JPH08330718A - Method of applying cream solder - Google Patents
Method of applying cream solderInfo
- Publication number
- JPH08330718A JPH08330718A JP7130104A JP13010495A JPH08330718A JP H08330718 A JPH08330718 A JP H08330718A JP 7130104 A JP7130104 A JP 7130104A JP 13010495 A JP13010495 A JP 13010495A JP H08330718 A JPH08330718 A JP H08330718A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream solder
- cream
- soldering land
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子回路部品を基板上
に実装する際のクリーム半田の塗布方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder coating method for mounting electronic circuit components on a substrate.
【０００２】[0002]
【従来の技術】クリーム半田を用いた電子部品の実装
は、近年の電子機器の進展に大きく寄与している。以下
に従来のクリーム半田の塗布方法について図４，図５に
より説明する。図において、１は基板上に設けた半田付
けランド、２は半田付けランドを覆うように印刷塗布さ
れたクリーム半田、４は実装する部品、５はリフローに
より溶融した半田を示している。2. Description of the Related Art Mounting of electronic parts using cream solder has greatly contributed to the recent progress of electronic devices. A conventional solder paste application method will be described below with reference to FIGS. In the figure, 1 is a soldering land provided on a substrate, 2 is a cream solder printed and applied so as to cover the soldering land, 4 is a component to be mounted, and 5 is a solder melted by reflow.
【０００３】[0003]
【発明が解決しようとする課題】上記従来のクリーム半
田２の塗布パターンは、半田付けランド１と相似した形
状であり、半田によるショートや断線が発生しない半田
量を塗布しているのであるが、クリーム半田をリフロー
する際に以下のような問題が生じていた。The application pattern of the conventional cream solder 2 has a shape similar to that of the soldering land 1, and the amount of solder is applied so that a short circuit or disconnection due to solder does not occur. The following problems have occurred when reflowing the cream solder.
【０００４】すなわち、リフローの予備加熱時に、クリ
ーム半田２を構成するフラックス等の成分が気化し、ガ
スがクリーム半田中に発生する。クリーム半田２の金属
分が溶融する時には、クリーム半田中に包含されたガス
の圧力は高まる。溶融した半田が固体化する前に、ガス
が半田の外に抜けると、溶融した半田の形状は著しく変
形して、図５に示すように多くの半田ボール７ができ
る。この半田ボールの発生により、ショートの危険性は
高まり、半田付け品質は著しく低下する。That is, at the time of preheating for reflow, components such as the flux forming the cream solder 2 are vaporized, and gas is generated in the cream solder. When the metal component of the cream solder 2 is melted, the pressure of the gas contained in the cream solder increases. If the gas escapes from the solder before the molten solder solidifies, the shape of the molten solder is significantly deformed, and many solder balls 7 are formed as shown in FIG. Due to the generation of the solder balls, the risk of short circuit is increased, and the soldering quality is significantly deteriorated.
【０００５】また、発生したガスを包含したまま半田が
固体化すると、大きな空隙６が半田フィレット中に残る
ことになり、半田の強度、熱伝導性、電気特性など所望
の性能を得られず品質の低下となる。When the solder solidifies while containing the generated gas, a large void 6 remains in the solder fillet, and desired performance such as strength, thermal conductivity, and electrical characteristics of the solder cannot be obtained. Will decrease.
【０００６】そこで本発明は、発生するガスによる影響
を受けないように、クリーム半田の塗布パターンを改良
することで、上記問題を解決しようとするものである。Therefore, the present invention aims to solve the above problems by improving the cream solder coating pattern so as not to be affected by the generated gas.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、本発明のクリーム半田の塗布方法は、基板に形成し
た半田付けランド上に塗布するクリーム半田を、前記半
田付けランドの外周に通じる溝を形成するよう分割して
塗布したことを特徴とするものである。In order to solve the above-mentioned problems, in the method for applying cream solder of the present invention, the cream solder applied on the soldering land formed on the substrate is communicated to the outer periphery of the soldering land. It is characterized in that it is divided and applied so as to form a groove.
【０００８】[0008]
【作用】上記方法によれば、基板の半田付けランド上に
設けた細かなピッチの溝は、半田付けランドの外周に通
じているので、リフロー加熱時に発生したガスは、半田
金属の溶融前に溝から放出され、半田溶融時のガス包含
はなくなる。According to the above method, the fine pitch grooves provided on the soldering lands of the substrate communicate with the outer periphery of the soldering lands, so that the gas generated during the reflow heating is generated before the melting of the solder metal. The gas is released from the groove and the gas is not included when the solder is melted.
【０００９】[0009]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図１はプリント基板の半田付けラン
ド上にクリーム半田を塗布した平面図を、図２はチップ
部品を搭載した断面図を、図３はリフロー後の断面図を
それぞれ示している。An embodiment of the present invention will be described below with reference to the drawings. 1 is a plan view in which cream solder is applied on a soldering land of a printed circuit board, FIG. 2 is a cross-sectional view in which a chip component is mounted, and FIG. 3 is a cross-sectional view after reflow.
【００１０】図において、１はプリント基板上の半田付
けランド、２ａ，２ｂ，２ｃ，２ｄはそれぞれ分割して
塗布したクリーム半田、３はクリーム半田を分割する
溝、４は半田で接続する部品、５はリフローした後の固
体化した半田をそれぞれ示している。In the figure, 1 is a soldering land on a printed circuit board, 2a, 2b, 2c and 2d are cream solders applied separately, 3 is a groove for dividing the cream solder, 4 is a part connected by solder, Reference numeral 5 denotes solidified solder after reflow.
【００１１】図１のごとくクリーム半田のパターンは、
半田付けランド１の形状と異なり、溝３により分割され
たパターンにしている。このクリーム半田上に部品４を
載せると図２に示すように、部品４と半田付けランド１
の間に溝３による空間ができる。The pattern of cream solder as shown in FIG.
Unlike the shape of the soldering land 1, the pattern is divided by the groove 3. When the component 4 is placed on this cream solder, as shown in FIG.
A space is formed by the groove 3 between the two.
【００１２】図２の状態でリフローすると、まず予備加
熱の段階では、クリーム半田のフラックスの活性化が始
まり、クリーム半田の金属分以外の成分の一部が気化す
る。クリーム半田中の金属分が溶融加熱する前に、この
気化したガスは容易に溝３の空間へ抜け出て、半田付け
ランド１の外周から放出し、クリーム半田２ａ，２ｂ，
２ｃ，２ｄ中には殆ど残らない。その後、クリーム半田
中の金属分が溶融し、半田付けランド１上に広がり部品
４の電極も濡れて半田付けが完了する。When reflowing in the state of FIG. 2, first, in the preheating stage, activation of the flux of the cream solder starts, and a part of the components other than the metal component of the cream solder is vaporized. Before the metal component in the cream solder is melted and heated, the vaporized gas easily escapes into the space of the groove 3 and is discharged from the outer periphery of the soldering land 1, and the cream solder 2a, 2b,
Almost no residue remains in 2c and 2d. After that, the metal component in the cream solder is melted, spreads on the soldering land 1, and the electrodes of the component 4 are wetted, and the soldering is completed.
【００１３】なお、上記実施例においては、クリーム半
田の塗布パターンについて、４分割した例を示したが、
半田付けランドの面積に応じて溝の数を増減することが
できる。すなわち分割した１区画のクリーム半田が大き
くなりすぎると、上記従来の問題が生じるため、半田付
けランドの面積が大きいほど、溝の数を増やし１区画の
面積を小さくすることが好ましい。In the above embodiment, an example in which the cream solder coating pattern is divided into four is shown.
The number of grooves can be increased or decreased according to the area of the soldering land. That is, when the divided one section of the cream solder becomes too large, the above-mentioned conventional problem occurs. Therefore, it is preferable to increase the number of grooves and decrease the area of one section as the area of the soldering land increases.
【００１４】このように溶融した半田が固体化する、ガ
スが半田の外に抜けるため半田ボールによるショートの
問題は発生せず、また、発生したガスを包含したまま半
田が固体化すると、大きな空隙６が半田フィレット中に
残り、半田の強度、熱伝導性、電気特性など所望の性能
を得られず品質の低下となる。In this way, the molten solder solidifies, and the gas leaks out of the solder, so that the problem of short-circuiting due to the solder balls does not occur. Further, when the solder solidifies while containing the generated gas, a large void is generated. 6 remains in the solder fillet, and desired performance such as strength, thermal conductivity, and electrical characteristics of the solder cannot be obtained, resulting in deterioration of quality.
【００１５】[0015]
【発明の効果】以上のように本発明によれば、半田付け
ランド上に細かなピッチの溝を形成するよう、分割して
クリーム半田を塗布することにより、半田ボールによる
ショートや半田の特性低下の問題を解決することができ
る。As described above, according to the present invention, cream solder is divided and applied so as to form grooves with a fine pitch on the soldering land, so that a short circuit due to a solder ball or deterioration of solder characteristics is caused. Can solve the problem.
【図１】本発明の一実施例におけるクリーム半田の塗布
方法の一工程を示す平面図FIG. 1 is a plan view showing one step of a cream solder coating method according to an embodiment of the present invention.
【図２】同方法の他の工程を示す断面図FIG. 2 is a sectional view showing another step of the method.
【図３】同方法により実装した後の状態を示す断面図FIG. 3 is a sectional view showing a state after mounting by the same method.
【図４】従来のクリーム半田の塗布方法を示す平面図FIG. 4 is a plan view showing a conventional cream solder coating method.
【図５】同方法により実装した後の状態を示す断面図FIG. 5 is a sectional view showing a state after mounting by the same method.
【符号の説明】 １ 基板上の半田付けランド ２，２ａ，２ｂ，２ｃ，２ｄ クリーム半田 ３ 溝 ４ 部品[Explanation of Codes] 1 Soldering land on board 2, 2a, 2b, 2c, 2d Cream solder 3 Groove 4 Parts
Claims (1)
るクリーム半田を、前記半田付けランドの外周に通じる
溝を形成するよう分割して塗布したことを特徴とするク
リーム半田の塗布方法。1. A method of applying cream solder, characterized in that cream solder to be applied on a soldering land formed on a substrate is divided and applied so as to form a groove communicating with the outer periphery of the soldering land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7130104A JPH08330718A (en) | 1995-05-29 | 1995-05-29 | Method of applying cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7130104A JPH08330718A (en) | 1995-05-29 | 1995-05-29 | Method of applying cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08330718A true JPH08330718A (en) | 1996-12-13 |
Family
ID=15026050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7130104A Pending JPH08330718A (en) | 1995-05-29 | 1995-05-29 | Method of applying cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08330718A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7491893B2 (en) | 2004-04-13 | 2009-02-17 | Fujitsu Limited | Mounting substrate and mounting method of electronic part |
-
1995
- 1995-05-29 JP JP7130104A patent/JPH08330718A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7491893B2 (en) | 2004-04-13 | 2009-02-17 | Fujitsu Limited | Mounting substrate and mounting method of electronic part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20031224 |