the gate wiring 62 is connected to the guard ring 70, and the other end is the floating pad 62a.
It is floating in.

In order to inspect the gate wirings 62, 62 of the thin film transistor array substrate of this example by the inspection apparatus of the first embodiment, the first probe terminal 15 is placed on the guard ring 70 beside one gate wiring 62 to be inspected. The second probe terminal 16 is brought into contact with the other end of the gate wiring 62, that is, the floating pad 62a. Further, the fourth probe terminal 18 is brought into contact with the guard ring 70 at the portion where the second gate wiring 62 is connected, and the third probe terminal 17 is connected to the other end of the second gate wiring 62, that is, the floating pad 62a. Abut. Then, similarly to the case described in the previous example, by passing a predetermined current from the current source and reading the value of the voltmeter, it is possible to inspect whether or not the gate wirings 62, 62 are short-circuited.

To inspect the source wirings 61, 61, the first probe terminal 15 is brought into contact with the guard ring 70 connected to one source wiring 61 to be inspected,
The second probe terminal 16 is brought into contact with the other end of the source wiring 61, that is, the floating pad 61a. Also,
The fourth probe terminal 18 is brought into contact with the guard ring 70 of the portion to which the second source wiring 61 is connected,
The third probe terminal 17 is brought into contact with the other end of the second source wiring 61, that is, the floating pad 61a.
Then, in the same manner as in the case described in the previous example, by passing a predetermined current from the current source and reading the value of the voltmeter, it is possible to inspect whether or not the gate wirings 61, 61 are short-circuited.

Next, when the two source wirings and the two gate wirings of the thin film transistor array substrate shown in FIG. 11 are inspected at the same time, the apparatus of the third embodiment shown in FIG. 7 is used.
Each abutting the fourth probe terminal 18 and the second probe terminal 16 a first probe terminal 15 to the position of the COM ₁ in the position of O ₁ the third probe terminal 17 to the position of the O ₂ to the position of the COM ₂ of FIG. 11 At the same time, the fifth probe 25 is brought into contact with the position of COM ₃ , the sixth probe terminal 26 is brought into contact with the position of O ₃ , the seventh probe terminal 27 is brought into contact with the position of O ₄ , and the eighth probe terminal 28 is brought into contact with it in the position of COM ₄ . . From this state,
As in the case of the third embodiment, by applying a current and observing the value of each voltmeter, two source wirings and two gate wirings at a time, that is, a total of four wirings to be measured are measured. Can be inspected.

FIG. 12 shows four electrode wirings 1 arranged vertically and horizontally.
Fourth according to the present invention configured so that 0 can be inspected at once
The inspection apparatus of an Example is shown. In the device of the fourth embodiment,
The inspection apparatus of the third embodiment described with reference to FIG. 7 has a simplified configuration. That is, in the device of this example, four electrode wirings 10 shown in FIG. 12 to be measured are measured with respect to strip-shaped electrode wirings 10 ... .. of the second probe terminal 16 that is in contact with the right end portion (the end portion on the side that is not short-circuited) of the first electrode wiring on the upper left side, and the second electrode wiring 10 on the lower left side The third probe terminal 17 that is in contact with the right end (the end that is not short-circuited) and the left end (the end that is not short-circuited) of the third electrode wiring on the upper right 6th probe terminal 16 that contacts the lower end of the fourth electrode wiring 10 on the lower right side (the end on the side that is not short-circuited), and the second lower left side And a voltmeter (voltage measuring means) 80 for measuring the voltage between the right end and the left end of the electrode wiring 10. To have.

Further, the first current source 21 connected to the second probe terminal 16 and installed, the second current source 23 connected to the third probe terminal 17 and installed, and the sixth probe terminal 26 are connected. The third current source 31 is connected to the ground and the fourth current source 33 is connected to the seventh probe terminal 27 and grounded. In the case of the device of this example, it is necessary that the first current source 21 and the third current source 31 have opposite polarities and the second current source 23 and the fourth current source 33 have opposite polarities. Also, regarding the relationship between the first current source 21 and the second current source 23, and the relationship between the third current source 31 and the fourth current source 33, the polarities are opposite when the current flows in or out. ing. In this embodiment, the voltmeter 80 is used as the second electrode wiring 10 on the lower left side of FIG.
However, the voltmeter 80 may be connected to any one of the first, second, or fourth electrode wirings 10, and two or more, for example, all of them may be arranged. It doesn't matter. In the configuration shown in FIG. 12, the electrode wirings 10 vertically adjacent to each other on the right side ... Or the electrode wirings 10 vertically adjacent to each other on the left side.
・ They can be grounded or not grounded, and inspection is possible in any case.

The apparatus of the fourth embodiment can also be used in the same manner as the apparatus of the third embodiment described above to inspect for the presence of a short circuit defect. In the device of the fourth embodiment, it is possible to detect short-circuit defects between the electrode wirings 10 and 10 arranged vertically, and of course, short-circuit defects between the electrode wirings 10 and 10 arranged on the left and right and diagonal arrangement. It is also possible to detect a short-circuit defect between the electrode wirings 10 and 10 that are connected.

FIG. 13 shows a fifth embodiment of the inspection apparatus according to the present invention. In the apparatus of this embodiment, the position of the voltmeter in the apparatus of the fourth embodiment is changed.
By disposing the voltmeter (voltage measuring means) 81 for measuring the voltage on both ends of the second current source 23 as in this example, the short circuit defect of the electrode wirings 10 ... Is measured similarly to the previous embodiment. can do. In the configuration of this example, it is preferable that the electrode wirings 10 ... Are grounded. Further, the connection position of the voltmeter 81 does not have to be at both ends of the second current source 23 as shown in the figure, but both ends of the first current source 21, both ends of the third current source 31, and the fourth current source 33. Both ends may be provided, or two or more, for example, all of them may be provided with voltmeters.

FIG. 14 shows four electrode wirings 10 'arranged vertically side by side, and the electrode wirings 10 ... In the previous embodiment.
According to a sixth aspect of the present invention, which is configured to inspect four electrode wirings 10 ′ arranged so that the short circuit position is different from
The inspection apparatus of an Example is shown. In the device of the sixth embodiment,
The structure is similar to that of the inspection device according to the fourth embodiment described above with reference to FIG.

In the device of this example, the wiring 1 arranged in the vertical direction is used.
0 '... is configured to inspect the electrode wiring 10', which is obtained by short-circuiting every other electrode wiring 10 'on the right side or the left side, and is the first electrode wiring from the top of FIG. 10 'and the third electrode wiring 10' are short-circuited on the left end side of the drawing, and the second electrode wiring 10 'and the fourth electrode wiring 10' are short-circuited on the right side of the drawing. Is provided for. That is, in the device of this example, the second probe terminal 16 connected to the left end portion (the end portion on the non-short-circuited side) of the second electrode wiring 10 ′ and the left end of the fourth electrode wiring 10 ′. Part (end not short-circuited)
To the third probe terminal 17, the sixth probe terminal 26 connected to the right end portion (the end portion on the side not short-circuited) of the first electrode wiring 10 ′, and the third electrode wiring 10 And a seventh probe terminal 27 connected to the right end portion (the end portion on the non-short-circuited side) of the fourth electrode wiring 10 ', and the voltage between the right end portion and the left end portion of the fourth electrode wiring 10' is measured. A voltmeter (voltage measuring means) 90 is provided.

Further, the first current source 21 connected to the second probe terminal 16 is installed, the second current source 23 connected to the third probe terminal 17 is installed, and the sixth probe terminal 26 is connected. The third current source 31 is connected to the ground and the fourth current source 33 is connected to the seventh probe terminal 27 and grounded. In the case of the device of this example, it is necessary that the first current source 21 and the third current source 31 have opposite polarities and the second current source 23 and the fourth current source 33 have opposite polarities. Also, regarding the relationship between the first current source 21 and the second current source 23, and the relationship between the third current source 31 and the fourth current source 33, the polarities are opposite when the current flows in or out. ing.

In this embodiment, the voltmeter 90 is shown in FIG.
Although it is connected to both ends of the second electrode wiring 10 on the lower left side of the above, the voltmeter 90 may be connected to any one of the first, second, or fourth electrode wirings 10. Two or more, for example, all may be arranged. In addition, in the configuration shown in FIG. 12, the electrode wirings 10 ... Which are vertically adjacent to each other on the right side or the electrode wirings 10 that are vertically adjacent to each other on the left side are grounded even if they are grounded. It does not have to be performed, and inspection is possible in any case.

The apparatus of the sixth embodiment can also be used in the same manner as the apparatus of the fourth embodiment described above to inspect for the presence or absence of a short circuit defect. In the device of the sixth embodiment, it is of course possible to detect a short circuit defect between the electrode wirings 10 and 10 arranged on the upper and lower sides, and of course, a short circuit defect between the electrode wirings 10 and 10 arranged on the left and right and a diagonal arrangement. It is also possible to detect a short-circuit defect between the electrode wirings 10 and 10 that are connected.

FIG. 15 shows a seventh embodiment of the inspection apparatus according to the present invention. In the apparatus of this embodiment, the position of the voltmeter in the apparatus of the sixth embodiment is changed.
By disposing the voltmeter (voltage measuring means) 91 for measuring the voltage on both ends of the second current source 23 as in this example, the short circuit defect of the electrode wirings 10 ... Is measured similarly to the previous embodiment. can do. In the configuration of this example, it is preferable that the electrode wirings 10 ... Are grounded. Further, the connection position of the voltmeter 91 does not have to be at both ends of the second current source 23 as shown in the figure, but both ends of the first current source 21, both ends of the third current source 31, and the fourth current source 33. Both ends may be provided, or two or more, for example, all of them may be provided with voltmeters.

[0071]

As described above, according to the present invention, 2
A short-circuit defect can be inspected by causing currents of opposite polarities to simultaneously flow through the one wiring to be measured and reading the voltage change due to the resistance change that occurs when a short circuit occurs between the two wirings to be measured. In this case, it is possible to easily detect a defect having a large short circuit resistance as well as a defect having a small short circuit resistance. Therefore, the inspection accuracy is improved. Furthermore,
Since two wirings to be measured can be inspected at the same time, the inspection efficiency is improved as compared with the conventional device in which the wirings are inspected one by one. In addition, the one provided with the first to third probe terminals connected to the wiring for measurement or the wiring for short circuit, the short circuit of the wiring for measurement is made by measuring the voltage between the first probe terminal and the second probe terminal. Can be detected, first to fourth
Those having a probe terminal include a first probe terminal and a second probe terminal.
By measuring the voltage between the probe terminals and the voltage between the third probe terminal and the fourth probe terminal, it is possible to detect the presence or absence of a short circuit in the wiring to be measured.

The inspection apparatus according to the present invention is convenient when the wiring to be measured is a strip-shaped wiring, and is applicable to a configuration in which the wiring to be measured is connected to the short-circuit wiring via the lead wiring. You can also Furthermore, the present invention can be applied to the case where the wiring to be measured is an electrode wiring for a simple matrix liquid crystal substrate and can be easily applied to the case where the wiring to be measured is an indium tin oxide film. In addition, the wiring to be measured is formed in at least two rows on the substrate, and the wiring to be measured in each row is short-circuited by the short-circuit wiring for each row, or the wiring to be measured is on the substrate. Formed in line,
Every other wiring under test is short-circuited by one short-circuit wiring,
It can also be applied to the case where the remaining every other measured wiring is short-circuited by another short-circuited wiring.

The device or method of the present invention can also be applied to a thin film transistor array substrate in which a thin film transistor is formed on a substrate and a source wiring and a gate wiring are formed. In that case, among the wiring under measurement arranged on the substrate, the source wiring or the gate wiring should be 2
You can efficiently inspect each pair of books. Also in the inspection in that case, as in the case described above, it is possible to easily detect not only a defect having a short resistance, but also a defect having a large short resistance.

Next, if the first to fourth probe terminals are used to contact and inspect the first to fourth wirings to be measured, it is possible to inspect four wirings to be measured at one time. Efficiency is further improved. Moreover, by inspecting like this,
Since it becomes possible to inspect short-circuit defects between the first to fourth wirings to be measured, the inspection accuracy can be improved. Further, as the wiring to be measured, the device of the present invention is applied to the wiring provided on the substrate in an intersecting state such as the source wiring and the gate wiring of the active matrix display substrate for driving the liquid crystal element. In the case of applying one having the first to third probe terminals or one having the first to fourth probe terminals, two source wirings or two gate wirings are formed as a set. Can be inspected. Furthermore, first to
If a similar board is inspected using a device having an eighth probe terminal, two source wirings and two gate wirings can be inspected at the same time, in which case the two source wirings are It is possible to detect a defect even if a short defect between the source line and the gate line occurs, as well as a short defect between the two gate lines.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of electrode wiring of a simple matrix liquid crystal substrate to be inspected by an apparatus according to the present invention and connection positions of probe terminals.

FIG. 2 is a circuit diagram showing a main part of a first embodiment of the inspection apparatus according to the present invention.

3 is a diagram showing a part of electrode wiring of a simple matrix liquid crystal substrate which has a short circuit defect and is inspected by the inspection apparatus shown in FIG.

FIG. 4 is a circuit diagram showing a current flow and a resistance of each part in a state where the electrode wiring shown in FIG. 3 is being inspected.

5 is a diagram showing a detectable range when the apparatus shown in FIG. 2 detects a short circuit defect of the electrode wiring shown in FIG.

FIG. 6 is a circuit diagram showing a state in which a short circuit defect of an electrode wiring is detected by using the device of the second embodiment of the present invention.

FIG. 7 is a configuration diagram showing a state in which a short circuit defect of an electrode wiring is detected using the device of the third embodiment of the present invention.

FIG. 8 is an explanatory view showing connection positions of probe terminals when inspecting a thin film transistor array substrate in the device of the first embodiment of the present invention.

9 is a diagram showing a circuit configuration when inspecting a gate wiring of the thin film transistor array substrate shown in FIG.

10 is a configuration diagram showing a circuit configuration when inspecting the source wiring of the thin film transistor array substrate shown in FIG.

FIG. 11 is an explanatory diagram showing connection positions of probe terminals when inspecting another example of the thin film transistor array substrate in the device according to the first embodiment of the present invention.

FIG. 12 is a configuration diagram showing a state in which a short circuit defect of an electrode wiring is detected by using the device of the fourth embodiment of the present invention.

FIG. 13 is a configuration diagram showing a state in which a short circuit defect of an electrode wiring is detected by using the device of the fifth embodiment of the present invention.

FIG. 14 is a configuration diagram showing a state in which a short circuit defect of an electrode wiring is detected by using the device of the sixth embodiment of the present invention.

FIG. 15 is a configuration diagram showing a state in which a short circuit defect of an electrode wiring is detected by using the device of the seventh embodiment of the present invention.

FIG. 16 is a configuration diagram of electrode wiring of a simple matrix liquid crystal substrate tested by a conventional device.

FIG. 17 is a circuit diagram showing a main part of an example of a conventional inspection apparatus used for inspecting the electrode wiring shown in FIG.

FIG. 18 is an enlarged view showing a part of an electrode circuit including a short circuit defect and the resistance of each part inspected by the conventional inspection apparatus shown in FIG.

FIG. 19 is a configuration diagram showing a state in which the electrode wiring is inspected without a short circuit defect.

FIG. 20 is a configuration diagram showing a state in which an electrode wiring having a short circuit defect is inspected.

FIG. 21 is a diagram showing an area that can be detected and an area that cannot be detected by a conventional inspection apparatus.

[Explanation of symbols]

 K1 wiring for measurement 9 substrate 10 electrode wiring 11 lead-out wiring 12 guard ring (short-circuit wiring for protection) 15 first probe terminal 16 second probe terminal 17 third probe terminal 18 fourth probe terminal 20 first voltmeter (first 1 voltage measuring means) 21 1st current source 22 2nd voltmeter (2nd voltage measuring means) 23 2nd current source 25 5th probe terminal 26 6th probe terminal 27 7th probe terminal 28 8th probe terminal 30 3rd Voltmeter (third voltage measuring means) 31 Third current source 32 Fourth voltmeter (fourth voltage measuring means) 33 Fourth current source 40 Substrate 41, 61 Source wiring (wiring for measurement) 42, 62 Gate wiring ( Wiring to be measured) 43 Thin film transistor 50, 70 Guard ring (short-circuit wiring for protection) 51 Lead wiring 80, 90 Voltmeter (voltage measuring means)

Claims (24)

[Claims] 1. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuiting wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. An inspection device for inspecting a wiring board comprising: a first probe terminal connected to a short-circuit wiring for protection; and a second probe terminal connected to one of the measured wirings,
A third probe terminal connected to another one of the wirings to be measured, a first voltage measuring means for measuring a voltage between the first probe terminal and the second probe terminal, and a second probe terminal And a second current source connected to the third probe terminal, wherein the polarities of the first current source and the second current source are reversed. Wiring board inspection device. 2. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuiting wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. An inspection device for inspecting a wiring board comprising: a first probe terminal connected to a short-circuit wiring for protection; and a second probe terminal connected to one of the measured wirings,
The voltage between the third probe terminal connected to the other one of the measured wires and the fourth probe terminal connected to the protective short-circuit wiring, and the voltage between the first probe terminal and the second probe terminal is measured. First voltage measuring means, second voltage measuring means for measuring the voltage between the third probe terminal and the fourth probe terminal, a first current source connected to the second probe terminal, and the third probe An inspection apparatus for a wiring board, comprising: a second current source connected to a terminal, wherein the polarities of the first current source and the second current source are reversed. 3. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuit wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. An inspection device for inspecting a wiring board comprising: a first probe terminal connected to a short-circuit wiring for protection; and a second probe terminal connected to one of the measured wirings,
A third probe terminal connected to another one of the wirings to be measured, a means for grounding the first probe terminal, and a first voltage measuring means for measuring the voltage between the second probe terminal and the ground plane. And a first current source connected to the second probe terminal and a second current source connected to the third probe terminal, wherein the polarities of the first current source and the second current source are A wiring board inspection device, which is characterized by being reversed. 4. The wiring to be measured is a plurality of strip-shaped electrode wirings formed in alignment on a substrate, and the end portions of these electrode wirings are connected to a protective short-circuit wiring via a lead wiring. The wiring board inspection apparatus according to claim 1, 2, or 3. 5. The substrate for a simple matrix liquid crystal display element, wherein the substrate is cut at the lead-out wiring portion as a boundary, and the measured wiring portion side is used as an electrode. The wiring board inspection device described. 6. The wiring board inspection apparatus according to claim 1, wherein the substrate is a transparent substrate, and the wiring is formed from an indium tin oxide film. 7. The wiring to be measured is a wiring formed in a matrix on a substrate, a switch element is formed at each intersection of the matrix wiring, and an end of the wiring in the matrix is connected via a lead wiring. 4. The wiring board inspection apparatus according to claim 1, wherein the inspection apparatus is connected to a protective short-circuit wiring. 8. The wiring to be measured is a wiring formed in a matrix on a substrate, a thin film transistor is formed at each intersection of the wiring in the matrix, and an end portion of the wiring in the matrix is led through a lead wiring. 3. A thin film transistor array substrate which is connected to a short-circuit wiring for protection and which is cut at the lead-out wiring portion as a boundary and whose measured wiring portion side is used as wiring. Alternatively, the wiring board inspection device according to the item 3. 9. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuiting wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. And a second probe terminal connected to a first wiring to be measured and a first probe terminal connected to the short-circuit wiring for protection. A third probe terminal connected to the second wiring to be measured adjacent to the measurement wiring, a fourth probe terminal connected to the short-circuit wiring for protection, and a fifth probe connected to the short-circuit wiring for protection. A sixth probe terminal connected to a terminal and a third wiring under test adjacent to the second wiring under measurement; and a fourth measurement under test adjacent to the third wiring under measurement. Probe terminal connected to the wiring for protection and for protection An eighth probe terminal connected to the short-circuit wiring, a first voltage measuring means for measuring a voltage between the first probe terminal and the second probe terminal, and a voltage between the third probe terminal and the fourth probe terminal. A second voltage measuring means for measuring the voltage, a third voltage measuring means for measuring a voltage between the fifth probe terminal and the sixth probe terminal, and a voltage between the seventh probe terminal and the eighth probe terminal. Fourth voltage measuring means, a first current source connected to the second probe terminal, a second current source connected to the third probe terminal, and the sixth
A third current source connected to the probe terminal and a fourth current source connected to the seventh probe terminal, wherein the first current source and the second current source have opposite polarities, Two
An inspection apparatus for a wiring board, wherein the current source and the third current source have opposite polarities, and the third current source and the fourth current source have opposite polarities. 10. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuiting wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. And a second probe terminal connected to an end portion of the first non-short-circuited side of the first measured wiring, and a second shorted wiring to be measured. The third probe terminal connected to the end on the non-shorted side, the sixth probe terminal connected to the end on the non-short-circuited side of the third measured wire, and the fourth measured terminal A seventh probe terminal connected to an end of the wire on the non-short-circuited side, voltage measuring means for measuring a voltage across at least one end of the measured wire, and a seventh probe terminal connected to the second probe terminal. One current source and a second current source connected to the third probe terminal , The sixth
A third current source connected to the probe terminal and a fourth current source connected to the seventh probe terminal, wherein the first current source and the second current source have opposite polarities, and Two
An inspection apparatus for a wiring board, wherein the current source and the third current source have opposite polarities, and the third current source and the fourth current source have opposite polarities. 11. The wiring for measurement is at least 2 on the substrate.
The wiring board inspection apparatus according to claim 9 or 10, wherein the wirings to be measured in each row are arranged in a row, and the wirings to be measured in each row are short-circuited for each row by a short-circuit wiring. 12. The wirings to be measured are formed in line on the substrate in one row, and the wirings to be measured are short-circuited by one short-circuit wiring and the remaining wirings to be measured are the other wirings. It is short-circuited with a short-circuit wiring, It is characterized by the above-mentioned.
The wiring board inspection device described. 13. The substrate for a simple matrix liquid crystal display element, wherein the substrate is cut at the lead-out wiring portion as a boundary and the measured wiring portion side is used as an electrode. Wiring board inspection device. 14. The wiring board inspection apparatus according to claim 9, wherein the substrate is a transparent substrate, and the wiring is formed from an indium tin oxide film. 15. The wiring to be measured is a wiring formed in a matrix on a substrate, a switch element is formed at each intersection of the wiring in a matrix, and an end portion of the wiring in the matrix is connected via a lead wiring. The wiring board inspection device according to claim 9 or 10, wherein the inspection device is connected to a protective short-circuit wiring. 16. The wiring to be measured is a wiring formed in a matrix on a substrate, a thin film transistor is formed at each intersection of the matrix wiring, and an end of the wiring in the matrix is connected via a lead wiring. 11. The thin film transistor array substrate, which is connected to a short-circuit wiring for protection and is cut at the lead-out wiring portion as a boundary so that the measured wiring portion side is used as the wiring. The wiring board inspection device described. 17. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuit wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. A method for inspecting a wiring board, comprising applying a predetermined current between the short-circuit wiring for protection and the end of the first wiring, and at the same time applying the short-circuit wiring for protection and the end of the second wiring. The voltage between the short-circuit wiring for protection and the end of the first wiring is measured while applying a predetermined current whose polarity is opposite to that between A method for inspecting a wiring board, which comprises determining a disconnection and a short circuit between the second wiring and the second wiring. 18. A substrate, a plurality of wirings to be measured formed on the substrate, and a short circuit wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. A method for inspecting a wiring board comprising: a short circuit wiring for protection and an end of the first wiring while applying a predetermined current between the short circuit wiring for protection and the end of the first wiring. The voltage between the protective short-circuit wire and the second short-circuit wire while applying a predetermined current of the opposite polarity to the short-circuit wire for protection and the end of the second wire. A voltage between the end of the second wiring is measured, and a disconnection and a short circuit between the first wiring and the second wiring are determined from the measured value of each voltage. Wiring board inspection method. 19. A plurality of strip-shaped electrode wirings aligned and formed on a substrate are used as the wirings to be measured, and end portions of these electrode wirings are connected to short-circuiting wirings for protection through lead-out wirings. 19. The method for inspecting a wiring board according to claim 17, wherein a wiring board is used. 20. The substrate for a simple matrix liquid crystal display device, wherein the substrate is a substrate for a simple matrix liquid crystal display element, which is cut at the lead-out wiring portion as a boundary and the measured wiring portion side is used as an electrode. Wiring board inspection method. 21. The method for inspecting a wiring board according to claim 17, wherein a transparent substrate is used as the substrate, and a wiring formed of an indium tin oxide film is used. 22. As the wiring to be measured, wiring formed in a matrix on a substrate is used, and a wiring in which a switch element is formed at each intersection of the matrix wiring is used.
19. The method for inspecting a wiring board according to claim 17, wherein an end portion of the matrix wiring is connected to a protective short-circuit wiring through a lead wiring. 23. As the wiring to be measured, wiring formed in a matrix on a substrate is used, and a thin film transistor is formed at each intersection of the wiring in the matrix, and an end portion of the wiring in the matrix is drawn out. A thin film transistor array substrate is used that is connected to a short-circuiting wiring for protection through wiring, and is used as a substrate, which is cut at the lead wiring portion as a boundary and uses the measured wiring portion side as wiring. The wiring board inspection device according to claim 17 or 18. 24. A substrate, a plurality of wirings to be measured formed on the substrate, and a short-circuiting wiring for protection formed on the substrate by short-circuiting the plurality of wirings to be measured. A method for inspecting a wiring board comprising: a short circuit wiring for protection and an end of the first wiring while applying a predetermined current between the short circuit wiring for protection and the end of the first wiring. The voltage between the protective short-circuit wire and the second short-circuit wire while applying a predetermined current of the opposite polarity to the short-circuit wire for protection and the end of the second wire. The voltage between the end of the second wiring is measured, and the short-circuit wiring for protection is applied while applying a predetermined current between the short-circuit wiring for protection and the end of the third wiring. While measuring the voltage between the end of the third wire and the end of the fourth short wire for protection The voltage between the short-circuiting wiring for protection and the end of the fourth wiring is measured while applying a predetermined current having a polarity opposite to that of the above, and the measured value of each voltage is used to measure the first A method of inspecting a wiring board, which comprises determining a disconnection and a short circuit between a wiring, the second wiring, the third wiring, and the fourth wiring.