JPH08330888A - Ceramic resonator - Google Patents

Ceramic resonator

Info

Publication number
JPH08330888A
JPH08330888A JP13333795A JP13333795A JPH08330888A JP H08330888 A JPH08330888 A JP H08330888A JP 13333795 A JP13333795 A JP 13333795A JP 13333795 A JP13333795 A JP 13333795A JP H08330888 A JPH08330888 A JP H08330888A
Authority
JP
Japan
Prior art keywords
cap case
insulating substrate
ceramic resonator
piezoelectric element
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13333795A
Other languages
Japanese (ja)
Inventor
Tsuneo Hirao
恒夫 平尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP13333795A priority Critical patent/JPH08330888A/en
Publication of JPH08330888A publication Critical patent/JPH08330888A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a ceramic resonator attaining miniaturization (small area). CONSTITUTION: Terminal plates 11a to 11c consisting of metalic material are integrated to a cap case 10 housing a capacitive element 3 and a piezoelectric element 6 to engage an insulated substrate 12 with the level difference part 10b of an opening part. Then the other terminals 11d to 11f of the terminal plates 11a to 11c are bent to the side of the outside of the insulated substrate 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は圧電素子の振動を利用し
たセラミック共振子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic resonator utilizing the vibration of a piezoelectric element.

【0002】[0002]

【従来の技術】セラミック共振子はマイクロコンピュー
タ用のクロック発振、各種リモートコントロール装置の
発振等に不可欠な電子部品として将来の発展が期待され
ている電子部品である。
2. Description of the Related Art Ceramic resonators are electronic parts that are expected to develop in the future as indispensable electronic parts for clock oscillation for microcomputers and oscillations of various remote control devices.

【0003】以下に従来のセラミック共振子について説
明する。図5は従来のセラミック共振子の外観斜視図、
図6はその要部拡大断面図、図7はその等価回路図であ
る。尚、図6は左右対称のために左半分のみを示してい
る。
A conventional ceramic resonator will be described below. FIG. 5 is an external perspective view of a conventional ceramic resonator,
FIG. 6 is an enlarged cross-sectional view of the main part, and FIG. 7 is an equivalent circuit diagram thereof. Note that FIG. 6 shows only the left half because of left-right symmetry.

【0004】絶縁基板1の表、裏面にはある一定の間隔
で第一電極2a、第二電極2b、第三電極2cが設けら
れ、絶縁基板1の側面に形成された半円切り欠き状の側
面電極2d,2e,2fを介して表裏間の電気的導通が
図られている。容量素子3は薄板状で表側電極4aおよ
びこれと対称位置の右側の表側電極(図示せず)と裏側
電極4bとにより長尺方向に2箇所の静電容量(コンデ
ンサ)を形成している。絶縁基板1の各電極2a,2
b,2cと容量素子3の各電極4a,4b,4cとは第
一電極2aと表側電極4a、第二電極2bと裏側電極4
b、第三電極2cと表側電極の各接続が導電性接着剤5
によりなされている。
A first electrode 2a, a second electrode 2b, and a third electrode 2c are provided on the front and back surfaces of the insulating substrate 1 at regular intervals, and have a semicircular cutout shape formed on the side surface of the insulating substrate 1. Electrical connection between the front and back is achieved via the side surface electrodes 2d, 2e, 2f. The capacitive element 3 is in the form of a thin plate, and a front electrode 4a, a right front electrode (not shown) symmetrical to the front electrode 4a, and a back electrode 4b form two capacitances (capacitors) in the longitudinal direction. Each electrode 2a, 2 of the insulating substrate 1
b and 2c and the electrodes 4a, 4b and 4c of the capacitive element 3 are the first electrode 2a and the front side electrode 4a, the second electrode 2b and the back side electrode 4 respectively.
b, each connection between the third electrode 2c and the front electrode is a conductive adhesive 5
Is done by.

【0005】圧電素子6は薄板状で表側電極7a、およ
び裏側電極7bが設けられ、長尺方向の両端部が導電性
接着剤5により容量素子3の表側電極4aと圧電素子6
の表側電極7a、表側電極4cと裏側電極7bとがそれ
ぞれ接続されている。なお、キャップケース8は一端の
開口部8aと内部の空洞部8bを有し、外周側面8cは
直線平面となった断面コ字状の箱であり、空洞部8bに
容量素子3と圧電素子6を収納し、開口部8aが絶縁基
板1上に接着剤9により密封固定されているものであ
る。上記構成を等価回路で示すと図7となり、圧電素子
6とコンデンサA,Bを同時収納したセラミック共振子
である。
The piezoelectric element 6 has a thin plate shape and is provided with a front electrode 7a and a back electrode 7b. Both ends of the piezoelectric element 6 in the lengthwise direction are electrically conductive adhesive 5 and the front electrode 4a of the capacitive element 3 and the piezoelectric element 6 are provided.
The front side electrode 7a, the front side electrode 4c, and the back side electrode 7b are connected to each other. The cap case 8 has an opening 8a at one end and a hollow portion 8b inside, and the outer peripheral side surface 8c is a box having a U-shaped cross section that is a linear plane. The hollow portion 8b has a capacitive element 3 and a piezoelectric element 6 therein. And the opening 8a is hermetically fixed on the insulating substrate 1 with an adhesive 9. The above configuration is shown in an equivalent circuit in FIG. 7, which is a ceramic resonator in which the piezoelectric element 6 and the capacitors A and B are housed at the same time.

【0006】[0006]

【発明が解決しようとする課題】上記従来の構成では、
絶縁基板1の表面電極2a,2b,2cは一定膜厚の平
面状で、また、キャップケース8の開口部8aも平面状
であり、したがって、絶縁基板1とキャップケース8と
の接着剤9による密封固定時において搭載ずれが生じ易
く、キャップケース8の側面8cが絶縁基板1の半円切
り欠き状側面電極2d,2e,2fに近接しすぎると接
着剤9が側面電極2d,2e,2f部に流れ込み、半田
付け不良となるものである。これらの防止を考慮する
と、搭載ずれを見込んだ広い面積の絶縁基板1寸法とす
る必要があり、したがって、実装面積が大となるという
問題点を有していた。
SUMMARY OF THE INVENTION In the above conventional configuration,
The surface electrodes 2a, 2b, 2c of the insulating substrate 1 are flat with a constant film thickness, and the opening 8a of the cap case 8 is also flat, so that the adhesive 9 between the insulating substrate 1 and the cap case 8 is used. If the side surface 8c of the cap case 8 is too close to the semicircular cutout side surface electrodes 2d, 2e, 2f of the insulating substrate 1, the adhesive 9 causes the side surface electrodes 2d, 2e, 2f to come into contact with each other. Flow into the solder and lead to poor soldering. In consideration of these preventions, it is necessary to make the size of the insulating substrate 1 to be a large area in consideration of mounting misalignment, so that there is a problem that the mounting area becomes large.

【0007】本発明は上記従来の問題点を解決するもの
で、実装時の小面積化を容易に図ったセラミック共振子
を提供することを目的とする。
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a ceramic resonator whose area can be easily reduced during mounting.

【0008】[0008]

【課題を解決するための手段】そしてこの目的を達成す
るために本発明は、開口端部内側に段部を有する断面コ
字状のキャップケースと、上記キャップケース内に収納
された容量素子および圧電素子と、上記キャップケース
開口端部内側の段部に嵌合された絶縁基板とからなり、
一端がキャップケース内の圧電素子に電気的に接続され
た金属端子板の他端を、キャップケースの天面、または
側面からキャップケース外部へ引出した後、このキャッ
プケースの開口端部の絶縁基板外面側に折曲し、入、出
力端子としたものである。
In order to achieve this object, the present invention provides a cap case having a U-shaped cross section having a step inside the opening end, a capacitive element housed in the cap case, and A piezoelectric element and an insulating substrate fitted to the step inside the opening end of the cap case,
After pulling out the other end of the metal terminal plate, one end of which is electrically connected to the piezoelectric element inside the cap case, from the top or side of the cap case to the outside of the cap case, the insulating substrate at the open end of this cap case It is bent to the outside and used as an input and output terminal.

【0009】[0009]

【作用】この構成によれば、キャップケース内に容量素
子、圧電素子が収納され、また絶縁基板はキャップケー
スの開口端部内側の段部に嵌合され、さらに金属端子板
の他端はキャップケースの側面から絶縁基板外面側に折
曲し、入、出力端子とするため、キャップケースの搭載
ずれがおきず、また絶縁基板の小面積化が可能となり、
したがって、実装面積を小さくすることが出来る。
According to this structure, the capacitative element and the piezoelectric element are housed in the cap case, the insulating substrate is fitted to the step inside the opening end of the cap case, and the other end of the metal terminal plate is capped. Since it is bent from the side of the case to the outer surface of the insulating board and used as input and output terminals, there is no misalignment of the cap case and it is possible to reduce the area of the insulating board.
Therefore, the mounting area can be reduced.

【0010】[0010]

【実施例】以下、本発明の一実施例について、図面を参
照しながら説明する。図1は本発明の一実施例における
セラミック共振子の斜視図、図2は本発明の要部拡大断
面図、図3はその組み立て構成を示す分解斜視図、尚、
図3は左右対称のために左半分のみを示している。ま
た、従来例と同一の部品については同一番号を記してい
る。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a ceramic resonator according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of an essential part of the present invention, and FIG. 3 is an exploded perspective view showing its assembly configuration.
FIG. 3 shows only the left half because of left-right symmetry. Further, the same parts as those in the conventional example are designated by the same reference numerals.

【0011】キャップケース10は一端に開口部10
a、その開口部10aの内側に段差部10b、内部に空
洞部10cを有した断面コ字状の箱である。金属材料よ
りなる長尺の端子板11a〜11cはキャップケース1
0の天面10dの近傍部で、内部の空洞部10cに一端
が挿入された状態で3箇所一定間隔で設けられている。
また、端子板11a〜11cの他端11d,11e,1
1fはキャップケース10の外側面10eの両側より突
出し、開口部10a側へそれぞれ曲げられ、最終的には
図2のごとく段差部10bに嵌合される絶縁基板12の
外面側へ折曲される。容量素子3は薄板状で表側電極4
a、およびこれと対称位置の表側電極4cと裏側電極4
bとにより長尺方向に2箇所の静電容量(コンデンサ)
を有しているものである。キャップケース10の空洞部
10cに突入された端子板11a〜11cの一端は、容
量素子3の各電極4a,4b,4cと導電性接着剤5に
より電気的に接続されている。
The cap case 10 has an opening 10 at one end.
a, a stepped portion 10b inside the opening 10a, and a hollow portion 10c inside the box having a U-shaped cross section. The long terminal plates 11a to 11c made of a metal material are the cap case 1
In the vicinity of the top surface 10d of 0, one end is inserted into the internal cavity 10c, and three spaces are provided at regular intervals.
Also, the other ends 11d, 11e, 1 of the terminal plates 11a to 11c.
1f protrudes from both sides of the outer surface 10e of the cap case 10, is bent toward the opening 10a, and is finally bent toward the outer surface of the insulating substrate 12 fitted in the step portion 10b as shown in FIG. . The capacitive element 3 is a thin plate and has a front electrode 4
a, and the front side electrode 4c and the back side electrode 4 at symmetrical positions
Capacitance (capacitor) at two locations in the longitudinal direction depending on b
Are those that have. One end of each of the terminal plates 11a to 11c protruding into the cavity 10c of the cap case 10 is electrically connected to each of the electrodes 4a, 4b, 4c of the capacitive element 3 by the conductive adhesive 5.

【0012】圧電素子6は薄板状で表側電極7a、およ
び裏側電極7bが設けられ、長尺方向の両端部が導電性
接着剤5により容量素子3の表側電極4aと圧電素子6
の表側電極7a、表側電極4cと裏側電極7bとがそれ
ぞれ電気的に接続されている。つまり端子板11a〜1
1cと容量素子3および圧電素子6が電気的に接続され
ているのである。
The piezoelectric element 6 has a thin plate shape and is provided with a front side electrode 7a and a back side electrode 7b. Both ends in the lengthwise direction are covered with a conductive adhesive 5 and the front side electrode 4a of the capacitive element 3 and the piezoelectric element 6 are connected.
The front side electrode 7a, the front side electrode 4c and the back side electrode 7b are electrically connected to each other. That is, the terminal boards 11a to 1
1c is electrically connected to the capacitive element 3 and the piezoelectric element 6.

【0013】キャップケース10の開口部10aの段差
部10bには絶縁基板12が嵌合設置されるものであ
り、空洞部10cに収納設置した容量素子3、圧電素子
6を密封するためにキャップケース10と絶縁基板12
は接着剤9により接着される。そしてこの状態で上述の
ごとくキャップケース10の外側面10eより引き出さ
れた端子板11a〜11cの他端11d,11e,11
fが絶縁基板10の外面側で図4のごとくに折り曲げら
れる。
The insulating substrate 12 is fitted and installed in the step portion 10b of the opening 10a of the cap case 10, and the cap case for sealing the capacitive element 3 and the piezoelectric element 6 housed and installed in the cavity 10c. 10 and insulating substrate 12
Are bonded by the adhesive 9. In this state, the other ends 11d, 11e, 11 of the terminal plates 11a to 11c pulled out from the outer surface 10e of the cap case 10 as described above.
f is bent on the outer surface side of the insulating substrate 10 as shown in FIG.

【0014】尚、本実施例では、絶縁基板12とキャッ
プケース10を接着剤9により接着を行っているが、同
一の樹脂材料を用いることにより超音波溶着により接合
を図り、密封化を行うことも可能である。
In this embodiment, the insulating substrate 12 and the cap case 10 are adhered to each other by the adhesive agent 9. However, the same resin material is used for ultrasonic welding to achieve the joining and sealing. Is also possible.

【0015】そして以上の構成とすればキャップケース
10寸法が製品寸法となり、したがって、小形化が図
れ、また、金属の端子板11a〜11cを端子とするこ
とで安定した半田付けが確保されていることとなる。
With the above configuration, the size of the cap case 10 becomes the product size, and therefore the size can be reduced, and stable soldering is ensured by using the metal terminal plates 11a to 11c as terminals. It will be.

【0016】[0016]

【発明の効果】以上のように本発明によれば、キャップ
ケース内に容量素子、圧電素子が収納され、また絶縁基
板はキャップケースの開口端部内側の段部に嵌合され、
さらに金属端子板の他端はキャップケースの側面から絶
縁基板外面側に折曲し、入、出力端子とするため、キャ
ップケースの搭載ずれがおきず、また絶縁基板の小面積
化が可能となり、したがって、実装面積を小さくするこ
とが出来る。
As described above, according to the present invention, the capacitative element and the piezoelectric element are housed in the cap case, and the insulating substrate is fitted to the step inside the opening end of the cap case.
Furthermore, since the other end of the metal terminal plate is bent from the side surface of the cap case to the outer surface side of the insulating substrate to serve as an input / output terminal, the mounting displacement of the cap case does not occur, and it is possible to reduce the area of the insulating substrate. Therefore, the mounting area can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すセラミック共振子の斜
視図
FIG. 1 is a perspective view of a ceramic resonator showing an embodiment of the present invention.

【図2】図1の要部拡大断面図FIG. 2 is an enlarged cross-sectional view of the main part of FIG.

【図3】本発明の一実施例を示すセラミック共振子の組
み立て前の分解斜視図
FIG. 3 is an exploded perspective view of a ceramic resonator according to an embodiment of the present invention before assembly.

【図4】本発明の一実施例を示すセラミック共振子の側
面図
FIG. 4 is a side view of a ceramic resonator showing an embodiment of the present invention.

【図5】従来のセラミック共振子の斜視図FIG. 5 is a perspective view of a conventional ceramic resonator.

【図6】従来のセラミック共振子の要部拡大断面図FIG. 6 is an enlarged sectional view of a main part of a conventional ceramic resonator.

【図7】セラミック共振子の等価回路図FIG. 7: Equivalent circuit diagram of ceramic resonator

【符号の説明】[Explanation of symbols]

3 容量素子 6 圧電素子 10 キャップケース 11a 端子板 11b 端子板 11c 端子板 12 絶縁基板 3 Capacitance element 6 Piezoelectric element 10 Cap case 11a Terminal board 11b Terminal board 11c Terminal board 12 Insulation board

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 開口端部内側に段部を有する断面コ字状
のキャップケースと、上記キャップケース内に収納され
た容量素子および圧電素子と、上記キャップケース開口
端部内側の段部に嵌合された絶縁基板とからなり、一端
がキャップケース内の圧電素子に電気的に接続された金
属端子板の他端を、このキャップケースの天面、または
側面からキャップケース外部へ引出した後、このキャッ
プケースの開口端部の絶縁基板外面側に折曲し、入、出
力端子としたセラミック共振子。
1. A cap case having a U-shaped cross section having a step inside the opening end, a capacitive element and a piezoelectric element housed in the cap case, and a step inside the opening end of the cap case. Consisting of a combined insulating substrate, one end of which is electrically connected to the piezoelectric element in the cap case, the other end of which is pulled out from the top or side of the cap case to the outside of the cap case. A ceramic resonator that is bent to the outside of the insulating substrate at the open end of this cap case and used as the input and output terminals.
【請求項2】 キャップケースと絶縁基板を同一材料と
し、嵌合部を超音波による溶着にて接合した請求項1記
載のセラミック共振子。
2. The ceramic resonator according to claim 1, wherein the cap case and the insulating substrate are made of the same material, and the fitting portion is joined by ultrasonic welding.
JP13333795A 1995-05-31 1995-05-31 Ceramic resonator Pending JPH08330888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13333795A JPH08330888A (en) 1995-05-31 1995-05-31 Ceramic resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13333795A JPH08330888A (en) 1995-05-31 1995-05-31 Ceramic resonator

Publications (1)

Publication Number Publication Date
JPH08330888A true JPH08330888A (en) 1996-12-13

Family

ID=15102364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13333795A Pending JPH08330888A (en) 1995-05-31 1995-05-31 Ceramic resonator

Country Status (1)

Country Link
JP (1) JPH08330888A (en)

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