JPH08340001A - Solder bump forming method and equipment - Google Patents

Solder bump forming method and equipment

Info

Publication number
JPH08340001A
JPH08340001A JP7145962A JP14596295A JPH08340001A JP H08340001 A JPH08340001 A JP H08340001A JP 7145962 A JP7145962 A JP 7145962A JP 14596295 A JP14596295 A JP 14596295A JP H08340001 A JPH08340001 A JP H08340001A
Authority
JP
Japan
Prior art keywords
plate member
solder
squeegee
solder paste
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7145962A
Other languages
Japanese (ja)
Other versions
JP3305162B2 (en
Inventor
Yasuo Yamagishi
康男 山岸
Masayuki Ochiai
正行 落合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14596295A priority Critical patent/JP3305162B2/en
Priority to US08/516,284 priority patent/US6025258A/en
Priority to US08/659,356 priority patent/US6319810B1/en
Publication of JPH08340001A publication Critical patent/JPH08340001A/en
Priority to US09/118,064 priority patent/US6271110B1/en
Priority to US09/749,521 priority patent/US6528346B2/en
Application granted granted Critical
Publication of JP3305162B2 publication Critical patent/JP3305162B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

PURPOSE: To prevent the sticking of solder paste on the surface of a plate part member and exclude incorrect metering, by heating the plate part member and forming solder balls in recessed parts after a plurality of the recessed parts of the plate part member are filled with the solder paste, the solder paste left on the surface of the plate part member is scraped off by using a hard knife edge, and metering is performed. CONSTITUTION: A squeegee 18 is slided along the surface of a plate part member 10 having a plurality of recessed parts 12, which are filled with solder paste supplied on the surface. A hard knife edge 22 forming an obtuse angle to the plate part member in the sliding direction is slided along the surface of the plate part member. The solder paste left on the plate part member is scraped off, and accurate metering is performed. By heating the plate part member 10, solder particles contained in the solder paste 14 in the recessed parts 12 are fused, and solder balls 20 are formed by the effect of surface tension. Electrode pads 24 of a semiconductor chip 22 are made to abut against the solder balls 20, which are transferred to the electrode pads 24 from the plate part member 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は半導体装置等で使用され
るはんだバンプを形成するためのはんだバンプ形成方法
及び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bump forming method and device for forming solder bumps used in semiconductor devices and the like.

【０００２】[0002]

【従来の技術】大量の情報を高速に処理する情報処理装
置においては、半導体チップに電子回路や電子部品を集
積したＬＳＩやＶＬＳＩ等が多く用いられている。電子
回路が形成されている半導体チップを例えばセラミック
基板に取り付けるために、半導体チップ又はセラミック
基板にはんだバンプを設け、はんだバンプの溶着によ
り、半導体チップをセラミック基板に固定するとともに
電気的な接続を行うことができる。2. Description of the Related Art LSIs, VLSIs and the like in which electronic circuits and electronic components are integrated on a semiconductor chip are often used in information processing apparatuses for processing a large amount of information at high speed. In order to attach a semiconductor chip on which an electronic circuit is formed to, for example, a ceramic substrate, a solder bump is provided on the semiconductor chip or the ceramic substrate, and by welding the solder bump, the semiconductor chip is fixed to the ceramic substrate and electrically connected. be able to.

【０００３】はんだバンプを形成する方法としては、メ
ッキ法やはんだ合金の転写法が使用されている。前者は
主にフリップチップに使用されている方法で、ウエハー
プロセスの最終工程で、アルミパッド上にバリアメタル
を介してはんだを厚くメッキし、リフローしてはんだバ
ンプを形成する方法である。後者は、はんだ薄板から打
ち抜いた小片や切断したワイヤを加熱して形成したはん
だボールをパッド上に転写するもので、ＢＧＡパッケー
ジで広く用いられている。また、はんだ合金をステンシ
ルを介してガラス基板等の上に蒸着し、これをパッド上
に転写する方法も知られている。As a method for forming solder bumps, a plating method or a solder alloy transfer method is used. The former is a method mainly used for flip chips, and is a method of forming solder bumps by thickly plating solder on an aluminum pad via a barrier metal and then reflowing the solder in the final step of a wafer process. The latter is for transferring a solder ball formed by heating a small piece punched from a thin solder plate or a cut wire onto a pad, and is widely used in a BGA package. A method is also known in which a solder alloy is vapor-deposited on a glass substrate or the like via a stencil and is transferred onto a pad.

【０００４】一方、微小なはんだ粉末をフラックスや溶
剤と混練したはんだペーストを用いて、はんだバンプを
形成する方法が知られている。例えば、特公昭５３─３
９８０号公報は、所定の大きさの穴のあいたスクリーン
を用いて、はんだペーストを金属板に印刷し、金属板を
加熱して球状のはんだ（はんだボール）を形成し、その
はんだボールを回路基板に転写することを開示してい
る。On the other hand, there is known a method of forming solder bumps by using a solder paste prepared by kneading fine solder powder with a flux or a solvent. For example, Japanese Patent Publication Sho 53-3
No. 980, a solder paste is printed on a metal plate by using a screen having a hole of a predetermined size, and the metal plate is heated to form spherical solder (solder ball), and the solder ball is used as a circuit board. It is disclosed to transfer to.

【０００５】また、特開平６─１２４９５３号公報は、
複数の窪みを有する板部材を用いたはんだバンプの形成
方法を開示している。この方法では、はんだペーストが
この板部材の窪みに充填され、半導体装置をこの板部材
に近づけて、半導体装置の金バンプを各窪みのはんだペ
ーストに差し込み、それから半導体装置をこの板部材か
ら遠ざけると、はんだペーストが半導体装置の金バンプ
に付着する（転写される）。Further, Japanese Patent Laid-Open No. 6-124953 discloses
A method for forming a solder bump using a plate member having a plurality of depressions is disclosed. In this method, the solder paste is filled in the depressions of the plate member, the semiconductor device is brought close to the plate member, the gold bumps of the semiconductor device are inserted into the solder paste of each depression, and then the semiconductor device is moved away from the plate member. , The solder paste adheres (is transferred) to the gold bumps of the semiconductor device.

【０００６】さらに、本願の先願である特願平７─００
３６７９号は、所定のパターンで配置された複数の凹部
を有するはんだボール形成部材（板部材）を準備し、は
んだボール形成部材の凹部にはんだペーストを充填し、
はんだボール形成部材を加熱して各凹部内のはんだペー
スト中に含まれるはんだ粒子が溶融して表面張力により
丸まったはんだボールを形成し、このはんだボールを回
路基板等に転写することを開示している。Furthermore, Japanese Patent Application No. 7-00, which is the prior application of the present application,
No. 3679 prepares a solder ball forming member (plate member) having a plurality of recesses arranged in a predetermined pattern, fills the recesses of the solder ball forming member with a solder paste,
Disclosed is that a solder ball forming member is heated to form a solder ball which is melted by solder particles contained in a solder paste in each concave portion and is rounded by surface tension, and the solder ball is transferred to a circuit board or the like. There is.

【０００７】[0007]

【発明が解決しようとする課題】はんだペーストを板部
材の窪みに充填することによりはんだバンプを形成する
方法においては、スキージが用いられる。スキージは板
部材の表面に沿って摺動せしめられ、板部材の表面に沿
ってはんだペーストを押しながら、はんだペーストを窪
みに充填する。A squeegee is used in the method of forming solder bumps by filling the depressions of the plate member with the solder paste. The squeegee is slid along the surface of the plate member, and the depression is filled with the solder paste while pressing the solder paste along the surface of the plate member.

【０００８】各窪みに充填されたはんだペーストが、取
り出されてはんだバンプとなる。板部材の全ての窪みは
一定の体積を持つように製造され、はんだペーストはス
キージを用いて全ての窪みに一様に充填され、つまり窪
みによって計量される。こうして、全ての窪みに充填さ
れたはんだペーストは一定の体積をもち、その結果、均
一な大きさのはんだバンプを形成することができる。The solder paste filled in each recess is taken out to form a solder bump. All the depressions of the plate member are manufactured so as to have a constant volume, and the solder paste is uniformly filled in all the depressions by using a squeegee, that is, the solder paste is measured by the depressions. Thus, the solder paste filled in all the depressions has a constant volume, and as a result, solder bumps having a uniform size can be formed.

【０００９】スキージを用いたはんだペーストの充填に
おいては、スキージがはんだペーストを押し退けていく
ので、はんだペーストは板部材の表面には付着して残留
していないはずである。しかし、実際には板部材の表面
にはんだペーストが付着物として残留していることがあ
る。すると、この板部材から回路基板にはんだを転写す
る場合に、回路基板の望ましくない位置にはんだが付着
し、導電性のゴミとなるという問題点がある。また、各
窪みの近傍において、はんだペーストが板部材の表面よ
りも盛り上がっていると、はんだペーストの計量が不正
確になるという問題点がある。In filling the solder paste with a squeegee, the squeegee pushes the solder paste away, so the solder paste should adhere to the surface of the plate member and not remain. However, in reality, the solder paste may remain as an adhered substance on the surface of the plate member. Then, when the solder is transferred from the plate member to the circuit board, there is a problem that the solder adheres to an undesired position on the circuit board and becomes conductive dust. Further, if the solder paste is higher than the surface of the plate member in the vicinity of each recess, there is a problem that the solder paste is not accurately measured.

【００１０】スキージは例えば硬質ウレタン等のエラス
トマーで作られ、板部材に対してかなりの圧力をかけた
状態で使用される。それによってスキージの先端は板部
材に対して弾性変形した状態で全体的に一様に板部材に
接触する。もしスキージが軟らかいとより変形しやす
く、板部材の表面からはんだペーストを押し退ける作用
が弱くなってはんだペーストが板部材の表面に付着した
り、窪みの周辺部にはんだペーストが残留したりするこ
とがある。もしスキージが硬いと変形しにくく、例え
ば、スキージの一端側が板部材に強く接触し、他端側が
板部材から離れ気味になり、スキージが一様に板部材に
接触しない恐れがあり、すると板部材の表面にはんだペ
ーストが付着しやすくなり、窪み内のはんだペーストの
量が不均一になりやすい。The squeegee is made of, for example, an elastomer such as hard urethane and is used with a considerable pressure applied to the plate member. As a result, the tip end of the squeegee uniformly contacts the plate member while being elastically deformed with respect to the plate member. If the squeegee is soft, it is more likely to be deformed, the action of pushing the solder paste away from the surface of the plate member is weakened, and the solder paste may adhere to the surface of the plate member, or the solder paste may remain around the recess. is there. If the squeegee is hard to be deformed, for example, one end of the squeegee may come into strong contact with the plate member and the other end may be separated from the plate member, and the squeegee may not evenly contact the plate member. The solder paste is likely to adhere to the surface of, and the amount of the solder paste in the depression is likely to be uneven.

【００１１】本発明の目的は、窪みを有する板部材及び
スキージを用いてはんだペーストを計量する際にはんだ
ペーストが板部材の表面に付着したり、不正確に計量さ
れるのを防止するようにしたはんだバンプ形成方法及び
装置を提供することである。An object of the present invention is to prevent the solder paste from adhering to the surface of the plate member or being inaccurately measured when the solder paste is weighed using a plate member having a recess and a squeegee. A solder bump forming method and device are provided.

【００１２】[0012]

【課題を解決するための手段】本発明によるはんだバン
プ形成方法は、平坦な表面１０ａに複数の窪み１２を有
する板部材１０を準備し、該板部材の表面に沿ってスキ
ージ１８を摺動させて前記表面に供給されたはんだペー
スト１４を前記窪みに充填し、該板部材との間で摺動方
向に向かってとった角度が鈍角となるように硬質のナイ
フエッジ２２を該板部材の表面に沿って摺動させ、該板
部材の表面に残留するはんだペーストを剥ぎ取り、該板
部材１０を加熱して各窪み１２内のはんだペースト１４
中に含まれるはんだ粒子が溶融して表面張力により丸ま
ったはんだボール２０を形成することを特徴とする。In the method for forming solder bumps according to the present invention, a plate member 10 having a plurality of depressions 12 on a flat surface 10a is prepared, and a squeegee 18 is slid along the surface of the plate member. The solder paste 14 supplied to the surface is filled in the recess, and a hard knife edge 22 is formed on the surface of the plate member so that the angle formed with the plate member in the sliding direction is an obtuse angle. The solder paste remaining on the surface of the plate member is peeled off, and the plate member 10 is heated to remove the solder paste 14 in each depression 12
It is characterized in that the solder particles contained therein are melted to form rounded solder balls 20 due to surface tension.

【００１３】また、本発明によるはんだバンプ形成装置
は、平坦な表面１０ａに複数の窪み１２を有する板部材
１０を支持する支持手段２６、２７と、はんだペースト
１４を前記窪みに充填するためのスキージ１８と、該板
部材が該支持手段に支持された状態で該板部材の表面に
沿って該スキージを摺動させることができるように該ス
キージを支持するスキージ支持手段８１、８２、８４
と、該板部材の表面の前記窪みの周辺に付着するはんだ
ペーストを剥ぎ取るための硬質のナイフエッジ２２と、
該板部材との間で摺動方向に向かってとった角度が鈍角
となるように該ナイフエッジを該板部材の表面に沿って
摺動させることができるように該ナイフエッジを支持す
るナイフエッジ支持手段８１、８２、８５とを備えたこ
とを特徴とする。In the solder bump forming apparatus according to the present invention, the supporting means 26 and 27 for supporting the plate member 10 having the plurality of depressions 12 on the flat surface 10a and the squeegee for filling the depressions with the solder paste 14 are provided. 18, and squeegee support means 81, 82, 84 for supporting the squeegee so that the squeegee can slide along the surface of the plate member while the plate member is supported by the supporting means.
And a hard knife edge 22 for stripping off solder paste adhering to the periphery of the depression on the surface of the plate member,
A knife edge supporting the knife edge so that the knife edge can be slid along the surface of the plate member so that an angle formed with the plate member in the sliding direction is an obtuse angle. It is characterized in that it is provided with supporting means 81, 82, 85.

【００１４】[0014]

【作用】上記構成においては、スキージを板部材に沿っ
て摺動させることにより板部材の表面の窪みにおいては
んだペーストを計量した後で、硬質のナイフエッジが板
部材の表面に沿って摺動せしめられて、スキージの摺動
の際に板部材の表面に付着したはんだペーストが剥ぎ取
られる。ナイフエッジはスキージよりも硬質の材料でス
キージよりも鋭利に作られ、エッジ先端が進行方向に向
いているので、板部材の表面に付着するはんだペースト
を確実に剥ぎ取ることができ、より正確な計量を行うこ
とができる。In the above structure, the hard knife edge is slid along the surface of the plate member after the solder paste is weighed in the depression of the surface of the plate member by sliding the squeegee along the plate member. The solder paste adhered to the surface of the plate member is stripped off when the squeegee slides. The knife edge is made of a material that is harder than the squeegee and is sharper than the squeegee, and the tip of the edge is oriented in the direction of travel, so the solder paste that adheres to the surface of the plate member can be reliably stripped off, making it more accurate. Weighing can be done.

【００１５】[0015]

【実施例】図１は、本発明によるはんだバンプ形成方法
を説明する実施例を示す図である。（Ａ）に示されるよ
うに、平坦な表面１０ａに複数の等しい形状の窪み１２
を有する板部材１０を準備する。窪み１２は、図２に示
されるように例えば２００μｍのピッチでマトリックス
状に設けてある。実施例においては、板部材１０は、平
坦な表面１０ａが〈１００〉となるシリコンの板で作ら
れ、平坦な表面１０ａに異方性エッチングを行うことに
より窪み１２を形成した。エッチングにおいては、正方
形の開口部を有するレジストを使用したので、一辺２０
０μｍの四角錐形の窪み１２が形成された。FIG. 1 is a diagram showing an embodiment for explaining a solder bump forming method according to the present invention. As shown in (A), a plurality of equal shaped depressions 12 are formed on the flat surface 10a.
The plate member 10 having the is prepared. The depressions 12 are provided in a matrix at a pitch of, for example, 200 μm as shown in FIG. In the embodiment, the plate member 10 is made of a silicon plate having a flat surface 10a of <100>, and the recess 12 is formed by anisotropically etching the flat surface 10a. In the etching, since a resist having a square opening was used, one side 20
A 0 μm quadrangular pyramid-shaped depression 12 was formed.

【００１６】板部材１０はシリコン、ステンレス、クロ
ム、ガラス、セラミック、チタン等のはんだ濡れ性の劣
る材料で形成されることが好ましく、あるいはその表面
にクロム、チタン、ＳｉＯ2 等のはんだ濡れ性の劣る材
料を被覆されるのが好ましい。The plate member 10 is preferably formed of a material having poor solder wettability such as silicon, stainless steel, chromium, glass, ceramics, titanium, or the surface of the plate member 10 having solder wettability such as chromium, titanium or SiO 2 . It is preferably coated with inferior materials.

【００１７】図３及び図４に示す例においては、板部材
１０は、耐熱性の優れたステンレス鋼の板（ＳＵＳ３０
４）で作られ、放電加工によって窪み１２を形成した
後、表面を酸化膜処理してある。窪み１２は直径２００
μｍの円形であり、深さが５０μｍである。窪み１２の
形状は深さが深くなるにつれて直径が小さくなってい
る。放電加工の代わりに、エッチング等の他の手段を用
いることもできる。In the example shown in FIGS. 3 and 4, the plate member 10 is a stainless steel plate (SUS30) having excellent heat resistance.
4), the recess 12 is formed by electric discharge machining, and then the surface is treated with an oxide film. The depression 12 has a diameter of 200
It has a circular shape of μm and a depth of 50 μm. The shape of the depression 12 has a smaller diameter as the depth increases. Instead of electrical discharge machining, other means such as etching can be used.

【００１８】図１（Ａ）に示されるように、板部材１０
を準備した後、はんだペースト１４を板部材１０の窪み
１２に充填する。はんだペースト１４ははんだ粒子１６
とフラックス１５とからなり、フラックス１５は松脂
や、活性剤や、有機溶剤などを含む。はんだ粒子１６は
はんだペースト中に非常に高い密度で配置され、よって
はんだペースト１４中にはんだ成分が均一に分布してい
る。はんだは、公知の金属、例えばＰｂ、Ｓｎ、Ｉｎ，
Ｂｉ及びそれらの合金等を使用することができる。実施
例では、Ｐｂ─５Ｓｎのはんだ粉末（粒径１０〜２５μ
ｍ）をロジンとグリコール系溶剤からなるフラックスビ
ヒクルと混練し、粘度５００ポイズのはんだペースト１
４を作製した。As shown in FIG. 1A, the plate member 10
Then, the solder paste 14 is filled in the recess 12 of the plate member 10. Solder paste 14 is solder particles 16
And flux 15, which contains pine resin, activator, organic solvent, and the like. The solder particles 16 are arranged in the solder paste with a very high density, so that the solder components are uniformly distributed in the solder paste 14. Solder is a known metal such as Pb, Sn, In,
Bi and their alloys can be used. In the examples, Pb-5Sn solder powder (particle size 10 to 25 μm
m) is kneaded with a flux vehicle composed of rosin and a glycol-based solvent, and a solder paste 1 having a viscosity of 500 poise
4 was produced.

【００１９】はんだペースト１４の充填は、スキージ１
８を板部材１０の平坦な表面１０ａに沿って例えば矢印
Ａの方向に摺動させることによって行われる。板部材１
０の窪み１２の体積は全て等しいので、窪み１２の中の
はんだペースト１４の体積も全て等しい。はんだペース
ト１４の中には、はんだ粒子１６が実質的に均一に分布
しているので、窪み１２の中のはんだ粒子１６の体積も
実質的に全て等しい。The squeegee 1 is filled with the solder paste 14.
8 is slid along the flat surface 10a of the plate member 10 in the direction of arrow A, for example. Plate member 1
Since the volumes of the recesses 12 of 0 are all the same, the volumes of the solder paste 14 in the recesses 12 are also the same. Since the solder particles 16 are distributed substantially uniformly in the solder paste 14, the volume of the solder particles 16 in the depressions 12 is also substantially all the same.

【００２０】はんだペースト１４がスキージ１８によっ
て窪み１２に充填された後、ナイフエッジ２２が矢印Ａ
の方向に摺動せしめられる。ここでは、ナイフエッジ２
２とは単にエッジ先端だけでなく、エッジ先端を支える
本体部分を含むものとする。ナイフエッジ２２は板部材
１０との間で摺動方向Ａに向かってとった角度αが鈍角
となるように配置され、すなわち、ナイフエッジ２２は
エッジ先端が進行方向に向いている。ナイフエッジ２２
はスキージ１８よりも硬質の材料でスキージ１８よりも
鋭利に作られ、板部材１０の表面１０ａに付着している
はんだペーストを確実に剥ぎ取ることができ、且つ板部
材１０の表面１０ａの窪み１２の周辺部に盛り上がった
余分なはんだペースト１４があると、それを剥がしてよ
り正確な計量を行う。After the solder paste 14 is filled into the depression 12 by the squeegee 18, the knife edge 22 is changed to the arrow A.
It can be slid in the direction of. Here, knife edge 2
The term "2" includes not only the edge tip, but also a body portion that supports the edge tip. The knife edge 22 is arranged such that the angle α taken in the sliding direction A with the plate member 10 is an obtuse angle, that is, the knife edge 22 has its edge tip oriented in the traveling direction. Knife edge 22
Is made of a material harder than the squeegee 18 and sharper than the squeegee 18, so that the solder paste adhering to the surface 10a of the plate member 10 can be reliably peeled off, and the recess 12 of the surface 10a of the plate member 10 can be removed. If there is extra solder paste 14 that has risen around the periphery of the, the solder paste is peeled off and more accurate weighing is performed.

【００２１】スキージ１８は例えば硬質ウエタン等のエ
ラストマー又は金属で作られ、ナイフエッジ２２は例え
ばセラミック又は金属で作られる。板部材１０はサラミ
ックで作られており、これはナイフエッジ２２よりも硬
いので、ナイフエッジ２２で板部材１０を擦っても、板
部材１０は傷つかず、付着したはんだペースト１４のみ
が除去されることになる。The squeegee 18 is made of, for example, an elastomer or metal such as hard wettan, and the knife edge 22 is made of, for example, ceramic or metal. Since the plate member 10 is made of salamic and is harder than the knife edge 22, even if the plate member 10 is rubbed with the knife edge 22, the plate member 10 is not damaged, and only the attached solder paste 14 is removed. It will be.

【００２２】従って、板部材１０の表面１０ａのはんだ
ペースト１４の付着が防止され、はんだペースト１４は
板部材１０の窪み１２において正確に計量される。こう
して計量されたはんだペースト１４は種々の方法で使用
されることができる。例えば、上記特開平６─１２４９
５３号公報に記載されているように、金パンプを有する
半導体装置をこの板部材１０に近づけて、半導体装置の
金バンプを各窪み１２のはんだペースト１４に差し込
み、それから半導体装置をこの板部材１０から遠ざける
と、はんだペースト１４が半導体装置の金バンプに付着
する（転写される）。Therefore, the adhesion of the solder paste 14 on the surface 10a of the plate member 10 is prevented, and the solder paste 14 is accurately measured in the recess 12 of the plate member 10. The solder paste 14 thus measured can be used in various ways. For example, the above-mentioned JP-A-6-1249.
As described in Japanese Patent Publication No. 53-53, a semiconductor device having a gold pump is brought close to the plate member 10, gold bumps of the semiconductor device are inserted into the solder paste 14 of each depression 12, and then the semiconductor device is mounted on the plate member 10. The solder paste 14 adheres (transfers) to the gold bumps of the semiconductor device when it is moved away from the semiconductor device.

【００２３】実施例においては、計量されたはんだペー
スト１４をはんだボール２０として使用する。図１
（Ｂ）に示されるように、板部材１０をはんだの融点以
上（例えば３５０℃）にまで加熱すると、はんだペース
ト１４中のはんだ粒子１６が溶融し、はんだが表面張力
により丸まって各窪み内１２内に１つのはんだボール２
０が形成される。フラックス１５ははんだボール２０と
は分離される。In the embodiment, the measured solder paste 14 is used as the solder ball 20. FIG.
As shown in (B), when the plate member 10 is heated to a temperature equal to or higher than the melting point of the solder (for example, 350 ° C.), the solder particles 16 in the solder paste 14 are melted and the solder is curled due to the surface tension and the inside of each recess 12 1 solder ball in 2
0 is formed. The flux 15 is separated from the solder balls 20.

【００２４】次に、図１（Ｃ）に示されるように、電極
パッド２４を備えた半導体チップ２２を板部材１０に相
対的に近づけて、電極パッド２４を加熱されたはんだボ
ール２０に突き当て、はんだボール２０を板部材１０か
ら電極パッド２４に転写する。板部材１０は電極パッド
２４よりもはんだ濡れ性の劣る材料で形成され、又は被
覆されているので、はんだボール２０は板部材１０から
電極パッド２４に容易に転写される（移動する）。Next, as shown in FIG. 1C, the semiconductor chip 22 having the electrode pads 24 is brought relatively close to the plate member 10, and the electrode pads 24 are abutted against the heated solder balls 20. , The solder balls 20 are transferred from the plate member 10 to the electrode pads 24. Since the plate member 10 is formed of or coated with a material having a solder wettability lower than that of the electrode pad 24, the solder balls 20 are easily transferred (moved) from the plate member 10 to the electrode pad 24.

【００２５】板部材１０の窪み１２は、使用すべき半導
体チップ２２の電極パッド２４と同じパターンで設けら
れている。電極パッド２４はシリコン基板上に設けた厚
さが１０００Å／５０００Åの金（Ａｕ）とニッケル
（Ｎｉ）の層からなり、はんだ付け性の優れた構成をと
っている。半導体チップ２２は板部材１０に対して適切
に位置合わせされ、はんだボール２０が電極パッド２４
に付着するようになっている。The depressions 12 of the plate member 10 are provided in the same pattern as the electrode pads 24 of the semiconductor chip 22 to be used. The electrode pad 24 is formed of a layer of gold (Au) and nickel (Ni) having a thickness of 1000 Å / 5000 Å provided on a silicon substrate, and has a structure excellent in solderability. The semiconductor chip 22 is properly aligned with the plate member 10, and the solder ball 20 is attached to the electrode pad 24.
It is designed to adhere to.

【００２６】図１（Ｄ）に示されるように、半導体チッ
プ２２を板部材１０から遠ざけると、はんだボール２０
が半導体チップ２２に付着したはんだバンプとなる。こ
れによって、例えば直径９８μｍの小さなはんだバンプ
を得ることができた。As shown in FIG. 1D, when the semiconductor chip 22 is moved away from the plate member 10, the solder balls 20
Are solder bumps attached to the semiconductor chip 22. As a result, small solder bumps having a diameter of 98 μm, for example, could be obtained.

【００２７】上記実施例においては、半導体チップ２２
にはんだバンプを形成する例を示したが、半導体チップ
２２の代わりに回路基板その他の電気部品にはんだバン
プを形成することもできる。また、はんだバンプを形成
した半導体チップ２２を用いて種々の半導体パッケージ
を製造することができる。In the above embodiment, the semiconductor chip 22
Although the example in which the solder bumps are formed is shown, the solder bumps may be formed on the circuit board or other electric components instead of the semiconductor chip 22. Further, various semiconductor packages can be manufactured using the semiconductor chip 22 on which the solder bumps are formed.

【００２８】例えば、図１０はピングリッドアレイ（Ｐ
ＧＡ）と呼ばれる半導体パッケージであり、セラミック
基板４０の表面には電極パターン又は電極パッド４２が
設けられており、セラミック基板４０の下面からピン４
４が延びている。電極パッド４２はピン４４に接続さ
れ、ピン４４を例えばプリント回路板に取り付けること
により、ＰＧＡをプリント回路板に取り付けることがで
きる。半導体チップ２２は、はんだバンプ（はんだボー
ル）２０が電極パッド４２の上に位置するようにしてＰ
ＧＡ上に位置せしめられ、加熱することにより、はんだ
バンプ（はんだボール）２０を電極パッド４２に溶着さ
せる。最後に樹脂４６により封止を行う。For example, FIG. 10 shows a pin grid array (P
This is a semiconductor package called GA), and an electrode pattern or an electrode pad 42 is provided on the surface of the ceramic substrate 40, and the pins 4 from the lower surface of the ceramic substrate 40.
4 is extended. The electrode pad 42 is connected to the pin 44, and the PGA can be attached to the printed circuit board by attaching the pin 44 to the printed circuit board, for example. The semiconductor chip 22 has a P shape so that the solder bumps (solder balls) 20 are located on the electrode pads 42.
The solder bumps (solder balls) 20 are welded to the electrode pads 42 by being positioned on the GA and heated. Finally, the resin 46 is used for sealing.

【００２９】図１１はボールグリッドアレイ（ＢＧＡ）
と呼ばれる半導体パッケージであり、ＰＧＡの下面のピ
ン４４の代わりに、ボール４８が設けられている。その
他の構成は図１０のＰＧＡと類似している。ボール４８
は、プリント回路板に溶着される。従って、このボール
４８も、はんだバンプの一種であり、図１の方法に従っ
て形成されることができる。FIG. 11 shows a ball grid array (BGA).
In the semiconductor package called, a ball 48 is provided instead of the pin 44 on the lower surface of the PGA. Other configurations are similar to the PGA of FIG. Ball 48
Are welded to the printed circuit board. Therefore, this ball 48 is also a kind of solder bump and can be formed according to the method of FIG.

【００３０】図１２はマルチチップモジュール（ＭＣ
Ｍ）と呼ばれる半導体パッケージである。ＭＣＭは、図
１０のセラミック基板４０と同様のセラミック基板４０
に、半導体チップ２２を複数個含むものである。この場
合にも、はんだバンプ（はんだボール）２０が電極パッ
ド４２に溶着され、樹脂４６により封止される。なお、
ＭＣＭを、図１１のセラミック基板４０と同様のセラミ
ック基板４０で構成してもよい。FIG. 12 shows a multi-chip module (MC
It is a semiconductor package called M). The MCM is a ceramic substrate 40 similar to the ceramic substrate 40 of FIG.
In addition, a plurality of semiconductor chips 22 are included. Also in this case, the solder bumps (solder balls) 20 are welded to the electrode pads 42 and sealed with the resin 46. In addition,
The MCM may be composed of a ceramic substrate 40 similar to the ceramic substrate 40 of FIG.

【００３１】図１３はクワッドフラットパッケージ（Ｑ
ＦＰ）と呼ばれる半導体パッケージである。半導体チッ
プ２２のはんだバンプ（はんだボール）２０は、リード
５０に溶着され、樹脂４６により封止される。FIG. 13 shows a quad flat package (Q
It is a semiconductor package called FP). The solder bumps (solder balls) 20 of the semiconductor chip 22 are welded to the leads 50 and sealed with the resin 46.

【００３２】図１４は、半導体チップ２２をプリント回
路板（ＰＷＢ）５４に取り付けた例を示す図である。プ
リント回路板５４は電極パッド５６を有し、はんだバン
プ（はんだボール）２０はプリント回路板５４の電極パ
ッド５６に溶着される。FIG. 14 is a view showing an example in which the semiconductor chip 22 is attached to a printed circuit board (PWB) 54. The printed circuit board 54 has electrode pads 56, and the solder bumps (solder balls) 20 are welded to the electrode pads 56 of the printed circuit board 54.

【００３３】図１５及び図１６は、ＴＡＢ部品５８には
んだボール２０を設けて、はんだバンプとした例を示す
図である。ＴＡＢ部品５８は中央開口部６０ａを有する
プラスチックのテープ６０にリード６２を取り付けたも
のであり、はんだボール２０はリード６２に取り付けら
れる。電極パッド６６を有する半導体チップ６４がＴＡ
Ｂ部品５８の中央開口部６０ａにおいてリード６２上に
置かれ、はんだボール２０を溶着することによりＴＡＢ
部品５８に取り付けられる。半導体チップ６４は樹脂６
８により封止される。FIGS. 15 and 16 are views showing an example in which the solder balls 20 are provided on the TAB component 58 to form solder bumps. The TAB component 58 is a plastic tape 60 having a central opening 60 a with leads 62 attached thereto, and the solder balls 20 are attached to the leads 62. The semiconductor chip 64 having the electrode pad 66 is TA
It is placed on the lead 62 at the central opening 60a of the B part 58 and the solder ball 20 is welded to the TAB.
It is attached to the part 58. The semiconductor chip 64 is made of resin 6
It is sealed by 8.

【００３４】図１７は図１（Ｂ）の段階で形成されたは
んだボール２０を冷却した後にそのまま取り出して使用
する例を示す図である。はんだボール２０は容器７６に
集められ、半導体チップや回路基板に付着せしめられ
る。FIG. 17 is a diagram showing an example in which the solder ball 20 formed in the step of FIG. 1B is cooled and then taken out and used as it is. The solder balls 20 are collected in a container 76 and attached to a semiconductor chip or a circuit board.

【００３５】図５及び図６は、本発明によるはんだバン
プ形成方法を実施するのに適した装置を示す図である。
この装置は、図１の板部材１０を支持するステージ２６
と、このステージ２６を取り付けるための本体フレーム
２７とを有する。ステージ２６はねじ２８によって本体
フレーム２７に固定されようになっている。5 and 6 are views showing an apparatus suitable for carrying out the solder bump forming method according to the present invention.
This apparatus includes a stage 26 that supports the plate member 10 of FIG.
And a main body frame 27 for attaching the stage 26. The stage 26 is adapted to be fixed to the main body frame 27 by screws 28.

【００３６】ステージ２６は、板部材１０を支持する中
央の第１の支持面２９と、第１の支持面２９よりも高く
て板部材１０が第１の支持面２９上に位置せしめられた
ときに板部材１０の表面１０ａとほぼ同じ高さになる周
辺部の第２の支持面３０とを有する。ただし、板部材１
０の表面１０ａは第２の支持面３０よりもわずかに高い
（例えば、１０〜１００μｍ）方がよい。The stage 26 has a central first supporting surface 29 for supporting the plate member 10, and is higher than the first supporting surface 29 so that the plate member 10 is positioned on the first supporting surface 29. In addition, the second support surface 30 in the peripheral portion having substantially the same height as the surface 10a of the plate member 10 is provided. However, plate member 1
The surface 10a of 0 should be slightly higher than the second support surface 30 (for example, 10 to 100 μm).

【００３７】第１の支持面２９には、真空チャックを構
成する真空通路３１が開口し、真空通路３１は図示しな
い真空源に接続される。また、第１の支持面２９と第２
の支持面３０との間には、ペーストかす受け穴３２が設
けられる。第２の支持面３０は第１の支持面２９に支持
された板部材１０との間の間隙ができるだけ小さくなる
ようになっているが、この間隙を０にすることはできな
いので、スキージ１８が第２の支持面３０から第１の支
持面２９上の板部材１０の表面１０ａへ動かされるとき
にこの間隙から洩れたはんだペーストがペーストかす受
け穴３６に溜まる。A vacuum passage 31 forming a vacuum chuck is opened in the first support surface 29, and the vacuum passage 31 is connected to a vacuum source (not shown). In addition, the first support surface 29 and the second support surface 29
A paste residue receiving hole 32 is provided between the support surface 30 and the support surface 30. Although the gap between the second support surface 30 and the plate member 10 supported by the first support surface 29 is made as small as possible, this gap cannot be set to 0, so that the squeegee 18 is The solder paste leaking from this gap when being moved from the second support surface 30 to the surface 10a of the plate member 10 on the first support surface 29 is collected in the paste residue receiving hole 36.

【００３８】この装置においては、十分な量のはんだペ
ースト１４がスキージ１８とともに第２の支持面３０に
載置されており、スキージ１８は第２の支持面３４から
第１の支持面２９上の板部材１０の表面１０ａへ、さら
に板部材１０の表面１０ａからその先の第２の支持面３
４へ連続的に摺動せしめられる。このスキージ１８の移
動行程がＰによって示されている。In this apparatus, a sufficient amount of the solder paste 14 is placed on the second supporting surface 30 together with the squeegee 18, and the squeegee 18 moves from the second supporting surface 34 to the first supporting surface 29. To the surface 10a of the plate member 10, and further from the surface 10a of the plate member 10 to the second support surface 3 beyond that.
4 is continuously slid. The moving stroke of the squeegee 18 is indicated by P.

【００３９】一方、ナイフエッジ２２はスキージ１８に
追従して動かされるが、最初は第２の支持面３０の上方
の位置にあって、第２の支持面３０の上方の位置から板
部材１０の表面１０ａの上方の位置へ達した後、板部材
１０の表面１０ａへ向かって下降せしめられ、板部材１
０の表面１０ａに圧接される。これによって、ナイフエ
ッジ２２が第２の支持面３０と第１の支持面２０に支持
された板部材１０との間の間隙に引っ掛からないように
している。なお、スキージ１８は図１に示されるように
双方向性であり、はんだペースト１４を押しながら矢印
Ａの方向に移動でき、また板部材１０の表面１０ａを通
り過ぎた後ではんだペースト１４を押しながら逆の方向
に移動できる。この場合、ナイフエッジ２２はスキージ
１８の最後のストロークの後で降下される。On the other hand, the knife edge 22 is moved following the squeegee 18, but initially at a position above the second supporting surface 30 and from the position above the second supporting surface 30 to the plate member 10. After reaching the position above the surface 10a, the plate member 10 is lowered toward the surface 10a, and the plate member 1
It is pressed against the 0 surface 10a. This prevents the knife edge 22 from getting caught in the gap between the second supporting surface 30 and the plate member 10 supported by the first supporting surface 20. The squeegee 18 is bidirectional as shown in FIG. 1, and can move in the direction of arrow A while pressing the solder paste 14, and while pressing the solder paste 14 after passing the surface 10a of the plate member 10. You can move in the opposite direction. In this case, the knife edge 22 is lowered after the last stroke of the squeegee 18.

【００４０】図７は、本発明の第２実施例を示し、図６
の装置と類似している。図７においては、ステージ１０
は第１の支持面２９と第２の支持面３０とを含むが、第
１の支持面２９の縁部はスキージ１８の移動方向Ａに対
して斜めに形成されている。つまり、上方から見て、ス
キージ１８は第１の支持面２９上の板部材１０に対して
所定の角度で配置されている。従って、スキージ１８
が、矢印Ａの方向に、第２の支持面３４から第１の支持
面２９上の板部材１０の表面１０ａへ、さらに板部材１
０の表面１０ａからその先の第２の支持面３４へ連続的
に摺動せしめられるときに、スキージ１８が第２の支持
面３０と板部材１０の表面１０ａとの間の間隙でひっか
かりにくいようになっている。FIG. 7 shows a second embodiment of the present invention, and FIG.
Is similar to the device. In FIG. 7, the stage 10
Includes a first support surface 29 and a second support surface 30, but an edge portion of the first support surface 29 is formed obliquely with respect to the moving direction A of the squeegee 18. That is, when viewed from above, the squeegee 18 is arranged at a predetermined angle with respect to the plate member 10 on the first support surface 29. Therefore, the squeegee 18
In the direction of arrow A, from the second support surface 34 to the surface 10a of the plate member 10 on the first support surface 29, and further to the plate member 1
The squeegee 18 is unlikely to be caught in the gap between the second support surface 30 and the surface 10a of the plate member 10 when continuously slid from the zero support surface 10a to the second support surface 34 ahead thereof. It has become.

【００４１】図８は本発明の第３実施例を示し、図５の
実施例と同様に、板部材１０を支持するステージ２６
と、このステージ２６を取り付けるための本体フレーム
２７とを有する。ステージ２６はガイドロッド３３及び
送りねじ３４によって本体フレーム２７に昇降可能に支
持される。駆動手段３５は送りねじ３４に係合するナッ
トとモータを含む。FIG. 8 shows a third embodiment of the present invention, and similarly to the embodiment of FIG. 5, a stage 26 for supporting the plate member 10.
And a main body frame 27 for attaching the stage 26. The stage 26 is supported by the main body frame 27 so as to be able to move up and down by the guide rod 33 and the feed screw 34. The drive means 35 includes a nut that engages the lead screw 34 and a motor.

【００４２】ステージ２６が板部材１０を支持する中央
の第１の支持面２９を提供し、本体フレーム２７の一部
が板部材１０の表面１０ａとほぼ同じ高さになる第２の
支持面３０を提供する。さらに、アダプタ３６が第２の
支持面３０の一部を形成するように本体フレーム２７に
脱着可能に取り付けられている。アダプタ３６は板部材
１０の種類に応じて取り替えられることができる。The stage 26 provides a central first support surface 29 for supporting the plate member 10, and a second support surface 30 where a part of the main body frame 27 is substantially level with the surface 10a of the plate member 10. I will provide a. Further, the adapter 36 is detachably attached to the body frame 27 so as to form a part of the second support surface 30. The adapter 36 can be replaced depending on the type of the plate member 10.

【００４３】さらに、図９に示されるように、ステージ
２６に支持された板部材１０の表面１０ａの高さを検出
する検出手段３７が設けられる。この検出手段３７は回
転可能な支持部材３８に取り付けられた高さ検出カメラ
であり、検出手段３７からの信号を受けて、すなわち、
板部材１０の表面１０ａとアダプタ３６の表面との境界
部において両者にピントが合うように、駆動手段３５に
よってステージ２６の高さ位置を移動させる。アダプタ
３６がない場合には、板部材１０の表面１０ａと第２の
支持面３０を形成する本体フレーム２７の部分の表面の
高さを合わせる。そして、この場合にも、板部材１０の
表面１０ａは第２の支持面３０よりもわずかに高い方が
よい。Further, as shown in FIG. 9, detection means 37 for detecting the height of the surface 10a of the plate member 10 supported by the stage 26 is provided. The detection means 37 is a height detection camera attached to a rotatable support member 38, and receives a signal from the detection means 37, that is,
The height position of the stage 26 is moved by the driving means 35 so that the surface 10a of the plate member 10 and the surface of the adapter 36 are in focus at the boundary between them. If the adapter 36 is not provided, the heights of the surface 10a of the plate member 10 and the surface of the portion of the main body frame 27 forming the second support surface 30 are matched. Also in this case, the surface 10a of the plate member 10 should be slightly higher than the second support surface 30.

【００４４】図８に示されるように、本体フレーム２７
の上方には、キャリッジ８１及び送りねじ８２が設けら
れている。キャリッジ８１と送りねじ８２との間には、
送りねじ８２に係合するナットとモータを含む駆動手段
８３が設けられる。実施例においては、２つのスキージ
１８がそれぞれエアシリンダ８４によってキャリッジ８
１に支持され、またナイフエッジ２２はエアシリンダ８
５によってキャリッジ８１に支持される。エアシリンダ
８４、８５はそれぞれ独立に制御される。As shown in FIG. 8, the main body frame 27
A carriage 81 and a feed screw 82 are provided above. Between the carriage 81 and the feed screw 82,
Drive means 83 is provided that includes a nut and a motor that engages the lead screw 82. In the embodiment, the two squeegees 18 are respectively attached to the carriage 8 by the air cylinder 84.
1, the knife edge 22 is supported by the air cylinder 8
5 is supported by the carriage 81. The air cylinders 84 and 85 are independently controlled.

【００４５】スキージ１８は、エアシリンダ８４によっ
て板部材１０に向かって昇降せしめられ、且つ送りねじ
８２によって矢印Ｂの方向及び逆方向に移動せしめられ
る。すなわち、スキージ１８は、板部材１０が第１の支
持面２９に支持された状態で板部材１０の表面１０ａに
沿って摺動せしめられる。同様に、ナイフエッジ２２
は、エアシリンダ８５及び送りねじ８２によって、板部
材１０の表面１０ａに沿って摺動せしめられ、板部材１
０の表面１０ａに付着したはんだペーストを剥ぎ取る。
なお、ナイフエッジ２２は、板部材１０との間で摺動方
向Ｂに向かってとった角度が鈍角となるように取り付け
られている。The squeegee 18 is moved up and down toward the plate member 10 by the air cylinder 84, and is moved in the direction of arrow B and the opposite direction by the feed screw 82. That is, the squeegee 18 is slid along the surface 10 a of the plate member 10 with the plate member 10 supported by the first support surface 29. Similarly, knife edge 22
Is slid along the surface 10a of the plate member 10 by the air cylinder 85 and the feed screw 82, and the plate member 1
The solder paste adhering to the 0 surface 10a is stripped off.
The knife edge 22 is attached such that the angle formed between the knife edge 22 and the plate member 10 in the sliding direction B is an obtuse angle.

【００４６】[0046]

【発明の効果】以上説明したように、本発明によれば、
窪みを有する板部材及びスキージを用い、さらにナイフ
エッジを用いて、一定の大きさのはんだバンプを、大量
に且つ簡単に形成することができる。As described above, according to the present invention,
By using a plate member having a depression and a squeegee, and further using a knife edge, a large number of solder bumps of a certain size can be easily formed.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明によるはんだバンプ形成方法を説明する
実施例を示す図である。FIG. 1 is a diagram showing an embodiment for explaining a solder bump forming method according to the present invention.

【図２】図１の板部材を示す平面図である。FIG. 2 is a plan view showing the plate member of FIG.

【図３】板部材の他の例を示す断面図である。FIG. 3 is a cross-sectional view showing another example of the plate member.

【図４】図３の板部材の平面図である。FIG. 4 is a plan view of the plate member shown in FIG.

【図５】板部材を支持するステージを示す断面図であ
る。FIG. 5 is a cross-sectional view showing a stage that supports a plate member.

【図６】図５の装置の平面図である。6 is a plan view of the device of FIG.

【図７】本発明の第２実施例を示す平面図である。FIG. 7 is a plan view showing a second embodiment of the present invention.

【図８】本発明の第３実施例を示す断面図である。FIG. 8 is a sectional view showing a third embodiment of the present invention.

【図９】高さ調節手段を示す側面図である。FIG. 9 is a side view showing height adjusting means.

【図１０】はんだバンプを使用したＰＧＡの例を示す断
面図である。FIG. 10 is a cross-sectional view showing an example of PGA using solder bumps.

【図１１】はんだバンプを使用したＢＧＡの例を示す断
面図である。FIG. 11 is a cross-sectional view showing an example of BGA using solder bumps.

【図１２】はんだバンプを使用したＭＣＭの例を示す断
面図である。FIG. 12 is a cross-sectional view showing an example of an MCM using solder bumps.

【図１３】はんだバンプを使用したＱＦＰの例を示す断
面図である。FIG. 13 is a cross-sectional view showing an example of QFP using solder bumps.

【図１４】はんだバンプを使用したプリント回路板の例
を示す断面図である。FIG. 14 is a cross-sectional view showing an example of a printed circuit board using solder bumps.

【図１５】はんだバンプを使用したＴＡＢ部品の例を示
す断面図である。FIG. 15 is a cross-sectional view showing an example of a TAB component using solder bumps.

【図１６】図１４のＴＡＢ部品に半導体チップを取り付
けた例を示す断面図である。16 is a sectional view showing an example in which a semiconductor chip is attached to the TAB component of FIG.

【図１７】取り出されたはんだボールを示す図である。FIG. 17 is a view showing a solder ball taken out.

【符号の説明】 １０…板部材 １２…窪み １４…はんだペースト １８…スキージ ２２…ナイフエッジ ２６…ステージ[Explanation of Codes] 10 ... Plate Member 12 ... Dimple 14 ... Solder Paste 18 ... Squeegee 22 ... Knife Edge 26 ... Stage

Claims (9)

【特許請求の範囲】[Claims] 【請求項１】 平坦な表面（１０ａ）に複数の窪み（１
２）を有する板部材（１０）を準備し、 該板部材の表面に沿ってスキージ（１８）を摺動させて
前記表面に供給されたはんだペースト（１４）を前記窪
みに充填し、 該板部材との間で摺動方向に向かってとった角度が鈍角
となるように硬質のナイフエッジ（２２）を該板部材の
表面に沿って摺動させ、該板部材の表面に残留するはん
だペーストを剥ぎ取り、 該板部材（１０）を加熱して各窪み（１２）内のはんだ
ペースト（１４）中に含まれるはんだ粒子が溶融して表
面張力により丸まったはんだボール（２０）を形成する
ことを特徴とするはんだバンプ形成方法。1. A plurality of depressions (1) on a flat surface (10a).
A plate member (10) having 2) is prepared, and a squeegee (18) is slid along the surface of the plate member to fill the depressions with the solder paste (14) supplied to the surface. The hard knife edge (22) is slid along the surface of the plate member so that the angle formed in the sliding direction with the member is an obtuse angle, and the solder paste remaining on the surface of the plate member Peeling off and heating the plate member (10) to melt the solder particles contained in the solder paste (14) in each depression (12) to form a solder ball (20) rounded by surface tension. A method for forming solder bumps, which comprises: 【請求項２】 はんだバンプを形成すべき部材（２２）
を該板部材（１０）に相対的に近づけて加熱されたはん
だボール（２０）を該板部材（１０）から該はんだバン
プを形成すべき部材（２２）に転写することを特徴とす
る請求項１に記載のはんだバンプ形成方法。2. A member (22) for forming a solder bump.
The solder balls (20) heated by bringing the solder balls relatively close to the plate member (10) are transferred from the plate member (10) to the member (22) on which the solder bumps are to be formed. 1. The method for forming solder bumps according to 1. 【請求項３】 該板部材の表面に沿ってスキージを摺動
させる工程において、該板部材（１０）を、該板部材を
支持する第１の支持面（２９）と、該第１の支持面より
も高くて該板部材が該第１の支持面上に位置せしめられ
たときに該板部材の表面とほぼ同じ高さになる第２の支
持面（３０）とを有する支持手段（２６、２７）に支持
し、該スキージ（１８）を該第２の支持面から該板部材
の表面へ連続的に摺動させることを特徴とする請求項１
に記載のはんだバンプ形成方法。3. In the step of sliding a squeegee along the surface of the plate member, the plate member (10) is provided with a first support surface (29) for supporting the plate member and the first support surface. Support means (26) having a second support surface (30) which is higher than the surface and is approximately level with the surface of the plate member when the plate member is positioned on the first support surface. , 27) and sliding the squeegee (18) continuously from the second support surface to the surface of the plate member.
The method for forming solder bumps according to. 【請求項４】 該板部材の表面に沿ってスキージを摺動
させる工程において、上方から見て、該スキージ（１
８）を該板部材に対して所定の角度で配置することを特
徴とする請求項３に記載のはんだバンプ形成方法。4. In the step of sliding the squeegee along the surface of the plate member, the squeegee (1
The solder bump forming method according to claim 3, wherein 8) is arranged at a predetermined angle with respect to the plate member. 【請求項５】 平坦な表面（１０ａ）に複数の窪み（１
２）を有する板部材（１０）を支持する支持手段（２
６、２７）と、 はんだペースト（１４）を前記窪み（１２）に充填する
ためのスキージ（１８）と、 該板部材（１０）が該支持手段に支持された状態で該板
部材の表面に沿って該スキージ（１８）を摺動させるこ
とができるように該スキージを支持するスキージ支持手
段（８１、８２、８４）と、 該板部材の表面の前記窪みの周辺に付着するはんだペー
ストを剥ぎ取るための硬質のナイフエッジ（２２）と、 該板部材（１０）との間で摺動方向に向かってとった角
度が鈍角となるように該ナイフエッジ（２２）を該板部
材の表面に沿って摺動させることができるように該ナイ
フエッジを支持するナイフエッジ支持手段（８１、８
２、８５）とを備えたことを特徴とするはんだバンプ形
成装置。5. A plurality of depressions (1) on a flat surface (10a).
Support means (2) for supporting a plate member (10) having 2)
6, 27), a squeegee (18) for filling the recess (12) with the solder paste (14), and the plate member (10) on the surface of the plate member while being supported by the supporting means. Squeegee support means (81, 82, 84) for supporting the squeegee so that the squeegee (18) can be slid along, and peeling off the solder paste adhering to the periphery of the recess on the surface of the plate member. The knife edge (22) is formed on the surface of the plate member so that the angle formed between the hard knife edge (22) for taking and the plate member (10) in the sliding direction is an obtuse angle. Knife edge support means (81, 8) for supporting the knife edge so that it can be slid along.
2.85) and a solder bump forming apparatus. 【請求項６】 該ナイフエッジ（２２）が該スキージ
（１８）の摺動方向からみて該スキージの後方に配置さ
れることを特徴とする請求項５に記載のはんだバンプ形
成装置。6. The solder bump forming apparatus according to claim 5, wherein the knife edge (22) is arranged behind the squeegee when viewed from the sliding direction of the squeegee (18). 【請求項７】 該支持手段が、該板部材（１０）を支持
する第１の支持面（２９）と、該第１の支持面よりも高
くて該板部材が該第１の支持面上に位置せしめられたと
きに該板部材の表面とほぼ同じ高さになる第２の支持面
（３０）とを有し、該スキージが該第２の支持面から該
板部材の表面へ連続的に摺動せしめられることを特徴と
する請求項５に記載のはんだバンプ形成装置。7. The first supporting surface (29) for supporting the plate member (10), and the plate member being higher than the first supporting surface so that the plate member is on the first supporting surface. A second support surface (30) that is substantially level with the surface of the plate member when positioned at the squeegee, the squeegee being continuous from the second support surface to the surface of the plate member. The solder bump forming apparatus according to claim 5, wherein the solder bump forming apparatus is slidably mounted on the solder bump forming apparatus. 【請求項８】 該ナイフエッジ（２２）を該第２の支持
面に対して昇降させる駆動手段（３４、３５）を備え、
該ナイフエッジが該第２の支持面の上方の位置から該板
部材の表面の上方の位置へ達した後、該板部材の表面へ
向かって下降せしめられ、該板部材の表面に圧接される
ようにしたことを特徴とする請求項７に記載のはんだバ
ンプ形成装置。8. A drive means (34, 35) for raising and lowering the knife edge (22) relative to the second support surface,
After the knife edge reaches a position above the surface of the plate member from a position above the second support surface, it is lowered toward the surface of the plate member and pressed against the surface of the plate member. The solder bump forming apparatus according to claim 7, wherein the solder bump forming apparatus is configured as described above. 【請求項９】 該支持手段の該第１の支持面（２９）が
昇降可能な支持部材の表面であり、該第１の支持面に支
持された板部材の表面の高さを検出する検出手段（３
７）を備え、前記駆動手段は前記検出手段からの信号を
受けて該昇降可能な支持部材を所定の高さ位置に移動さ
せることを特徴とする請求項７に記載のはんだバンプ形
成装置。9. The detection for detecting the height of the surface of the plate member supported by the first support surface, wherein the first support surface (29) of the support means is a surface of a support member that can be raised and lowered. Means (3
8. The solder bump forming apparatus according to claim 7, further comprising 7), wherein the drive means receives the signal from the detection means and moves the vertically movable support member to a predetermined height position.
JP14596295A 1994-01-20 1995-06-13 Solder bump forming method and apparatus Expired - Fee Related JP3305162B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14596295A JP3305162B2 (en) 1995-06-13 1995-06-13 Solder bump forming method and apparatus
US08/516,284 US6025258A (en) 1994-01-20 1995-08-17 Method for fabricating solder bumps by forming solder balls with a solder ball forming member
US08/659,356 US6319810B1 (en) 1994-01-20 1996-06-06 Method for forming solder bumps
US09/118,064 US6271110B1 (en) 1994-01-20 1998-07-17 Bump-forming method using two plates and electronic device
US09/749,521 US6528346B2 (en) 1994-01-20 2000-12-28 Bump-forming method using two plates and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14596295A JP3305162B2 (en) 1995-06-13 1995-06-13 Solder bump forming method and apparatus

Publications (2)

Publication Number Publication Date
JPH08340001A true JPH08340001A (en) 1996-12-24
JP3305162B2 JP3305162B2 (en) 2002-07-22

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Country Link
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936118A (en) * 1995-07-24 1997-02-07 Fujitsu Ltd Manufacture of semiconductor device and semiconductor device
US6335271B1 (en) 1997-08-19 2002-01-01 Hitachi, Ltd. Method of forming semiconductor device bump electrodes
US6454159B1 (en) 1999-08-18 2002-09-24 International Business Machines Corporation Method for forming electrical connecting structure
US6528346B2 (en) 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
EP1074844A3 (en) * 1999-08-03 2003-08-06 Lucent Technologies Inc. Testing integrated circuits
KR20030070342A (en) * 2002-02-25 2003-08-30 최록일 Solder ball forming apparatus of semiconductor device and mounting method thereof
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
US6965166B2 (en) 1999-02-24 2005-11-15 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure
JP2008536113A (en) * 2005-04-08 2008-09-04 ブール メディカル アーベー Equipment for filling sample metering instruments
US7560374B2 (en) 2006-06-19 2009-07-14 Samsung Electronics Co., Ltd. Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
KR100955605B1 (en) * 2008-04-18 2010-05-03 주식회사 에이디피엔지니어링 Method for removing of extra solder in template for forming solder bump, and method for forming solder bump
KR101036190B1 (en) * 2008-04-18 2011-05-23 엘아이지에이디피 주식회사 Method for forming solder bump
JPWO2015052780A1 (en) * 2013-10-08 2017-03-09 リンテック株式会社 Manufacturing method of electronic component mounting body

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6528346B2 (en) 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JPH0936118A (en) * 1995-07-24 1997-02-07 Fujitsu Ltd Manufacture of semiconductor device and semiconductor device
US6335271B1 (en) 1997-08-19 2002-01-01 Hitachi, Ltd. Method of forming semiconductor device bump electrodes
US6965166B2 (en) 1999-02-24 2005-11-15 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure
US7307349B2 (en) 1999-02-24 2007-12-11 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
EP1074844A3 (en) * 1999-08-03 2003-08-06 Lucent Technologies Inc. Testing integrated circuits
US6454159B1 (en) 1999-08-18 2002-09-24 International Business Machines Corporation Method for forming electrical connecting structure
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
KR20030070342A (en) * 2002-02-25 2003-08-30 최록일 Solder ball forming apparatus of semiconductor device and mounting method thereof
JP2008536113A (en) * 2005-04-08 2008-09-04 ブール メディカル アーベー Equipment for filling sample metering instruments
US7560374B2 (en) 2006-06-19 2009-07-14 Samsung Electronics Co., Ltd. Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
KR100955605B1 (en) * 2008-04-18 2010-05-03 주식회사 에이디피엔지니어링 Method for removing of extra solder in template for forming solder bump, and method for forming solder bump
KR101036190B1 (en) * 2008-04-18 2011-05-23 엘아이지에이디피 주식회사 Method for forming solder bump
JPWO2015052780A1 (en) * 2013-10-08 2017-03-09 リンテック株式会社 Manufacturing method of electronic component mounting body

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