JPH0831584B2 - Solid-state imaging device and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device for a color video camera and a manufacturing method thereof .

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, a solid-state image pickup device used for a color video camera has been proposed.

In this solid-state image pickup device, a solid-state image pickup device 3 is fixed to a substantially central portion of a bottom of a ceramic case 2 having a glass plate 1 mounted in an upper opening, with its image pickup portion 3a directed toward the opening of the case 2. Then, the electrode 4 of the solid-state image pickup device 3 and the lead portion 5 are connected by the Au wire 6 and so-called wire bonding is performed, and the terminal 9 of the substrate 8 on which the peripheral drive circuit element 7 is mounted is connected by the lead wire 10. Is configured.

In the color video camera equipped with the solid-state image pickup device having the above-mentioned structure, the image of the subject is formed on the image pickup section 3a of the solid-state image pickup device 3 through the lens system to reproduce the image. The information signal necessary for the recording is obtained and recorded on a magnetic recording medium such as a video tape.

[0005]

However, in such a conventional solid-state image pickup device, since the solid-state image pickup device 3 and the case 2 are packaged, the solid-state image pickup device itself becomes large, and the color video camera is also used. There was an inconvenience that it became large.

The solid-state image pickup device 3 is packaged in a case 2, the case 2 is mounted on a color video camera, the peripheral drive circuit device 7 is arranged on a substrate 8, and the substrate 8 is mounted on a color video camera. Since the lead portion 5 of the case 2 and the terminal 9 of the substrate 8 are connected by the lead wire 10, there is a disadvantage that the number of manufacturing processes increases.

In view of the above problems, the present invention is directed to a solid-state image pickup device and a method of manufacturing the same which can downsize a video camera using the solid-state image pickup device and shorten the manufacturing process thereof.
The purpose is to provide the law .

[0008]

A solid-state image pickup device for a video camera according to the present invention has a wiring pattern formed by a metal foil on the surface.
A discrete type two-dimensional solid-state image pickup device having an image pickup section on one main surface and a peripheral drive circuit element of the solid-state image pickup device are arranged on the insulating support substrate on which the main surface is formed. An electrode formed in a region excluding the image pickup section and a wiring pattern formed on the substrate are connected by a conductive member, and the image pickup section of the solid-state image pickup element and the substrate are hollow, and The light incident surface of the substrate, on which the solid-state image sensor is arranged, facing the image pickup section of the solid-state image sensor, is a smooth surface.

[0009]

[0010]

According to the present invention, since the light incident surface 8a or 11a of the substrate 8 or the protective film 11 facing the image pickup section 3a of the solid-state image pickup device 3 is a smooth surface, the light incident surface is not uniform. 8a
Alternatively, light scattering does not occur at 11a, and a subject image can be formed on the image pickup unit 3a of the solid-state image pickup device 3.

The solid-state image sensor 3 and the solid-state image sensor 3
Since the peripheral drive circuit element 7 is disposed on the same substrate 8, the solid-state imaging device can be downsized, the electronic optical device can be downsized, and the case 2 and the substrate 8 can be separately provided in the electronic optical device. The manufacturing process can be shortened by eliminating the process of mounting the device inside the device and connecting the two with the lead wire 10.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the solid-state image pickup device of the present invention will be described below with reference to FIG. In FIG. 1, parts corresponding to those in FIG. 5 are designated by the same reference numerals, and detailed description thereof will be omitted.

In this example, the electrode 4 of the solid-state image pickup device 3 is used.
Then, the beam lead 12 made of Au is formed by a wafer process. Also, the beam lead 1 on the glass substrate 8
Corresponding to No. 2, a necessary wiring pattern 13 such as a wiring pattern to which the beam lead 12 is connected is formed of Cu foil, and at least the wiring pattern 13a at the connection portion with the beam lead 12 is plated with gold.

In this example, the solid-state image pickup device 3 having the above-described beam leads 12 is placed at a predetermined position on the glass substrate 8 thus constructed, and the beam leads 12 and corresponding gold plating are performed. The printed wiring pattern 13a is joined by thermocompression bonding so that the imaging unit 3a faces the substrate 8 and the light incident surface 8a of the substrate 8 facing the imaging unit 3a.
Is mirror-polished to prevent the incident light from being scattered on the light incident surface 8a. Further, the solid-state image sensor 3 is sealed with epoxy resin or the like to form the protective film 11.

According to this embodiment having such a configuration, since the light incident surface 8a of the substrate 8 facing the image pickup portion 3a of the solid-state image pickup device 3 is mirror-polished, the incident light is incident on the light incident surface 8a.
Therefore, the subject image can be formed on the image pickup unit 3a of the solid-state image pickup device 3 without being scattered.

In this case, in this example, the solid-state image pickup device 3
Since the peripheral driving circuit element 7 of the solid-state image pickup device 3 is arranged on the same substrate 8, the solid-state image pickup device is downsized, and when the solid-state image pickup device is mounted on, for example, a color video camera, There is an advantage that the color video camera can be miniaturized, and a case 2 in which the solid-state image pickup device 3 is mounted and fixed and a substrate 8 in which the peripheral drive circuit device 7 is mounted
There is an advantage that the manufacturing process can be shortened by eliminating the step of separately mounting and in the color video camera and connecting the lead portion 5 of the case 2 and the terminal 9 of the substrate 8 with the lead wire 10.

2, 3 and 4 respectively show another embodiment of the present invention. In this example of FIG. 2, bumps 14 are formed on the electrodes 4 of the solid-state image pickup device 3 by soldering, and the bumps 14 are formed on the substrate. No. 8 wiring pattern 13a is welded, and the other parts are configured similarly to the example of FIG. Also in this FIG. 2 example, FIG.
The same effect as the example can be obtained.

Further, in the example of FIG. 3, a non-reflective coating 15 is applied between the periphery of the image pickup section 3a of the solid-state image pickup device 3 and the substrate 8, and the other configurations are similar to those of the example of FIG. In the example of FIG. 3, the same effect as that of the example of FIG. 1 can be obtained, and the solid-state imaging device 3 is resin-sealed after the antireflection coating 15 is applied, so that the sealing resin allows the imaging unit 3a and the substrate 8 to be sealed. There is an advantage in that it can be prevented from flowing in between, and an advantage that incident light can be prevented from being reflected by the wiring pattern 13a and entering the imaging unit 3a.

Further, in the example of FIG. 4, the image pickup section 3a of the solid-state image pickup device 3 is fixed to the substrate 8 so as to face the side opposite to the substrate 8.
The electrode 4 of the solid-state image sensor 3 and the wiring pattern 13a are connected to Au.
The protective film 11 is formed by sealing the solid-state image sensor 3 with acrylic resin having excellent transparency while connecting with the line 6, and a portion of the protective film 11 that becomes the light incident surface 11a facing the image capturing section 3a is formed. The mirror polishing is performed, and the other parts are configured in the same manner as in the example of FIG. Also in the example of FIG. 4, the same operational effect as that of the example of FIG. 1 can be obtained.

The present invention is not limited to the above-described embodiments, and it goes without saying that various other structures can be adopted without departing from the gist of the present invention.

[0021]

According to the present invention, since the solid-state image pickup device and the peripheral drive circuit element of the solid-state image pickup device are arranged on the same substrate, the solid-state image pickup device can be downsized and the solid-state image pickup device can be realized. There is an advantage that the electro-optical equipment to be used can be downsized, and the case with the solid-state image sensor and the board with the peripheral drive circuit element are separately mounted on the electro-optical equipment, and lead between them. There is an advantage that a manufacturing process can be shortened by eliminating a process such as connecting with a wire.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a solid-state imaging device of the present invention.

FIG. 2 is a cross-sectional view showing the main parts of another embodiment of the present invention.

FIG. 3 is a sectional view showing a main part of another embodiment of the present invention.

FIG. 4 is a configuration diagram showing another embodiment of the present invention.

FIG. 5 is a configuration diagram showing an example of a conventional solid-state imaging device.

[Explanation of symbols]

 3 solid-state image sensor 3a image pickup section 7 peripheral drive circuit element 8 substrate 8a light incident surface of substrate 11 protective film 11a light incident surface of protective film

Claims (4)

[Claims] 1. A wiring pattern made of metal foil is formed on the surface.
A discrete type two-dimensional solid-state imaging device having an imaging unit on one main surface and a peripheral drive circuit element of the solid-state imaging device are arranged on the insulated supporting substrate, and the imaging is performed on the main surface. The electrode formed in the region excluding the area and the wiring pattern are connected by a conductive member, and the space between the image pickup section of the solid-state image pickup device and the substrate is hollow, and the image pickup section of the solid-state image pickup device is formed. A solid-state image pickup device for a video camera, wherein a light-incident surface of the substrate on which the opposed solid-state image pickup element is arranged is a smooth surface. 2. The solid-state imaging device according to claim 1, wherein the conductive member is a bump. 3. A wiring pattern made of metal foil is formed on the surface.
A two-dimensional solid-state image pickup device having an image pickup section on one principal surface and a peripheral drive circuit element of the solid-state image pickup element are arranged on the insulated supporting substrate, and the image pickup section is excluded on the main surface. A video camera characterized in that an electrode formed in a region and the wiring pattern are electrically connected by a conductive member, and a light incident surface of a protective film facing the image pickup section of the solid-state image pickup device is a smooth surface. Solid-state image pickup device. 4. A method of manufacturing a solid-state imaging device, wherein a discrete type solid-state imaging device and a peripheral drive circuit element of the solid-state imaging device are arranged on the same substrate, and an insulating substrate having a wiring pattern formed of a metal foil is manufactured. And a step of manufacturing a solid-state imaging device in which an imaging section and an electrode are formed on the same surface independently of the step of manufacturing the insulating substrate, and the electrodes of the solid-state imaging element and the substrate formed on the substrate. a step of welding through the bumps and the wiring pattern, a solid-state imaging apparatus characterized by a step of electrically connecting the wiring pattern formed on the peripheral drive circuit element and the substrate Production method.