JPH08334471A - Optical inspecting device for work - Google Patents

Optical inspecting device for work

Info

Publication number
JPH08334471A
JPH08334471A JP16681195A JP16681195A JPH08334471A JP H08334471 A JPH08334471 A JP H08334471A JP 16681195 A JP16681195 A JP 16681195A JP 16681195 A JP16681195 A JP 16681195A JP H08334471 A JPH08334471 A JP H08334471A
Authority
JP
Japan
Prior art keywords
work
inspection
light
fiber
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16681195A
Other languages
Japanese (ja)
Other versions
JP3815628B2 (en
Inventor
Toshiyasu Tanaka
敏保 田中
Toshiki Nagaishi
俊己 永石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASAHI KOODEN KK
Original Assignee
ASAHI KOODEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASAHI KOODEN KK filed Critical ASAHI KOODEN KK
Priority to JP16681195A priority Critical patent/JP3815628B2/en
Publication of JPH08334471A publication Critical patent/JPH08334471A/en
Application granted granted Critical
Publication of JP3815628B2 publication Critical patent/JP3815628B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE: To highly sensitively and precisely detect a fine flaw, a distortion, etc., formed on the surface of a work by an optical detection means. CONSTITUTION: A light projecting fiber 13 and two light receiving fibers 14a, 14b positioned in the adjacent of this light projecting fiber 13 are bound in each fiber bundle 12 of a plurality of fiber bundles arranged in an array state in an inspecting optical end part 11. An inspecting light emitted from the projecting fiber 13 of each fiber bundle is cast on the surface of a flat work (W) relatively moving in relation to the optical end part 11. After the reflection light reflected from the surface of the flat work (W) is made incident on two light receiving fibers 14a, 14b respectively, it is emitted from respective light receiving fibers 14a, 14b to a photodiode provided in an inspective arithmetic part of an arithmetic device so that the reflection quantity is converted into voltage. Existence/nonexistence of flaws or a distortion, etc., formed on the surface of the flat work (W) is inspected based on output voltage of the two photosensors.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ワーク表面の微細な傷
の有無、或は歪みを検査するワークの光学的検査装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical inspection device for a work for inspecting the presence or absence of fine scratches on the work surface or the distortion.

【0002】[0002]

【従来の技術】一般に、ワーク表面に付いた微細な傷、
或いは微少な異物の付着状況を非接触式に検査するもの
として光学的検査装置がある。この光学的検査装置は、
図7に示すように、発光ダイオード等の光源1から出射
した検査光を対物レンズ2を介してワーク3の表面に集
光し、その反射光を、上記検査光の光軸に対して挟み角
αの位置に配設する他の対物レンズ4を介してフォトセ
ンサ5で受光し、この反射光量(フォトセンサの出力電
圧)と、上記ワーク3表面の性状に基づいて設定したス
レッショルドレベルとを比較して、ワーク表面の傷、異
物の付着等の有無、又は歪み等を検査している。すなわ
ち、上記ワーク表面が平坦な場合には、このワーク表面
からの反射光が上記フォトセンサ方向へ全反射し、又、
ワーク表面に傷、異物物等が付着した場合、或は歪みが
生じている場合には、反射光が散乱、或は偏角するた
め、上記フォトセンサ5で受光する反射光量が低下す
る。その結果、上記フォトセンサで検出した上記反射光
の強度(出力電圧)が変化し、フォトセンサの出力電圧
が上記スレッショルドレベルよりも低いときには、ワー
ク表面に傷等が存在すると判断する。
2. Description of the Related Art Generally, fine scratches on a work surface,
Alternatively, there is an optical inspection device as a non-contact type inspection device for inspecting the adhesion state of minute foreign matter. This optical inspection device
As shown in FIG. 7, the inspection light emitted from the light source 1 such as a light emitting diode is condensed on the surface of the work 3 through the objective lens 2, and the reflected light is included at an included angle with respect to the optical axis of the inspection light. The photosensor 5 receives the light through another objective lens 4 arranged at the position α, and compares the reflected light amount (output voltage of the photosensor) with a threshold level set based on the property of the surface of the work 3. Then, the surface of the work is inspected for scratches, presence of foreign matter, distortion, and the like. That is, when the work surface is flat, the light reflected from the work surface is totally reflected in the photosensor direction, and
If scratches, foreign matter, etc. adhere to the work surface, or if distortion occurs, the reflected light is scattered or deviated, so that the amount of reflected light received by the photosensor 5 decreases. As a result, when the intensity (output voltage) of the reflected light detected by the photosensor changes and the output voltage of the photosensor is lower than the threshold level, it is determined that the work surface has a scratch or the like.

【0003】[0003]

【発明が解決しようとする課題】しかし、従来の光学的
計測装置では、発光系、及び受光系がワークに近接する
位置に配設されているため、この両者間の挟み角αは上
記光源と上記フォトセンサとの形状により決定される。
従って、上記挟み角αを狭小化するには限界がある。
又、微少な傷、歪み等を一つのフォトセンサの出力電圧
の変化のみで検出することは極めて難しく、その対策と
して検出感度を単純に上げただけでは誤検出が生じ易く
なる。
However, in the conventional optical measuring device, since the light emitting system and the light receiving system are arranged at positions close to the work, the sandwiching angle α between them is the same as the light source. It is determined by the shape of the photo sensor.
Therefore, there is a limit to narrowing the included angle α.
Further, it is extremely difficult to detect minute scratches, distortions, and the like only by a change in the output voltage of one photosensor, and if the detection sensitivity is simply increased as a countermeasure, erroneous detection easily occurs.

【0004】従って、発光−受光素子からなる従来の光
学的検査装置では、液晶ディスプレイ等のガラス基板、
半導体等に採用するシリコンウエハ、セラミック基板等
の表面に形成された微細な傷、或は肉眼では確認するこ
との困難な異物の付着等、及び僅かな歪みを高精度に検
出することが困難であった。
Therefore, in the conventional optical inspection apparatus composed of a light emitting element and a light receiving element, a glass substrate such as a liquid crystal display,
It is difficult to detect minute scratches formed on the surface of silicon wafers, ceramic substrates, etc. used for semiconductors, etc., or adhesion of foreign matter that is difficult to see with the naked eye, and slight distortion with high accuracy. there were.

【0005】従って、本発明の目的は、低コストでワー
ク表面に形成された微細な傷、或は歪み等を高精度に検
出することのできるワークの光学的検査装置を提供する
ことにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an optical inspection device for a work which can detect fine scratches, distortions, etc. formed on the surface of the work at low cost with high accuracy.

【0006】[0006]

【課題を解決するための手段】本発明による第1のワー
クの光学的検査装置は、ワーク表面に検査光学先端部を
相対移動可能に対設し、この検査光学先端部に、光源か
らの検査光を上記ワーク表面に出射する1本の投光ファ
イバと、上記検査光の上記ワーク表面からの反射光を入
光する複数の受光ファイバとを結束して成るファイバ束
の先端部を少なくとも1本配設し、又上記ファイバ束に
設けた複数の受光ファイバを2つの受光ファイバ群に区
分し、この各受光ファイバ群の出射端にフォトセンサを
各々配設し、一方のフォトセンサは、検査演算部に直接
接続し、他方のフォトセンサは、反転回路を経て前記検
査演算部に接続し、前記検査演算部は、前記一方のフォ
トセンサからの出力電圧と前記反転回路を経た他方のフ
ォトセンサからの出力電圧との差と、予め設定したスレ
ッショルドレベルとを比較して、上記ワーク表面の傷等
の有無を検出するものであることを特徴とする。
In a first optical inspection device for a work according to the present invention, an inspection optical tip is provided on the surface of the work so as to be relatively movable, and the inspection optical tip is inspected from a light source. At least one tip of a fiber bundle formed by binding one light projecting fiber for emitting light to the work surface and a plurality of light receiving fibers for receiving the reflected light of the inspection light from the work surface. The plurality of light-receiving fibers arranged in the fiber bundle are divided into two light-receiving fiber groups, and photosensors are respectively arranged at the emission ends of the respective light-receiving fiber groups. , The other photosensor is connected to the inspection operation unit via an inversion circuit, and the inspection operation unit is connected to the output voltage from the one photosensor and the other photosensor via the inversion circuit. of And the difference between the force voltage is compared with the threshold level set in advance, and characterized in that to detect the presence or absence of scratches in the workpiece surface.

【0007】本発明による第2のワークの光学的検査装
置は、ワーク表面に検査光学先端部を相対移動可能に対
設し、この検査光学先端部に、光源からの検査光を上記
ワーク表面に出射する1本の投光ファイバと、上記検査
光の上記ワーク表面からの反射光を入光する複数の受光
ファイバとを結束して成るファイバ束の先端部を少なく
とも1本配設し、又上記ファイバ束に設けた複数の受光
ファイバを複数の受光ファイバ群に区分し、この各受光
ファイバ群の出射端にフォトセンサを各々配設し、この
各フォトセンサを、この各フォトセンサの出力電圧の差
に基づいて上記ワーク表面の歪みを検出する検査演算部
に接続したことを特徴とする。
In the second optical inspection device for a work according to the present invention, the inspection optical tip is provided on the surface of the work so as to be relatively movable, and the inspection light from the light source is directed to the surface of the work. At least one tip end of a fiber bundle formed by binding one emitting light emitting fiber and a plurality of light receiving fibers for receiving the reflected light of the inspection light from the work surface is provided, and The plurality of light-receiving fibers provided in the fiber bundle are divided into a plurality of light-receiving fiber groups, and photosensors are respectively provided at the output ends of the respective light-receiving fiber groups. It is characterized in that it is connected to an inspection calculation unit for detecting the distortion of the work surface based on the difference.

【0008】本発明の好ましい態様においては、上記第
1、第2のワーク検査装置における前記検査光学先端部
は、前記ファイバ束を複数本配列したファイバアレイで
構成されている。
[0008] In a preferred aspect of the present invention, the inspection optical tip in the first and second workpiece inspection devices is composed of a fiber array in which a plurality of the fiber bundles are arranged.

【0009】[0009]

【作用】第1のワークの光学的検査装置では、検査光学
先端部に設けた少なくとも1本のフアイバ束の中の1本
の投光ファイバからの検査光を、上記検査光学先端部に
対向して相対移動するワーク表面に出射し、その反射光
を上記ファイバ束の複数の受光ファイバに入光する。そ
して、この各受光ファイバから出射した反射光を、この
各受光ファイバを区分した2つの受光フアイバ群の出射
端に対設するフォトセンサで受光し、その反射光量を電
圧変換した後、検査演算部で、一方のフォトセンサから
の出力電圧と、他方のフォトセンサからの出力電圧を反
転した電圧との差を求め、その差電圧を予め設定したス
レッショルドレベルと比較して上記ワーク表面に傷、異
物の付着の有無を検査する。
In the optical inspection device for the first work, the inspection light from one projection fiber in at least one fiber bundle provided at the inspection optical tip is opposed to the inspection optical tip. Is emitted to the surface of the workpiece that moves relatively, and the reflected light enters the plurality of light receiving fibers of the fiber bundle. Then, the reflected light emitted from each of the light receiving fibers is received by a photosensor opposite to the light emitting ends of the two light receiving fiber groups that divide the light receiving fibers, and the amount of the reflected light is converted into a voltage. Then, the difference between the output voltage from one photosensor and the voltage obtained by inverting the output voltage from the other photosensor is obtained, and the difference voltage is compared with a preset threshold level to scratch or debris the work surface. Inspect for adherence.

【0010】第2のワークの光学的検査装置では、検査
光学先端部に設けた少なくとも1本のフアイバ束の中の
1本の投光ファイバからの検査光を、上記検査光学先端
部に対向して相対移動するワーク表面に出射し、その反
射光を上記ファイバ束の複数の受光ファイバに入光す
る。そして、この各受光ファイバから出射した上記反射
光を、この各受光ファイバを所定に区分した受光フアイ
バ群ごとの出射端に対設するフォトセンサで受光し、こ
の反射光量を電圧変換した後、検査演算部で上記各フォ
トセンサの出力電圧の差を求め、この差電圧に基づいて
上記ワーク表面の歪みを検査する。
In the optical inspection device for the second work, the inspection light from one projection fiber in at least one fiber bundle provided at the inspection optical tip is opposed to the inspection optical tip. Is emitted to the surface of the workpiece that moves relatively, and the reflected light enters the plurality of light receiving fibers of the fiber bundle. Then, the reflected light emitted from each of the light receiving fibers is received by a photosensor opposite to the emission end of each light receiving fiber group that divides each of the light receiving fibers in a predetermined manner, and the amount of the reflected light is converted into a voltage, which is then inspected. The difference between the output voltages of the photosensors is calculated by the arithmetic unit, and the distortion of the work surface is inspected based on the difference voltage.

【0011】又、上記第1、第2のワークの光学的検査
装置において、前記検査光学先端部を前記ファイバ束を
複数本配列したファイバアレイで構成することで、相対
的に移動するワーク表面を列単位で検査することができ
る。
Further, in the above-mentioned first and second optical inspection devices for works, the inspection optical tip portion is constituted by a fiber array in which a plurality of the fiber bundles are arranged, so that a relatively moving work surface is formed. It can be inspected column by column.

【0012】[0012]

【実施例】以下、図1〜6に基づいて本発明の実施例を
説明する。図1には、平板状ワークWと、この平板状ワ
ークWに対設する検査装置の検査光学先端部11とが示
されている。この平板状ワークWは液晶ディスプレイの
ガラス基板、セラミック基板、太陽電池の受光面等であ
り、検査光学先端部11に対して相対移動可能なテーブ
ル(図示せず)に載置される。
Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows a flat plate-shaped work W and an inspection optical tip portion 11 of an inspection device which is opposed to the flat plate-shaped work W. The flat work W is a glass substrate of a liquid crystal display, a ceramic substrate, a light receiving surface of a solar cell, or the like, and is placed on a table (not shown) that is movable relative to the inspection optical tip 11.

【0013】又、上記検査光学先端部11は、複数組の
ファイバ束12を、上記平板状ワークWの幅方向へ一列
に配列したファイバアレイであり、このファイバアレイ
を構成する各ファイバ束12は、互いに当接した状態で
結束する1本の投光ファイバ13と2本の受光ファイバ
14a,14bとで構成されている。更に、図2に示す
ように、この各ファイバ束12の先端に対物光学系15
が装着され、この対物光学系15の焦点上に上記平板状
ワークWの表面が臨まされる。
The inspection optical tip portion 11 is a fiber array in which a plurality of sets of fiber bundles 12 are arranged in a row in the width direction of the flat work W, and each fiber bundle 12 constituting this fiber array is , One light projecting fiber 13 and two light receiving fibers 14a and 14b which are bound together in a state of being in contact with each other. Further, as shown in FIG. 2, the objective optical system 15 is attached to the tip of each fiber bundle 12.
Is mounted, and the surface of the flat work W is exposed on the focal point of the objective optical system 15.

【0014】一方、図3に示すように、上記各ファイバ
束12の基端側が、個々に対応する演算装置21に臨ま
されている。この演算装置21は、光源部21Aと検査
演算部21Bとから成り、この光源部21Aに上記投光
ファイバ13の入射端が臨まされている。又、上記受光
ファイバ14a,14bは、二つの受光ファイバ群16
a,16bに区分され、その各受光ファイバ群16a,
16bの出射端が上記検査演算部21Bに臨まされてい
る。なお、本実施例では、受光ファイバが2本であるた
め、受光ファイバ群16a,16bに対して各1本の受
光ファイバ14a,14bが1対1で対応することにな
るが、受光ファイバが3本(好ましくは偶数本)以上あ
る場合、個々の受光ファイバを受光ファイバ群16a,
16bに適宜(例えば、偶数本あれば1/2本毎に)区
分して、上記検査演算部21Bに臨ませる。
On the other hand, as shown in FIG. 3, the proximal ends of the fiber bundles 12 face the corresponding computing devices 21. The arithmetic unit 21 is composed of a light source unit 21A and an inspection arithmetic unit 21B, and the light source unit 21A faces the incident end of the light projecting fiber 13. The light receiving fibers 14a and 14b are composed of two light receiving fiber groups 16
a, 16b, and each of the light receiving fiber groups 16a,
The emission end of 16b faces the inspection calculation unit 21B. In this embodiment, since there are two light receiving fibers, one light receiving fiber 14a and 14b corresponds to the light receiving fiber groups 16a and 16b in a one-to-one relationship, but three light receiving fibers are used. When there are more than one (preferably even number), the individual light receiving fibers are connected to the light receiving fiber group 16a,
16b is appropriately divided (for example, if there is an even number of lines, divided into ½ lines), and the inspection calculation unit 21B is exposed.

【0015】上記光源部21AにはLEDドライバ22
が設けられ、このLEDドライバ22からの駆動信号で
発光する発光ダイオード23に、上記投光ファイバ13
の入射端が対設されている。又、上記検査演算部21B
には、上記各受光ファイバ群16a,16bの出射端に
フォトセンサ24a,24bが各々対設されている。こ
の各フォトセンサ24a,24bは増幅回路25a,2
5bにそれぞれ接続され、一方の増幅回路25aが差動
増幅回路28の一方の入力端子に接続されている。又、
他方の増幅回路25bが、アナログマルチプレクサ等の
アナログスイッチ26に接続されている。このアナログ
スイッチ26は、2チャンネル構成で、一方の出力端子
が反転回路27を介して上記差動増幅回路28の他方の
入力端子に接続され、他方の出力端子が上記差動増幅回
路28の他方の入力端子に直接接続されている。なお、
このアナログスイッチ26では、図示しない制御装置か
ら出力される制御信号に従って何れかのチャンネルを時
分割で、或は任意に選択する。又、上記差動増幅回路2
8では、入力される2つの信号の差に比例した電圧を出
力する。
The light source section 21A includes an LED driver 22.
Is provided to the light emitting diode 23 which emits light in response to the drive signal from the LED driver 22,
The entrance ends of are opposite to each other. Also, the inspection calculation unit 21B
, Photosensors 24a and 24b are respectively installed at the emission ends of the respective light receiving fiber groups 16a and 16b. Each of the photosensors 24a and 24b includes an amplifier circuit 25a and 2a.
5b, and one amplifier circuit 25a is connected to one input terminal of the differential amplifier circuit 28. or,
The other amplifier circuit 25b is connected to an analog switch 26 such as an analog multiplexer. The analog switch 26 has a two-channel configuration, one output terminal is connected to the other input terminal of the differential amplifier circuit 28 via an inverting circuit 27, and the other output terminal is the other of the differential amplifier circuit 28. It is directly connected to the input terminal of. In addition,
The analog switch 26 selects one of the channels in a time-divisional manner or arbitrarily according to a control signal output from a control device (not shown). Also, the differential amplifier circuit 2
At 8, the voltage output is proportional to the difference between the two input signals.

【0016】更に、この差動増幅回路28の出力端子
が、比較回路29の一方の入力端子に接続され、他方の
入力端子にスレッショルドレベル設定回路30が接続さ
れている。上記比較回路29では、上記差動増幅回路2
8から出力される差電圧を上記スレッショルドレベル設
定回路30から出力されるスレッショルドレベルと比較
し、その結果をカウンタ等を含む後処理回路31へ出力
する。一方、上記差動増幅回路28の他方の出力端子
は、A/D変換回路を含む後処理回路32に接続されて
いる。上記スレッショルドレベルは上記平板状ワークW
の表面の傷Wo (或は異物の付着)等の有無を判断する
しきい値で、検査対象となる平板状ワークWの表面の性
状に基づいて設定されている。
Further, the output terminal of the differential amplifier circuit 28 is connected to one input terminal of the comparison circuit 29, and the threshold level setting circuit 30 is connected to the other input terminal. In the comparison circuit 29, the differential amplifier circuit 2
The difference voltage output from 8 is compared with the threshold level output from the threshold level setting circuit 30, and the result is output to the post-processing circuit 31 including a counter and the like. On the other hand, the other output terminal of the differential amplifier circuit 28 is connected to a post-processing circuit 32 including an A / D conversion circuit. The threshold level is the flat work W
Is a threshold value for determining the presence or absence of scratches Wo (or adherence of foreign matter) on the surface of the sheet, and is set based on the surface properties of the flat work W to be inspected.

【0017】上記検査演算部21Bでは、上記アナログ
スイッチ26の切換え動作により、上記平板状ワークW
の表面の傷Wo (或は異物の付着)等の有無と歪みθと
を、選択的に検査する。すなわち、上記アナログスイッ
チ26により上記増幅回路25bからの出力信号を上記
反転回路27へ出力したときは、平板状ワークWの表面
の傷Wo (或は異物の付着)等の有無が検査され、その
結果が上記後処理回路31で処理される。又、上記増幅
回路25bからの出力信号を上記差動増幅回路28へ直
接出力したときは、上記平板状ワークWの表面の歪みθ
が検査され、その結果が上記A/D変換回路を含む後処
理回路32へ出力される。
In the inspection / calculation section 21B, the flat work W is changed by the switching operation of the analog switch 26.
The presence or absence of scratches Wo (or adherence of foreign matter) on the surface and the distortion θ are selectively inspected. That is, when the output signal from the amplifier circuit 25b is output to the inversion circuit 27 by the analog switch 26, it is inspected for the presence of scratches Wo (or adherence of foreign matter) on the surface of the flat work W, and The result is processed by the post-processing circuit 31. When the output signal from the amplifier circuit 25b is directly output to the differential amplifier circuit 28, the distortion .theta.
Is checked and the result is output to the post-processing circuit 32 including the A / D conversion circuit.

【0018】次に、上記構成による実施例の作用につい
て説明する。検査装置のテーブル(図示せず)に平板状
ワークWを載置し、このテーブルを相対移動させて、上
記平板状ワークWを検査光学先端部11へ移送する。こ
の検査光学先端部11の各ファイバ束12に設けた投光
ファイバ13からは、図3に示す演算装置21の光源部
21Aに設けた発光ダイオード23からの検査光が出射
され、対物光学系15を介して上記平板状ワークWの表
面に照射される。
Next, the operation of the embodiment having the above structure will be described. A flat plate-shaped work W is placed on a table (not shown) of the inspection device, and the table is relatively moved to transfer the flat plate-shaped work W to the inspection optical tip 11. From the light projecting fiber 13 provided in each fiber bundle 12 of the inspection optical tip portion 11, the inspection light is emitted from the light emitting diode 23 provided in the light source portion 21A of the arithmetic unit 21 shown in FIG. The surface of the flat plate-shaped work W is irradiated with the light through.

【0019】一方、上記平板状ワークWの表面から反射
された上記検査光が、上記対物光学系15を経て2つの
受光ファイバ14a,14bにそれぞれ入射されると、
この反射光が、各受光ファイバ14a,14bの出射
端、すなわち本実施例では1対1に対応している受光フ
ァイバ群16a,16bの出射端から上記演算装置21
の検査演算部21Bに設けた各フォトセンサ24a,2
4bにて受光され、反射光量が電圧変換された後、増幅
回路25a,25bで所定に増幅される。上記反射光
は、上記平板状ワークWの表面に傷(或は付着物等)W
o が存在すると、散乱されるため、上記各フォトセンサ
24a,24bでの受光量が減少し、上記増幅回路25
a,25bから出力される電圧も低い値になる。
On the other hand, when the inspection light reflected from the surface of the flat plate-shaped work W is incident on the two light receiving fibers 14a and 14b via the objective optical system 15,
The reflected light is emitted from the output ends of the light receiving fibers 14a and 14b, that is, from the output ends of the light receiving fiber groups 16a and 16b, which correspond to each other in the present embodiment, in the arithmetic unit 21.
Photosensors 24a, 2 provided in the inspection calculation unit 21B
After being received by 4b, the amount of reflected light is converted into a voltage, and then amplified by the amplifier circuits 25a and 25b in a predetermined manner. The reflected light causes scratches (or adhered matters) W on the surface of the flat plate-like work W.
If o is present, it is scattered, so the amount of light received by each of the photosensors 24a and 24b decreases, and the amplifier circuit 25
The voltage output from a and 25b also becomes a low value.

【0020】そして、一方の増幅回路25aからの出力
電圧が、差動増幅回路28の一方の入力端子へ出力さ
れ、又、他方の増幅回路25bからの出力電圧は、アナ
ログスイッチ26を介し、現在の検査項目が上記平板状
ワークWの表面の傷Wo 等の有無の検査である場合には
反転回路27へ出力し、又、現在の検査項目が上記平板
状ワークWの表面の歪みθの検査である場合には、上記
差動増幅回路28の他方の入力端子に直接出力する。
The output voltage from the one amplification circuit 25a is output to one input terminal of the differential amplification circuit 28, and the output voltage from the other amplification circuit 25b is passed through the analog switch 26 and is now output. If the inspection item is an inspection for the presence or absence of scratches Wo or the like on the surface of the flat work W, it is output to the inverting circuit 27, and the current inspection item is an inspection for the distortion θ of the surface of the flat work W. If it is, the signal is directly output to the other input terminal of the differential amplifier circuit 28.

【0021】以下の説明では、まず平板状ワークWの表
面の傷Wo 等の有無を検査する場合について説明し、次
いで平板状ワークWの表面の歪みθを検査する場合につ
いて説明する。
In the following description, the case of inspecting the surface of the flat work W for the presence of scratches Wo and the like will be described first, and then the case of inspecting the strain θ of the surface of the flat work W will be described.

【0022】上記増幅回路25bからの出力電圧がアナ
ログスイッチ26を経て反転回路27で反転された後、
上記差動増幅回路28の他方の入力端子に入力される
と、一方の入力端子に入力されている上記増幅回路25
aからの出力電圧との差に比例した電圧が出力される。
この増幅回路25aに入力される2つの出力電圧は、上
記ワークWの表面で反射した同一の検査光の反射光を光
電変換したものであるため、一方の出力電圧を反転させ
て上記2つの出力電圧の差を求めることで、出力電圧の
変化が増大されて感度が格段に良くなり、差電圧の感度
が通常は0.2V程度であるものが、1.0〜2.0V
と大きくなる。
After the output voltage from the amplifier circuit 25b is inverted by the inversion circuit 27 through the analog switch 26,
When input to the other input terminal of the differential amplifier circuit 28, the amplifier circuit 25 is input to one input terminal.
A voltage proportional to the difference from the output voltage from a is output.
The two output voltages input to the amplifier circuit 25a are obtained by photoelectrically converting the reflected light of the same inspection light reflected on the surface of the work W, so that one output voltage is inverted to output the two output voltages. By obtaining the voltage difference, the change in the output voltage is increased and the sensitivity is remarkably improved. The sensitivity of the difference voltage is normally about 0.2V, but 1.0 to 2.0V.
And grows.

【0023】そして、この差動増幅回路28から出力さ
れる差電圧が比較回路29の一方の入力端子に入力さ
れ、他方の入力端子に入力されているスレッショルドレ
ベル設定回路30からのスレッショルドレベルと比較さ
れる。このスレッショルドレベルは、上記ワークWの表
面の微細な傷(或は付着物等)Wo がある場合の上記差
動増幅回路28から出力される差電圧の増大量を予測し
て、差電圧がそのような値に増大したことを検出できる
ようなしきい値として予め設定される。
The difference voltage output from the differential amplifier circuit 28 is input to one input terminal of the comparison circuit 29 and compared with the threshold level from the threshold level setting circuit 30 input to the other input terminal. To be done. This threshold level predicts the amount of increase in the differential voltage output from the differential amplifier circuit 28 when there is a minute scratch (or adhered matter) Wo on the surface of the work W, and the differential voltage The threshold value is set in advance so that it can be detected that the value has increased.

【0024】そして、この比較回路29からは、上記差
電圧が上記スレッショルドレベル以上のときはH信号
が、又差電圧が上記スレッショルドレベル以下のときは
L信号が、後処理回路31へ出力される。この後処理回
路31では、上記比較回路29からの出力信号を、上記
平板状ワークWの移動量に同期して所定時間ごとに読込
み、平板状ワークWの移動量に対応するメモリのアドレ
スをカウンタで順次指定し、当該アドレスの1ビットデ
ータをH信号が出力されているときにセットし、L信号
が出力されているとにはクリアする。
The comparison circuit 29 outputs an H signal to the post-processing circuit 31 when the difference voltage is above the threshold level, and an L signal when the difference voltage is below the threshold level. . In the post-processing circuit 31, the output signal from the comparison circuit 29 is read every predetermined time in synchronization with the movement amount of the flat plate work W, and the address of the memory corresponding to the movement amount of the flat plate work W is counted. Are sequentially designated by, and 1-bit data of the address is set when the H signal is output, and cleared when the L signal is output.

【0025】この検査は、各ファイバ束12に連設する
演算装置21毎に実行されており、各演算装置21に設
けた上記後処理回路31のメモリに格納されているデー
タを点座標系に表して出力することで、上記ワークWの
表面の傷(或は付着物等)Wo の有無、及びその傷等の
位置を列単位で順次検査することができる。
This inspection is executed for each arithmetic unit 21 connected to each fiber bundle 12, and the data stored in the memory of the post-processing circuit 31 provided in each arithmetic unit 21 is converted into a point coordinate system. By displaying and outputting the data, it is possible to sequentially inspect the presence or absence of scratches (or adhered matters) Wo on the surface of the work W and the positions of the scratches in column units.

【0026】一方、上記平板状ワークWの表面の歪みθ
を検査する場合は、上記アナログスイッチ26から上記
増幅回路25bで増幅された電圧が上記差動増幅回路2
8の他方の入力端子へ直接出力される。そして、この差
動増幅回路28で、両増幅回路25a,25bから出力
された電圧の差に比例した電圧を後処理回路32へ出力
する。
On the other hand, the surface strain θ of the flat work W
When inspecting, the voltage amplified by the amplifier circuit 25b from the analog switch 26 is the differential amplifier circuit 2
8 is directly output to the other input terminal. Then, the differential amplifier circuit 28 outputs a voltage proportional to the difference between the voltages output from the two amplifier circuits 25a and 25b to the post-processing circuit 32.

【0027】図2に示すように、例えば上記ワークWの
表面に図の右上方向への傾きθの歪みがある場合、投光
ファイバ13から出射された検査光の反射方向は偏角
し、上記受光ファイバ14a側へ多く反射され、その
分、他方の受光ファイバ14bへの反射光量が少なくな
る。その結果、上記受光ファイバ14aから出射し、フ
ォトセンサ25aで受光される反射光量は、平坦時の受
光量をPとした場合、P+δP(δP:傾きθに対する
変化量)となり、又、他方の受光ファイバ14bを経て
他方のフォトセンサ25bで受光される反射光量は、P
−δPとなる。上記差動増幅回路28から出力される電
圧は、上記光量(P+δP,P−δP)の差に比例した
電圧であるため、上記平板状ワークWの表面が平坦(θ
=0)の場合には、0Vに近い値となり、また、傾きθ
の歪みがある場合には、傾きの方向により+2δP、或
は−2δPに対応した電圧が、後処理回路32へ出力さ
れる。
As shown in FIG. 2, for example, when the surface of the work W is distorted with an inclination θ in the upper right direction in the figure, the reflection direction of the inspection light emitted from the light projecting fiber 13 is deviated, and A large amount of light is reflected to the side of the light receiving fiber 14a, and the amount of reflected light to the other light receiving fiber 14b decreases accordingly. As a result, the amount of reflected light emitted from the light receiving fiber 14a and received by the photosensor 25a becomes P + δP (δP: the amount of change with respect to the inclination θ) when the amount of light received in the flat state is P, and the other light is received. The amount of reflected light received by the other photosensor 25b through the fiber 14b is P
−δP. Since the voltage output from the differential amplifier circuit 28 is a voltage proportional to the difference between the light amounts (P + δP, P−δP), the surface of the flat work W is flat (θ).
= 0), the value is close to 0 V, and the slope θ
When there is a distortion of, the voltage corresponding to + 2δP or -2δP is output to the post-processing circuit 32 depending on the inclination direction.

【0028】この後処理回路32では、上記差動増幅回
路28から出力された電圧を、A/D変換し、このデー
タを上記平板状ワークWの移動量に同期して所定時間ご
とにメモリに格納する。そして、この検査結果を演算装
置21毎の点座標系に表すことで、上記ワークWの表面
全体の歪み具合を具体的な数字で把握することができ
る。
In the post-processing circuit 32, the voltage output from the differential amplifier circuit 28 is A / D-converted, and this data is stored in the memory in synchronization with the movement amount of the flat plate-shaped work W at predetermined intervals. Store. Then, by expressing the inspection result in the point coordinate system of each arithmetic unit 21, it is possible to grasp the degree of distortion of the entire surface of the work W by a specific number.

【0029】なお、平板状ワークWの表面の傷、歪みの
何れを検査する場合も、2本の受光ファイバ14a,1
4bは、極めて近接した位置でワーク表面に対設されて
いるため、色調の変化や距離の変化等は互いに相殺され
る。
When inspecting for any scratches or distortions on the surface of the flat work W, the two light receiving fibers 14a, 1 are used.
Since 4b is placed opposite to the work surface at a position extremely close to each other, a change in color tone, a change in distance, and the like cancel each other out.

【0030】更に、本実施例では、1本の投光ファイバ
13と2本の受光ファイバ14a,14bとを最小の断
面積となる配列で結束しているが、検査対象となるワー
クの大きさ、及び状態に応じて適宜設定することがで
き、例えば、図4に示すように、2本の受光ファイバ1
4a,14bを上記投光ファイバ13を挟む両側に配設
しても良く、又、図5に示すように、上記投光ファイバ
13を中心として、4本の受光ファイバ14a〜14d
を十文字状に配列し、或は、図6に示すように、上記投
光ファイバ13の周囲に受光ファイバ14a〜14fを
複数配設するようにしても良い。この場合、上記各受光
ファイバ14a〜14d、或は14a〜14fの出射端
側は、2つの受光ファイバ群16a,16bに区分され
て、図3に示す上記演算装置21の検査演算部21Bへ
導かれる。
Further, in the present embodiment, one light projecting fiber 13 and two light receiving fibers 14a and 14b are bundled in an array having the smallest cross-sectional area, but the size of the work to be inspected. , And the state can be appropriately set. For example, as shown in FIG.
4a and 14b may be disposed on both sides of the light projecting fiber 13, and as shown in FIG. 5, four light receiving fibers 14a to 14d with the light projecting fiber 13 as the center.
May be arranged in a cross shape, or as shown in FIG. 6, a plurality of light receiving fibers 14a to 14f may be arranged around the light projecting fiber 13. In this case, the output end side of each of the light receiving fibers 14a to 14d or 14a to 14f is divided into two light receiving fiber groups 16a and 16b, and is guided to the inspection operation unit 21B of the operation device 21 shown in FIG. Get burned.

【0031】[0031]

【発明の効果】以上、説明したように本発明によれば、
光源からの検査光を投光ファイバを介してワーク表面に
出射し、その反射光を受光ファイバを介してフォトセン
サまで導くようにしたので、上記ワーク表面に対設する
検査光学先端部を極小サイズに形成することが可能にな
り、ワーク表面の微細な傷、或は歪み等を検出すること
が可能になる。
As described above, according to the present invention,
The inspection light from the light source is emitted to the work surface via the light projecting fiber, and the reflected light is guided to the photosensor via the light receiving fiber. Therefore, it becomes possible to detect minute scratches or distortions on the surface of the work.

【0032】又、1本の投光ファイバから出射した検査
光の上記ワーク表面からの反射光を、複数の受光ファイ
バに入光し、この各入光された反射光をそれぞれに区分
された受光ファイバ群毎にフォトセンサで受光するよう
にしたので、ワーク表面に形成された微細な傷、或は歪
み等を高感度で検出でるようになり、検査精度を格段に
向上させることができるばかりでなく、低コスト化が実
現できる。
Further, the inspection light emitted from one light projecting fiber is reflected by the work surface and is incident on a plurality of light receiving fibers, and each of the incident reflected light is received separately. Since the photo sensor receives light for each fiber group, it becomes possible to detect minute scratches, distortions, etc. formed on the surface of the work with high sensitivity, and not only the inspection accuracy can be significantly improved. It is possible to realize cost reduction.

【図面の簡単な説明】[Brief description of drawings]

【図1】ワークと図2のI−I断面で示す検査光学先端
部の平面図である。
FIG. 1 is a plan view of a work and an inspection optical tip portion taken along the line II of FIG.

【図2】図1のA矢視側面図である。FIG. 2 is a side view taken along arrow A in FIG.

【図3】演算装置の回路図である。FIG. 3 is a circuit diagram of an arithmetic unit.

【図4】他の態様によるファイバ束の断面図である。FIG. 4 is a cross-sectional view of a fiber bundle according to another aspect.

【図5】別の態様によるファイバ束の断面図である。FIG. 5 is a cross-sectional view of a fiber bundle according to another aspect.

【図6】その他の態様によるファイバ束の断面図であ
る。
FIG. 6 is a cross-sectional view of a fiber bundle according to another aspect.

【図7】従来の光学的検査装置の概略説明図である。FIG. 7 is a schematic explanatory view of a conventional optical inspection device.

【符号の説明】[Explanation of symbols]

11…検査光学先端部 12…ファイバ束 13…投光ファイバ 14a〜14f…受光ファイバ 16a,16b…受光ファイバ群 21A…光源 21B…検査演算部 24a,24b…フォトセンサ W…ワーク Reference numeral 11 ... Inspection optical tip portion 12 ... Fiber bundle 13 ... Projection fibers 14a to 14f ... Receiving fibers 16a, 16b ... Receiving fiber group 21A ... Light source 21B ... Inspection computing unit 24a, 24b ... Photo sensor W ... Workpiece

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ワーク表面に検査光学先端部を相対移動
可能に対設し、 この検査光学先端部に、光源からの検査光を上記ワーク
表面に出射する1本の投光ファイバと、上記検査光の上
記ワーク表面からの反射光を入光する複数の受光ファイ
バとを結束して成るファイバ束の先端部を少なくとも1
本配設し、 又上記ファイバ束に設けた複数の受光ファイバを2つの
受光ファイバ群に区分し、 この各受光ファイバ群の出射端にフォトセンサを各々配
設し、 一方のフォトセンサは、検査演算部に直接接続し、他方
のフォトセンサは、反転回路を経て前記検査演算部に接
続し、 前記検査演算部は、前記一方のフォトセンサからの出力
電圧と前記反転回路を経た他方のフォトセンサからの出
力電圧との差と、予め設定したスレッショルドレベルと
を比較して、上記ワーク表面の傷等の有無を検出するも
のであることを特徴とするワークの光学的検査装置。
1. An inspection optical tip is provided on a surface of a work so as to be relatively movable, and one optical projection fiber for emitting inspection light from a light source to the surface of the work is provided at the inspection optical tip, and the inspection. At least one end portion of a fiber bundle formed by binding a plurality of light receiving fibers that receive reflected light of light from the work surface
The plurality of light receiving fibers provided in this fiber bundle are divided into two light receiving fiber groups, and photosensors are respectively provided at the emission ends of the respective light receiving fiber groups. Directly connected to the operation unit, the other photosensor is connected to the inspection operation unit via an inversion circuit, the inspection operation unit, the output voltage from the one photosensor and the other photosensor via the inversion circuit An optical inspection device for a work, wherein the presence or absence of scratches or the like on the work surface is detected by comparing the difference between the output voltage from the work and a preset threshold level.
【請求項2】 ワーク表面に検査光学先端部を相対移動
可能に対設し、 この検査光学先端部に、光源からの検査光を上記ワーク
表面に出射する1本の投光ファイバと、上記検査光の上
記ワーク表面からの反射光を入光する複数の受光ファイ
バとを結束して成るファイバ束の先端部を少なくとも1
本配設し、 又上記ファイバ束に設けた複数の受光ファイバを複数の
受光ファイバ群に区分し、 この各受光ファイバ群の出射端にフォトセンサを各々配
設し、 この各フォトセンサを、この各フォトセンサの出力電圧
の差に基づいて上記ワーク表面の歪みを検出する検査演
算部に接続したことを特徴とするワークの光学的検査装
置。
2. An inspection optical tip is provided on the surface of the work so as to be relatively movable, and one optical projection fiber for emitting inspection light from a light source to the surface of the work is provided to the inspection optical tip, and the inspection. At least one end portion of a fiber bundle formed by binding a plurality of light receiving fibers that receive reflected light of light from the work surface
The plurality of light receiving fibers provided in the fiber bundle are divided into a plurality of light receiving fiber groups, and photosensors are respectively provided at the exit ends of the respective light receiving fiber groups. An optical inspection device for a work, which is connected to an inspection calculation unit for detecting the distortion of the surface of the work based on a difference in output voltage of each photo sensor.
【請求項3】 前記検査光学先端部を前記ファイバ束を
複数本配列したファイバアレイで構成したことを特徴と
する前記請求項1又は2記載のワークの光学的検査装
置。
3. The optical inspection device for a workpiece according to claim 1, wherein the inspection optical tip portion is formed of a fiber array in which a plurality of the fiber bundles are arranged.
JP16681195A 1995-06-08 1995-06-08 Optical inspection system for workpieces Expired - Lifetime JP3815628B2 (en)

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JP16681195A JP3815628B2 (en) 1995-06-08 1995-06-08 Optical inspection system for workpieces

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Application Number Priority Date Filing Date Title
JP16681195A JP3815628B2 (en) 1995-06-08 1995-06-08 Optical inspection system for workpieces

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JPH08334471A true JPH08334471A (en) 1996-12-17
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057157B2 (en) 2000-11-02 2006-06-06 Kirin Techno-System Corporation Photosensor device and disk inspection apparatus using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057157B2 (en) 2000-11-02 2006-06-06 Kirin Techno-System Corporation Photosensor device and disk inspection apparatus using it

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JP3815628B2 (en) 2006-08-30

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