JPH0832042A - Solid state image pickup device - Google Patents
Solid state image pickup deviceInfo
- Publication number
- JPH0832042A JPH0832042A JP6168310A JP16831094A JPH0832042A JP H0832042 A JPH0832042 A JP H0832042A JP 6168310 A JP6168310 A JP 6168310A JP 16831094 A JP16831094 A JP 16831094A JP H0832042 A JPH0832042 A JP H0832042A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- state image
- image pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、固体撮像装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device.
【０００２】[0002]
【従来の技術】従来の固体撮像素子２の実装構造は、図
３，図４に示すように、外側面に外部接続用端子１１ａ
を設け、二段の凹部を設ける多層基板１１の２段目の凹
部１１ｂに、前記固体撮像素子２を受光面２ａを外向き
に接着剤１６で接着収納し、前記多層基板１１の１段目
の凹部１１ｃに設ける電極１１ｄと前記固体撮像素子２
の受光面２ａの周辺に設ける電極２ｂとを、金属ワイヤ
ー１４または、両端に端子を設け該端子間を導電線で接
続するＴＡＢテープ１３等で接続し、透明なガラス等の
板１５を前記固体撮像素子２の上方に配置するように被
せて接着剤１７で接着してなり、前記多層基板１１の外
部接続端子１１ａを回路基板２０の導体部に接続するよ
うにしていた。しかし、この実装方法では、部品点数が
多く、部品コストおよび加工コストが高価であるという
問題があった。2. Description of the Related Art As shown in FIGS. 3 and 4, a conventional mounting structure of a solid-state image pickup device 2 has an external connection terminal 11a on its outer surface.
, And the concave portion 11b of the multi-layer substrate 11 in which the two-stage concave portion is provided, the solid-state image sensor 2 is housed by bonding the light receiving surface 2a outward with the adhesive 16. 11d provided in the concave portion 11c of the
The electrode 2b provided around the light receiving surface 2a of the above is connected with a metal wire 14 or a TAB tape 13 having terminals at both ends and connecting the terminals with a conductive wire, and the plate 15 made of transparent glass or the like is connected to the solid state. It is arranged so as to be arranged above the image pickup element 2 and is adhered with an adhesive 17 so that the external connection terminal 11a of the multilayer substrate 11 is connected to the conductor portion of the circuit board 20. However, this mounting method has a problem that the number of parts is large and the parts cost and the processing cost are high.
【０００３】[0003]
【発明が解決しようとする課題】本発明は以上述べた問
題点を解決し、部品点数を削減し、部品コストおよび加
工コストを低減した固体撮像装置を提供することを目的
としている。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems and to provide a solid-state image pickup device in which the number of parts is reduced and the cost of parts and processing are reduced.
【０００４】[0004]
【課題を解決するための手段】本発明は上述の課題を解
決するため、一端面を開放する透明な収納容器と、受光
面の周辺部に電極を配置する固体撮像素子と、一端部に
前記固体撮像素子の電極に接続する端子を形成し、他端
部に外部接続用端子を形成するＴＡＢテープとで構成
し、前記収納容器の開放面と対向する面に、前記固体撮
像素子の受光面を配置し、前記ＴＡＢテープを受光面の
周辺部に配置する電極に接続して前記固体撮像素子の側
面に沿って折り曲げ、前記収納容器の開放面より導出
し、前記透明な収納容器の内部に絶縁性樹脂を充填して
封止している。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a transparent storage container having one end open, a solid-state image sensor having electrodes arranged around the light-receiving surface, and the above-mentioned one end having the above-mentioned structure. A TAB tape which forms a terminal connected to an electrode of the solid-state imaging device and has an external connection terminal formed at the other end thereof, and a light-receiving surface of the solid-state imaging device on a surface facing the open surface of the storage container. Is arranged, the TAB tape is connected to an electrode arranged in the peripheral portion of the light-receiving surface, bent along the side surface of the solid-state imaging device, led out from the open surface of the storage container, and placed inside the transparent storage container. Insulating resin is filled and sealed.
【０００５】[0005]
【作用】以上のように構成したので、本発明の固体撮像
装置によれば、一端面を開放する透明な収納容器に、受
光面の周辺部に配置する電極にＴＡＢテープを接続した
固体撮像素子を装着し、前記ＴＡＢテープを折り曲げて
前記固体撮像素子の側面に沿って前記透明な収納容器よ
り導出し、絶縁性の樹脂で封止ており、前記ＴＡＢテー
プを外部接続用端子として使用できる。With the above construction, according to the solid-state image pickup device of the present invention, the solid-state image pickup device in which the TAB tape is connected to the electrode arranged in the peripheral portion of the light-receiving surface in the transparent storage container having one end open Is mounted, the TAB tape is bent, led out from the transparent storage container along the side surface of the solid-state imaging device, and sealed with an insulating resin, and the TAB tape can be used as an external connection terminal.
【０００６】[0006]
【実施例】以下、図面に基づいて本発明による固体撮像
装置を詳細に説明する。図１は本発明による固体撮像装
置の一実施例を示す分解斜視図、図２はその断面図であ
る。図において、１は透明な収納容器で、一側面を開放
し、固体撮像素子２の受光面近傍の側面に凸枠１ａを設
けている。２は前記固体撮像素子で、受光面２ａの周辺
に電極２ｂを配置している。３はＴＡＢテープで、一端
部に、前記固体撮像素子２の電極２ｂに接続する端子３
ａと、他端部に外部接続用端子３ｂを設け、前記端子３
ａと外部端子３ｂとを導電体３ｃで接続している。４は
封止用の絶縁性樹脂である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A solid-state image pickup device according to the present invention will be described in detail below with reference to the drawings. 1 is an exploded perspective view showing an embodiment of a solid-state imaging device according to the present invention, and FIG. 2 is a sectional view thereof. In the figure, reference numeral 1 denotes a transparent container, one side surface of which is open, and a convex frame 1a is provided on the side surface near the light receiving surface of the solid-state image sensor 2. Reference numeral 2 denotes the solid-state imaging device, in which an electrode 2b is arranged around the light receiving surface 2a. 3 is a TAB tape, one end of which is a terminal 3 connected to the electrode 2b of the solid-state imaging device 2
a and an external connection terminal 3b at the other end,
A and the external terminal 3b are connected by a conductor 3c. 4 is an insulating resin for sealing.
【０００７】以上の構成において、つぎにその組み立て
手順を説明する。まず、固体撮像素子２の受光面２ａの
周辺に配置する電極に、ＴＡＢテープ３の端子３ａを接
続し固体撮像素子２の側面に沿うように折り曲げてい
る。つぎに、前記加工する固体撮像素子２を受光面２ａ
が凸枠１ａを通過するように透明な収納容器１に収納
し、絶縁性樹脂４で封止している。このとき、前記凸枠
１ａにより、絶縁性樹脂４が固体撮像素子２の受光面２
ａに流れ込まないように工夫している。In the above structure, the assembling procedure will be described below. First, the terminals 3a of the TAB tape 3 are connected to the electrodes arranged around the light-receiving surface 2a of the solid-state image sensor 2, and the electrodes are bent along the side surface of the solid-state image sensor 2. Next, the solid-state image sensor 2 to be processed is mounted on the light receiving surface 2a.
Are housed in a transparent container 1 so as to pass through the convex frame 1a and sealed with an insulating resin 4. At this time, due to the convex frame 1 a, the insulating resin 4 causes the light-receiving surface 2 of the solid-state imaging device 2
It is devised so that it does not flow into a.
【０００８】[0008]
【発明の効果】以上説明したように、本発明による固体
撮像装置によれば、一端面を開放する透明な収納容器
に、受光面の周辺部に配置する電極にＴＡＢテープを接
続した固体撮像素子を装着し、前記ＴＡＢテープを折り
曲げて前記固体撮像素子の側面に沿って前記透明な収納
容器より導出し、絶縁性の樹脂で封止ており、前記ＴＡ
Ｂテープを外部接続用端子として使用でき、部品点数が
少なく、部品コストおよび加工コストを低減した固体撮
像装置を提供することができる。As described above, according to the solid-state image pickup device of the present invention, the solid-state image pickup device in which the TAB tape is connected to the electrodes arranged in the peripheral portion of the light-receiving surface in the transparent storage container whose one end surface is open. Is mounted, the TAB tape is bent, led out from the transparent storage container along the side surface of the solid-state imaging device, and sealed with an insulating resin.
A B-tape can be used as an external connection terminal, the number of parts is small, and a solid-state imaging device with reduced parts cost and processing cost can be provided.
【図１】本発明による固体撮像装置の一実施例を示す分
解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of a solid-state imaging device according to the present invention.
【図２】本発明による固体撮像装置の一実施例を示す断
面図である。FIG. 2 is a sectional view showing an embodiment of a solid-state imaging device according to the present invention.
【図３】従来の固体撮像装置の外観を示す斜視図であ
る。FIG. 3 is a perspective view showing an appearance of a conventional solid-state imaging device.
【図４】従来の固体撮像装置を示す断面図である。FIG. 4 is a sectional view showing a conventional solid-state imaging device.
１ 透明な収納容器 １ａ凸枠 ２ 固体撮像素子 ２ａ受光面 ２ｂ電極 ３ ＴＡＢテープ ３ａ端子 ３ｂ外部接続端子 ３ｃ導電体 ４ 絶縁性樹脂 DESCRIPTION OF SYMBOLS 1 Transparent container 1a Convex frame 2 Solid-state image sensor 2a Light receiving surface 2b Electrode 3 TAB tape 3a terminal 3b External connection terminal 3c Conductor 4 Insulating resin
Claims (4)
光面の周辺部に電極を配置する固体撮像素子と、一端部
に前記固体撮像素子の電極に接続する端子を形成し、他
端部に外部接続用端子を形成するＴＡＢテープとで構成
し、前記収納容器の開放面と対向する面に、前記固体撮
像素子の受光面を配置し、前記ＴＡＢテープを受光面の
周辺部に配置する電極に接続して前記固体撮像素子の側
面に沿って折り曲げ、前記収納容器の開放面より導出
し、前記透明な収納容器の内部に絶縁性樹脂を充填して
封止して成ることを特徴とする固体撮像装置。1. A transparent container having one end open, a solid-state imaging device having electrodes arranged around the light-receiving surface, a terminal connected to an electrode of the solid-state imaging device at one end, and the other end. And a TAB tape having terminals for external connection formed on the surface thereof, the light receiving surface of the solid-state imaging device is arranged on the surface facing the open surface of the storage container, and the TAB tape is arranged on the periphery of the light receiving surface. And is bent along the side surface of the solid-state imaging device, led out from the open surface of the storage container, filled with an insulating resin inside the transparent storage container, and sealed. Solid-state imaging device.
の受光面近傍の側面に対応する面に凸枠を設けているこ
とを特徴とする請求項１記載の固体撮像装置。2. The solid-state imaging device according to claim 1, wherein the transparent storage box has a convex frame on a surface corresponding to a side surface near the light-receiving surface of the solid-state imaging device.
用端子を設け、両端子間を導線で接続していることを特
徴とする請求項１記載の固体撮像装置。3. The solid-state imaging device according to claim 1, wherein the TAB tape is provided with electrode connecting terminals at both ends thereof, and the terminals are connected by a conductor.
用端子を設け、他端部にコネクタ接続用端子を設け、両
端子間を導線で接続していることを特徴とする請求項１
記載の固体撮像装置。4. The TAB tape is provided with an electrode connecting terminal at one end and a connector connecting terminal at the other end, and the terminals are connected by a conductive wire.
The solid-state imaging device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168310A JPH0832042A (en) | 1994-07-20 | 1994-07-20 | Solid state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168310A JPH0832042A (en) | 1994-07-20 | 1994-07-20 | Solid state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0832042A true JPH0832042A (en) | 1996-02-02 |
Family
ID=15865661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6168310A Pending JPH0832042A (en) | 1994-07-20 | 1994-07-20 | Solid state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0832042A (en) |
-
1994
- 1994-07-20 JP JP6168310A patent/JPH0832042A/en active Pending
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