JPH08316676A - Electronic equipment and case structure and cooling unit thereof - Google Patents

Abstract

PURPOSE: To control the temperature and humidity of cooled air inside a case by providing an electronic equipment which has a cooling means and a case structure and a cooling unit thereof with humidification means. CONSTITUTION: As a humidification means, a part of a wall of a case 1 is made of moisture absorbing and releasing material 15 which has such a function as to absorb or release moisture according to the humidity. Due to the work of the moisture absorbing and releasing material 15, moisture moves from air on a high humidity side to air on a low humidity side. Therefore, both the temperature and the humidity of cooled air can be controlled within desired ranges and thereby bedewing and static electricity, which could be causes of troubles of the electronic equipment, etc., can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, a housing structure, and a cooling unit thereof, and is particularly suitable for controlling the humidity of an electronic device having a large number of heat-generating electronic components or an electronic computer using the electronic device. Electronic device and housing structure and its cooling unit.

[0002]

2. Description of the Related Art In electronic devices such as electronic calculators and communication devices, temperature and humidity control of cooling air for cooling heat-generating electronic components (semiconductor components) such as CPUs and LSIs is important for ensuring reliability. As a cooling method using a refrigeration cycle of an electronic device having the heat generating electronic component, for example, a cooling device for an electronic device as described in JP-A-6-1199083 and a JP-A-4-320399 are disclosed. There is a cooling device for such electronic devices.

[0003]

[Patent Document 1] Japanese Patent Application Laid-Open No. 6-11908
The prior art described in Japanese Patent No. 3 is intended to control the temperature of electronic parts by providing a refrigeration cycle in a heat-insulated housing, and a heater for warming the internal temperature is provided to prevent condensation of the electronic parts. Has been. In addition, JP-A-4-320
The prior art described in Japanese Patent No. 399 includes a dehumidifying heat exchanger in addition to a temperature adjusting means in a heat-insulated housing, and the dehumidifying heat exchanger is used to prevent dew condensation on electronic components. It is configured to dehumidify the air inside the housing.

However, these two conventional techniques are
Both of them can control the temperature of the electronic components in the housing and prevent dew condensation of the electronic components by dehumidifying, but in order to provide a more reliable housing structure of the electronic device, the temperature control (cooling of the electronic components in the housing is performed. -It is desirable that both heating and humidity control (dehumidification / humidification) be performed in detail.

In a general device, as seen in the above-mentioned prior art, only temperature control (cooling) and dehumidification are mainly performed,
There is no humidifying means. However, in an actual electronic device, etc., many switching parts are also mounted, which causes a great obstacle such as generating static electricity at low humidity.
It is desirable to have a humidifying means.

An object of the present invention is to provide an electronic device, a housing structure and a cooling unit for the electronic device, which are provided with a humidifying means in the housing of the electronic device and can finely control both temperature and humidity of electronic components. is there.

[0007]

In order to achieve the above object, an electronic device according to the present invention is configured such that at least a part of a wall forming a housing for housing electronic components absorbs or releases water depending on humidity. The humidity inside the housing is controlled by discharging the moisture absorbed from the high humidity side air to the low humidity side air by the moisture absorbing / releasing material. It is characterized by.

Further, in an electronic device configured to store an electronic component that generates heat in a casing and cool the electronic component by air cooling, at least a part of a wall that constitutes the casing is controlled depending on humidity. It is composed of an absorbent / moisture releasing material that absorbs and releases moisture, and the absorbed moisture is released from the high-humidity side air to the low-humidity side air, thereby It is characterized in that the humidity of the cooling air is controlled.

Further, in an electronic device having an electronic part for generating heat, a blowing means, and a cooler for supplying cooling air in the housing, the electronic device is configured to forcibly cool the electronic part by the cooling air. Moisture absorbed from the air on the high humidity side by at least a part of the wall forming the housing is made of a moisture absorbing / releasing material that absorbs or releases moisture depending on the humidity. Is discharged to the air on the low humidity side, whereby the humidity of the cooling air in the housing is controlled.

Further, in the casing structure of the present invention, at least a part of the surface of the cooling casing having the heat generating component therein is covered with a wall, and a cooling device and a temperature controller for supplying cooling air to the casing are provided. However, in the case structure in which the temperature of the heat generating component is controlled, the case is provided with a humidifying means, and the humidifying means is a wall forming a cooling case. A moisture absorbing / releasing material that absorbs or releases moisture depending on the humidity provided in at least a part of the moisture absorbing / releasing material, and absorbs moisture from the air on the high humidity side by the moisture absorbing / releasing material on the low humidity side. It is characterized in that it is released into the air to control the humidity of the air in the housing.

Further, in the cooling unit of the present invention, in the cooling unit constituted by the casing having the refrigeration cycle such as the compressor, the condenser, the evaporator and the expansion mechanism, the casing is divided into two and heat is dissipated. Chamber and a heat absorbing chamber, a condenser is provided in the heat radiating chamber, an evaporator is provided in the heat absorbing chamber as a cooler, and at least two openings through which cooling air flows in and out of the heat absorbing chamber are provided, and the heat absorbing chamber is further provided. The humidifying means is characterized in that the humidifying means absorbs and releases moisture depending on the humidity provided on at least a part of the wall forming the heat absorbing chamber. A wet material, wherein the moisture absorbing / releasing material releases moisture absorbed from the high humidity side air to the low humidity side air to control the humidity of the cooling air in the heat absorbing chamber. is there.

[0012]

In the electronic device and the casing structure and the cooling unit thereof having the above-mentioned constitution, by providing the humidifying means, it is possible to prevent a trouble such as static electricity generation which occurs at a low humidity and to make a fine-tuned response. Further, the following action can be obtained by using, as the humidifying means, an absorbent / moisture releasing material having a function of absorbing and releasing water depending on the humidity, for a part of each housing wall. .

First, when the relative humidity of the air is higher in the surrounding air than in the cooling air in the housing, the moisture absorbing / releasing material quickly removes moisture from the ambient air having a high relative humidity through its outer surface. The water immediately penetrates into the material. On the other hand, the material rapidly releases moisture through its inner surface to the cooling air in the housing with low relative humidity. Therefore, the moisture taken from the ambient air moves to the cooling air in the housing through the absorbent / moisture releasing material having the function of absorbing and releasing the water depending on the humidity, and the cooling air in the housing is cooled. Will be humidified. In the humidifying means of the present invention,
Since water is obtained from the ambient air, there is no need for auxiliary equipment such as a water supply pipe, a makeup water tank, and a humidifier, and there is a great feature that the material can be constituted by only the material.

By adding the dehumidifying means using the evaporator of the refrigeration cycle to the humidifying means of the present invention, it becomes possible to control the humidity of the cooling air in the housing. Furthermore, by optimizing the absorbent / moisture releasing material and the evaporator,
It is also possible to control the relative humidity of the cooling air in the housing within an arbitrary range, preventing condensation of high-humidity electronic parts and static electricity at low humidity, which can cause electronic device failures. However, it is possible to make detailed correspondences.

Further, when the relative humidity of the air is lower in the surrounding air than in the cooling air in the housing, the absorptive and desorptive material conversely acts as a dehumidifying means. First, the material is
Water is rapidly absorbed from the cooling air in the housing having a high relative humidity through the inner surface thereof, and the water immediately penetrates into the material. On the other hand, the material rapidly releases moisture through its outer surface to ambient air with low relative humidity. Therefore, the moisture taken from the cooling air in the casing moves to the ambient air through the material having the function of absorbing and releasing moisture depending on the humidity, and the cooling air in the casing is dehumidified. It will be.

As an example of a moisture absorbing / releasing material having a function of absorbing and releasing moisture depending on humidity, a cloth is used as a base material and a special moisture absorbing material composed of a polymer material or the like is used as the cloth. Some are impregnated with agents. Further, the amount of water absorption of the absorbent / moisture releasing material can be freely set by controlling the amount of the absorbent that is impregnated into the material, and can also be controlled by the surface area of the material.

Here, a non-woven fabric can be used as the cloth for the base material of the absorbent / moisture releasing material. Further, as other applicable materials, a material in which a shape-memory polymer is thinly coated on one surface of nylon or the like, or a so-called moisture-permeable material manufactured in a laminated shape may be used. Here, the shape memory polymer is a polyurethane type shape memory resin, and the cloth may be polyester or the like in addition to nylon. Also in this case, a non-woven fabric may be used.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a side sectional view of an electronic device housing 1 of the present invention, and FIG. 2 is a perspective view of the electronic device housing 1. Here, an electronic computer will be taken up as an example of the electronic apparatus, and the electronic computer will be mainly described. The electronic device according to the present invention is a device having electronic components (semiconductor components) such as CPU, LSI and resistors, and heat-generating components such as electromagnetic relays, and in addition to electronic computers, server devices, magnetic disk devices,
This includes telephone exchanges, communication devices, measuring devices, control devices, etc.

In these figures, the printed circuit board 2 is C
A large number of heat-generating electronic components 3 such as PUs and LSIs are mounted, and are stacked (2a, 2b) in two stages on the front part of the housing 1. As shown in FIG. 2, a plurality of printed circuit boards 2 are juxtaposed in each stage. The number of stacked layers of the printed circuit board 2 and the number of stacked layers are determined by the performance of the electronic device, and may be one or three or more in terms of mounting. Further, the electronic component 3 mounted on the printed circuit board 2 may be provided with a heat dissipation fin for improving heat dissipation performance. The blower means is the blower 4 here,
It is placed on the lower part (upstream side) of the printed circuit board 2. A fan, a compressor, or the like may be used as a blowing unit other than the blower 4.

A cooler 5 for supplying cooling air is provided at the center of the rear part of the housing 1. The cooler 5 may be an evaporator of a refrigeration cycle as described later, or a cooler in which cold water introduced from a separately provided chiller unit or the like flows. The cooling air 6 is discharged upward from the blower 4, is warmed while passing between the lower printed circuit boards 2a and between the upper printed circuit boards 2b, and is turned from the upper part of the housing 1 to the rear part and cooled by the cooler 5. Then, it is rotated from the lower part of the housing 1 to the front part and sucked into the blower 4 again. And
The cooling air 6 circulates continuously in the cooling flow path,
Is forcibly air cooled.

Further, the housing 1 includes a partition plate 7 for partitioning the inside into front and back, an openable and closable door 8 provided on the front surface of the housing 1,
It is composed of a ceiling plate 9 of the housing 1, a bottom plate 10 of the housing 1, a rear side plate 11 of the housing 1, and the like. Inside each of the plates 8, 9, 10 and 11, as a lining material 12, a heat insulating material or a soundproof material. Either or both are attached. The frame 13 constitutes the framework of the housing 1, and is formed by a square-shaped or L-shaped angle or the like.

Here, the lining material 12 is preferably made of a material having both the performances of the heat insulating material and the soundproofing material, and is generally made of a material having both of the performances, in general, urethane. Foam or glass wool is used. Note that vacuum heat insulation may be used in an electronic device that requires further heat insulation. Also, each plate 8,
Since 9, 10, and 11 are generally made of steel plate or the like, an effect as a sound insulating material can be expected. Here, each plate 8, 9, 1
Since 0, 11 and its lining material 12 constitute the wall of the housing 1, and in the figure, the entire surface of the housing 1 is covered with the wall,
The cooling air 6 is almost completely blocked from the ambient air,
Are separated.

Therefore, when the electronic device is operating, the cooling air 6 in the housing and the ambient air hardly mix with each other through the wall of the housing 1, but the electronic device is stopped for a long time. In this case, it is considered that the in-housing cooling air 6 and the ambient air are slowly mixed from a slight gap between the walls. Here, when the heat insulation and soundproofing of the housing 1 are not required so much, the wall configuration of the housing 1 is such that the plates 8, 9, 10, 1
There is no need to provide the lining material 12 with only one. Further, the wall of the housing 1 may be mixed with a place where only the plate members (8, 9, 10, 11) are provided and a place where the lining material 12 is attached to each plate member. Further, it is desirable that the partition plate 7 provided in the center of the housing 1 is also made of a heat insulating material. The caster / stopper 14 is used when the housing 1 is moved and fixed.

Next, the humidifying means of the present invention will be described.
In FIG. 1, the absorbent / moisture releasing material 15 is a material having a function of absorbing and releasing water depending on humidity. The absorbent / moisture releasing material 15 is provided on the upstream side of the cooler 5 in the flow direction of the cooling air 6 so as to form a part of the wall of the housing 1. The armored door 16
The rear side plate 11a having the
Only moisture can move back and forth between the air inside and outside the housing via 6 and the moisture absorbing / releasing material 15. Arrow 17
Indicates the moving direction of water in this case.

The temperature detector 18 and the humidity detector 19 are detectors for detecting the temperature and the humidity of the cooling air 6, both of which are the temperature T of the cooling air 6 immediately before the inflow side of the front row printed circuit board 2a.
1 and the humidity φ1 are provided. The temperature detector 18 may be an inexpensive one such as a thermocouple or thermistor, and the humidity detector 19 may be an electrostatic capacitance type humidity sensor, and at least one humidity sensor is required. In order to increase the number, two to three or more may be provided. In addition, the temperature detector 1
8 and the humidity detector 19 may be combined into a single detector.

The temperature T of the cooling air 6 immediately before the inflow side of the frontmost printed circuit board 2a detected by the detectors 18 and 19
1 and the humidity φ1 correspond to the temperature and humidity of the cooling air 6 passing through the most upstream electronic components that generate heat on the first-row printed circuit board 2a, and the allowable temperature of the electronic components 3 (such as the junction temperature of the IC chip) and From the viewpoint of condensation and static electricity prevention,
Desirably, the temperature is T1 = 16 to 22 ° C. and the relative humidity is φ.
It is preferable to control so that 1 = 55% to 75%.
The controlled temperature T1 and the humidity φ1 are determined in consideration of the temperature increase of the cooling air 6 due to the cooling of the electronic component 3 and the accompanying decrease of the relative humidity.

The position of the moisture absorbing / releasing material 15 and the configuration of the entire casing 1 shown in FIG.
It is effective as a humidifying means for the cooling air 6 in the inside, and is effective in preventing static electricity of the electronic component 3 during winter drying. The reason and the operating principle will be described with reference to FIGS. FIG.
A commonly used moist air diagram, where the horizontal axis is the dry-bulb temperature T, the vertical axis is the absolute humidity x, and the upward-sloping line is the equal relative humidity line φ.
Is.

In winter, both indoors and outdoors are in a dry state, and the relative humidity φ is often 20 to 30% or less.
Now, as an example, the stopped electronic device casing 1 is placed in a room whose temperature is controlled, and the temperature and relative humidity of the indoor air are 22 ° C. and 30% as shown by points in FIG. Then, the temperature and humidity of the cooling air 6 in the housing 1 are considered to be about the same. If the electronic device is operated for a long time at the absolute humidity as it is, the relative humidity of the cooling air 6 becomes low when the temperature rises, and there is a risk of generating static electricity and causing a failure.

However, in the case of the present invention, the moisture of the ambient air is replenished into the case 1 by the absorbent / moisture releasing material 15,
The humidity of the air in the housing 1 can be raised to a level where static electricity can be prevented. First, 22 degrees Celsius inside and outside the housing 1,
When the electronic device is operated at a temperature and humidity of 30%, the cooling air 6 (T
1 = 22 ° C, φ1 = 30%) is a two-stage printed circuit board 2
By cooling a and 2b, the temperature rises and the relative humidity decreases accordingly.

After the temperature is raised, the temperature of the cooling air 6 is T2, and the relative humidity is φ2. As an example, when the temperature rise due to the cooling of the printed circuit board 2 by the cooling air 6 is 10 ° C., T2 =
32 ° C., φ2≈16% (point in FIG. 3). The relative humidity is an estimated calculation with the absolute humidity x kept constant. Then, the cooling air 6 in the temperature and humidity state faces the absorbent / moisture releasing material 15 provided above the rear portion of the housing 1.

Here, the temperature T0 and the humidity φ0 of the ambient air in contact with the outer surface of the absorbent / humidifier 15 are T0 as described above.
= 22 ° C., φ0 = 30%, and the temperature T2 and the humidity φ2 of the cooling air 6 in contact with the inner surface of the absorbent / humidifying material 15 are T2 =
Since 32 ° C. and φ2 = 16%, a humidity difference Δφ = 14% (= 30% −16%) occurs inside and outside the moisture-absorbing / desorbing material 15, and the movement of water through the moisture-absorbing / desorbing material 15. Occur. That is, since the relative humidity of the air is higher in the surrounding air than in the cooling air 6 in the housing, the moisture absorbing / releasing material 15 quickly absorbs moisture from the ambient air having a high relative humidity through the outer surface thereof. However, the moisture immediately penetrates into the absorbent / moisture releasing material 15.

On the other hand, the moisture absorbing / releasing material 15 quickly releases the absorbed moisture through the inner surface thereof to the cooling air 6 in the housing 1 having a low relative humidity. Therefore, the moisture taken from the ambient air moves to the cooling air 6 in the housing 1 via the absorbent / humidifying material 15, and the cooling air 6 is humidified. Assuming that the temperature and humidity of the humidified cooling air 6 are T3 and φ3, T3≈T2, but φ3> φ2.

Here, the amount of increase in relative humidity ((φ3-φ2)
= Increase in water content of the cooling air 6 = Increase in absolute humidity x)
You can set it to some extent. As an example, absorbent / moisture releasing material 1
5, when a cloth is used as the base material and a material in which the cloth is impregnated with a special moisture absorbent composed of a polymer material or the like is used, the moisture absorption amount of the moisture absorbent / moisture releasing material 15 is It can be controlled by the amount of the hygroscopic agent impregnated in. That is, when the amount of the hygroscopic agent impregnated into the cloth is increased, the amount of absorbed water of the moisture absorbent / moisture releasing material 15 is increased. It can also be controlled by changing the surface area of the material.

Here, a non-woven fabric may be used as the base material cloth. Further, as other applicable materials, a material in which a shape-memory polymer is thinly coated on one surface of nylon or the like, or a so-called moisture-permeable material manufactured in a laminated shape may be used. Here, the shape memory polymer is a polyurethane type shape memory resin, and the cloth may be polyester or the like in addition to nylon. Also in this case, a non-woven fabric may be used.

The temperature and humidity of the cooling air 6 on the inflow side of the cooler 5 are set to T3 (T3≉T2) and φ3 (φ3> φ2), and the cooling air 6 is cooled by the cooler 5 so as not to be dehumidified. Assuming that the cooling air 6 is controlled to a desired set temperature T1 = 22 ° C. (set temperature detected by the temperature detector 18), the relative humidity φ1 at that time is higher than the relative humidity during start-up operation of 30%. . By continuously repeating the circulation of the cooling air 6, the cooling air 6 in the casing 1 is
Since the relative humidity of the cooling air 6 gradually increases, the amount of humidification through the absorbent / humidifying material 15 gradually decreases, but the relative humidity (φ1) of the cooling air 6 is changed to the relative humidity (φ) of the ambient air by this humidifying means.
It is possible to make it higher than 0), and it is very effective in preventing static electricity.

It is when the relative humidity φ2 and φ0 become equal that the amount of moisture transfer (humidification amount) through the absorbent / humidifier 15 disappears (equilibrium is reached). When the relative humidity of the cooling air 6 becomes higher than a desired set value, the temperature level of the refrigerant in the cooler 5 and the air volume of the cooling air 6 may be adjusted to dehumidify the cooler 5. That is, the absorbent / moisture releasing material 15
By using the humidifying means using the above, the dehumidifying means using the cooler 5 and the humidity detector 19, the humidity of the cooling air 6 in the housing 1 can be freely controlled, and the inflow side of the printed circuit board 2 can be controlled. The humidity of the immediately preceding cooling air 6 can be controlled to a desired humidity.

Here, it is considered that the temperature rise of the cooling air 6 due to the heat generation of the blower 4 is small, and the temperature immediately before the inflow side of the printed circuit board 2 (the temperature of the temperature detector 18) and the temperature of the outflow side of the cooler 5 are determined. Although treated as the same temperature T1, when the temperature rise of the cooling air 6 due to the heat generation of the blower 4 is large, the above 2
It is better to consider the two temperatures separately. The same applies to the relative humidity.

Further, in the above study example, the temperature rise of the cooling air 6 due to the cooling of the printed circuit board 2 is set to 10 ° C. However, when the temperature rise is larger, the humidity difference Δφ between the inside and outside of the moisture absorbent / moisture releasing material 15 is 14 above. %, And more water can be moved. For example, increase the temperature by 20 ℃
(T2 = 42 ° C, φ2 ≈ 9%), the humidity difference Δφ is 2
It will be 1%. Further, although the above embodiment has been described by taking the case of forced air cooling as an example, the inside of the housing 1 may be cooled by natural air, and is heated by passing through the printed circuit board 2 (the relative humidity becomes low. ) The cooling air 6 may be humidified by the absorbent / humidifier 15 as in the case of forced air cooling.

FIG. 4 is another embodiment of the present invention and is a side sectional view of the housing 1 of the electronic device of the present invention, like FIG. The difference from FIG. 1 is that the absorbent / moisture releasing material 15 is provided on the downstream side of the cooler 5 so as to form a part of the wall of the housing 1. The position of the moisture absorbing / releasing material 15 and the configuration of the entire casing 1 are effective as a dehumidifying means for the cooling air 6 in the casing 1 in the summer and the rainy season, and are useful for preventing dew condensation during the high humidity in the summer and the rainy season. effective.

The reason and the operating principle will be described below with reference to FIG. 3 (moist air diagram) described above. However, it should be noted that in this case, it acts as a dehumidifying means. In the summer and the rainy season, both indoors and outdoors are in a high humidity state, and the relative humidity φ is often 60 to 70% or more. Now, as an example, the stopped electronic device housing 1 is placed in a temperature-controlled room, and the temperature and relative humidity of the indoor air are 26 ° C., 6 ° C. and 6 ° C., as shown by points in FIG.
If it is 0%, the temperature and humidity of the cooling air 6 in the housing 1 are considered to be about the same.

First, when the electronic device is operated both inside and outside the housing 1 at a temperature and humidity of 26 ° C. and 60%, the temperature of the cooling air 6 rises by cooling the two-stage printed circuit boards 2a and 2b. As a result, the relative humidity decreases. The temperature of the cooling air 6 after the temperature rise is T2, and the relative humidity is φ2. Then, the cooling air 6 in the temperature and humidity state goes around the rear portion of the housing 1 and reaches the cooler 5. During this period, the absolute humidity x is considered to be kept constant.

The temperature and humidity of the cooling air 6 on the inflow side of the cooler 5 are set to T2 and φ2, the cooling air 6 is cooled by the cooler 5, and the desired temperature of the cooling air 6 is T3 = 2.
If the temperature is controlled to 2 ° C. (T3≈T1), then the relative humidity φ3 is φ3≈77% (point in FIG. 3). This relative humidity is estimated and calculated with the absolute humidity x kept constant. Then, the cooling air 6 in the temperature and humidity state is
Face the absorbent / moisture releasing material 15 provided below the rear of the housing 1.

Here, the temperature T0 and the humidity φ0 of the ambient air in contact with the outer surface of the absorbent / humidifying material 15 are T0 = 26 ° C. and φ0.
= 60%, and the temperature T3 and the humidity φ3 of the cooling air 6 in contact with the inner surface of the absorbent / humidifying material 15 are T3 = 22 ° C., φ3≈
Since it is 77%, there is a humidity difference Δφ between the inside and outside of the absorbent / humidifying material 15.
= 17% occurs, and the movement of water occurs through the absorbent / moisture releasing material 15. That is, since the relative humidity of the air is lower in the surrounding air than in the cooling air 6 in the housing 1, the absorbent / humidifier 15
Quickly absorbs moisture from the cooling air 6 having a high relative humidity via its inner surface, and the moisture immediately absorbs and releases moisture 15.
Penetrates inside.

On the other hand, the moisture absorbing / releasing material 15 quickly releases the absorbed moisture through the outer surface thereof to the ambient air having a low relative humidity. Therefore, the moisture taken from the cooling air 6 in the housing 1 moves to the ambient air via the absorbent / humidifier 15,
The cooling air 6 will be dehumidified. Assuming that the temperature and humidity of the cooling air 6 after dehumidification are T1 and φ1, T1≈
Although T3, φ1 <φ3. By continuously repeating the circulation of the cooling air 6, the relative humidity (φ 1) of the cooling air 6 is changed to the relative humidity (φ 1) of the ambient air by the dehumidifying means.
0). If sufficient dehumidification cannot be achieved by the dehumidifying means alone, the temperature level of the refrigerant in the cooler 5 and the air volume of the cooling air 6 may be adjusted to assist the dehumidification by the cooler 5.

In the above embodiment, the installation position (upstream side or downstream side of the cooler 5) of the moisture absorbing / releasing material 15 is different in winter, summer, and rainy season, and it is necessary to use properly for each season. The following can be considered as a corresponding example. One is that the absorbent / moisture-releasing material 15 is provided on the entire rear surface of the housing 1 (from the upstream side to the downstream side of the cooler 5), and the necessary parts are provided depending on the season or the temperature and humidity conditions of the ambient air. This is a method of moving the cover provided on the surface of the absorbent / moisture releasing material 15 so that the absorbent / moisture releasing material 15 acts.

In FIGS. 1 and 4, the cover may be moved vertically. The other is that either the upper part or the lower part of the rear part of the housing 1 (upstream side or downstream side of the cooler 5)
The moisture-releasing material 15 is provided, and the housing 1 rear side plate 1 is seasonally changed.
This is a method of reversing the top and bottom of 1. However, since these operations are troublesome, the absorbing / releasing material 15 should be used as a humidifying means in winter.
It may be used only for (Fig. 1), and the cooler 5 may be fixed to the dehumidifying means in the summer and the rainy season. They are,
It may be selected according to the situation. Here, since the water absorption / moisture absorbing material 15 (water absorption amount) in the winter, summer, and rainy season is often different, it is necessary to select it according to the specifications.

Next, the installation environment of the electronic device of the present invention will be described. FIG. 5 shows an embodiment in which the housing 1 of the electronic device is installed in a room 20 whose temperature is controlled to some extent such as a computer room and an office. The housing 1 of the electronic device is described by simplifying FIG. 1 and the like. It is a thing. Here, the cooler 5 is an evaporator of the refrigeration cycle and is provided inside the housing 1, and the condenser 21 of the refrigeration cycle is provided outdoors. Further, the compressor 22 of the refrigeration cycle is provided outdoors like the condenser 21, the expansion mechanism 23 is provided inside the housing 1 like the evaporator 5, and between the indoor and outdoor refrigeration cycle parts, Refrigerant pipe 2
Connected with 4. The fan 25 is a fan for the condenser 21, the unit 26 is an outdoor unit surrounding the outdoor component,
The room-constituting wall 27 is a wall, a floor, and a ceiling that constitute the room. The parts other than the evaporator 5 and the condenser 21 need not be limited to the indoor and outdoor parts.

In this structure, the heat taken from the electronic parts 3 mounted on the printed board 2 through the cooler (evaporator) 5 is
Since the condenser 21 of the outdoor unit 26 dissipates heat to the ambient air outside the room, the room 20 such as the computer room and the office room
Even if the housing 1 of the electronic device is installed in the room, the temperature of the room 20 does not rise due to the electronic device. However, this configuration
Since the cooling system is divided into indoor and outdoor, the piping system such as the refrigerant piping 24 is fixed, and it is difficult to move the cooling housing 1 freely, resulting in a fixed cooling housing.

On the other hand, in FIG. 6, the housing 1 of the electronic device is divided into two rooms, and a first housing 28 and a second housing 29 are provided.
The cooler 5 is an evaporator of the refrigeration cycle and is provided in the same first housing 28 as the printed circuit board 2, and the condenser 21 of the refrigeration cycle is provided in the second housing 29. This is an example of the case where the entire housing is installed indoors. Further, the compressor 22 of the refrigeration cycle is provided in the same second housing 29 as the condenser 21, and the expansion mechanism 23 is provided in the same first housing 28 as the evaporator 5. The refrigerant pipe 24 is provided between the refrigeration cycle parts of the first casing 28 and the second casing 29.
Connected by.

In this configuration, the heat taken from the electronic components 3 mounted on the printed board 2 in the first housing 28 through the cooler (evaporator) 5 is stored in the adjacent second housing 29. Condenser 2
Since the heat is radiated to the ambient air around the housing 1 of the electronic device by the device 1, when the housing 1 is installed in the room 20 such as the computer room and the office, the temperature of the room 20 rises due to the heat dissipation of the electronic device. However, this configuration has a great feature that the cooling system is closed in one housing 1, so that it can be freely moved in the room as a stand-alone cooling housing.
Here, the installation locations of the compressor 22, the expansion mechanism 23, etc., which are the refrigeration cycle components other than the evaporator 5 and the condenser 21, need not be limited to the above.

In both the above description of FIGS. 5 and 6, the housing 1 of the electronic device is referred to as a room 2 such as a computer room or an office room.
Although the case where the electronic device is installed at 0 is described,
The installation location of may be a work site, outdoor, or outdoors. In particular, in the stand-alone type cooling case described in FIG. 6, heat is radiated to the ambient air around the case 1 of the electronic device by the condenser 21 of the second case 29, which is convenient outdoors. It should be noted that whether the cooling system of the electronic device is a separate type as shown in FIG. 5 or an integrated type as shown in FIG. However, when the housing 1 of the electronic device is installed in the room 20 such as a computer room and an office room, the separated type of FIG. 5 radiates heat to the outside, so a power saving effect can be expected, but the integrated structure of FIG. In shape, heat 2 indoors
Since it is released to 0, the load on the indoor air conditioner increases, and the power saving effect cannot be expected.

Next, the blowing direction of the cooling air 6 in the electronic device casing 1 of the present invention will be described. When the evaporator of the refrigeration cycle is used as the cooler 5 and the cooler 5 is provided with a dehumidifying means, the water in the cooling air 6 is condensed in the cooler 5 to generate drainage. If the installation position of the cooler 5 and the blowing direction are improper, the drain may be scattered and floated by the cooling air flow and reach the printed circuit board 2, causing the drain to cause dew condensation. Therefore, it is preferable that the drain produced in the cooler 5 be quickly removed from the cooler 5 and treated. One of the countermeasures is to install the cooler 5 sufficiently apart from the upstream side of the printed circuit board 2, and the other is to remove the drain from the cooler 5 quickly so that the cooling air 6 is Before and after the cooler 5, air is blown from the upper side to the lower side. Here, the blown air from the upper side to the lower side is preferably blown in the direction of gravity, but may be slightly inclined from the direction of gravity depending on the configuration of the housing 1 or the like.

Another embodiment of the present invention will be described with reference to FIG. The housing 1 of the electronic device shown in FIGS. 1 and 4 is an embodiment in which air is blown from the upper side to the lower side, and the cooler 5 is horizontally installed in the center of the rear part of the housing 1. In the cooler 5, the cooling air 6 is blown from the upper side to the lower side. In the embodiment shown in FIG. 7, the cooler 5 is installed obliquely below the rear part of the housing 1, but the cooling air 6 is blown from the upper side to the lower side. The drain pan 30
A drain pan for collecting drain, which is provided below the cooler 5. Here, the cooler 5 may be placed in the horizontal direction as shown in FIGS. 1 and 4, or may be inclined as shown in FIG. 7.

FIG. 8 shows another embodiment of the present invention, in which the cooler 5 is provided below the blower 4 in the front part of the housing 1, and the cooling air 6 flows in the direction shown in FIG. On the contrary, in the cooler 5, the cooling air 6 is blown from the upper side to the lower side. As described above, the installation position of the cooler 5 is not limited to a fixed place and may be an arbitrary place. In the cooler 5, the cooling air 6 is preferably directed from the upper side to the lower side. The air may be blown in the direction of gravity.

Of course, as long as drainage from the cooler 5 is efficiently performed, the blowing direction of the cooling air 6 in the cooler 5 may not be a flow from the upper side to the lower side, and will be described later, for example. As shown in FIG. 20, the cooler 5 may be installed in the vertical direction or in a direction close to the vertical direction, and the cooling air 6 may flow in the cooler 5 in the horizontal direction. Further, the cooling device 5 may be installed in the vertical direction and the direction of 45 degrees.

Next, an example of the shape of the heat exchanger used in the cooler 5 of the present invention will be described. FIG. 9 is an example of a heat exchanger, which is a fin-tube heat exchanger. This heat exchanger is configured by laminating a large number of thin fins 31 at regular intervals and penetrating a large number of circular pipes 32 through the fins 31. Cooling air 6 flows between the fins 31 and inside the circular pipes 32. The refrigerant flows, and efficient heat exchange is performed between both fluids. The bend 32a connects the two circular pipes 32. In addition to this, as a heat exchanger suitable for the cooler 5 of the present invention, there is a compact heat exchanger used for an engine radiator or the like. In the heat exchanger, the surface of the fin 31 may be subjected to either a hydrophilic surface treatment or a water-repellent surface treatment in order to quickly separate the drain from the surface of the fin 31.

Next, an embodiment of the present invention showing a drain treatment method will be described. FIG. 10 is a side cross-sectional view of the electronic device casing 1, which is an embodiment showing a method for treating drain collected by the drain pan 30. Although the basic configuration is the same as that of FIG. 1, a drain pan 30 is provided below the cooler 5, and the drain dropped from the cooler 5 is guided to the drain pan 30 by the drain guide 33. And the drain pan 30
At least a part of the drain collected by is guided to the external drain pan 34 outside the electronic device housing 1.

This will be described with reference to FIG. FIG.
1 is a perspective view of the drain pan 30 and the external drain pan 34. The drain 3 collected in the drain pan 30 in the housing 1 is shown.
A part of 5 is guided to the external drain pan 34 by a small communication hole 36 that connects the drain pan 30 and the external drain pan 34 outside the housing 1. The communication hole 36 may be a thin pipe or the like, and not only one but also several may be provided. A part of the high temperature / high pressure side pipe 37 of the refrigeration cycle is guided to the inner bottom portion of the outer drain pan 34, and comes into contact with the drain 35. A refrigerant pipe on the outlet side of the condenser 21 of the refrigeration cycle may be used as a part of the high temperature / high pressure side pipe 37, and the refrigerant pipe reaches the expansion mechanism 23 after passing through the external drain pan 34.

With this structure, the external drain pan 3
Since the drain 35 contacts the high temperature / high pressure side pipe 37 in the inside 4, the drain 35 is gradually evaporated by the heat of the refrigerant. Since the evaporation of the drain 35 is performed outside the housing 1, there is no concern that the evaporation of the drain 35 humidifies the inside of the housing 1.
Here, in order to promote the evaporation of the drain 35, a heat dissipation fin for increasing the heat transfer area may be provided in the high temperature / high pressure side pipe 37 to be contacted, and the drain 35 may be contacted with the heat dissipation fin. Further, the heating of the drain 35 may be performed by a heater provided separately instead of using a part of the piping of the refrigeration cycle, and the external drain pan 34 may be installed at the lower portion, not the rear portion of the housing 1. May be

Next, the openable and closable door provided in the electronic device housing 1 of the present invention will be described. FIG. 12 is a perspective view of the housing 1, showing an embodiment of the door of the present invention. In FIG. 2, the openable / closable door 8 is provided over the entire one surface of the front surface of the housing 1. With this configuration, when the door 8 is opened for maintenance / replacement of the printed circuit board 2, temperature and humidity are controlled. The cooling air 6 in the housing 1 that is being operated and the uncontrolled ambient air are violently mixed, and there is a concern that dew condensation troubles may occur. As measures against this, maintenance of the printed circuit board 2
Make the opening of the door 8 opened at the time of replacement as small as possible,
It is to suppress the mixing of the cooling air 6 and the ambient air.

First, the openable / closable door 8a provided in the front part of the upper printed circuit board 2b in FIG. 12 includes a plurality of printed circuit boards 2 arranged side by side in one step (in the figure, seven printed circuit boards are used as an example. ) Each door is a door 8a
By opening the, any of the seven printed circuit boards 2 in that stage can be inserted and removed. However, as a matter of course, the lower printed circuit board 2a cannot be inserted or removed from the door 8a. Further, the openable and closable doors 8b provided at the front part of the lower printed circuit board 2a (not shown in the figure) in FIG. 12 are doors corresponding to the left and right halves of the plurality of printed circuit boards 2 arranged side by side in one step. Then, by opening this one door 8b, half the number of the printed circuit boards 2 in that stage can be inserted and removed.

In FIG. 12, an example in which two kinds of doors 8a and 8b are provided in one housing 1 has been described for the sake of description, but an openable and closable door provided corresponding to each of these plural printed circuit boards 2. In one housing 1, 8a and 8b may be unified into one kind. Further, the number of the printed circuit boards 2 corresponding to the doors 8a and 8b does not have to be limited to the above, and may be 10 or more, or about 2 to 3. However, when the number of the printed circuit boards 2 corresponding to the doors 8a and 8b is increased, the opening of the door 8 is widened, so that the cooling air 6 and the ambient air are likely to be mixed with each other.

FIG. 13 shows another embodiment of the openable / closable door 8 of the present invention. A large number of openable / closable doors 8c are provided for each printed circuit board 2 in a one-to-one correspondence. For this reason,
Only one printed circuit board 2 can be inserted and removed from the door 8c. The door 8c of this embodiment is the door 8a shown in FIG.
Since the opening of the door 8 is smaller than that of 8b, the mixing of the cooling air 6 and the ambient air is further suppressed. Thus, in terms of performance (suppression of air mixing), the door 8c of FIG. 13 is better, but in terms of productivity, the door 8a or 8b of FIG. 12 is used.
Because it is better, it is necessary to select depending on the situation. Further, in the above-described embodiment, the openable and closable doors 8 are provided centrally on one wall surface (front surface) of the housing 1, but they may be provided separately on other wall surfaces.

Next, referring to FIGS. 14 and 15, FIG.
2 and FIG. 13, an example of countermeasures when the mixture of the cooling air 6 and the ambient air cannot be sufficiently suppressed even if the opening of the door 8 is made small will be described. 14 and 15 show an embodiment of the present invention that suppresses the mixing of air.
FIG. FIG. 14 shows an example of a structure in which the downward cooling air 6 is blown to the printed circuit board 2. In order to suppress the mixing of the cooling air 6 and the ambient air, the vicinity of the inside of the openable doors 8a, 8b at the front of the printed circuit board 2 is shown. In the narrow space 38, a part 6a of the cooling air 6 is caused to flow substantially in parallel along the surfaces of the doors 8a and 8b to form an air curtain with a thin and wide air flow 6a.

A part 6a of the cooling air constituting the air curtain is separated from the main flow of the cooling air 6 by the air separation plate 39 on the upper part of the casing 1, and is directed downward in a narrow space 38a between the door 8a and the printed circuit board 2a. Is guided as an air flow.
The main flow of the cooling air 6 is the two-stage printed circuit board 2a,
After passing through 2b, it is sucked into the blower 4. The air flow 6a forming the air curtain is preferably faster than the flow velocity of the cooling air 6 flowing between the printed boards 2a and 2b. The airflow 6a flowing out from the narrow space 38a is guided as it is to the narrow space 38b between the lower door 8b and the printed circuit board 2b, and is sucked into the blower 4 from the lower end.

When the air curtain is constructed by using the part 6a of the cooling air as described above, even when the door 8 is opened,
Mixing of the cooling air 6 in the housing 1 and the ambient air through the opening of the door 8 is suppressed, heat AC inside and outside the housing 1 is shut off, and dust and the like enter the housing 1. Can be prevented. However, complete blocking and intrusion prevention cannot be expected.

In FIG. 14, the air curtain is constructed by using a part of the cooling air 6, but the air separation plate 39 on the upper part of the casing 1 is used.
It is also possible to provide another fan at the portion of and to make a thin and wide air flow 6a constituting the air curtain by this fan. However, in this case, power for driving the fan is required. Further, although the example in which the printed circuit boards 2 are laminated in two layers has been described, the printed circuit board 2 may be one layer or three or more layers may be laminated in the air curtain structure. Further, the air curtain structure can be applied to the case of the large door 8 provided over the entire one surface of the housing 1.

FIG. 15 shows an example of a structure in which the upward cooling air 6 is blown to the printed circuit board 2. An air separating plate 39 is provided at the outlet of the blower 4, and the air separating plate 39 forms an air curtain. You get a portion of the air 6a. The thin and wide air flow 6a forming the air curtain is an upward flow, but the effect is the same as in FIG.

Next, the structure of the cooler 5 used in the electronic device housing 1 of the present invention will be described with reference to FIG. FIG.
6 is an embodiment showing the configuration of the cooler 5 of the present invention, and is a side sectional view of the electronic device housing 1. The cooler 5 is divided into two in the flow direction of the cooling air 6, and the cooler 5a is provided on the upstream side.
The cooler 5b is installed in series adjacent to the downstream side.
When the cooler 5 is divided into two parts in this manner, the temperature level of the refrigerant flowing in each of the coolers 5a and 5b can be changed, and the following usage can be performed. For example,
When increasing the amount of dehumidification in the housing 1, it is necessary to lower the temperature level of the refrigerant flowing in the cooler 5, and the temperature of the cooling air 6 may be lowered accordingly.
It is also conceivable that the temperature becomes lower than the set temperature (for example, T1 = 22 ° C.).

In this case, first, the temperature level of the refrigerant flowing in the cooler 5a on the upstream side is lowered to increase the dehumidification amount of the cooling air 6, and when the temperature of the cooling air 6 becomes lower than the set temperature, the downstream side That is, the temperature level of the refrigerant flowing in the cooler 5b is raised slightly to heat the temperature of the cooling air 6 to the set temperature. In this way, by dividing the cooler 5 into two parts and changing the temperature level of the refrigerant flowing in each of the coolers 5a and 5b, the temperature and humidity of the cooling air 6 in the housing 1 can be relatively easily increased. It can be well controlled and is an effective method. Here, the cooling device 5 may be divided into not only two but also three or more.

FIG. 17 is a side sectional view of the electronic device casing 1 in another embodiment showing the structure of the cooler 5 of the present invention. Similar to FIG. 16, the cooler 5 is divided into two in the flow direction of the cooling air 6, and the cooler 5a is provided in the upstream side and the cooler 5b is provided in the downstream side in series. 5a
And 5b are installed separately. The effect is similar to that of FIG. 16, and the installation positions of the two coolers 5a and 5b need not be limited to those shown in FIGS. The sizes (volumes) of the coolers 5a and 5b do not have to be the same, and for example, the cooler 5a on the dehumidifying side may be larger.

Further, FIG. 18 is a side sectional view of the electronic device casing 1 in another embodiment showing the structure of the cooler 5 of the present invention. The cooler 5 is divided into two at right angles to the flow direction of the cooling air 6, and the cooler 5a is on the right side and the cooler 5b is on the left side in the figure.
Are installed adjacent to each other in parallel in the flow direction of the cooling air 6. Thus, even if the cooler 5 is divided into two, the temperature level of the refrigerant flowing in each of the coolers 5a and 5b can be changed. Here, the division of the cooler 5 is 2
It does not matter if it is not divided but divided into three or more.

The effect will be described with reference to FIG. FIG.
18 is a cross-sectional view showing only the cooler 5 portion of FIG. 18, in which the cooling air 6 is separated on the upstream side of the cooler, and the temperature level of the refrigerant flowing in the cooler 5a on the right side is lowered (TL) to cool it. The dehumidifying amount of the air 6 is increased, the temperature level of the refrigerant flowing in the left cooler 5b is made slightly higher (TH) to suppress the temperature of the cooling air 6 to some extent, and the temperature obtained by the two coolers 5a and 5b. The cooling air 6 having different humidity is mixed on the downstream side of the cooler to obtain the cooling air 6 having the set temperature and the set humidity.

As the refrigerant having a slightly high temperature level flowing in the cooler 5b, the refrigerant on the outlet side of the condenser 21 of the refrigeration cycle may be used, and the high temperature, high pressure refrigerant at the outlet of the condenser 21 may be used as it is. However, it is also possible to lower the pressure level of the high temperature / high pressure refrigerant at the outlet of the condenser 21 to the intermediate pressure by the first expansion mechanism 23a and use the medium temperature / medium pressure refrigerant. As the low temperature level refrigerant flowing through the cooler 5a, a low temperature / low pressure refrigerant whose pressure level is further lowered by the second expansion mechanism 23b different from the first expansion mechanism 23 may be used. The first expansion mechanism 23a and the second expansion mechanism 23b are the first expansion mechanism 23a, the cooler 5b, and the second expansion mechanism 23b.
The expansion mechanism 23b and the cooler 5a may be connected in series in this order. Here, the sizes (volumes) of the coolers 5a and 5b do not have to be the same, and for example, the cooler 5a on the dehumidifying side may be larger.

Next, a method of operating the electronic apparatus casing 1 of the present invention at the time of starting will be described. In particular, immediately before the start-up in winter, the temperature of the electronic components 3 and the printed circuit board 2 in the housing 1 is considerably low, and the electronic equipment housing 1 is started in that state (power-on of the electronic components 3 and When the refrigerating cycle is operated), the temperature of the component becomes lower than the dew point temperature of the cooling air 6, which causes dew condensation. Therefore, at the time of startup, it is desirable to detect the temperature of the components in the housing 1 and the temperature and humidity of the cooling air 6 and control the operating method according to the situation.

FIG. 20 is a side sectional view of the electronic device casing 1 in the embodiment. The component temperature detector 40 is provided on the electronic component 3 on the printed circuit board 2 and detects the temperature of the electronic component 3. In the temperature detector 40, the electronic component 3 is CP
As long as it is an IC chip such as U or LSI, it may be composed of a heat-sensitive diode provided in the circuit of the IC chip, or may be a thermocouple or thermistor newly attached to the electronic component 3. In addition, the temperature detector 40 for the component
May be provided only on the representative electronic component 3, but from the viewpoint of reliability, it may be provided on as many electronic components 3 as possible, and the worst temperature among them may be set as the representative component temperature.

The temperature detector 40 of the component may be provided on the printed board 2 to detect the temperature of the printed board 2. In this case, the temperature detector 40 may be a thermocouple or thermistor. Further, the temperature detector 40 of the component may be provided only on one of the electronic component 3 and the printed circuit board 2, but may be provided on both of them depending on the situation.
Further, in the present embodiment, the component heating means 41 is the electronic component 3 itself on the printed circuit board 2, and the electronic component 3 and the printed circuit board 2 are heated by energizing the electronic component 3. Of course, the component heating means 41 may be a new heater provided on the printed circuit board 2, or depending on the situation, the heater and the electronic component 3 may be energized together.
The heater provided on the printed circuit board 2 is an insulated SU.
An S foil or a ceramic heater may be used.

Next, the operating method will be described by taking characteristic conditions as an example. First, immediately before turning on the power of the electronic component 3 and starting the refrigeration cycle, the temperature of the electronic component 3 is detected by the temperature detector 40 of the component, and at the same time, the temperature detector 18 of the cooling air 6 and the humidity detector 19 print. The temperature and the relative humidity of the cooling air 6 immediately before the substrate inflow side are detected.
Then, of the detected temperatures of the components, the lowest temperature is set as the representative component temperature, and the dew point temperature of the cooling air 6 is obtained from the temperature and the relative humidity of the cooling air 6, and the representative component temperature and the dew point of the cooling air 6 are obtained. Compare the temperatures.

Here, when the temperature of the representative component is higher than the dew point temperature of the cooling air 6, there is almost no fear of dew condensation, and therefore the electronic device is controlled so as to be operated as it is (power-on of the electronic component and activation of the refrigeration cycle). . However, when the temperature of the representative component is lower than or about the same as the dew point temperature of the cooling air 6, there is a risk of dew condensation, so that the electronic component serving as the heating means 41 is energized to raise the electronic component 3 and the printed circuit board 2. After the temperature of the representative component is raised and the temperature of the representative component becomes higher than the dew point temperature of the cooling air 6, the electronic device is controlled to operate.

FIG. 21 is a side sectional view of the electronic device casing 1. When the representative component temperature is lower than or about the same as the dew point temperature of the cooling air 6, the housing 1 may be configured as shown in FIG. 21 as another method for preventing dew condensation. Via the printed circuit board 2 different from the first cooling flow path (the main cooling flow path described above with reference to FIG. 18) of the cooling air 6 for cooling the printed circuit board 2 on which the electronic component 3 is mounted in the housing 1. The second cooling flow path 42 that does not include the second cooling flow path 42
A cooler 5 and a fan 43 for the second cooling flow path 42 are provided therein.

The cooler provided in the second cooling passage 42 may be a part of the cooler 5 instead of the entire cooler 5. Here, the cooler 5 as a whole is divided into two as shown in FIG. 18 to form coolers 5a and 5b, which are installed in parallel and adjacent to each other. As will be described later, the cooler 5b serves as a reheater (heater), and a part of the high temperature / high pressure side refrigerant pipe on the outlet side of the condenser 21 of the refrigeration cycle may be used for the reheater. The two fans 43a and 43b are blown in opposite directions, and the cooling air 6 flows from the upper side to the lower side in the cooler 5a and flows from the lower side to the upper side in the cooler 5b, and flows in the cooling path of the short path. I am configuring.

At this time, the blower 4 is stopped, and the cooling air 6 is not flowing (retained) in the first cooling flow path. Then, the cooling air 6 is first dehumidified by the cooler 5a having a low temperature level (TL), and then heated by the cooler 5b (reheater) having a high temperature level, and the short second cooling flow path. By rapidly circulating the cooling air 6 in 42, only the dehumidification of the cooling air 6 is performed, and the dew point temperature of the cooling air 6 is lowered. Although the dehumidification of the cooling air 6 is locally performed in the second cooling flow path 42, the dehumidified cooling air 6 quickly diffuses throughout the housing 1, so that the cooling air 6 in the entire housing 1 is Has a lower dew point temperature. Then, the electronic device is operated after the dew point temperature of the cooling air 6 becomes lower than the representative component temperature (electronic component power-on and refrigeration cycle startup).
Control to do. These electronic device operation control methods described in FIGS. 20 and 21 may be used in combination.

When the temperature of the representative parts is higher than the dew point temperature of the cooling air 6, the electronic parts may be turned on and the refrigeration cycle may be started at the same time to operate the electronic device. First, the electronic parts are turned on and the blower 4, which is a blowing means, is operated to start the refrigeration cycle after the temperature of the electronic parts 3 approaches an allowable value (for example, the junction temperature of the IC chip). You may control.

In the above-described embodiment of the electronic device of the present invention, in order to provide a relatively highly reliable high-end electronic device, it is assumed that the electronic device is placed in a room whose temperature is sufficiently controlled. The temperature and relative humidity of the cooling air 6 immediately before the inflow side of the printed circuit board of 16 ° C to 22 ° C and 55% to 7%.
Although it is controlled to 5%, in the case of a low-end electronic device placed in a slightly bad environment such as a work site or outdoors, the temperature and the relative humidity of the cooling air 6 immediately before the inflow side of the printed circuit board in the housing 1 are controlled. 16 ° C to 32 ° C, and 20%
In many cases, it is sufficient if it can be controlled to about 80%. The electronic device of the present invention can easily control the temperature and humidity of the cooling air 6 as described above.

Next, a description will be given of soundproofing measures for the housing wall of the electronic device provided with the moisture absorbing / releasing material 15. As described with reference to FIG. 1 and the like, the absorbent / moisture releasing material 1 that is a part of the housing wall of the electronic device 1
5 is a lining material 12 composed of a heat insulating material and a soundproof material
Similarly, since it is made of a cloth or the like having a sufficient thickness, a considerable soundproof effect can be expected, but since the armored door 16 is opened on the rear side plate 11a, there is a concern that the sound insulating effect may be reduced.

FIG. 22 is a side cross-sectional view of the electronic device housing 1, which is an embodiment of the soundproofing measures of the present invention. Absorption / humidification material 1
An air passage 44a is provided on the outside of the wall 11a having the armored door 16 composed of 5 so as to cover the wall.
The air passage 44a has two or more openings between the air passage 44a and the wall 11a so that air can flow back and forth. here,
The air passages 44b may be provided inside the wall 11a made of the moisture absorbent / humidifier 15, or the air passages 44a and 44b may be provided both inside and outside the wall 11a. Further, the material forming the ventilation passages 44a and 44b may be only a plate material such as a steel plate, only a soundproof material having a sound absorbing function, or a combination of the plate material and the soundproof material. The ventilation path 44a or 44b mainly suppresses noise in the horizontal direction and does not cause discomfort to a person working in the surrounding area.

FIG. 23 shows an embodiment of the soundproofing measures of the present invention, in which one acoustic reflector 45 is provided on the outside of the wall 11a having the armored door 16 composed of the moisture absorbing / releasing material 15. The propagation direction of the noise leaking from the wall 11a is changed to an arbitrary direction. Here, as the arbitrary direction in which the noise is propagated, the underfloor (below the housing 1) is selected so that it is difficult for a person working in the surroundings to feel noisy. Conversely, the direction in which noise propagates may be above the housing 1. In addition, the control of the direction in which noise propagates is performed by adjusting the inclination angle θ of the reflection plate 45.
Etc. Further, the reflector 45 may be divided into a plurality of pieces, and the material forming the reflector 45 is
Only a plate material such as a steel plate may be used, only a soundproof material having a sound absorbing function may be used, or a plate material and a soundproof material may be combined.

Further, FIG. 24 shows another embodiment of the soundproofing measure of the present invention, which is an armored door 16 composed of a moisture absorbing / releasing material 15.
The sound propagation path 46 is provided on the outside of the wall 11a having the above, and the member 47 forming the propagation path 46 is a plate material or the like having a material having a sound absorbing function attached to the inside. As a material having a sound absorbing function, urethane foam, glass wool or the like is used. The propagation path 46 has one opening (lower part in the figure). The propagation path 46 can reduce noise leaking from the wall 11a. The propagation path 46 may be one, or may be divided into a plurality of pieces in the direction perpendicular to the paper surface (width direction of the rear wall 11a). However, since the frequency range that can be suppressed differs depending on the size of the propagation path 46, it is necessary to appropriately select the number of divisions of the propagation path 46.

FIG. 25 is also another embodiment of the soundproofing measures of the present invention, in which one or the same as that shown in FIG. 24 is provided on the outside of the wall 11a having the armored door 16 made of the absorbent / moisture releasing material 15. A sound propagation path 46 divided into a plurality of parts is provided, and a reference sensor 48 for detecting noise is provided in the middle of the propagation path 46.
A controller 50 is provided for generating a signal having the same amplitude and an opposite phase based on the signal obtained from the speaker 49 for canceling noise and the reference sensor 48. When the propagation path 46 is configured in this manner, a signal having the same amplitude as the noise leaking from the wall 11a but an opposite phase is emitted from the speaker 49 and the noise is canceled by the signal.

As another soundproofing measure, the absorbent / moisture releasing material 1
It is conceivable to make the area of the wall 11a having the armored door 16 constituted by 5 sufficiently smaller than the area of the entire wall constituting the housing 1. Generally, if a hole having a size of 1 / n of the total wall area is formed in the wall, the transmission loss (d
The maximum value of B) is given by 10 · log (n). Therefore, in order to secure the transmission loss of the electronic device of the present invention of 10 dB or more, the area of the wall 11a having the absorbent / moisture releasing material 15 is 1/10 of the area of the entire wall forming the housing 1.
Must be: In the electronic device housing 1 of the present invention shown in FIG. 1 and the like, the area ratio of the walls is about 1/10.

Next, referring to FIG. 26, an embodiment of the casing structure of the present invention will be described. FIG. 26 is a side sectional view showing the housing structure of the present invention, and shows the housing 1 of the magnetic disk device as an example. In the housing 1, a plurality of magnetic disk drives 51 as heat generating parts, and a control circuit therefor,
There is a drive power source 52 and the like, and the housing 1 is surrounded by a wall 53. The wall of the housing 1 is composed of the openable and closable door 8 provided on the front surface, the ceiling plate 9, the bottom plate 10, the rear side plate 11, the lining material 12, and the like, as in FIG. 1 described above.

The temperature of the heat generating component 51 and the like is controlled by the cooler 5 for supplying the cooling air 6, the fan 43 as the blowing means, the temperature detector 18, and the temperature controller for controlling them. Here, as the cooler 5, an evaporator of a refrigeration cycle is used, but a cooler in which cold water introduced from a separately provided chiller unit or the like flows, or an electronic cooling element (Peltier element) using the Peltier effect is used. It may be. The electronic cooling element cannot cool a large amount of heat, but since it does not require a compressor or the like, it has a housing structure with low noise and low vibration.

Next, the humidifying means of the cooling casing 1 of the present invention shown in FIG. 26 will be described. Absorbing / dehumidifying material 1 which is a material having a function of absorbing and releasing moisture according to humidity
5 is provided on the upstream side of the cooler 5 in the flow direction of the cooling air 6 so as to form a part of the wall of the housing 1,
A rear side plate 11a having an armoring door 16 is provided on the outer surface of the moisture absorbing / releasing material 15, and only moisture is transferred between the inside and outside air of the housing 1 via the armoring door 16 and the moisture absorbing / releasing material 15. You can come and go. The effect of such a humidifying means is as described with reference to FIG. 1, and the arrow 17 indicates the moving direction of water in this case. Further, the dehumidifying means of the cooling casing 1 of the present invention is the cooler 5, and is performed by adjusting the temperature level of the cooler 5 and the air volume of the cooling air 6.

Like the temperature detector 18, the humidity detector 19 for the cooling air 6 is provided at a position for detecting the temperature and humidity of the cooling air 6 to be controlled. The temperature detector 18 may be an inexpensive one such as a thermocouple or thermistor, and the humidity detector 19 may be an electrostatic capacitance type humidity sensor, and at least one humidity sensor is required. In order to increase the number, two to three or more may be provided. In addition, the temperature detector 18 and the humidity detector 19
May be combined and configured as one detector.

The cooling cabinet 1 of the present invention may be installed in a room whose temperature is controlled to some extent, as in FIG. 5, and the cooler 5 is an evaporator of a refrigeration cycle and is installed in the cooling cabinet 1. The condenser of the refrigeration cycle is provided outdoors. In this configuration, the heat generating component 51 and the like are connected to the cooler (evaporator) 5
Since the heat taken away through the condenser is radiated to the ambient air outside the room by the condenser, even if the cooling case 1 is installed in the room, the temperature of the room does not rise due to the cooling case 1.

Further, similar to FIG. 6, the cooling casing 1 is divided into two rooms, the first casing and the second casing are provided, and the cooler 5 is provided.
Is the evaporator of the refrigeration cycle, and is the same as the heat generating parts 51 etc.
It is also possible to provide the condenser of the refrigeration cycle in the second casing and to install the entire cooling casing 1 indoors.
In this configuration, the heat generating component 51 and the like are connected to the cooler in the first housing.
The heat taken through the (evaporator) 5 is radiated to the ambient air around the cooling housing 1 by the condenser of the adjacent second housing. Therefore, when the cooling housing 1 is installed indoors, However, the temperature rises due to the heat radiation of the cooling casing 1. Furthermore, the cooling housing 1 may be installed at a work site, outdoors, or outdoors. It should be noted that whether the cooling system of the cooling housing 1 is a separate type as shown in FIG. 5 or an integrated type as shown in FIG. 6 may be determined according to the user's request.

Next, another embodiment of the present invention will be described with reference to FIGS. 27 to 29. 27 to 29 are side sectional views showing the case structure of the present invention, and show the case 1 of the electronic computer as an example. In FIG. 27, the housing 1
Is a cooling housing 1a containing a printed circuit board 2 on which a plurality of heat-generating electronic components 3 are mounted, a compressor 22, a condenser 21, an evaporator 5 and blowing means 25 and 4 thereof, an expansion mechanism 23 and the like. The cooling unit 53 includes a cooling unit 53 having a refrigerating cycle, and the cooling unit 53 is attached to the upper part of the cooling casing 1a. Here, the cooling unit 53 and the cooling housing 1a
Can be completely separated at the arrows AB and are independent of each other. Therefore, the cooling unit 53 can be attached to another cooling housing.

The casing of the cooling unit 53 is divided into two by the partition plate 7a, and the heat radiating chamber 54 and the heat absorbing chamber 5 are divided into two.
5, the condenser 21 is provided in the heat radiating chamber 54, the evaporator 5 is provided as the cooler in the heat absorbing chamber 55, and the heat absorbing chamber 55 is further provided with two openings through which the cooling air 6 can enter and exit.
An intake port 56 and an exhaust port 57 are provided. Further, the absorbent / humidifier 15 having the function of absorbing and releasing water depending on the humidity, which is an example of the humidifying means of the present invention, has an upstream portion of the cooler 5 in the flow direction of the cooling air 6. On the side,
It is provided as a part of a wall forming the heat absorption chamber 55.

The effect of the moisture absorbing / releasing material 15 as the humidifying means is as described with reference to FIG. 1 and the like, so that only moisture can pass between the air inside and outside the heat absorbing chamber 55 through the moisture absorbing / releasing material 15. It has become. The arrow 17 indicates the moving direction of water in this case. On the other hand, the cooling casing 1a is also provided with two openings through which the cooling air 6 can flow in and out, an intake port 56 and an exhaust port 57, and an intake port 56 and an exhaust port 57 of the heat absorption chamber 55 and the cooling casing 1a. The intake port 56 and the exhaust port 57 are connected so that the cooling air 6 can communicate with each other.

Therefore, in the cooling housing 1a, the cooling air 6 whose temperature has risen by the printed circuit board 2 on which a plurality of heat-generating electronic components 3 are mounted flows into the cooling unit 53 from the cooling housing 1a through the intake port 56. After being cooled by the cooler 5, the air flows out from the cooling unit 53 to the cooling casing 1a through the exhaust port 57 and cools the electronic components 3 and the like again. In this configuration, as in FIG. 6, the heat taken away through the cooler 5 is
The adjacent condenser 21 radiates heat to the ambient air around the cooling case 1. Therefore, when the cooling case 1 is installed in the room, the temperature inside the room increases due to the heat radiated by the cooling case 1. In addition, the intake port 5
The number of the exhaust ports 6 and the exhaust ports 57 need not be limited to one each, but may be multiple.

Further, FIG. 28 shows an example in which the cooling unit 53 is attached to the side surface portion of the cooling housing 1a, and the cooling unit 53 and the cooling housing 1a are completely separated at the arrow AB portion. Can and are independent of each other. Figure 2
27 differs from FIG. 27 only in the mounting position of the cooling unit 53, but the cooling unit 53 and the cooling housing 1a have substantially the same basic configuration and effect.

27 and 28, the cooling unit 53 and the cooling casing 1a are closely attached to each other by the intake port 56 and the exhaust port 57, so that the cooling unit 5 is cooled.
3 and the cooling casing 1a are not connected, but the intake port 56 and the exhaust port 5 of the cooling unit 53 and the cooling casing 1a.
7 may be separated from each other, and the intake port 56 and the exhaust port 57 thereof may be connected to each other by two ducts or the like to communicate the cooling air 6. This method is effective when it is structurally difficult to directly attach the cooling unit 53 to the cooling housing 1a.

Further, FIG. 29 shows an example in which the cooling unit 53 also serves as the openable / closable door 8 attached to the cooling housing 1a, and the cooling unit 53 can be opened / closed at the arrow AB portion. . In this case, the cooling unit 53
It is particularly desirable that the is thin and lightweight. FIG. 29 is also FIG.
7, the basic configuration and effect of the cooling unit 53 and the cooling housing 1a are substantially the same, except that the mounting position of the cooling unit 53 is different.

Here, the shape and installation position of the refrigeration cycle constituent parts need not be limited to those shown in FIGS. 27 to 29. For example, the heat exchanger used for the cooler 5 may be the fin-tube type heat exchanger shown in FIG. 9 or a compact type heat exchanger used for an engine radiator or the like. Further, the blowing means 4 and 25 may be various blowers, fans, compressors and the like. Further, also in the cooling casing structure shown in FIGS. 27 to 29, the heat absorption chamber 55
Alternatively, the temperature detector 18 and the humidity detector 19 may be provided at any arbitrary positions of the cooling casing 1a to control the temperature and humidity of the cooling air 6.

In FIG. 27, an example in which a detector is provided immediately before the inflow side of the printed circuit board 2 of the cooling housing 1a, and in FIG. 28, an example in which the detector is provided immediately before the exhaust port 57 of the heat absorption chamber 55 is shown. Shown respectively. The temperature detector 18 may be an inexpensive one such as a thermocouple or thermistor, and the humidity detector 1
A capacitance type humidity sensor may be used as 9, and at least one each may be provided, but two or more each may be provided to increase reliability. Further, the temperature detector 18 and the humidity detector 19 may be combined to form one detector.

Further, in the case structure of the present invention shown in FIGS. 26 to 29, the surrounding walls forming the case 1 are the doors 8, the ceiling plate 9 and the bottom plate which can be opened and closed as in the case of FIG. 1
0, the rear side plate 11 and the lining material 12 and the like, and the lining material 12 is either a heat insulating material or a soundproof material,
Or both are attached. Here, the lining material 12
Is better to be composed of a material having both the performances of the heat insulating material and the soundproofing material than the material having both performances, and urethane foam, glass wool, etc. are generally used. It should be noted that in the cooling casing 1 that requires further heat insulation, vacuum heat insulation may be used.

Further, when heat insulation and soundproofing of the casing 1 are not so necessary, the wall constitution of the casing 1 is such that each plate 8, 9, 1
It is possible to use only 0 and 11 without the lining material 12, and to use the housing 1
The walls may be mixed with a place where only the plate materials (8, 9, 10, 11) are provided and a place where the lining material 12 is attached to each plate material.
Further, the openable / closable door 8 may be provided not only on the front surface of the housing wall but also on other surfaces. Further, the openable / closable door 8 may be provided on a plurality of surfaces forming the wall of the housing. Further, when the heat generation density (heat generation amount per unit volume and unit area) of the heat generating components such as the electronic component 3 and the magnetic disk drive 51 is large, the surface of the heat generating component exposed to the cooling air 6 serves as a surface area enlarging means for radiating fins. May be provided.

In the case structure of the present invention shown in FIGS. 26 to 29, the heat generating part may be an electronic part mounted on a printed circuit board, and the cooling case may be a case of an electronic computer. However, if the heat generating component is a magnetic disk drive or the like,
The cooling case may be the case of the magnetic disk device,
Furthermore, the heat-generating component may be an electronic component, a magnetic disk drive, or the like, and the cooling casing may be the casing of the server machine, or may be used as the casing of another electronic device. Furthermore, the housing structure of the present invention includes a power supply device, an amplifier, a circuit breaker,
It can also be used for temperature and humidity control of various products with heat-generating components such as resistors, transformers and electromagnetic relays.

Next, another embodiment of the present invention will be described with reference to FIG. FIG. 30 is a side cross-sectional view showing the casing structure of the present invention, and shows the casing 1 of the server machine as an example. The housing 1 accommodates an electronic component 3, which is a heat-generating component, a magnetic disk drive 51, and the like. The cooler 5 is divided into two to form coolers 5a and 5b, which are installed in parallel in the flow direction of the cooling air 6, and the temperature level of the refrigerant flowing in each cooler 5 can be changed. It is like this. Here, the cooling device 5 may be divided into three or more.

The effects of this embodiment are as described with reference to FIGS. 18 and 19, and are effective in controlling the temperature and humidity during dehumidification. The cooling air 6 is separated, the temperature level of the refrigerant flowing in the cooler 5a is lowered to increase the dehumidification amount of the cooling air 6, and the temperature level of the refrigerant flowing in the cooler 5b is raised slightly to reduce the cooling air 6 By controlling the temperature to some extent and mixing the cooling air 6 having different temperatures and humidity, the cooling air 6 having the set temperature and the set humidity is obtained.

As the refrigerant having a slightly high temperature level flowing in the cooler 5b, the refrigerant on the outlet side of the condenser 21 of the refrigeration cycle may be used, and the high temperature, high pressure refrigerant on the outlet side of the condenser 21 may be used as it is. However, it is also possible to lower the pressure level of the high temperature / high pressure refrigerant at the outlet of the condenser 21 to the intermediate pressure by the first expansion mechanism 23a and use the medium temperature / medium pressure refrigerant. As the low temperature level refrigerant flowing through the cooler 5a, a low temperature / low pressure refrigerant whose pressure level is further lowered by the second expansion mechanism 23b different from the first expansion mechanism 23 may be used. These first expansion mechanism 23a and second expansion mechanism 23
b may be connected in series in the order of the first expansion mechanism 23a, the cooler 5b, the second expansion mechanism 23b, and the cooler 5a. Here, the sizes of the coolers 5a and 5b do not have to be the same, and for example, the cooler 5 on the dehumidifying side may be used.
A may be larger, and the two coolers 5a and 5b for dividing may be provided in series as shown in FIGS. 16 and 17.

As described above, in the case of the present invention, the cooler 5 which is a cooling and dehumidifying means is divided into a plurality of parts, which are used together with the humidifying means by the absorbent / moisture releasing material 15 of the present invention. The temperature and humidity of the cooling air 6 of the casing structure and the cooling unit of the invention can be controlled relatively easily, efficiently, and delicately. Due to the high humidity of the cooling air 6, dew condensation and low humidity are achieved. It is possible to suppress static electricity and prevent occurrence of failures in electronic devices and the like.

In the electronic device, the case structure and the cooling unit thereof according to the present invention described in the above embodiments, even if the temperature of the cooling air 6 in the case 1 is lower than the temperature of the ambient air of the case 1. Good. Here, the cooling air 6 for lowering the temperature
Is the cooling air 6 generated by the cooler 5, and corresponds substantially to the cooling air 6 immediately before the inflow side of the printed circuit board 2. For example, the temperature of the cooling air 6 is 0 ° C to 15 ° C.
You may control to a low temperature range of about. To lower the temperature,
It suffices if the temperature of the refrigerant flowing through the cooler 5 is lowered.
The evaporation pressure of the (evaporator) 5 may be lowered. In this method,
In order to prevent dew condensation, etc., it is necessary to pay attention to the humidity control of the cooling air 6 in the cooling casing 1 for lowering the temperature.
This is effective when the total amount of heat generated by the heat-generating components therein is large and the temperature level of the heat-generating components must be kept low.

Particularly, in the case of an IC chip or the like, since the junction temperature is about 80 ° C. to 90 ° C., it can be applied when it is necessary to achieve the allowable temperature. In the electronic device, the housing structure, and the cooling unit thereof, the refrigeration cycle is a heat pump cycle capable of switching between cooling and heating, and a cooler provided in the housing 1 or the like.
The (evaporator) may be switched to a heater (condenser) for use. For example, when the electronic device is stopped after the operation, the heat pump cycle may be switched, a heater (condenser) may be provided in the casing 1, and the drain 35 accumulated in the drain pan 30 may be evaporated by the heater.

[0115]

In the electronic device and the housing structure and the cooling unit thereof according to the present invention, in addition to the cooling means and the dehumidifying means, the cooling housing is provided with the humidifying means for the cooling air. By using a detector,
It is possible to control both the temperature and humidity of the cooling air that cools the heat-generating components in the cooling housing, and it is also possible to finely control the temperature and humidity within a desired range, which can cause failures in electronic devices, etc. It is possible to prevent both dew condensation at high humidity and static electricity at low humidity of electronic parts. In addition, the humidifying means of the present invention forms a part of the cooling housing wall by the moisture absorbing / releasing material having a function of absorbing and releasing moisture depending on the humidity to obtain moisture from ambient air. Since there is no need for auxiliary equipment such as a water supply pipe, a makeup water tank, and a humidifier, there is a great effect that it is possible to suppress an increase in the size and weight of the cooling housing.

[Brief description of drawings]

FIG. 1 is a side sectional view of an electronic device housing showing an embodiment of the present invention.

FIG. 2 is a perspective view of the electronic device housing of FIG.

FIG. 3 is a moist air diagram shown for explaining the effect of the present invention.

FIG. 4 is a side sectional view of an electronic device housing showing another embodiment of the present invention.

FIG. 5 is a side sectional view of an electronic device housing separated into an indoor and an outdoor, according to another embodiment of the present invention.

FIG. 6 is a side cross-sectional view of an electronic device casing according to another embodiment of the present invention, in which the casing is divided into two.

FIG. 7 is a side cross-sectional view of an electronic device housing in which a cooler is obliquely installed according to another embodiment of the present invention.

FIG. 8 is a side sectional view of an electronic device housing in which a cooler is installed below a blower according to another embodiment of the present invention.

FIG. 9 is a side view of a fin tube type heat exchanger used in an embodiment of the present invention.

FIG. 10 is a side sectional view of an electronic device housing having a drain pan according to another embodiment of the present invention.

FIG. 11 is a perspective view of a drain pan used in an embodiment of the present invention.

FIG. 12 is a perspective view of an electronic device housing having a door according to another embodiment of the present invention.

FIG. 13 is a partial perspective view of an electronic device housing having a door provided for each printed circuit board according to another embodiment of the present invention.

FIG. 14 is a side sectional view of an electronic device housing having a downward air curtain according to another embodiment of the present invention.

FIG. 15 is a side sectional view of an electronic device casing having an upward air curtain according to another embodiment of the present invention.

FIG. 16 is a side cross-sectional view of an electronic device housing having a cooler divided into two in the flow direction according to another embodiment of the present invention.

FIG. 17 is a side cross-sectional view of an electronic device housing in which a cooler divided into two parts is separated according to another embodiment of the present invention.

FIG. 18 is a side sectional view of an electronic device casing having a cooler that is divided into two in parallel according to another embodiment of the present invention.

FIG. 19 is a partial cross-sectional view showing the effect of the cooler divided into two in parallel in another embodiment of the present invention.

FIG. 20 is a side sectional view of an electronic device casing having a heating unit according to another embodiment of the present invention.

FIG. 21 is a side sectional view of an electronic device casing having a second cooling channel according to another embodiment of the present invention.

FIG. 22 is a partial side sectional view of an electronic device casing having a ventilation path according to another embodiment of the present invention.

FIG. 23 is a partial side sectional view of an electronic device casing having a reflector according to another embodiment of the present invention.

FIG. 24 is a partial cross-sectional side view of an electronic device casing having a propagation path according to another embodiment of the present invention.

FIG. 25 is a partial side sectional view of an electronic device housing having another example of a propagation path according to another embodiment of the present invention.

FIG. 26 is a side sectional view of a magnetic disk device housing structure according to another embodiment of the present invention.

FIG. 27 is a side sectional view of a casing structure having a cooling unit on an upper portion according to another embodiment of the present invention.

FIG. 28 is a side sectional view of a casing structure having a cooling unit on a side surface according to another embodiment of the present invention.

FIG. 29 is a side cross-sectional view of a housing structure having a cooling unit that also serves as a door, according to another embodiment of the present invention.

FIG. 30 is a side cross-sectional view of a server machine housing having a cooler that is divided into two in parallel in another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic device housing 2 Printed circuit board 3 Electronic component 4 Blower 5 Cooler 6 Cooling air 7 Partition plate 8 Door 9 Ceiling plate 10 Bottom plate 11 Rear side plate 12 Lining material 13 Frame 14 Caster 15 Moisture absorbing material 16 Irregular door 17 Moisture transfer direction 18 Temperature detector 19 Humidity detector 20 Indoor 21 Condenser 22 Compressor 23 Expansion mechanism 24 Refrigerant piping 25 Condenser fan 26 Outdoor unit 27 Room constituent wall 28 First casing 29 Second casing 30 Drain pan 31 Fin 32 Yen Pipe 33 Drain guide 34 External drain pan 35 Drain 36 Communication hole 37 High temperature / high pressure side pipe 38 Space 39 Air separation plate 40 Component temperature detector 41 Component heating means 42 Second cooling flow passage 43 Fan 44 Ventilation passage 45 Reflector 46 46 Propagation passage 47 sound absorbing material 48 reference sensor 49 speaker 50 controller Roller 51 and magnetic disk drive 52 the drive power supply 53 cooling unit 54 and the radiation chamber 55 absorbs heat chamber 56 inlet 57 outlet

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadakatsu Nakajima 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd. Mechanical Research Laboratory (72) Inventor Noriyuki Ashibu 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Co., Ltd. Machinery Research Laboratory (72) Inventor Takayuki Shin 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd. (72) Inventor Toshio Hatada 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd.

Claims (57)

[Claims] 1. A moisture absorbing / releasing material that absorbs or releases moisture depending on humidity, at least a part of a wall constituting a housing for housing an electronic component. The humidity in the housing is controlled by releasing moisture absorbed from the high humidity side air to the low humidity side air by the electronic device. 2. In an electronic device configured to store an electronic component that generates heat in a housing and cool the electronic component by air cooling, at least a part of a wall that configures the housing is responsive to humidity. Absorption that absorbs and releases water
It is composed of a moisture releasing material, and the humidity of the cooling air in the housing is controlled by releasing moisture absorbed from the high humidity side air by the moisture absorbing / releasing material to the low humidity side air. And electronic device. 3. An electronic device, comprising: an electronic component that generates heat, a blower, and a cooler that supplies cooling air in a housing, wherein the electronic component is forcedly cooled by the cooling air. Moisture absorbed from the air on the high humidity side by at least a part of the wall forming the housing is made of a moisture absorbing / releasing material that absorbs or releases moisture depending on the humidity. Is discharged to the air on the low humidity side, whereby the humidity of the cooling air in the housing is controlled. 4. The electronic device according to claim 1, wherein at least one of a heat insulating material and a sound insulating material is provided on all or part of a wall forming the housing. apparatus. 5. A detector for detecting the temperature and the humidity of the cooling air is provided in the housing, and the temperature and the relative humidity of the cooling air immediately before the inflow side to the electronic parts are 16 ° C. to 32 ° C. and 20%. 5. The electronic device according to claim 1, wherein the electronic device is controlled to 80% to 80%. 6. A detector for detecting the temperature and the humidity of the cooling air is provided in the housing, and the temperature and the relative humidity of the cooling air immediately before the inflow side to the electronic parts are 16 ° C. to 22 ° C. and 55%. 5. The electronic device according to claim 1, wherein the electronic device is controlled to 75% to 75%. 7. A wall portion of the wall of the housing, which is made of an absorbent / moisture releasing material that absorbs or releases moisture depending on humidity, is cooled by a cooler in a low humidity environment such as winter. 7. The electronic device according to claim 1, wherein the electronic device is provided on an upstream side which is a high temperature / low humidity air side in a flow direction of air. 8. A wall portion of the wall of the housing, which is made of an absorbent / moisture-releasing material that absorbs and releases water depending on humidity, is provided with a high-humidity environment such as in the summer or the rainy season. 7. The electronic device according to claim 1, wherein the electronic device is provided on a downstream side which is a low temperature / high humidity air side in a cooling air flow direction of the cooler. 9. The condenser of the refrigeration cycle, wherein the casing is installed indoors, and the cooler for supplying cooling air is an evaporator of a refrigeration cycle including a compressor, a condenser, an evaporator, an expansion mechanism, and the like. 9. The electronic device according to claim 1, wherein the container is installed outdoors. 10. The casing is divided into two and is composed of a first casing and a second casing, and a cooler for supplying cooling air includes a compressor, a condenser, an evaporator and a cooler. An evaporator of a refrigeration cycle configured by an expansion mechanism and the like, wherein the evaporator is provided in a first housing in which electronic components are stored, and the condenser is provided in a second housing. The electronic device according to any one of claims 1 to 8. 11. The cooling air supplied to the cooler in the housing is blown from the upper side to the lower side in the front and rear of the cooler section. Electronic device. 12. The drain pan for collecting condensed water (drain) produced by the cooler is provided below the cooler in the housing, and the drain pan collects the drain. The electronic device according to any one of 1 to 11. 13. The method according to claim 1, wherein at least a part of the drain generated by the cooler in the housing is led to the outside of the housing and a part of the high temperature / high pressure side pipe of the refrigeration cycle is brought into contact with the drain. 13. The electronic device according to any one of 12. 14. The door according to claim 1, wherein a plurality of openable and closable doors corresponding to one to one are provided for each of a large number of printed circuit boards contained in the housing. Electronic device as described. 15. The door according to claim 1, further comprising an openable and closable door corresponding to a plurality of printed boards contained in the housing. Electronic device. 16. The openable and closable door for accommodating a large number of printed circuit boards in the housing is provided centrally on one wall surface of the housing.
5. The electronic device according to any one of 5. 17. The air curtain means for flowing air substantially in parallel along the door surface is provided in a space near the inside of the openable / closable door of the housing.
17. The electronic device according to any one of 1 to 16. 18. The air flowing along the inner surface of the openable / closable door of the housing by the air curtain means is a part of the cooling air. Electronic device. 19. The temperature detector and the heating means are provided on at least one of a printed circuit board and an electronic component housed in the housing, and the temperature detector and the heating means are provided. Electronic device. 20. A temperature detector and a heating unit are provided on at least one of a printed circuit board and an electronic component housed in the housing, and the heating unit is provided for the electronic component mounted on the printed circuit board. 20. The electronic device according to claim 1, wherein at least one of energization and / or energization of a heater provided on the printed circuit board. 21. Powering on electronic components in the housing,
Immediately before starting the refrigeration cycle, the temperature of the electronic component and the temperature and humidity of the cooling air are detected. If the temperature of the electronic component is lower than the dew point temperature of the cooling air, the temperature of the printed circuit board and the electronic component is set to the value of the cooling air. 21. The electronic device according to claim 1, wherein the electronic device is controlled so that the electronic component is powered on and a refrigerating cycle is started after the temperature is raised by the heating means to the dew point temperature or higher. . 22. Powering on the electronic components in the housing,
And, immediately before the start of the refrigeration cycle, the temperature of the electronic component and the temperature and humidity of the cooling air are detected, and when the temperature of the electronic component is higher than the dew point temperature of the cooling air, the power is turned on to the electronic component and the refrigeration cycle as it is. 22. The electronic device according to claim 1, wherein the electronic device is controlled to perform a start-up operation. 23. Control is performed such that power is turned on to the electronic components in the housing and operation of the cooling fan is first performed, and then the refrigeration cycle is started up after the temperature of the electronic components approaches the allowable temperature. Claim 1 characterized by the above.
23. The electronic device according to any one of 22 to 22. 24. The cooler in the casing is divided into two or more and arranged in series in the flow direction of the cooling air, and the temperature level of the refrigerant flowing in each cooler is changed to at least two. 24. Electronic device according to any one of the preceding claims, characterized in that 25. The cooling device in the housing is divided into two or more parts and arranged in parallel in the flow direction of the cooling air, and the temperature level of the refrigerant flowing in each cooling device is changed to at least two. 24. Electronic device according to any one of the preceding claims, characterized in that 26. A second cooling flow path which does not pass through the printed circuit board and is different from the first cooling flow path of the cooling air for cooling the printed circuit board on which the electronic parts in the housing are mounted is formed. The electronic device according to any one of claims 1 to 25, wherein at least a part of a cooler is provided in the second cooling flow path. 27. Among the housing walls, at least one of the inside and the outside of a wall made of an absorbent / moisture releasing material that absorbs or releases moisture depending on humidity is covered with the wall. The electronic device according to any one of claims 1 to 26, further comprising: a ventilation passage configured as described above. 28. Absorption / release of water depending on the humidity with respect to the entire area of the wall forming the casing.
The electronic device according to any one of claims 1 to 26, wherein an area of the wall made of the moisture releasing material is set to be 1/10 or less. 29. An acoustic reflector is provided on the outside of a wall of the housing wall made of an absorbent / moisture releasing material that absorbs or releases moisture depending on humidity, and leaks from this wall. The electronic device according to any one of claims 1 to 26, characterized in that the propagation direction of noise can be arbitrarily changed. 30. Propagation of one or a plurality of divided sounds to the outside of the wall of the housing wall, which is made of an absorbent / moisture releasing material that absorbs or releases moisture depending on humidity. The electronic device according to any one of claims 1 to 26, wherein a passage is provided and a member having a sound absorbing function is attached to an inner surface of the propagation passage to reduce noise leaking from the wall. 31. Propagation of one or a plurality of divided sounds to the outside of the wall of the housing wall made of an absorbent / moisture releasing material that absorbs or releases moisture depending on humidity. A reference sensor for detecting noise in the propagation path, a speaker for canceling the noise, and a controller for generating a signal of the same amplitude and an opposite phase based on the signal obtained from the reference sensor. The electronic device according to any one of claims 1 to 26, further comprising: 32. The electronic device according to claim 1, wherein the temperature detector that detects the temperature inside the housing is at least one of a thermocouple and a thermistor. 33. The electronic device according to claim 1, wherein the humidity detector for detecting the humidity in the housing is a capacitance type humidity sensor. 34. A moisture absorbing / releasing material that absorbs or releases moisture in accordance with humidity, which constitutes a part of the housing wall,
The base material is a non-woven fabric.
3. The electronic device according to any one of 3. 35. An absorbent / moisture releasing material which absorbs or releases water in accordance with humidity, which constitutes a part of the housing wall,
The electronic device according to any one of claims 1 to 34, wherein one side of a cloth such as nylon or polyester is coated with a shape memory polymer, or a so-called moisture permeable material manufactured in a laminate is used. 36. A cooling device and a temperature controller, which cover at least a part of a surface of a cooling housing having a heat generating component therein with a wall and supply cooling air to the housing, are provided. A case structure for controlling, wherein the case is provided with a humidifying means. 37. The moisture absorbing / releasing material, wherein the humidifying means absorbs / releases moisture according to the humidity provided on at least a part of the wall forming the cooling housing. 37. The casing structure according to claim 36, wherein moisture absorbed from the high-humidity side air is released to the low-humidity side air by the wet material to control the humidity of the air in the casing. 38. The cooling casing is installed indoors, and the cooler is an evaporator of a refrigeration cycle including a compressor, a condenser, an evaporator, an expansion mechanism, etc., and the condenser is installed outdoors. 38 to 37, characterized in that it is provided.
The housing structure according to any one of the above. 39. The cooling housing is divided into two to form a first
And a second casing, where the cooler is a compressor,
An evaporator of a refrigeration cycle including a condenser, an evaporator, an expansion mechanism, etc., wherein the evaporator is provided in the same first housing as the heat-generating component, and the condenser is provided in the second housing. The casing structure according to any one of claims 36 to 37, characterized in that. 40. A cooling unit comprising a casing having a refrigeration cycle such as a compressor, a condenser, an evaporator and an expansion mechanism, wherein the casing is divided into two to provide a heat radiating chamber and a heat absorbing chamber, A condenser is provided in the heat dissipation chamber, an evaporator is provided as a cooler in the heat absorption chamber, at least two openings through which cooling air flows in and out are provided in the heat absorption chamber, and the heat absorption chamber is provided with a humidifying means. A cooling unit. 41. The moisturizing means is an absorbent / moisture releasing material which absorbs or releases water in accordance with humidity provided on at least a part of a wall forming the heat absorbing chamber,
The cooling unit according to claim 40, wherein the moisture releasing material releases moisture absorbed from the high humidity side air to the low humidity side air to control the humidity of the cooling air in the heat absorbing chamber. 42. The cooling unit according to any one of claims 40 to 41 is attached to a cooling housing having a heat generating component therein and having at least two openings, and the cooling housing has an opening. A case structure characterized in that openings of the cooling unit are connected to each other so that cooling air can communicate between the heat absorption chamber of the cooling unit and the cooling case. 43. A temperature detector and a humidity detector are provided in at least one of the heat absorption chamber of the cooling unit and the cooling housing, and the temperature and the humidity of the cooling air are controlled. The casing structure according to claim 42. 44. The casing structure according to claim 42, wherein the cooling unit is attached to an upper portion of the cooling casing. 45. The cooling unit is attached to a side surface portion of the cooling housing.
The housing structure according to any one of the above. 46. The casing structure according to claim 42, wherein the cooling unit also serves as an openable / closable door attached to the cooling casing. 47. At least one of a heat insulating material and a sound insulating material such as a sound absorbing material or a sound insulating material is provided on the entire surface or a part of the wall forming the cooling housing. The casing structure according to any one of claims 36 to 39 and 42 to 46. 48. The casing according to claim 36, further comprising an openable / closable door provided on at least one surface of a wall forming the cooling casing. Construction. 49. Two coolers for cooling the inside of the cooling housing
The casing structure according to any one of claims 36 to 39 and 42 to 48, characterized in that the temperature level of the refrigerant flowing in each cooler is changed to at least two. . 50. The temperature of the cooling air immediately before the inflow side to the heat generating component in the cooling housing is set lower than the temperature of the ambient air of the housing.
50. The housing structure according to any one of 49 to 49. 51. The temperature detector for detecting the temperature in the cooling housing is at least one of a thermocouple and a thermistor, and
The housing structure according to any one of 42 to 50. 52. The casing according to claim 36, wherein the humidity detector for detecting the humidity in the cooling casing is a capacitance type humidity sensor. Construction. 53. The refrigeration cycle for cooling the cooling casing is a heat pump cycle capable of switching between cooling and heating.
The casing structure according to any one of 42 to 52. 54. One of the heat-generating components in the cooling enclosure,
The housing structure according to any one of claims 36 to 39 and 42 to 53, which is an electronic component or a semiconductor component mounted on a printed circuit board, wherein the housing is a housing of an electronic computer. 55. One of the heat-generating components in the cooling enclosure,
54. A housing structure according to claim 36, which is a magnetic disk drive, wherein the housing is a housing of a magnetic disk device. 56. At least two of the heat-generating components in the cooling casing are an electronic component mounted on a printed circuit board and a magnetic disk drive, and the casing is a casing of a server machine. Item 54. The housing structure according to any one of Items 36 to 39 and 42 to 53. 57. The cooling casing is a casing for an electronic device or an electronic device.
The housing structure according to any one of 9, 42 to 53.