JPH08329532A - Production of optical disk - Google Patents
Production of optical diskInfo
- Publication number
- JPH08329532A JPH08329532A JP7161514A JP16151495A JPH08329532A JP H08329532 A JPH08329532 A JP H08329532A JP 7161514 A JP7161514 A JP 7161514A JP 16151495 A JP16151495 A JP 16151495A JP H08329532 A JPH08329532 A JP H08329532A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- tacky adhesive
- radiation
- outer peripheral
- tacky
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
- B29C65/1467—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1445—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface heating both sides of the joint
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1496—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0002】[0002]
【0001】[0001]
【0003】[0003]
【産業上の利用分野】本考案は一対のディスクを貼り合
わせてなる光ディスクの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an optical disc which is formed by laminating a pair of discs.
【0004】[0004]
【0002】[0002]
【0005】[0005]
【従来の技術】従来、ビデオディスク等の光学式ディス
クは、図2で示すように、透光性の樹脂基板1の一面に
情報を担持するピット列又はグルーブを同心円状又は螺
旋状に形成し、その上方に各々反射膜2、保護膜3を順
次形成したもの2枚を、それらの保護層3を相対向させ
て接着剤層6により貼り合わせて両面記録ディスクと
し、ディスクの中心に設けられたセンターホールを照準
にしてディスクをクランプし回転させて、ディスクの各
面の情報記録領域へ読取りビームを照射し光学的に情報
を再生する構成となっている。2. Description of the Related Art Conventionally, in an optical disc such as a video disc, as shown in FIG. 2, a pit row or a groove for carrying information is formed on one surface of a transparent resin substrate 1 in a concentric or spiral shape. , Two films each having a reflective film 2 and a protective film 3 sequentially formed on the upper side thereof are bonded to each other with an adhesive layer 6 with the protective layers 3 facing each other to form a double-sided recording disc, which is provided at the center of the disc. The disc is clamped and rotated with the center hole as the aim, and the information recording area on each side of the disc is irradiated with a reading beam to optically reproduce the information.
【0006】このような貼り合わせ型光学式ディスクで
は、その接着剤層6として一般にホットメルト型粘着剤
を使用されている。In such a laminated optical disc, a hot-melt type pressure-sensitive adhesive is generally used as the adhesive layer 6.
【0007】[0007]
【0003】[0003]
【0008】[0008]
【発明が解決しようとする課題】しかしながら、ホット
メルト型粘着剤は熱可塑性であるために耐熱性の点で劣
り、熱によりディスクの変形、剥離が生じ易い。そこで
紫外線、電子線等の放射線を照射することにより粘着性
を発現する放射線硬化型粘着剤をディスクの貼り合わせ
用接着剤として用いることが考えられる。放射線硬化型
粘着剤は耐熱性が良好であるが放射線の照射により分子
構造が3重結合となり、流動性がなくなる為、放射線照
射前の塗布された表面が粗いと十分な接着面積が得られ
なくなる。よって接着強度が不足し、貼り合わせたディ
スクの端面より剥がれが生じるという問題が生じる。本
発明はかかる事情に基づいてなされたものであり、貼り
合わせ端面から剥がれの生じないような光ディスクの製
造方法を得ることを目的とする。However, since the hot-melt type pressure-sensitive adhesive is thermoplastic, it is inferior in heat resistance, and the disk is likely to be deformed or peeled by heat. Therefore, it is conceivable to use a radiation-curable pressure-sensitive adhesive that exhibits adhesiveness by being irradiated with radiation such as ultraviolet rays and electron beams, as an adhesive for laminating disks. Radiation-curable pressure-sensitive adhesives have good heat resistance, but the molecular structure becomes triple bonds upon irradiation with radiation, and the fluidity is lost. If the coated surface before irradiation is rough, a sufficient adhesive area cannot be obtained. . Therefore, there is a problem that the adhesive strength is insufficient and peeling occurs from the end faces of the bonded disks. The present invention has been made under such circumstances, and an object of the present invention is to obtain a method for manufacturing an optical disc in which peeling does not occur from a bonded end face.
【0009】[0009]
【0004】[0004]
【0010】[0010]
【課題を解決するための手段】本発明の光ディスクの製
造方法は、主面に外周部及び内周部を残してピット又は
グルーブを形成した記録領域を有する一対の透明基板を
作成する工程と、一対の透明基板の主面上に放射線硬化
型粘着剤層を形成する工程と、少なくとも記録領域に対
応する放射線硬化型粘着剤層に第1の所定量の放射線を
照射し、粘着性を付与する工程と、一対の透明基板を放
射線硬化型粘着剤層により貼り合わせる工程と、放射線
硬化型粘着剤層の少なくとも外周部に第1の所定量より
多い第2の所定量の放射線を照射し、粘着性を消滅させ
る工程とを有することを特徴とする。A method of manufacturing an optical disk according to the present invention comprises a step of forming a pair of transparent substrates having recording areas in which pits or grooves are formed on the main surface while leaving an outer peripheral portion and an inner peripheral portion, A step of forming a radiation-curable pressure-sensitive adhesive layer on the main surfaces of a pair of transparent substrates, and irradiating at least the radiation-curable pressure-sensitive adhesive layer corresponding to the recording area with a first predetermined amount of radiation to impart tackiness. A step of adhering a pair of transparent substrates with a radiation-curable pressure-sensitive adhesive layer, and irradiating at least an outer peripheral portion of the radiation-curable pressure-sensitive adhesive layer with a second predetermined amount of radiation larger than the first predetermined amount to adhere the layer. And a step of extinguishing the sex.
【0011】[0011]
【0005】[0005]
【0012】[0012]
【作用】一対の透明基板の対向する記録領域間の放射線
硬化型粘着剤層は粘着性を保持し、外周部の放射線硬化
型粘着剤層は、粘着性が消滅して硬化するので、ディス
ク変形の応力を吸収すると共に貼り合わせ端面部で強固
に固着される。The radiation-curable pressure-sensitive adhesive layer between the recording areas of the pair of transparent substrates facing each other retains the tackiness, and the radiation-curable pressure-sensitive adhesive layer on the outer peripheral portion disappears and is hardened. It absorbs the stress of and is firmly fixed at the end face of the bonding.
【0013】[0013]
【0006】[0006]
【0014】[0014]
【実施例】以下に、本発明の一実施例を図1に基づいて
詳細に説明する。本実施例の光ディスクは一対のディス
クを貼り合わせた構成となっている。まず、主面に外周
部及び内周部を除いて微細な凹凸による情報を表すピッ
ト又はグルーブが形成された記録領域を有する一対の透
明基板1を射出成形等によって作成し、外周部及び内周
部を除いた記録領域上にアルミニウム等からなる、反射
膜2を形成し、さらに透明基板1の内周部、外周部及び
記録領域を覆うように紫外線硬化型樹脂等からなる保護
膜3を形成して一対のディスクを得る。尚、透明基板1
はポリメチルメタクリレート(PMMA)、ポリカーボ
ネート(PC)等の合成樹脂板又はガラス板からなり、
厚さ0.2〜0.8mm例えば0.6mm厚の円形基板
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIG. The optical disc of this embodiment has a structure in which a pair of discs are bonded together. First, a pair of transparent substrates 1 having a recording area in which pits or grooves representing information by fine irregularities are formed on the main surface except for the outer peripheral portion and the inner peripheral portion are formed by injection molding or the like, and the outer peripheral portion and the inner peripheral portion are formed. A reflection film 2 made of aluminum or the like is formed on the recording area excluding a portion, and a protective film 3 made of an ultraviolet curable resin or the like is further formed so as to cover the inner peripheral portion, the outer peripheral portion and the recording area of the transparent substrate 1. To obtain a pair of discs. The transparent substrate 1
Is a synthetic resin plate such as polymethylmethacrylate (PMMA) or polycarbonate (PC) or a glass plate,
The circular substrate has a thickness of 0.2 to 0.8 mm, for example, 0.6 mm.
【0015】[0015]
【0007】次に図1(a)に示すようにディスクの保
護膜3上の内周端部に、ディスクを低速、例えば30〜
60rpmで回転させながら、あるいは静止させたまま
で環状に放射線硬化型粘着剤を滴下する。放射線硬化型
粘着剤としては、アクリルオゴマーを主成分とし、ゴム
状ポリマー粘着付与剤を必須成分として含み、揮発性溶
剤を含有しないもので常温(20゜C)、未硬化状態で
100〜2000cpsの粘度を有するもの、例えば、
セメダイン(株)社製「F−105」などが適してい
る。その後、図1(b)に示すようにディスクを高速、
例えば2000〜4000rpmで数秒間回転させて、
保護膜上に数十μm程度の均一の厚さの放射線硬化型粘
着剤層4を塗布、形成する。Next, as shown in FIG. 1 (a), the disk is placed at a low speed, for example, 30 to 30 at the inner peripheral end portion on the protective film 3 of the disk.
The radiation-curable pressure-sensitive adhesive is dripped in a ring while rotating at 60 rpm or while keeping it stationary. The radiation-curable pressure-sensitive adhesive contains acrylic ogomer as a main component, a rubber-like polymer tackifier as an essential component, and does not contain a volatile solvent at room temperature (20 ° C.) and 100 to 2000 cps in an uncured state. Having a viscosity of, for example,
"F-105" manufactured by Cemedine Co., Ltd. is suitable. After that, as shown in FIG.
For example, rotate at 2000-4000 rpm for a few seconds,
A radiation-curable pressure-sensitive adhesive layer 4 having a uniform thickness of about several tens of μm is applied and formed on the protective film.
【0016】このようにスピンコート法で形成された放
射線硬化型粘着剤層4はスクリーン印刷法で形成された
場合に比して表面が滑らかになっている。これにより十
分な接着面積が得られ、接着強度が向上する。The radiation-curable pressure-sensitive adhesive layer 4 thus formed by the spin coating method has a smoother surface than when formed by the screen printing method. As a result, a sufficient adhesive area can be obtained and the adhesive strength is improved.
【0017】[0017]
【0008】次に図1(c)に示すように反射膜2が形
成されていない透明基板1の内周部及び外周部上に石英
ガラス、熱線カットフィルターなどからなるマスク5を
配置した後、第1の所定量の紫外線を照射して、反射膜
2上の放射線硬化型粘着剤層4を硬化させて粘着性を付
与する。ここでマスク5により紫外線が照射されなかっ
た内周部及び外周部は未硬化状態となっている。Next, as shown in FIG. 1C, after a mask 5 made of quartz glass, a heat ray cut filter, etc. is placed on the inner and outer peripheral portions of the transparent substrate 1 on which the reflective film 2 is not formed, Irradiation with a first predetermined amount of ultraviolet rays cures the radiation-curable pressure-sensitive adhesive layer 4 on the reflective film 2 to impart tackiness. Here, the inner peripheral portion and the outer peripheral portion which are not irradiated with the ultraviolet rays by the mask 5 are in an uncured state.
【0018】その後、図1(d)に示すように形成され
た一対のディスクを放射線硬化型粘着剤層4を対向させ
て加圧し、貼り合わせた後、図1(e)に示すように放
射線硬化型粘着剤層4の未硬化部である内周部、外周部
及び外周部からあふれでて貼り合わせ端面を覆う部分に
対して上述の粘着性を付与する第1の所定量より十分大
きい第2の所定量の紫外線を照射して粘着性を消滅させ
る。すなわち、粘着性が無くなるまで紫外線を照射す
る。これにより放射線硬化型粘着剤層4が硬化し、内周
部、外周部及び貼り合わせ外周端面での接着強度が向上
する。Thereafter, a pair of disks formed as shown in FIG. 1 (d) are pressed against each other with the radiation-curable pressure-sensitive adhesive layer 4 facing each other, and bonded together, and then as shown in FIG. 1 (e), radiation is applied. A value sufficiently larger than the first predetermined amount for imparting the above-mentioned adhesiveness to the portion that overflows from the inner peripheral portion, the outer peripheral portion, and the outer peripheral portion of the curable pressure-sensitive adhesive layer 4 and covers the bonding end surface. The adhesiveness is extinguished by irradiating a predetermined amount of ultraviolet rays of 2. That is, ultraviolet rays are irradiated until the tackiness disappears. As a result, the radiation curable pressure-sensitive adhesive layer 4 is cured, and the adhesive strength at the inner peripheral portion, the outer peripheral portion and the bonded outer peripheral end surface is improved.
【0019】[0019]
【0009】上記実施例では、再生専用型の貼り合わせ
ディスクについて説明したが記録領域上にシアニン系有
機色素、磁気光学材料、相変化型材料からなる記録層を
形成した書き込み可能な貼り合わせタイプのディスクに
対しても適用できる。また、放射線硬化型粘着剤層4の
内周部に対しては第1の所定量の紫外線を照射して粘着
性を付与させるようにしても良い。In the above-mentioned embodiment, the reproduction-only type bonded disk has been described, but a writable bonded type in which a recording layer made of a cyanine organic dye, a magneto-optical material and a phase change material is formed on the recording area. It can also be applied to discs. In addition, the inner peripheral portion of the radiation-curable pressure-sensitive adhesive layer 4 may be irradiated with a first predetermined amount of ultraviolet rays to impart tackiness.
【0020】[0020]
【0010】[0010]
【0021】[0021]
【発明の効果】以上のように本発明では、一対の透明基
板を放射線硬化型粘着剤層で貼り合わせた状態で少なく
とも外周部の放射線硬化型粘着剤層の粘着性が無くなる
まで放射線を照射することによって、最も剥がれが発生
しやすい貼り合わせ外周部の接着強度を向上させること
ができ、長期にわたって信頼性のあるディスクを得るこ
とができる。INDUSTRIAL APPLICABILITY As described above, according to the present invention, radiation is irradiated in a state where a pair of transparent substrates are bonded with a radiation-curable pressure-sensitive adhesive layer until at least the radiation-curable pressure-sensitive adhesive layer at the outer peripheral portion loses its tackiness. As a result, it is possible to improve the adhesive strength of the bonded outer peripheral portion where peeling is most likely to occur, and it is possible to obtain a reliable disk for a long period of time.
【図1】本発明の一実施例による光ディスクの製造方法
を示す工程図である。FIG. 1 is a process drawing showing a method for manufacturing an optical disc according to an embodiment of the present invention.
【図2】従来の光ディスクの構成を示す概略側面断面図
である。FIG. 2 is a schematic side sectional view showing a configuration of a conventional optical disc.
1 ・・・・・ 基板 2 ・・・・・ 反射膜 3 ・・・・・ 保護膜 4 ・・・・・ 放射線硬化型粘着剤層 5 ・・・・・ マスク 6 ・・・・・ 接着剤層 1 ・ ・ ・ Substrate 2 ・ ・ ・ ・ ・ Reflective film 3 ・ ・ ・ ・ ・ Protective film 4 ・ ・ ・ ・ ・ Radiation curable adhesive layer 5 ・ ・ ・ ・ ・ Mask 6 ・ ・ ・ Adhesive layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 笹野 光彦 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 (72)発明者 本川 昌明 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 (72)発明者 平井 良和 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 (72)発明者 丸山 治久 山梨県中巨摩郡田富町西花輪2680番地 パ イオニアビデオ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mitsuhiko Sasano 2680 Nishi Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Pioneer Video Co., Ltd. (72) Inventor Masaaki Honkawa 2680 Nishi Hanawa, Tatomi-cho, Nakakoma-gun, Yamanashi Pioneer Video Incorporated (72) Inventor Yoshikazu Hirai 2680 West Hanawa, Tatomi-cho, Nakakoma-gun Yamanashi Pioneer Video Incorporated (72) Inventor Haruhisa Maruyama 2680 Nishihanawa, Tatomi-cho, Nakanima-gun Yamanashi Pioneer Video Co., Ltd.
Claims (2)
又はグルーブを形成した記録領域を有する一対の透明基
板を作成する工程と、前記一対の透明基板の主面上に放
射線硬化型粘着剤層を形成する工程と、第1の所定量の
放射線を照射し、少なくとも前記記録領域に対応する放
射線硬化型粘着剤層に粘着性を付与する工程と、前記一
対の透明基板を前記放射線硬化型粘着剤層により貼り合
わせる工程と、前記放射線硬化型粘着剤層の少なくとも
外周部分に前記第1の所定量より多い第2の所定量の放
射線を照射し、粘着性を消滅させる工程とを有する光デ
ィスクの製造方法。1. A step of forming a pair of transparent substrates having recording areas in which pits or grooves are formed on the main surface while leaving an outer peripheral portion and an inner peripheral portion, and a radiation curing type on the main surfaces of the pair of transparent substrates. Forming a pressure-sensitive adhesive layer; irradiating a first predetermined amount of radiation to impart adhesiveness to the radiation-curable pressure-sensitive adhesive layer corresponding to at least the recording area; A step of adhering with a curable pressure-sensitive adhesive layer, and a step of irradiating at least the outer peripheral portion of the radiation curable pressure-sensitive adhesive layer with a second predetermined amount of radiation that is larger than the first predetermined amount to eliminate the adhesiveness. A method for manufacturing an optical disc having the same.
ート法により形成されることを特徴とする請求項1記載
の光ディスクの製造方法。 【0001】2. The method of manufacturing an optical disc according to claim 1, wherein the radiation-curable pressure-sensitive adhesive layer is formed by a spin coating method. [0001]
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7161514A JPH08329532A (en) | 1995-06-05 | 1995-06-05 | Production of optical disk |
US08/651,841 US5759332A (en) | 1995-05-22 | 1996-05-21 | Process of reproducing optical discs and optical discs produced by the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7161514A JPH08329532A (en) | 1995-06-05 | 1995-06-05 | Production of optical disk |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08329532A true JPH08329532A (en) | 1996-12-13 |
Family
ID=15736521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7161514A Pending JPH08329532A (en) | 1995-05-22 | 1995-06-05 | Production of optical disk |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08329532A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100469218B1 (en) * | 2000-04-25 | 2005-01-29 | 마쯔시다덴기산교 가부시키가이샤 | Optical disk, method for manufacturing optical disk and apparatus for manufacturing optical disk |
EP1681676A2 (en) * | 2002-07-04 | 2006-07-19 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same |
CN102744954A (en) * | 2012-05-11 | 2012-10-24 | 友达光电股份有限公司 | Substrate manufacturing method and multilayer stack structure |
-
1995
- 1995-06-05 JP JP7161514A patent/JPH08329532A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100469218B1 (en) * | 2000-04-25 | 2005-01-29 | 마쯔시다덴기산교 가부시키가이샤 | Optical disk, method for manufacturing optical disk and apparatus for manufacturing optical disk |
EP1681676A2 (en) * | 2002-07-04 | 2006-07-19 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same |
EP1681676A3 (en) * | 2002-07-04 | 2006-08-02 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same |
US7195691B2 (en) | 2002-07-04 | 2007-03-27 | Matsushita Electric Industrial Co., Ltd. | Optical data recording medium and manufacturing method for the same |
CN102744954A (en) * | 2012-05-11 | 2012-10-24 | 友达光电股份有限公司 | Substrate manufacturing method and multilayer stack structure |
CN102744954B (en) * | 2012-05-11 | 2015-01-07 | 友达光电股份有限公司 | Substrate manufacturing method and multilayer stack structure |
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