KR101635448B1 - A server rack - Google Patents

A server rack Download PDF

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Publication number
KR101635448B1
KR101635448B1 KR1020160013982A KR20160013982A KR101635448B1 KR 101635448 B1 KR101635448 B1 KR 101635448B1 KR 1020160013982 A KR1020160013982 A KR 1020160013982A KR 20160013982 A KR20160013982 A KR 20160013982A KR 101635448 B1 KR101635448 B1 KR 101635448B1
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KR
South Korea
Prior art keywords
air
discharge
cooling
server rack
outside
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KR1020160013982A
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Korean (ko)
Inventor
김강연
Original Assignee
(주) 아스카넷
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Priority to KR1020160013982A priority Critical patent/KR101635448B1/en
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Publication of KR101635448B1 publication Critical patent/KR101635448B1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754Air circulating in closed loop within cabinets

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to an air conditioner for an air conditioner, which is capable of performing an independent cooling function by securing an independent area where air circulation is restricted in an entire space provided by interrupting air flow inside and outside.
And a cooling means for supplying air cooled to the inside of the body, the server rack comprising: a main body having a plurality of fixing means for stacking and arranging the computer equipment in layers; The body is provided with a shielding film for blocking the flow of air from the outside to the outside of the computer equipment fixed to the fixing means; The barrier film is formed of an air film formed on the boundary line between the inside and the outside of the body through air pressure discharged from one side to the other side.

Description

A server rack

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a server rack provided with cooling means for smoothly driving a computer apparatus mounted therein, and more particularly to a server rack in which air circulation inside and outside is blocked, And a server rack capable of performing an independent cooling function by securing an independent area.

In general, a server rack refers to a case for mounting a network equipment including a server, a computer equipment, and the like. In the inside, a plurality of server racks Is provided.

These server racks can cause fatal outages such as system shutdown and failure if the heat load released from the computer equipment housed in the server rack is not removed.

Accordingly, it is preferable that the server rack is provided with cooling means for cooling the computer equipment installed therein.

That is, the server rack is provided with cooling means for cooling the heat radiated from the inside to enable the computer devices to be driven smoothly. The cooling means typically constitutes a separate computer room in which a plurality of server racks are installed, The cooling air supplied through the air conditioning unit is supplied to the inside of the indoor unit to remove the heat load.

Such a server rack typically has a 'barrel-shaped' body having an open inlet and having the fixing means therein, an open / close door for opening and closing the inlet of the body, and air cooled to the inside of the body And a discharging means for discharging the waste heat exchanged in the inside of the body.

Accordingly, the cooling air is supplied to each server rack in the computer room in which the plurality of server racks are installed, so that the heat released from each server rack is shared with other server racks.

Therefore, when the heat load generated in one server rack is larger than the heat load generated in the other server rack, there is a problem that the cooling function is not properly performed, and the entire power consumption can not be efficiently reduced. to be.

In Korean Patent Registration No. 10-0997045 (name: server rack), as known in the art, a frame capable of housing information processing apparatuses and servers in a stacked state is built therein, and a door is opened A rack box having a cable inlet formed at its rear side; A cooling chamber part coupled to the side of the rack and provided with an evaporator to suck and cool the rack inside air; A water storage chamber part coupled to the lower part of the rack and the cooling chamber part for condensing water generated in the evaporator of the cooling chamber part to fall down and to be stored and to bring the cooled air of the cooling chamber part into contact with the condensate water and blow into the rack; A control chamber part coupled to the bottom of the rack box and having a refrigerant compressor for circulating, condensing, and supplying the refrigerant to a condenser for condensing the evaporator of the cooling chamber part and the high temperature and high pressure refrigerant; And a condenser chamber part in which a condenser for radiating and condensing the refrigerant is installed.

In addition, in Korean Patent Registration No. 10-1533007 (name: a cooling apparatus for a server rack), as known in the art, a server rack in which computer equipment is installed in multiple stages by a plurality of horizontal shelves; A case disposed inside the server rack and having a hole formed therein; An evaporator, a compressor, a condenser and an expansion valve disposed inside the case to generate cold air; A blow fan disposed inside the case and including a discharge guide pipe for providing the cool air to the computer equipment; And a blowing fan which is coupled to the discharge guide pipe and is lifted and lowered through the hole by the internal air pressure by the cool air provided by the blowing fan and is positioned at the same position as the multi- And a discharge member including discharge pipes each formed with a discharge port, wherein the discharge pipes are disposed inside the case when the discharge pipes are lowered.

In addition, as disclosed in Korean Patent Publication No. 10-2015-0123063 (name: server rack), a server is mounted and includes a sensor capable of measuring the internal temperature and humidity, An air inlet formed at one side of the outer surface of the rack for introducing outside air into the server rack; An air outlet formed at an outer surface of the server rack for discharging the air inside the server rack to the outside; And a controller connected to the sensor and controlling the operation of the air inlet and the air outlet according to a measured value of the sensor, wherein the air inlet includes an inlet port for introducing outside air into the server rack An inlet fan; A flow path connected to the inflow fan and extending into the server rack, the inflow air flowing through the inflow fan moving; And a discharge port that protrudes in a vertical direction of the flow path and extends to a central portion of the server rack and discharges air in the flow path.

On the other hand, in Korean Patent Registration No. 10-1468873 (titled "thermostat of server rack"), as is known in the art, a thermo-hygrostat module for keeping the inside of a rack in which a computer is mounted at a constant temperature and humidity; An internal air circulation duct composed of a suction fan for sucking the air inside the rack box from the discharge duct and blowing air to the evaporator, an evaporator for cooling the sucked internal air, and a heater for heating the internal air; An external air circulation duct composed of a compressor for supplying and circulating refrigerant to the evaporator, a condenser and a cooling fan for dissipating the condensation heat of the evaporator, an inlet for introducing outside air for condensation heat radiation and a discharge duct for discharging heat radiation air of the condenser In the thermostatic apparatus of the server rack, a discharge duct is installed in one of the discharge ports of the rack, and the discharge duct is coupled to one suction port of the suction fan of the internal air circulation duct to discharge the internal air of the rack port to the internal air circulation duct And a blowing chamber communicating with a discharge duct installed inside the rack air duct is interposed between the rack and the air circulation duct.

1, Korean Patent Registration No. 10-0997045 2, Korean Patent Registration No. 10-1533007 3, Korean Patent Publication No. 10-2015-0123063 4, Korean Patent Registration No. 10-1468873

However, in the conventional server racks described above, air is not cut off to the outside, and the cooling function is deteriorated due to the heat of the outside air.

That is, there has been a problem in that, under the cooling condition of the cooling means set inside the server rack, the cooling is not properly implemented due to the inflow of heat emitted from the other server rack.

In particular, when server racks of high performance computing (HPC) environments such as high-performance computers and general server racks are disposed in the same space (computer room), the heat released from the server rack for HPC flows into the general server rack, There was a falling problem.

On the other hand, when a server rack of a high performance computing (HPC) environment such as a high-performance computer and a general server rack are disposed in the same space (computer room), a cooling system for cooling the server rack in accordance with the cooling conditions of the server rack So that excessive power consumption can not be efficiently performed because an excessive cooling condition is given to a general server rack, resulting in an uneconomical problem.

The present invention has been made in order to solve the above-mentioned problems of the related art, and it is an object of the present invention to provide an air conditioner for an indoor air conditioner, And more particularly, to provide a server rack capable of efficiently cooling a server rack of a high performance computing (HPC) environment.

According to an aspect of the present invention, there is provided a server rack comprising: a main body having a plurality of fixing means for stacking and arranging computerized devices in layers; And cooling means for supplying air cooled by the cooling means to the server rack. The body is provided with a shielding film for blocking the flow of air from the outside to the outside of the computer equipment fixed to the fixing means; The barrier membrane is composed of an air membrane formed on the boundary line between the inside and the outside of the body through air pressure discharged from one side to the other side.

The shielding film is disposed on the body and discharges the cooling air supplied through the air conditioning unit to cool the outside air by exchanging heat with the outside air.

The body is provided with a discharge member having a discharge hole for discharging the cooling air supplied from the air conditioning unit.

The discharge member is disposed on a boundary line between the inside and the outside of the body, and is arranged to discharge the cooling air from the upper part to the lower part.

The discharge member is provided on a boundary line between the inside and the outside of the body, and has a plurality of discharge holes which are spaced from each other and discharge the cooling air from one side to the other side.

And the plurality of discharge holes are configured to discharge the cooling air while having an angle crossing each other on the front surface.

And the plurality of discharge holes are configured to discharge the cooling air while having an angle intersecting at a right angle on the front face.

And the plurality of discharge holes are configured to discharge the cooling air in a direction facing each other on the front surface.

In the server rack according to the present invention as described above, the air circulation on the boundary line between the inside and the outside of the body is blocked by the shielding film, so that an independent region in which the circulation of air is restricted in the entire space provided with the computer equipment installed in the body Thereby achieving an independent cooling function.

Accordingly, independent cooling is performed in accordance with the independent cooling conditions to increase the cooling efficiency, and in particular, cooling of the server rack of the HPC (high performance computing) environment can be efficiently performed.

In addition, a system capable of cooling the HPC server rack and the general server rack by setting the cooling conditions for each server rack and general server rack in the same space (computer room) in a high performance computing (HPC) environment So that the power consumption can be efficiently made and the economical benefit can be obtained.

1 is a schematic perspective view showing a server rack according to an embodiment of the present invention;
Fig. 2 is a schematic frontal view showing a server rack according to the embodiment. Fig.
3 is a schematic side cross-sectional view showing a server rack according to the embodiment.
Fig. 4 is a schematic frontal view showing the use state of the server rack according to the embodiment; Fig.
FIG. 5 is a schematic side cross-sectional view illustrating the use state of the server rack according to the embodiment. FIG.
6 and 7 are schematic side cross-sectional views showing other examples of the cooling means applied to the server rack according to the present embodiment.
8 is a schematic side cross-sectional view showing a server rack according to another embodiment of the present invention.
9 is a schematic perspective view showing a server rack according to another embodiment of the present invention.
Fig. 10 and Fig. 11 are schematic views showing the use state of the server rack according to this embodiment. Fig.
12 is a schematic side cross-sectional view showing a server rack according to another embodiment of the present invention.
13 is a schematic perspective view showing a server rack according to another embodiment of the present invention.
Fig. 14 and Fig. 15 are schematic views showing the use state of the server rack according to this embodiment. Fig.

Hereinafter, a server rack according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This embodiment is provided to more fully describe the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

1 to 5 are diagrams showing a server rack according to an embodiment of the present invention. In the server rack 1 according to the present embodiment, the computer devices 2 are stacked in layers, Shaped body 4 provided with a plurality of fixing means 3 and a cooling means for supplying air cooled to the inside of the body 4. [

That is, inside the body 4, the heat load discharged from the computerized equipment 2 housed therein is cooled and removed through the cooling means, thereby preventing damage to the computer equipment 2 such as system stoppage and malfunction .

Accordingly, the present invention is applied to cooling the heat emitted from the inside of the body 4 so that the computer devices 2 are smoothly driven.

The body 4 is formed with an inner space in which the computer devices 2 are disposed and an opening for spatially connecting the outer space. The opening and closing door 41 is coupled to the opening, And the opening of the body 4 may be opened or closed.

The cooling means has a supply duct 5 for supplying cooling air supplied from an air conditioning unit (not shown) to the inside of the body 4, As shown in FIG. 6, the body 4 may be arranged on the rear surface of the body 4 to discharge the cooling air toward the side of the computer 2, And may be configured to discharge the cooling air in the direction from the bottom to the side of the computer 2, and it is most preferable to apply the cooling air according to the user's selection.

It is preferable that the body 4 is provided with an exhaust duct 42 for discharging air having a high temperature from inside to the outside and the exhaust duct 42 is provided in the body 4, It is most preferable to be located on the ceiling of the building.

The air conditioning unit configured to supply the cooling air to the supply duct 5 of the cooling means includes an air circulation duct for supplying air to the supply duct 5 from the outside and an air circulation duct disposed on the air circulation duct And a condenser for dissipating the heat of condensation of the evaporator, is preferably applied to the air conditioner of the present invention, and the air conditioner And a detailed description thereof will be omitted.

In the server rack 1 according to the present embodiment, the body 4 is provided with a shielding film D for blocking the flow of air from the outside to the outside of the computer 2 fixed to the fixing means 93, Respectively.

That is, the air flow is blocked on the boundary line between the inside and the outside of the body 4 by the shielding film D so that the air is prevented from flowing in the entire space provided with the computer equipment 2 installed on the body 4, And an independent cooling function is performed.

Accordingly, independent cooling conditions for the server rack 1 according to the present embodiment can be operated, and independent cooling is performed, thereby increasing the cooling efficiency.

Accordingly, the cooling of the server rack of the high performance computing (HPC) environment can be efficiently performed.

In addition, when a server rack and a general server rack in a high performance computing (HPC) environment are arranged in the same space (computer room), a cooling system for cooling the server rack and the general server rack As a result, the overall power consumption can be efficiently made and economic benefits can be obtained.

In the server rack 1 according to the present embodiment as described above, the above-mentioned shielding film D is formed by air pressure formed on the boundary line between the inside and the outside of the body 4 through air pressure discharged from one side to the other side Lt; / RTI >

That is, heat exchange between the inside and the outside of the body 4 is blocked by the air pressure, so that the heat shielding efficiency is high, and the cooling efficiency is improved.

In this case, it is preferable that the shielding film D is formed on the body 4 and is configured to discharge the cooling air supplied through the air conditioning unit configured to perform heat exchange of the outside air.

That is, it is most preferable that the shielding film D is formed on the body 4 through a discharge member 6 provided with a discharge hole for discharging the cooling air supplied from the air conditioning unit.

The discharge member 6 is disposed on the boundary line between the inside and the outside of the body 4 and discharges the cooling air supplied through the air conditioning unit from one side to the other side, The blocking film D is formed.

In the server rack 1 according to the present embodiment as described above, the discharging member 6 is located inside the upper portion at the inlet of the body 4, as shown in Fig. 1, As shown in FIG. 9, may be disposed on one side of the inlet of the body 4 and may be arranged to discharge the air pressure in the horizontal direction with respect to the floor, and as shown in FIG. 13 It is most preferable to apply it according to the user's choice as it can be arranged to be located inside the bottom surface at the entrance of the body 4 and to discharge the air pressure from the bottom to the top as shown in FIG.

On the other hand, when the discharge member 6 is disposed on the boundary line between the inside and the outside of the body 4, the discharge member 6 is provided with a plurality of discharges In this case, at the entrance of the body 4, a plurality of shielding films D are formed with an interval therebetween to further strengthen the spatial division of the outside and the inside.

As a result, the heat exchange between the outside and the inside is further blocked, thereby maximizing the cooling efficiency for the computer equipment.

10 and 14, it is preferable that the plurality of discharge holes are arranged to discharge the cooling air while having an angle intersecting with each other on the front face, and as shown in FIG. 10, The cooling air may be discharged while having an angle of intersection. As shown in FIG. 10, the cooling air may be discharged in a direction facing each other on the front surface, and it is most preferable to apply the cooling air according to the user's choice Do.

13 and 14, the discharge member 6 is provided with a discharge hole of the discharge member 6 at one side of the inlet of the body 4, A first discharge hole (61) arranged to discharge air pressure to the first discharge hole (61); A second discharge hole (62) arranged to be spaced apart from the first discharge hole (61) in the inner direction of the body (4), and configured to discharge air pressure from the upper portion to the lower portion; And a third discharge hole (63) arranged to be spaced apart from the first discharge hole (61) in the outer direction of the body (4) and adapted to discharge the air pressure from the lower part to the upper part Do.

Accordingly, the inside and the outside of the body 4 are firmly separated into a plurality of layers through the first discharge hole 61, the second discharge hole 62, and the third discharge hole 63, No further.

In the server rack 1 according to the present embodiment, as described above, the discharge member 6 is disposed on the front and rear surfaces of the body 4, as shown in FIG. 8, So that heat can be externally and internally blocked by the body 4, respectively.

In this case, it is preferable that the supply duct 5 of the cooling means is disposed on the bottom surface of the body 4, and the air pressure is supplied from the bottom to the top of the body 4 to be cooled.

In the server rack 1 according to the present embodiment, the supply duct 5 of the cooling means is disposed on the boundary line between the inside and the outside of the body 4, and discharges the cooling air from the upper side to the lower side The body 4 may be provided with an induction member 7 for guiding the cooling air discharged from the supply duct 5 into the interior of the body 4. In this case,

The guide member 7 is preferably protruded from the body 4 while having a concave curved surface for guiding and guiding the air pressure discharged from the supply duct 5.

In this case, the cooling air discharged from the supply duct (5) can perform the function of the blocking film (D).

As described above, the server rack 1 according to the present embodiment is configured such that the airblock is applied to the shielding film D, which blocks the flow of air, on the boundary line between the inside and the outside of the body 4 in which the computer 2 is disposed. Which is a feature of the technical structure.

It will be apparent to those skilled in the art that various modifications and equivalent arrangements may be made therein without departing from the scope of the present invention as defined by the appended claims and their equivalents. . Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

1: Server rack 2: Computing equipment
3: fixing means 4: body
41: opening / closing door 42: exhaust duct
5: supply duct 6: discharge member
61: first discharge hole 62: second discharge hole
63: third discharge hole 7: guide member
D:

Claims (8)

Shaped body 4 provided with a plurality of fixing means 3 arranged inside the body 4 in such a manner that the computerized devices 2 are stacked and layered, (1) comprising a cooling means (1) for cooling the server rack (1);
In the body 4,
The air conditioning unit is disposed on the body (4), and is formed through an air pressure discharged from one side to the other side on a boundary line between the inside and the outside of the body (4) through an air conditioning unit, A shielding film (D) made of an air film which blocks the flow of air outside and inside the outside of the computer equipment (2);
(1), the cooling air being supplied from the one side to the other side of the body (4) so as to discharge the cooling air supplied through the air conditioning unit A discharge member 6 having a plurality of discharge holes arranged at an angle intersecting at right angles to discharge cooling air while having an angle intersecting with the front face so as to discharge the cooling air in a direction facing each other on the front face ;
The above-described discharge member (6)
A first discharge hole (61) located at one side of the discharge hole of the discharge member (6) at an inlet of the body (4) and arranged to discharge air pressure in a horizontal direction with respect to the bottom;
A second discharge hole (62) arranged to be spaced apart from the first discharge hole (61) in the inner direction of the body (4), and configured to discharge air pressure from the upper portion to the lower portion;
And a third discharge hole (63) spaced apart from the first discharge hole (61) in the outer direction of the body (4) and adapted to discharge air pressure from the lower part to the upper part;
Respectively, disposed on the front surface and the rear surface of the body 4, respectively;
The supply duct (5) of the cooling means
A body (4) disposed on a boundary line between the inside and the outside of the body (4) and arranged to discharge cooling air from an upper portion to a lower portion;
In the body 4,
And an induction member (7) projecting from the body (4) and having a concave curved surface to guide the cooling air discharged from the supply duct (5) into the interior of the body (4) Rack.
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KR1020160013982A 2016-02-04 2016-02-04 A server rack KR101635448B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102155366B1 (en) * 2020-06-22 2020-09-11 노브가든 주식회사 Consumer attraction system using link information-based affiliate marketing
KR102200539B1 (en) 2020-03-02 2021-01-11 주식회사 트루네트웍스 the improved server rack and the server rack arrangement structure using the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060056709A (en) * 2004-11-22 2006-05-25 삼성전자주식회사 Semiconductor manufacturing equipment with air curtain in door entrance
JP2008224455A (en) * 2007-03-13 2008-09-25 Stk Technology Co Ltd Chamber for test of semiconductor device
JP2009130272A (en) * 2007-11-27 2009-06-11 Nec Corp Exhaust air re-suction preventing apparatus for housing mounting rack, and layout method of housing mounting rack
KR100997045B1 (en) 2010-10-13 2010-11-29 에스피산업기술주식회사 Server rack
KR20120000224A (en) * 2010-06-25 2012-01-02 이성균 All in one subminiature data center
KR101468873B1 (en) 2014-08-07 2014-12-05 주식회사 씨엔씨알 Thermostatic device of the server rack
KR101533007B1 (en) 2013-12-11 2015-07-09 (주)한경아이넷 Air-conditioning equipment for server racks
KR20150123063A (en) 2014-04-24 2015-11-03 전진융복합협동조합 Server rack

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060056709A (en) * 2004-11-22 2006-05-25 삼성전자주식회사 Semiconductor manufacturing equipment with air curtain in door entrance
JP2008224455A (en) * 2007-03-13 2008-09-25 Stk Technology Co Ltd Chamber for test of semiconductor device
JP2009130272A (en) * 2007-11-27 2009-06-11 Nec Corp Exhaust air re-suction preventing apparatus for housing mounting rack, and layout method of housing mounting rack
KR20120000224A (en) * 2010-06-25 2012-01-02 이성균 All in one subminiature data center
KR100997045B1 (en) 2010-10-13 2010-11-29 에스피산업기술주식회사 Server rack
KR101533007B1 (en) 2013-12-11 2015-07-09 (주)한경아이넷 Air-conditioning equipment for server racks
KR20150123063A (en) 2014-04-24 2015-11-03 전진융복합협동조합 Server rack
KR101468873B1 (en) 2014-08-07 2014-12-05 주식회사 씨엔씨알 Thermostatic device of the server rack

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102200539B1 (en) 2020-03-02 2021-01-11 주식회사 트루네트웍스 the improved server rack and the server rack arrangement structure using the same
KR102155366B1 (en) * 2020-06-22 2020-09-11 노브가든 주식회사 Consumer attraction system using link information-based affiliate marketing

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