JPH0831467A - Apparatus and method for permanent connection - Google Patents

Abstract

PURPOSE: To provide a simple and highly reliable permanent connecting device and its method to connect a lead to a high temperature heating arrangement or the like. CONSTITUTION: A circuit trace 10 for a heating element of platinum or the like and a plate lead 4, interposing a precious metal such as a silver ring 11 or the like between them, are placed in between heat-resistant ceramic housings 6 and 6'. This assembly is heated up to a temperature above the melting point of the precious metal so as to produce an alloy having a high melting point; hence the circuit trace 10 and the lead 4 are permanently interconnected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection, and more particularly to a permanent connection device and method for wiring used at high temperatures in automobiles.

[0002]

2. Description of the Related Art A catalytic converter for automobiles (or a wide range of vehicles) includes a substrate (substrate) having a circuit printed with a noble metal such as platinum on an edge. Leads to other circuits must be permanently connected to this noble metal circuit. Here, the permanent connection means, unlike a conventional connector, a permanent or semi-permanent connection that cannot be freely separated.

[0003]

It is difficult to form connection leads for interconnection with the platinum circuit pad. Operating temperature is about 95
For applications as high as 0 ° C, conventional standard connection techniques cannot be used. When a conventional metal material is used for such an application, it is subjected to a sudden stress and loses the contact force. There is a need for a heat resistant permanent connection device that can withstand such high temperatures. Connection using high-temperature solder is also conceivable, but the melting temperature (melting point) of solder is close to this operating temperature and is not practical.

Accordingly, one object of the present invention is to provide a heat resistant permanent connection and method that will withstand the high temperatures described above. Another object of the present invention is to provide an electrical connection device with a substrate lead wire used in a high temperature operation state.

[0005]

[Means for Solving the Problems] In order to achieve the above-mentioned object,
The permanent connection device of the present invention is, for example, a connection device between a circuit trace and a lead wire, in which a precious metal intermediate is arranged between the circuit trace and the lead. The noble metal intermediate is heated to a first temperature, which is the melting point of the noble metal, is alloyed with the material of the circuit trace having a second melting point above the first temperature to make a permanent connection. Is characterized by.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the heat-resistant permanent connection device and connection method of the present invention will be described in detail below with reference to the accompanying drawings.

First, a description will be given with reference to FIG. FIG. 1 shows an exploded perspective view of the permanent connection device or assembly of the present invention. The substrate 2 is sandwiched between two ceramic housing parts 6 and an intermediate housing part 8. Next, the lead wire 4 is sandwiched between the intermediate ceramic housing 8 and one ceramic housing portion 6 between them. A silver ring 11 (see FIG. 1A) is placed between the substrate 2 and the lead wire 4.

Next, description will be made with reference to FIGS. 2 and 3.
The ceramic housing part 6 will be described in detail. The ceramic housing part 6 has an alignment peg or positioning pin 14 arranged on the upper surface 12 at a substantially central position. Furthermore, the ceramic housing part 6 comprises a front platform part 16 forming a rearward facing edge 18.
Referring to FIG. 3, the lower side (bottom surface) of the housing portion 6 has a longitudinal recess 20 and a central raised portion 22. The central raised portion 22 includes an opening 24 at a position corresponding to the positioning pin 14. The raised portion 24 is substantially U-shaped and has a flat upper edge 26 and a substantially U-shaped surface 28.

As best shown in FIG. 4, the ridge 22 includes a lip 30 around the opening 24, as will be described in more detail below. The housing part 6 is a side wall part which further forms a side surface 21.
23 are formed along both sides in the longitudinal direction. The raised portion 22 is higher than the side wall portion 23.

Referring to FIG. 1, the substrate 2 has a circular portion 10 surrounding the opening 40 with circuit traces disposed and formed on the insulating layer. A silver ring 11 is placed on this trace 10. The trace portion 10 is made of a noble metal such as a platinum printed material on the substrate 2. The substrate 2 has an outwardly projecting portion 42 near its front edge 44.
Note that a similar protrusion 42 is formed on the other side 46 along with the trace 10.

The intermediate ceramic housing portion 8 includes an opening 50 having a flat upper surface 52 and a U-shaped portion 54. The intermediate housing part 8 has side edges 55 which are smaller than the spacing between the side faces 21 of the lower housing part 6.

A connecting portion 60 is formed on the lead wire 4 by pressing and deforming the surface of the material forming the lead wire. It should be noted that the connecting portion 60 is formed with a straight portion 62 and a U-shaped portion 64, and the connecting portion 60 is arranged in the opening 50 of the intermediate housing portion 8. There is an opening 66 that can be placed on the positioning pin 14 of the ceramic housing part 6. As shown in FIG. 1, a ceramic upper housing portion 6
Are placed above to complete the connecting device or assembly.

Next, the permanent connecting device of the present invention will be described in detail with reference to FIGS. First, the substrate 2 is placed on the upper surface 12 of the lower housing part 6,
The locating pin 14 is inserted into the opening 40 of the substrate 2. The intermediate housing part 8 is then arranged such that its opening 50 overlaps the opening 40 of the substrate 2. Move the intermediate housing part 8 slightly laterally to open both openings 40, 50.
To be perfectly aligned. However, the lower edge 56 of the intermediate housing part 8 is arranged in contact with the shoulder 18 of the lower housing part 6 to longitudinally align both housing parts 6,8.

Next, the lead wire 4 is arranged so that the projecting portion 60 enters the opening 50 and the opening 66 is located on the positioning pin 14. As a result, the bottom surface of the lead wire 4 is attached to the substrate 2
Make direct contact with the upper silver ring 11. As described above, the side wall portion 23 stands up from the flat surface 20 by a thickness that absorbs the thickness of the lead wire 4, and the raised portion 22 rises higher than the side wall portion 23. Therefore, when the upper housing part 6 ′ is arranged on the lead wire 4, the raised portion 22 of the upper housing part 6 ′ is arranged in the recess 60 of the lead wire 4 and further in the opening 50 of the intermediate housing part 8. Entry, the opening 24 is aligned with the locating pin 14.

In this assembled state, the substrate 2 and the lead wire 4 are sandwiched between the bottom surface of the raised portion 22 of the upper housing portion 6'and the surface 12 of the lower housing portion 6. Further, a silver ring 11 is arranged between the trace 10 and the bottom surface of the lead wire 4. As best shown in FIG. 4, the assembled permanent connection arrangement of the present invention has the upper housing portion 6 ′ having a lip 30 around the opening 24. The rib portion 30 is dimensioned so that the lip portion 30 extends around the opening 66 of the lead wire 4 and can come into contact with the upper surface of the substrate 2. This prevents the silver ring 11 from flowing to the edge of the opening 40 of the substrate 2 and short-circuiting.

According to a preferred embodiment of the present invention, the lead wire 4
It is preferred that the material is an oxidation resistant material that does not oxidize rapidly at high processing or operating temperatures. Examples thereof include stainless steel, copper oxide resistant, and constantan. However, in the preferred embodiment, the leads 4 are nickel plated to provide the best interconnection.

If nickel-plated lead wires are used and a silver ring 11 is used for the interconnection between the lead wire 4 and the platinum trace 10, when heated to 1000 ° C. in air, the platinum becomes molten silver and has a higher melting point. It became an alloy and was found to make a permanent connection between the platinum trace 10 and the lead wire 4.

In another embodiment of the present invention, as shown in FIGS. 5-9, the lead has a stamping portion 104 and a protruding contact portion 160, which is disposed on the trace portion 134 of the substrate 102. Ceramic housing 106
Has a cavity 150 into which the lead wire 104, silver ring 111 and substrate 102 are inserted. Heating these assemblies results in a permanent connection device as described above.

Finally, a third embodiment of the permanent connecting device of the present invention will be described with reference to FIGS. Here, the lead wire 204 is formed by inlaying silver 211 on the base material and forming a protruding contact 260 on the inlaid material, which silver is placed in contact with the substrate trace and heated as described above.

The permanent connection device and method of the present invention have been described above in detail with reference to some preferred embodiments. However, the invention should not be limited to only such embodiments.

[0021]

According to the permanent connecting device and the permanent connecting method of the present invention, a noble metal such as silver is placed between circuit traces such as platinum interconnected and a plate-like lead wire and heated to a temperature higher than the melting point of the noble metal. By melting, an alloy having a melting point equal to or higher than the melting point is formed and the circuit traces and the lead wires are interconnected, so that a permanent connection device for heat resistance can be obtained easily and reliably. Therefore, it is possible to obtain a highly reliable heat-resistant connecting device and method between a heating element such as an automobile substrate converter and its lead wires.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of a permanent connection device of the present invention.

1A is a perspective view of a noble metal ring used in the permanent connection device of FIG. 1. FIG.

FIG. 2 is a perspective view showing an upper surface of a housing used in the permanent connection device of FIG.

FIG. 3 is a perspective view showing a bottom surface of the housing of FIG.

4 is a cross-sectional view showing a connection state of the permanent connection device of FIG.

5 is a top view of another embodiment of the permanent connection device of FIG. 1. FIG.

6 is an end view of the lead strip of FIG.

7 is a top view of the permanent connection device of FIG.

FIG. 8 is a side view of FIG. 7;

9 is a side view of the lead wire and substrate assembly of FIG. 8. FIG.

FIG. 10 is a top view of the lead strip of the permanent connection device according to the third embodiment of the present invention.

11 is an end view of FIG.

[Explanation of symbols]

 4 Lead wire 6, 6'Heat resistant housing 10 Circuit trace 11 Noble metal

Claims (2)

[Claims] 1. A heat-resistant housing having opposed surfaces having a substantially complementary shape, circuit traces and substantially plate-shaped lead wires arranged to overlap each other between the heat-resistant housings, and the circuit traces and the lead wires facing each other. A permanent metal comprising a noble metal disposed between the surfaces, which is heated to a temperature above the melting point of the noble metal to form an alloy having a melting point above the noble metal to interconnect the circuit traces and leads. Connection device. 2. A circuit trace comprising: arranging a noble metal between the circuit trace and the plate-shaped lead wire; and heating the noble metal above its melting point to form an alloy having a melting point above the melting point. And a permanent connection method for permanently connecting the lead wires with the alloy.