JPH08337880A - Method for roughening adhesive for electroless plating and production of printed circuit board - Google Patents

Abstract

PURPOSE: To impart practicable peeling strength to a substrate with low pollution by forming an adhesive layer consisting of an amino resin granular material and a heat resistant resin on the substrate and roughening its surface with an acid and an alkaline soln. of permanganate. CONSTITUTION: Adhesives 4 for electroless plating consisting of the amino resin granular material 3 and the heat resistant resin 2 (epoxy resin, etc.) and are formed on the substrate 1 are polished to expose the amino resin particles 3 on the surface. This surface is treated by using an acid (phosphoric acid, etc.), by which the particle materials 3 are dissolved away and primary anchors 5 are formed. The surface is then treated with the alkaline soln. of permanganate, by which the heat resistant resin surfaces are dissolved and the particle materials 3 are exposed again. The surface is thereafter treated with the acid again to dissolve the particle materials 3 to form secondary anchors 6, by which the surface is roughened and the peeling strength is substantially imparted to the surface. The surface of such substrate 1 is provided with a plating resist 7 and is subjected to electroless plating, by which conductor circuits 8 are formed. As a result, a printed circuit board having excellent insulation reliability and mass productivity is obtd.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for roughening an adhesive for electroless plating containing a particulate substance composed of an amino resin and a method for producing a printed wiring board using the same, and particularly, insulation reliability. It is a method of manufacturing a printed wiring board that is excellent in heat resistance and mass productivity, and has low pollution and practical peel strength.

[0002]

2. Description of the Related Art In recent years, with the progress of the electronic industry, miniaturization and speeding up of electrical equipment have been promoted. Therefore, even in printed wiring boards and wiring boards on which LSIs are mounted, high density and high reliability are achieved by fine patterns. Is required. In order to meet such a demand, a printed wiring board by the additive method has been proposed. In this additive printed wiring board, an adhesive layer for electroless plating is formed on a substrate made of glass epoxy or the like, and a conductor pattern is further formed thereon by electroless plating.

Various types of adhesives for electroless plating have been proposed. Basically, a particulate substance is dispersed in a resin matrix, which is cured, and then only the particulate substance is dissolved with an acid or an oxidizing agent. It is removed to form a roughened surface on the surface. By subjecting such a roughened surface to electroless plating, adhesion between the conductor film and the adhesive layer can be obtained. The applicants of the present application have previously disclosed, as JP-A-5-218638,
We have proposed an adhesive for electroless plating composed of "particulate matter consisting of amino resin and uncured heat resistant resin which is hardly soluble in acid or oxidizing agent". The particle size of this amino resin is easy to control the particle size during production and uniform particle size can be obtained. Therefore, the adhesive for electroless plating using this is excellent in mass productivity and product stability. It was a thing. Conventionally, this adhesive for electroless plating was often roughened with chromic acid, but since the waste liquid of chromium causes pollution, it has become difficult to use chromic acid during mass production. Therefore, the inventors of the present application investigated an alkaline solution of an acid or permanganate as a roughening substitute for chromic acid during mass production.

[0004]

However, when an alkaline solution of an acid or permanganate is used as a roughening solution, none of them has achieved a practical peel strength. As a result of diligent research, the inventors of the present invention have surprisingly newly found that this cause is due to the following mechanism. That is, in the case of an acid, although the particulate matter composed of the amino resin is satisfactorily dissolved and removed, it is difficult to dissolve the heat-resistant resin that is the matrix, and only the amino resin of the surface layer is roughened, and only a shallow anchor is used. I can't get it. When an alkaline solution of permanganate is used, the resin matrix can be dissolved, but the solubility of the amino resin is low, and it takes time to dissolve and remove the amino resin particulate matter. Being fragile Therefore, when an alkaline solution of acid or permanganate is used, the peel strength becomes low. Further, when an alkaline solution of permanganate is used, the resin matrix is dissolved, and the insulating layer becomes thin, resulting in a problem that the insulation reliability is reduced. An object of the present invention is to solve such problems, and to propose a method for roughening an adhesive using an amino resin particulate substance which has a low pollution and a practical peel strength.

[0005]

The present invention has the following constitution. A particulate material consisting of an amino resin and an adhesive layer for electroless plating consisting of a heat-resistant resin are alternately used with an alkaline solution of acid and permanganate to dissolve and remove the particulate material consisting of the amino resin. And a method for roughening an adhesive for electroless plating, and a printed wiring board using these configurations, that is, electroless plating consisting of a particulate material made of an amino resin and a heat-resistant resin on a substrate After forming the adhesive layer for use in electrolysis, the alkaline solution of acid and permanganate is alternately used to dissolve and remove the particulate matter consisting of the amino resin to roughen the surface of the adhesive layer for electroless plating. Then, a method of manufacturing a printed wiring board, characterized in that electroless plating is performed on the roughened surface to form a conductor circuit.

[0006]

In the present invention, it is necessary to dissolve and remove the particulate matter composed of the amino resin by alternately using the acid and the alkaline solution of permanganate. Since the amino resin is rapidly hydrolyzed by the acid, the acid can dissolve the particulate matter. Since the acid does not easily deteriorate the heat-resistant resin that is the matrix resin, it does not reduce the resin breaking strength of the anchor of the heat-resistant resin matrix formed by the acid treatment. Since the peel strength is governed by the resin breaking strength of the anchor, the peel strength will not be lowered unless the resin breaking strength is lowered. Therefore, the amino resin particulate matter can be removed while maintaining the peel strength by the acid treatment.

Further, as mentioned above, since the acid does not dissolve the heat resistant resin, it dissolves only the particulate matter of the amino resin exposed on the surface. Therefore, acid alone can form only a very shallow anchor, that is, a primary anchor. To deepen the anchor, it is necessary to slightly dissolve the resin matrix to expose the amino resin particulate material covered by the resin matrix and dissolve it to form the secondary anchor. For this reason, treatment with an oxidizing agent is required, but since chromic acid is being regulated for use at an industrial level because harmful heavy metal waste liquid is generated, permanganate, which has lower pollution, is used. The solution is adopted.

However, alkaline solutions of permanganate degrade the heat resistant resin matrix. Therefore, it is necessary to shorten the roughening time of the permanganate solution with the alkaline solution as much as possible (20 minutes is the limit according to the knowledge of the inventors of the present application). In the present invention, since the dissolution of the particulate matter is carried out by the acid, by performing only partial dissolution of the resin matrix with the alkaline solution of permanganate, the heat-resistant resin matrix with respect to the alkaline solution of permanganate. By shortening the exposure time, the deterioration of the heat resistant resin matrix can be suppressed, and at the same time, the particulate matter can be reliably removed. Further, it is possible to prevent the adhesive layer from being excessively dissolved by the alkaline solution of permanganate to lower the insulation reliability.
Further, by applying such a roughening method to an additive printed wiring board, it is possible to realize a method for manufacturing a printed wiring board having low pollution and practical peel strength.

The present invention will be described in detail below. The configuration 1) of the present invention is as follows. At least the following a) ~
A method for roughening an adhesive layer for electroless plating, which comprises the step c). a) A step of forming an adhesive layer for electroless plating made of a particulate material made of an amino resin and a heat resistant resin on a substrate. b) A step of polishing the surface of the adhesive layer for electroless plating. c) A step of dissolving and removing the exposed particulate matter composed of the amino resin using an acid, and then dissolving the surface of the heat-resistant resin with an alkaline solution of permanganate to expose the particulate matter composed of the amino resin. d) A step of dissolving and removing the particulate matter composed of the exposed amino resin using an acid.

By the step a), an adhesive layer for electroless plating is formed on the substrate. As the base body, various product shapes such as a plate shape are adopted. According to step b), the surface of the adhesive layer for electroless plating is polished. This is to expose the amino resin particles coated with the heat resistant resin matrix by polishing to the surface. As the polishing method, various methods such as buffing, sandblasting, and belt sanding are used. By such a polishing step, it is not necessary to treat with an oxidizing agent such as permanganate in order to expose the amino resin particulate matter, and the deterioration of the resin matrix can be prevented. Resin matrix is difficult to be dissolved by an oxidizing agent immediately after thermosetting, so when the oxidizing agent treatment with permanganate etc. is performed for the first time, long-term treatment is required to expose the amino resin particulate matter. Although the matrix is significantly deteriorated, such a problem can be solved by adopting the polishing treatment. In step c), the exposed particulate matter consisting of the amino resin is dissolved and removed to form a primary anchor formation, and then the surface of the heat-resistant resin is dissolved with an alkaline solution of permanganate to again form the amino resin particles. The substance is exposed. According to step d), the amino resin particulate material is re-roughened with acid to form a secondary anchor. This step c) and d) may be repeated. The number of times
2 to 5 times is desirable. According to the knowledge of the inventors of the present application, if the number of times is less than 2, the anchor is too shallow to obtain the peel strength.
If it exceeds the number of times, the peel strength decreases due to deterioration of the heat resistant resin. 5 times has the highest peel strength.

Next, the constitution 2) in which the constitution 1) of the present invention is applied to a printed wiring board will be described. The numbers in the description are those of FIG. A method for manufacturing a printed wiring board, comprising at least the following steps a) to e). a) A step of forming an adhesive layer 4 for electroless plating made of a particulate material made of an amino resin and a heat resistant resin on the substrate 1. b) A step of polishing the surface of the adhesive layer 4 for electroless plating. c) After the exposed particulate matter 3 made of amino resin is dissolved and removed using an acid, the surface of the heat resistant resin 2 is dissolved in an alkaline solution of permanganate to remove the particulate matter 3 made of amino resin. Step of exposing. d) A step of dissolving and removing the particulate matter 3 consisting of the exposed amino resin with an acid to form a roughened surface. e) A step of performing electroless plating on the roughened surface to form the conductor circuit 8.

Step a) is a step of forming on the substrate 1 an adhesive layer 4 for electroless plating made of a particulate material 3 made of an amino resin and a heat resistant resin 2 (a in FIG. 1). Board 1
Various substrates such as a glass epoxy substrate, a polyimide substrate, a ceramic substrate, and a metallic substrate such as copper or aluminum can be used. A conductor circuit may be formed on the substrate 1, and in this case, a multilayer printed wiring board is formed. In the case of a multilayer printed wiring board, it is desirable to use a photosensitive resin as an adhesive for electroless plating. By using a photosensitive resin, via holes can be formed by exposure and development, and a high-density build-up multilayer wiring board can be obtained. The electroless plating adhesive layer 4 may be formed by coating or may be formed into a film.

In step b), the surface of the adhesive layer 4 for electroless plating is polished. This is a process for exposing the amino resin particles 3 covered with the heat resistant resin matrix 2 to the surface by polishing (b in FIG. 1). The polishing method is
Various methods such as buffing, sandblasting and belt sanding are used. In step c), the exposed particulate matter 3 composed of the amino resin is dissolved and removed to remove the primary anchor 5.
After the formation of, the surface of the heat resistant resin is dissolved with an alkaline solution of permanganate and again the amino resin particulate matter 3
Is exposed (c in FIG. 1). According to step d)
The exposed amino resin particulate matter 3 is dissolved again to form the secondary anchor 6 (d in FIG. 1). In step e), electroless plating is performed on the roughened surface to form the conductor circuit 8 (e in FIG. 1). Before performing electroless plating, a catalyst nucleus such as palladium powder, palladium colloid, or a complex of palladium ion is provided, and this is fixed by heat treatment or the like. Before applying the electroless plating, a plating resist 7 is provided and electroless plating is performed to form the conductor circuit 8. To form the plating resist 7, the plating resist composition is applied or formed into a film and laminated, and exposure, development, and U
It is performed by performing V cure and then heat treatment.

If necessary, the catalyst is activated by acid treatment or the like, and then immersed in an electroless plating bath to form a plating film. In the case of a multilayer printed wiring board, steps a) to d) are repeated to form a multilayer. On the surface of the printed wiring board, apply an uncured resin composition of a liquid solder resist, or
Alternatively, an uncured solder resist film is laminated to form a solder resist layer. Finally, a solder layer is formed. As a method of forming the solder layer, there is a method of screen-printing a solder paste or the like for reflow, or a method of solder plating for reflow.

The acid used in the present invention may be an organic acid or an inorganic acid, but phosphoric acid or a carboxylic acid such as acetic acid or formic acid is preferable when a printed wiring board is manufactured. This is because these acids do not dissolve copper, which is the conductor circuit of the printed wiring board. Further, the alkaline solution of permanganate used in the present invention is
It is desirable to use an alkaline solution of potassium permanganate or sodium permanganate. This is because it has strong oxidizing power and relatively low toxicity. Further, it is desirable that the cumulative treatment time of the permanganate alkaline solution is 15 minutes or less. The reason for this is that the matrix resin deteriorates if the time exceeds 15 minutes.

The uncured heat-resistant resin which is hardly soluble in an acid or an oxidizing agent used in the adhesive for electroless plating of the present invention is preferably at least one selected from epoxy resins and epoxy acrylate resins. The reason is that these resins are low in cost and have excellent heat resistance. As the amino resin, melamine resin, urea resin, or guanamine resin is used. The particulate material made of amino resin is easy to control the particle size during production and a uniform particle size can be obtained.Therefore, the adhesive for electroless plating using this is excellent in mass productivity and product stability. is there.

The amino resin particulate material used in the present invention may have various shapes such as particle shape, hollow shape and crushed piece shape. Particularly, in the case of particle shape, 1) the average particle diameter is 10 μm or less. Particles, 2) Aggregated particles obtained by aggregating heat-resistant resin powder having an average particle size of 2 μm or less to have an average particle size of 2 to 10 μm, 3) Heat-resistant resin powder having an average particle size of 2 to 10 μm and average particle size of 2 μm or less A mixture with a heat resistant resin powder of
4) Heat-resistant resin powder having an average particle diameter of 2 μm or less or 2 μm on the surface of the heat-resistant resin powder having an average particle diameter of 2 to 10 μm.
It is desirable to be selected from pseudo particles formed by adhering at least one kind of inorganic powder of m or less. The reason is that if the average particle size exceeds 10 μm, the anchor becomes deeper,
This is because a so-called fine pattern of 100 μm or less cannot be formed. On the other hand, the reason why the pseudo particles of 2) to 4) are desirable is that a complex anchor can be formed and the peel strength can be improved.

The printed wiring board thus obtained has an adhesive layer for electroless plating, which is composed of a particulate material made of an amino resin and a hardened heat resistant resin which is hardly soluble in an acid or an oxidizing agent, on a substrate. The formed particulates of the amino resin are dissolved and removed to have a roughened surface on which a primary anchor and a deeper secondary anchor are formed, and a conductor circuit is formed on the roughened surface. It is a printed wiring board characterized by the fact. Hereinafter, specific examples will be described.

[0019]

【Example】

(Example 1) 1) Laminate a photosensitive dry film (made by DuPont) on a glass epoxy copper clad laminate (made by Toshiba Chemical),
An image was printed by exposing it to ultraviolet light through a mask film on which a desired conductor circuit pattern was drawn. Then 1,1,
After development with 1-trichloroethane and removal of copper in the non-conductor portion using a cupric chloride etching solution, the dry film was peeled off with methylene chloride. Thus, a wiring board having a first-layer conductor circuit composed of a plurality of conductor patterns on the substrate was prepared. 2) 70 parts by weight of a 25% acrylate of a cresol novolac type epoxy resin (molecular weight 2500 made by Nippon Kayaku) dissolved in DMDG, polyether sulfone (PES) 3
0 parts by weight, imidazole curing agent (Shikoku Kasei, trade name:
2E4MZ-CN) 4 parts by weight, and caprolactone modified tris (acryloxyethyl) isocyanurate (manufactured by Toagosei, trade name; Aronix M325) which is a photosensitive monomer 10
Parts by weight, benzophenone as a photoinitiator (manufactured by Kanto Kagaku) 5 parts by weight, photosensitizer Michler ketone (manufactured by Kanto Kagaku)
After mixing 0.5 parts by weight, the mixture was mixed while adding NMP, the viscosity was adjusted to 2000 CPS with a homodisper stirrer, and then the mixture was kneaded with three rolls to obtain an adhesive solution. 3) Apply this photosensitive adhesive solution onto the wiring board prepared in 1) above using a roll coater, and apply it horizontally.
After leaving for a minute, it was dried at 60 ° C. to obtain a 20 μm first layer.

4) Method for preparing melamine resin particles: Methylol melamine (600 g), an emulsifier (anionic acrylic resin 7 g) and water (8 kg) were stirred, and acetic acid was added thereto to adjust the pH to 5.0. Is started and the temperature is further raised to 70 ° C. to proceed with the condensation (crosslinking) reaction, and eventually becomes cloudy to form melamine resin particles. Further, the resin particles were separated and collected by a non-porous wall centrifuge, and dried under reduced pressure at 40 ° C. for 5 hours and 95 ° C. for 2 hours under reduced pressure. 5) Add 150 melamine resin particles prepared in this way
Heat treatment was performed in a dryer at ℃ for 1 hour.

6) 25 of cresol novolac type epoxy resin (Molecular weight 2500 made by Nippon Kayaku) dissolved in DMDG
% Acrylate, 70 parts by weight of polyether sulfone (PES), 4 parts by weight of imidazole curing agent (manufactured by Shikoku Kasei, product name: 2E4MZ-CN), and caprolactone modified tris (acryloxyethyl) as a photosensitive monomer. ) Isocyanurate (Toagosei, trade name; Aronix M
325) 10 parts by weight, benzophenone (manufactured by Kanto Kagaku) as a photoinitiator, 0.5 part by weight of photosensitizer Michler's ketone (manufactured by Kanto Kagaku), and an average particle size of 5.0 μm with respect to this mixture. After mixing 60 parts by weight of the melamine resin particles and 15 parts by weight of the melamine resin particles having an average particle size of 1.0 μm, the mixture was mixed while adding NMP, and the viscosity was adjusted to 2000 CPS with a homodisper stirrer, followed by 3 pieces. The mixture was kneaded with a roll to obtain an adhesive solution.

7) This photosensitive adhesive solution was applied onto the adhesive layer prepared in 3) above using a roll coater, left standing for 20 minutes in a horizontal state, and then dried at 60 ° C.
A 20 μm second layer was obtained. 8) A photomask film with a 100 μmφ black circle printed on it is adhered to the wiring board, and the ultra-high pressure mercury lamp 500 mj / cm
Exposed at ² . This was spray-developed with a DMDG (diethylene glycol dimethyl ether) solution to form 100 μmφ via-hole openings on the wiring board. In addition, the wiring board is approx.
Exposure at 3000mj / cm ² at 100 ℃ for 1 hour, then 150 ℃
Heat treatment for 5 hours at 40 μm, which has an opening with excellent dimensional accuracy equivalent to a photomask film.
m interlayer resin insulation layer was formed.

9) The interlayer resin insulating layer formed in the above 8) was polished with a buff roll (made by Kakuda Brush Co., Ltd.) to make the interlayer resin insulating layer 35 μm. 10) The substrate was placed in a 50 vol% phosphoric acid solution at 80 ° C. for 3 days.
It is immersed for 0 minutes to dissolve the melamine resin particles exposed on the surface of the interlayer resin insulation layer. Further, add potassium permanganate (KMnO ₄ 110 g / l, NaOH 45 g / l) at 70 ° C for 2
The surface of the interlayer resin insulation layer is dissolved by immersion for a minute to expose the surface of the melamine resin particles. This was repeated 5 times to form a roughened surface, and as a result, a fine anchor was formed on the surface of the adhesive layer. 11) The substrate with the surface of the adhesive layer roughened is treated with PdCl ₂ · 2.
H ₂ O: 0.2 g / l, SnCl · 2H ₂ O: 15 g / l,
The catalyst nuclei were provided on the adhesive layer by treating the substrate with a treatment liquid containing HCl: 30 g / l. At this time, the processing time is 2 minutes and the processing temperature is 35 ° C.

12) Photosensitive resist 60 on the adhesive layer
It was applied in a thickness of μm, prebaked, exposed and developed. As a result, a pattern resist was formed on the adhesive layer. 13) Next, after activating the substrate with a 10% H ₂ SO ₄ solution, the substrate was placed in an electroless copper plating bath. In this plating, HCHO: 3.5cc / l, NaOH: 5g / l, TE
An electroless copper plating bath having a bath composition of A: 8 g / l, CuSO ₄ .5H ₂ O: 4.5 g / l, and a small amount of stabilizer was used. At this time, the processing time is 3 hours and the processing temperature is 70 ° C.
As a result, an electroless copper plating layer having a thickness of 21 μm was formed. The deposition rate is 7 μm / hr.

(Comparative Example 1) 1) The procedure is the same as in Example 1 up to the procedure 9). 2) The above substrate was immersed in a 50 vol% phosphoric acid solution at 80 ° C. for 30 minutes.
It is immersed for a minute to dissolve the melamine resin particles exposed on the surface of the interlayer resin insulation layer. 3) PdCl ₂ · 2H is used for the substrate with the surface of the adhesive layer roughened.
₂ O: 0.2 g / l, SnCl · 2H ₂ O: 15 g / l, H
By treating the substrate with a treatment liquid containing Cl: 30 g / l, catalyst nuclei were provided on the adhesive layer. At this time, the processing time is 2 minutes and the processing temperature is 35 ° C. 4) A photosensitive resist was applied on the adhesive layer to a thickness of 60 μm, and prebaked, exposed and developed. As a result, a pattern resist was formed on the adhesive layer. 5) Next, after activating the substrate with a 10% H ₂ SO ₄ solution, the substrate was placed in an electroless copper plating bath. In this plating, HCHO: 3.5cc / l, NaOH: 5g / l, TE
An electroless copper plating bath having a bath composition of A: 8 g / l, CuSO ₄ .5H ₂ O: 4.5 g / l, and a small amount of stabilizer was used. At this time, the processing time is 3 hours and the processing temperature is 70 ° C.
As a result, an electroless copper plating layer having a thickness of 21 μm was formed. The deposition rate is 7 μm / hr.

(Comparative Example 2) 1) The procedure up to Step 9) is performed in the same manner as in Example 1. 2) The substrate is replaced with potassium permanganate (KMnO ₄ 110
g / l, NaOH 45 g / l KMnO ₄ ) at 70 ° C. for 15 minutes to dissolve the surface of the interlayer resin insulation layer to expose the surface of the melamine resin particles. This was repeated 5 times to form a roughened surface, and as a result, a fine anchor was formed on the surface of the adhesive layer. 3) PdCl ₂ · 2H is used for the substrate with the surface of the adhesive layer roughened.
₂ O: 0.2 g / l, SnCl · 2H ₂ O: 15 g / l, H
By treating the substrate with a treatment liquid containing Cl: 30 g / l, catalyst nuclei were provided on the adhesive layer. At this time, the processing time is 2 minutes and the processing temperature is 35 ° C. 4) A photosensitive resist was applied on the adhesive layer to a thickness of 60 μm, and prebaked, exposed and developed. As a result, a pattern resist was formed on the adhesive layer. 5) Next, after activating the substrate with a 10% H ₂ SO ₄ solution, the substrate was placed in an electroless copper plating bath. In this plating, HCHO: 3.5cc / l, NaOH: 5g / l, TE
An electroless copper plating bath having a bath composition of A: 8 g / l, CuSO ₄ .5H ₂ O: 4.5 g / l, and a small amount of stabilizer was used. At this time, the processing time is 3 hours and the processing temperature is 70 ° C.
As a result, an electroless copper plating layer having a thickness of 21 μm was formed. The deposition rate is 7 μm / hr.

Comparative Example 3 Basically the same as in Example 1, except that the treatment with phosphoric acid was performed twice and the treatment with potassium permanganate was performed once. The obtained peel strength is 0.
It was 7 kg / cm. (Comparative Example 4) Basically the same as in Example 1, but the treatment with phosphoric acid was performed 6 times, and the treatment with potassium permanganate was performed 5 times. The peel strength obtained is 0.5 kg / cm
Met. The peel strengths of Examples 1 to 5 above,
The film thickness is shown in Table 1.

[0028]

[Table 1]

[0029]

As described above, according to the method for roughening the adhesive layer for electroless plating and the method for manufacturing a printed wiring board using the same according to the present invention, low pollution and practical peel strength can be obtained. It is possible to form an electroless plated film that can be used, and to maintain insulation reliability by maintaining the thickness of the adhesive layer.

[Brief description of drawings]

1A to 1E are manufacturing process diagrams of a printed wiring board of the present invention.

[Explanation of symbols]

 1 Substrate 2 Heat-Resistant Resin Matrix (Heat-Resistant Resin) 3 Amino Resin Particles 4 Adhesive Layer for Electroless Plating 5 Primary Anchor 6 Secondary Anchor 7 Plating Resist 8 Conductor Circuit

Claims (8)

[Claims] 1. A particulate substance comprising an amino resin is formed by alternately using an alkaline solution of an acid and a permanganate for an adhesive layer for electroless plating comprising an amino resin and a heat resistant resin. A method for roughening an adhesive for electroless plating, which comprises melting and removing to roughen. 2. A method for roughening an adhesive layer for electroless plating, which comprises at least the following steps a) to c). a) A step of forming an adhesive layer for electroless plating made of a particulate material made of an amino resin and a heat resistant resin on a substrate. b) A step of polishing the surface of the adhesive layer for electroless plating. c) A step of dissolving and removing the exposed particulate matter consisting of the amino resin with an acid, and then dissolving the surface of the heat-resistant resin with an alkaline solution of permanganate to expose the particulate matter consisting of the amino resin. d) A step of dissolving and removing the exposed particulate matter composed of the amino resin by using an acid. 3. The method for roughening an adhesive layer for electroless plating according to claim 1, wherein the steps c) and d) are performed 2 to 5 times. 4. The method for roughening an adhesive for electroless plating according to claim 1, wherein the acid is at least one selected from phosphoric acid and carboxylic acid. 5. An electroless plating adhesive layer made of a particulate resin made of an amino resin and a heat-resistant resin is formed on a substrate, and then an alkaline solution of an acid and a permanganate is alternately used. A print characterized by dissolving and removing particulate matter made of resin to roughen the surface of the adhesive layer for electroless plating, and then performing electroless plating on the roughened surface to form a conductor circuit. Wiring board manufacturing method. 6. A method for manufacturing a printed wiring board, comprising at least the following steps a) to e). a) A step of forming an adhesive layer for electroless plating made of a heat-resistant resin and a particulate material made of an amino resin on a substrate. b) A step of polishing the surface of the adhesive layer for electroless plating. c) A step of dissolving and removing the exposed particulate matter consisting of the amino resin with an acid, and then dissolving the surface of the heat-resistant resin with an alkaline solution of permanganate to expose the particulate matter consisting of the amino resin. . d) A step of dissolving and removing the exposed particulate matter composed of the amino resin with an acid to form a roughened surface. e) A step of performing electroless plating on the roughened surface to form a conductor circuit. 7. The method for roughening an adhesive layer for electroless plating according to claim 6, wherein the steps c) and d) are performed 2 to 5 times. 8. The method for roughening an adhesive for electroless plating according to claim 6, wherein the acid is at least one selected from phosphoric acid and carboxylic acid.