JP3071733B2 - Method for manufacturing multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for manufacturing a multilayer printed wiring board in which a conductor layer is formed on an insulating resin by plating or the like.

[0002]

2. Description of the Related Art A method of manufacturing a multilayer printed wiring board by alternately forming a conductor by plating or the like and an insulating resin on an insulating resin substrate has attracted attention as a method of manufacturing a multilayer printed wiring board having a fine wire circuit. Is increasing.

For example, Japanese Patent Application Laid-Open No. 60-7191 (hereinafter referred to as a first conventional example) discloses the following method for manufacturing a multilayer printed wiring board. First, the surface of a polyimide resin film having a thickness of 25 μm, which is an insulating resin substrate, is sputter-etched by ion irradiation in order to improve the adhesion of a metal film formed thereon. Next, 50 nm of molybdenum is formed as a first layer and SUS304 is formed as a second layer of 30 nm in a vacuum. Further, copper is formed as a surface layer by sputtering to a thickness of 300 nm.

Next, after removing the substrate from the vacuum chamber, 35
A copper plating of a thickness of μm is performed, and this is patterned by etching to form an outermost conductor. Further, a multilayer printed wiring board is manufactured by repeating steps from formation of an insulating resin layer of a polyimide resin to copper plating and etching.

Japanese Patent Application Laid-Open No. Hei 6-196856 (hereinafter referred to as a second conventional example) discloses that the surface of an insulating resin layer is roughened by spraying a grinding material thereon, and the adhesion of a conductive metal layer formed thereon is reduced. Another method for manufacturing a multilayer printed wiring board which improves the above is shown.

A plating method according to the prior art will be described with reference to FIG. First, a crushed and granular abrasive 31 having a complicated shape as shown in FIG. 3A is prepared. These abrasives 31 are used for the sandblasting of the insulating resin layer described in detail below. As the abrasive, crushed granular alumina or silicon carbide based inorganic powder having a particle size of # 80 to # 320 (ISO standard) is used.
Next, a step of spraying a large number of abrasives 31 onto the surface of the insulating resin layer 32 is performed by a dry spray method using compressed air. This step is called a dry sandblasting step. By the sand blasting process, a part of the abrasive material 31 sinks into the surface of the insulating resin layer 32 as shown in FIG.

[0007] Next, the abrasive 31 that has been embedded in the insulating resin layer 32 and the abrasive 31 remaining on the surface of the insulating resin layer 32 are removed by a cleaning step. Thus, FIG.
As shown in (c), a roughened surface of the insulating resin layer 32 is obtained. On the surface of the insulating resin layer 32, a part of the complicated shape of the abrasive 31 is transferred,
Has a concave shape. Here, the structure formed on the surface of the insulating resin layer 32 as shown in FIG. 3C is called an “anchor structure”. In order to make it easier for the abrasive material 31 to dig into the insulating resin layer 32, the insulating resin layer 3
For 2, a material that is flexible and rich in elasticity is selected. Also, if more abrasive 31 is buried deeper into the insulating resin layer 32, a more complicated anchor shape is formed on the insulating resin layer 32, the surface area of the roughened surface is further increased, and This will improve the adhesion between the formed plating layer and the insulating resin layer 32.

In the above conventional example, as the material of the insulating resin layer 32, a material obtained by kneading a fine powder of silica with an ultraviolet curable epoxy resin is used. This material has a glass transition temperature of 122 ° C. and is a flexible and resilient material. When the sandblasting process using the above-mentioned abrasive 31 is performed on the insulating resin layer 32 made of this material at a spray pressure of 3 to 4 kg / cm ² , the insulating resin layer 3
On the surface of No. 2, irregularities having a roughness Rmax of 5 to 12 μm are formed.

Next, the insulating resin layer 32 whose surface has been roughened by sandblasting is treated with a chromic acid-sulfuric acid-based solution or a strongly oxidizing solution such as potassium permanganate. Thus, a part of the surface of the insulating resin layer 32 made of the epoxy resin is chemically dissolved and removed. By this chemical etching treatment, irregularities having a roughness lower than that of the irregularities formed by the sandblasting are formed. As a result, the surface area is further increased, and the adhesion of plating is improved.

Next, an activation treatment is performed by sequentially immersing the substrate in a hydrochloric acid solution of tin chloride and palladium chloride. Thereafter, the insulating resin layer 32 is treated with an electroless copper plating solution composed of an alkaline solution of a copper complex salt and formalin to form a thin film of metallic copper on the insulating resin layer 32. Is formed to an arbitrary thickness. Thus, FIG.
As shown in (d), the conductive metal layer 34 is formed on the insulating resin layer 32.

Next, a conventional method for manufacturing a multilayer printed wiring board using the above plating method will be described with reference to FIG. Here, a manufacturing process of a multilayer printed wiring board having four circuit conductor layers will be described. First, as shown in FIG.
In a copper-clad laminate in which metal copper foils 42 are bonded to upper and lower surfaces of an insulating substrate 41 such as a glass epoxy laminate, a copper foil 42
Unnecessary portions are selectively dissolved and removed by a photoetching method.

In this manner, first circuit conductor layers 43 having a desired pattern are formed on the upper and lower surfaces of the insulating substrate 41, as shown in FIG. Next, an insulating resin layer 44 is applied to both upper and lower surfaces of the insulating substrate 41 by a curtain coating method to insulate the circuit conductor layer 43. After drying the insulating resin layer 44, the insulating resin layer 44 is irradiated with ultraviolet rays via a mask film. This mask film is used for via hole 4
5 patterns.

Next, portions of the insulating resin layer 44 that have not been irradiated with ultraviolet rays by masking are dissolved and removed. Thus, the via hole 45 is formed as shown in FIG. After that, the insulating resin layer 44 becomes
Heat treated at 150 ° C. for 60 minutes and cured. Next, as shown in FIG. 4D, a through hole 46 is formed at a desired position on the insulating substrate 41 by drilling, and then a sandblasting process and a chemical etching process using an oxidizing agent are performed. These processes are performed by the above-described method to form an anchor structure having a fine rough surface on the insulating resin layer 44.

In the second conventional example, a photosensitive insulating resin such as an epoxy resin is used as an insulating resin to form a via hole, and a filler such as a fine powder of silica is mixed with the resin to form a via hole. Fine silica powder that is hardly chemically etched by the chemical etching process is exposed as fine protrusions on the etched surface of the insulating resin, and a more complicated uneven structure can be obtained.

Next, the substrate whose surface has been roughened is sequentially immersed in an activation treatment solution comprising stannous chloride and an acid solution of palladium chloride in hydrochloric acid to deposit catalyst nuclei comprising fine particles of metal palladium. Thereafter, electroless plating is performed to form a conductive metal layer 47 of metallic copper on the entire surface of the insulating resin layer 44 including the through holes 46, and furthermore, electrolytic copper is thickened if necessary (FIG. 4E).

Next, unnecessary portions of the conductive metal layer 47 are selectively removed by a photoetching method to form a circuit conductor pattern. Thus, a multilayer printed wiring board having a four-layer structure was manufactured.

[0017]

In the above conventional example, as a pretreatment for forming a copper plating layer on an insulating resin layer, sputtering by ion irradiation in vacuum on the surface of the insulating resin layer is performed. The formation of a base conductive metal layer by sputtering after etching and the roughening and hydrophilization of the surface of the insulating resin layer by sandblasting and chemical etching are performed to perform electroless copper plating.

With the recent development of high-density packaging, high-heat-resistant multilayer printed wiring boards have been required. In the above-mentioned conventional technology, high-heat-resistant insulating resins having a high glass transition temperature include: Since the resin is hard, a sufficiently roughened surface cannot be formed, and a problem has arisen that sufficient adhesion cannot be obtained between the insulating resin layer and the metal deposited by sputtering or electroless copper plating.

When the diameter of the via hole is smaller than 100 μm, in the second conventional example, the filler such as silica fine powder deteriorates the resolution of the photosensitive insulating resin. There is also a problem that it cannot be mixed with a conductive insulating resin and cannot cope with high-density mounting.

An object of the present invention is to solve the above-mentioned problems of the prior art, and has excellent adhesion to a high heat resistant insulating resin without mixing a filler into the insulating resin. It is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board capable of forming a plated layer.

[0021]

SUMMARY OF THE INVENTION A multilayer printed wiring board according to the present invention.
Method of manufacturing an insulating resin layer on the substrate surface as a base, a bi-via holes are formed in the insulating resin layer, and plating a conductive layer thereon and patterning the conductive layer, the insulating layer by layer the method of manufacturing a multilayer printed wiring board of build the resin layer conductive layer up formation, before Symbol wherein a metal film resistant to adhesion good and chemically etching the insulating resin layer <br/> a step of forming by sputtering on the insulating resin layer, a sandblasting step of removing the metal film by blowing abrasive partially to the surface of the metal film, the metal film by the sandblasting removed a processing step of chemically etching the surface of the exposed the insulating resin layer is, on the surface including the metal layer of the insulating resin layer which has been subjected to the chemical etching process, plating a conductive layer Characterized in that it comprises a degree.

In particular, titanium or chromium can be used as a preferable metal film formed on the insulating resin layer by sputtering.

According to the present invention, a dry-type sand blasting process in which a titanium or chromium metal film is formed on an insulating resin layer by sputtering and then a grinding material is sprayed, and a chemical etching of the sand-blasted insulating resin layer surface is performed by a conductive method. The main feature is that it is performed before the step of plating the layer, and the mechanically roughened surface by dry sand blasting,
Chemical etching of the insulating resin layer using the titanium film of a minute shape formed by sandblasting as a mask,
The surface roughness of the insulating resin increases, and the adhesion of the plating can be improved by the synergistic action with the titanium or chromium metal remaining on the insulating resin layer. Even when a photosensitive high heat resistance resin is used as the insulating resin, the great effect of the present invention can be obtained.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

First, a method of manufacturing a multilayer printed wiring board according to an embodiment of the present invention is a method of manufacturing a core layer 11 such as FR-4 having copper conductors 12 patterned on both sides as shown in FIG.
A photosensitive high heat resistant resin layer 13 serving as an insulating resin layer is formed to a thickness of 40 μm on both sides of a base substrate serving as a base, and then the photosensitive high heat resistant resin layer 13 is passed through a patterned exposure mask.
A step of partially irradiating the surface with ultraviolet light (UV light) of 1 J / cm ² .

Next, the film is developed with an aqueous solution of sodium carbonate,
The UV-irradiated portion of the photosensitive high heat-resistant resin layer 13 is removed to form a photovia hole 14 as shown in FIG. 1B. Thereafter, a step of performing post-baking at a temperature of 150 ° C. for about 2 hours to cure the photosensitive high heat resistant resin layer 13 is provided.

Next, as shown in FIG. 1C, a step of forming a titanium metal film 15 to a thickness of 10 to 100 nm on the surface of the photosensitive high heat resistant resin layer 13 in a vacuum sputtering apparatus is provided. If the thickness of the titanium metal film is less than 10 nm, the underlying photosensitive high heat resistant resin layer 13 will be excessively exposed in the next step of sandblasting. If the thickness of the titanium metal film exceeds 100 nm, the exposure of the underlying photosensitive high heat resistant resin layer 13 becomes too small by sandblasting, and the etching property after copper plating decreases. FIG.
The thickness of the titanium metal film 15 in FIG.

Next, as shown in FIG. 1 (d), 0.5 kg of an alumina powder as an abrasive for sandblasting was dry-sprayed.
And a step of spraying the surface of the titanium metal film 15 at a pressure of / cm ² for 120 seconds. Here, the alumina powder of the abrasive for sandblasting has a particle size of # 400 to # 600 (I
(SO standard) used in crushed granular form. By performing sandblasting under such conditions, about 50% of the surface area of the titanium film is removed. As a result, the surface of the photosensitive high heat resistant resin layer 13 is also partially exposed, and the surface of the photosensitive high heat resistant resin layer 13 is exposed. Has irregularities with a roughness Rmax of 0.05 to 0.1 μm.

Next, as shown in FIG. 2 (a), the photosensitive high heat resistant resin layer whose surface has been roughened by sandblasting is swollen with a diethylene-based solvent for about 5 minutes, and then with a potassium permanganate aqueous solution for about 20 minutes. Min, followed by a step of performing a neutralization treatment with a hydroxylamine sulfate aqueous solution for about 10 minutes. The surface of the photosensitive high heat resistant resin layer 13 has a roughness Rm
The unevenness 21 having ax of 0.1 to 0.5 μm is formed.

Since titanium metal is resistant to an aqueous solution of potassium permanganate, a titanium metal film 15 having a minute shape is formed.
Serves as a mask for chemical etching, the resin is etched only in the portion where the surface of the photosensitive high heat resistant resin layer 13 is exposed, and the unevenness on the surface is enlarged as described above.

Next, as shown in FIG. 2 (b), the electroless copper plating catalyst was applied to the surface of the photosensitive high heat resistant resin layer by dipping in a hydrochloric acid acidic aqueous solution of stannous chloride and palladium chloride.
It is immersed in an electroless copper plating solution composed of an alkaline solution of copper complex salt and formalin to precipitate metallic copper having a thickness of about 0.5 μm on the photosensitive high heat-resistant resin layer 13, and then to form metallic copper of about 25 μm by electrolytic copper plating. Deposited thickness, outermost layer conductor 2
2 (copper plating layer) is formed on the high heat resistant resin layer 13.

As described above, the photosensitive high heat-resistant resin layer (hereinafter referred to as
Titanium metal film remains on the surface)
The peel strength between the resin layer and the copper plating layer was as high as 1.8 kg / cm due to the synergistic effect of the high adhesion between the titanium metal film and the resin layer and the roughened uneven surface of the resin layer.

Next, as shown in FIG. 2C, a step of etching the copper plating layer to form an outermost conductor circuit 23 is provided. In some cases, further multilayering is possible by repeating the steps of forming the resin layer, copper plating, and etching.

In this embodiment, the outermost conductor circuit is formed by etching electrolytic copper plating to form a pattern. However, after the resin layer is chemically etched, a plating resist having a reverse pattern is formed, and the outermost conductor is formed by additive plating. A circuit may be formed. In the above-described embodiment of the present invention, titanium is used as the metal film formed on the surface of the photosensitive high heat resistant resin layer. Metals having resistance to the above can also be applied to the present invention.

[0035]

According to the present invention, a metal film such as titanium or chromium is formed on the surface of a photosensitive and heat-resistant insulating resin layer by sputtering, followed by mechanical roughening by sandblasting and chemical treatment by an oxidizing agent. The following effects can be obtained by treating the surface of the insulating resin layer by etching.

The first effect of the present invention is that the fine metal film remaining on the surface of the insulating resin layer serves as a mask for chemical etching, and the uneven surface of the exposed surface of the insulating resin layer is formed by chemical etching. A high adhesion can be obtained without mixing a filler into the insulating resin between the copper plating layer and the insulating resin layer due to the synergistic action of the high adhesion between the metal film and the insulating resin layer. It is.

An advantage of the present invention is that it is not necessary to mix a filler with a photosensitive high heat-resistant resin, so that a multilayer printed wiring board having minute via holes having a diameter of 100 μm or less can be manufactured.

[0038]

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view of a main part of a substrate for describing steps up to a sandblasting step in a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of a substrate for describing steps after a sandblasting step in a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a plating method in a conventional technique (second conventional example).

FIG. 4 is a process chart of a method for manufacturing a multilayer printed wiring board according to a conventional technique (second conventional example).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Core layer 12 Conductor 13 Photosensitive high heat resistant resin layer 14 Photo via hole 15 Titanium metal film 21 Irregularities of high heat resistant resin surface 22 Outermost layer conductor 23 Outermost layer conductor circuit 31 Grinding material 32 Insulating resin layer 33 Anchor structure 34 Conductive metal Layer 41 Insulating substrate 42 Copper foil 43 Circuit conductor layer 44 Insulating resin layer 45 Via hole 46 Through hole 47 Conductive metal layer

Claims (3)

(57) [Claims] 1. A forming an insulating resin layer to the underlying substrate surface, a bi-via holes are formed in the insulating resin layer, and plating a conductive layer thereon and patterning the conductive layer, one layer not a
One said insulating resin layer and the conductive layer in the method for manufacturing a multilayer printed wiring board for forming Birutoa' flop type, before Symbol insulating resin layer <br/> the adhesion lifting the resistant to good and chemical etching treatment One forming a metal film by sputtering on the insulating resin layer, a sandblasting step of spraying the abrasive to remove the metal film partially to the surface of the pre-Symbol metal film, the sandblasting A step of chemically etching the surface of the insulating resin layer where the metal film has been removed and exposed, and a step of plating a conductive layer on the surface of the insulating resin layer including the metal film which has been subjected to the chemical etching. method for manufacturing a multilayer printed wiring board, characterized in including Mukoto a. 2. The method according to claim 1, wherein the metal film formed by sputtering on the insulating resin layer is titanium or chromium. 3. The method according to claim 2 , wherein the thickness of the titanium or chromium formed on the insulating resin layer is 10 to 100 nm.