EP0633624A2 - High temperature connection - Google Patents
High temperature connection Download PDFInfo
- Publication number
- EP0633624A2 EP0633624A2 EP94305023A EP94305023A EP0633624A2 EP 0633624 A2 EP0633624 A2 EP 0633624A2 EP 94305023 A EP94305023 A EP 94305023A EP 94305023 A EP94305023 A EP 94305023A EP 0633624 A2 EP0633624 A2 EP 0633624A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- current lead
- temperature
- circuit trace
- precious metal
- trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Definitions
- the present invention relates to an electrical connection and a method for producing the connection, for use in high temperature applications, and in particular in applications relating to connection to catalytic converters.
- Automotive catalytic converters include a substrate having printed at the edges thereof, a printed circuit pad is provided, which could be a noble metal, such as platinum printing, and to which, a connection must be made.
- Standard electrical connectors are not useable in such applications as the operating temperatures can reach as high as 950°C.
- Standard metallic materials show rapid stress relaxation in such applications leading to loss of contact force.
- a permanent connection is needed which can withstand such high temperatures, and a connection such as high temperature soldering can also be considered, but the melting point of the solder is to close to the operating temperature.
- the object of the invention then is to provide an electrical connection for use at higher temperatures.
- the objects of the invention have been accomplished by a method of providing a permanent interconnection between a substrate trace and a current lead, which method is characterized by the steps of placing a precious metal intermediate the circuit trace and the current lead; heating the precious metal, the circuit trace and current lead to a first temperature where the precious metal melts, whereby the precious metal forms an alloy with the material of the circuit trace having a melting point at a second temperature which is higher than the first temperature.
- FIG. 1 an assembly is shown where the substrate 2 can be sandwiched between two ceramic housing portions, 6 and an intermediate ceramic housing portion 8.
- the current lead 4 can then be sandwiched between the intermediate ceramic portion 8 and a further ceramic housing portion 6', which is identical to housing portion 6.
- a silver ring 11 ( Figure 1A) can be positioned between the substrate 2 and current lead 4, as will be described further herein.
- the ceramic portion 6 is comprised of upper surface 12 having an alignment peg 14 centrally located therein.
- the ceramic housing portion 6 further comprises a forward platform portion 16 forming a rearwardly facing edge at 18.
- the lower side of the housing portion 6 comprises a recessed axially extending section at 20 where a central raised section is positioned at 22.
- the section 22 includes an aperture at 24 which is concentrically positioned relative to the locating pin 14.
- the raised section 24 is somewhat U-shaped including a flat upper edge 26 and a U-shaped surface 28.
- the lower platform portion 22 includes a lip section 30 surrounding the aperture 24 as will be described in greater detail herein.
- the housing portion 6 further includes side wall portions 23 which form inner side surfaces 21.
- the central section 22 upstands from surface 20 higher than the side wall portions 23.
- the substrate 2 includes a circuit trace positioned on top of insulative material, and includes a circular portion 10 surrounding an aperture 40.
- a silver ring 11 can be placed on top of the trace portion 10 or could otherwise be deposited thereon.
- the trace is comprised of a noble metal, such as a platinum printing, on top of the substrate 2.
- the substrate 2 has an outwardly projecting section at 42 proximate to a front side edge 44 thereof and it should be appreciated that another such projecting portion 42 as well as trace portion 10 are provided at the opposite side 46.
- the upper ceramic housing half 8 includes an opening 50 having an upper flat surface at 52 and a U-shaped portion at 54.
- the ceramic housing portion 8 has side edges 55, such that the distance therebetween, is less than the distance between side surfaces 21 of the lower housing portion 6.
- the current lead 4 is provided with a connection section at 60 which is pressed downwardly through the plane of the material forming the lead.
- This section 60 is formed with a straight portion at 62 and a U-shaped portion at 64, and it should be appreciated that the connection portion 60 can be positioned within the opening 50 in the ceramic housing part 8.
- a central aperture 66 is provided such that the aperture 66 is positionable over the central pin 14 of the ceramic housing portion 6.
- An identical housing portion 6' is positioned at the upper region of the assembly as shown in Figure 1 to complete the assembly thereof.
- the substrate 2 is first positioned on top of surface 12 such that the aperture 40 overlies the pin 14 on the ceramic porticn 6.
- the ceramic portion 8 is then placed above the substrate 2 with the aperture 50 overlying the aperture 40 of the substrate 2.
- the housing portion 8 will move somewhat laterally to allow for perfect alignment of the aperture 50 with the aperture 40.
- the lower edge 56 of the ceramic housing portion 8 is positionable against the counter shoulder 18 on the housing portion 6 to longitudinally align the two housing portions 6 and 8.
- the current lead 4 can now be positioned over the housing portion 8 such that the projecting portion 60 is situated within the aperture 50 and such that the aperture 66 is positioned over the pin portion 14. This places the lower surface of the lead portion 4 directly against the silver ring 11 found on the substrate 2. As mentioned above, the side counter ribs 23 upstand from the surface 20 only enough to take up the thickness of the current lead 4, whereas the central portion 22 upstands higher than the counter ribs 23, as measured from the surface 20. Therefore, when the housing portion 6' is positioned above the current lead 4, the projecting portion 22' of the housing portion 6' is positioned within the portion 60 of the current lead 4, and partially into the opening 50 of the ceramic housing portion 8, with the lower aperture 24' being aligned with the pin 14.
- the substrate 2 and current lead 4 are sandwiched between the lower surface of portion 22' and the surface 12 of portion 6, as best shown in Figure 4. This also positions the silver ring 11 intermediate the trace 10 and a lower surface of the current lead 4.
- the housing portion 6' has a lip portion 30' surrounding the lower aperture 24'. The lip portion 30' should be so profiled that, it extends through aperture 66 of the current lead 4, and will contact the upper surface of the substrate 2. This prevents any silver 11 from flowing against the edge 40 of the substrate, thereby shorting it out.
- the material of the current lead should be resistant to rapid oxidation at the high working temperature.
- Options for such material are stainless steel, oxidation-resistance steel, or constantan.
- the current lead should be nickel-plated to make the best interconnection.
- Figures 5-9 show an alternative embodiment of the invention where current leads are stamped at 104 to provide a projecting contact section 160 for placement over the trace portion 134 of the substrate 102.
- Ceramic housing 106 has an inner cavity 150 which can receive the lead 104, the silver ring 111 and the substrate 102. Heating of the assembly would take place as previously mentioned above.
Abstract
Description
- The present invention relates to an electrical connection and a method for producing the connection, for use in high temperature applications, and in particular in applications relating to connection to catalytic converters.
- Automotive catalytic converters include a substrate having printed at the edges thereof, a printed circuit pad is provided, which could be a noble metal, such as platinum printing, and to which, a connection must be made.
- The difficulty in providing this electrical connection, is that a current lead must be interconnected to the circuit pad. Standard electrical connectors are not useable in such applications as the operating temperatures can reach as high as 950°C. Standard metallic materials show rapid stress relaxation in such applications leading to loss of contact force. A permanent connection is needed which can withstand such high temperatures, and a connection such as high temperature soldering can also be considered, but the melting point of the solder is to close to the operating temperature.
- The object of the invention then is to provide an electrical connection for use at higher temperatures.
- It is a further object of the invention to provide an electrical connection between a current lead of a substrate for use at high temperature operating conditions.
- The objects of the invention have been accomplished by a method of providing a permanent interconnection between a substrate trace and a current lead, which method is characterized by the steps of placing a precious metal intermediate the circuit trace and the current lead; heating the precious metal, the circuit trace and current lead to a first temperature where the precious metal melts, whereby the precious metal forms an alloy with the material of the circuit trace having a melting point at a second temperature which is higher than the first temperature.
- Embodiments of the present invention will now be described by way of example with reference to the accompanying drawings in which:-
- Figure 1 is an isometric view of a first embodiment of the invention;
- Figure 1A is an isometric view of a precious metal component for incorporation in the first embodiment of Figure 1;
- Figure 2 is an isometric view of a ceramic housing half;
- Figure 3 is an isometric view of the connector half shown in Figure 2 from the opposite side thereof;
- Figure 4 is a cross sectional view through the assembly of Figure 1;
- Figure 5 is a top plan view of an alternative embodiment of the invention of Figure 1-4;
- Figure 6 is an end view of the current lead strip material shown in Figure 5;
- Figure 7 shows a top plan view of an assembly method utilizing the current lead of Figures 5 and 6;
- Figure 8 shows a side view of the assembly of Figure 7;
- Figure 9 shows a side view similar to that of Figure 8 showing the current lead and substrate in position;
- Figure 10 shows an upper plan view of a current lead strip material of a third embodiment of the invention; and
- Figure 11 shows an end view of the material shown in Figure 10.
- With reference first to Figure 1, an assembly is shown where the
substrate 2 can be sandwiched between two ceramic housing portions, 6 and an intermediateceramic housing portion 8. Thecurrent lead 4 can then be sandwiched between the intermediateceramic portion 8 and a further ceramic housing portion 6', which is identical tohousing portion 6. A silver ring 11 (Figure 1A) can be positioned between thesubstrate 2 andcurrent lead 4, as will be described further herein. - With respect now to Figures 2 and 3, the
ceramic housing portion 6 will be described in greater detail. Theceramic portion 6 is comprised ofupper surface 12 having analignment peg 14 centrally located therein. Theceramic housing portion 6 further comprises aforward platform portion 16 forming a rearwardly facing edge at 18. With respect now to Figure 3, the lower side of thehousing portion 6 comprises a recessed axially extending section at 20 where a central raised section is positioned at 22. Thesection 22 includes an aperture at 24 which is concentrically positioned relative to the locatingpin 14. The raisedsection 24 is somewhat U-shaped including a flatupper edge 26 and a U-shapedsurface 28. As best shown in Figure 4, thelower platform portion 22 includes alip section 30 surrounding theaperture 24 as will be described in greater detail herein. Thehousing portion 6 further includesside wall portions 23 which forminner side surfaces 21. Thecentral section 22 upstands fromsurface 20 higher than theside wall portions 23. - With respect now to Figure 1, the
substrate 2 includes a circuit trace positioned on top of insulative material, and includes acircular portion 10 surrounding anaperture 40. Asilver ring 11 can be placed on top of thetrace portion 10 or could otherwise be deposited thereon. The trace is comprised of a noble metal, such as a platinum printing, on top of thesubstrate 2. Thesubstrate 2 has an outwardly projecting section at 42 proximate to afront side edge 44 thereof and it should be appreciated that another such projectingportion 42 as well astrace portion 10 are provided at theopposite side 46. - The upper
ceramic housing half 8 includes an opening 50 having an upper flat surface at 52 and a U-shaped portion at 54. Theceramic housing portion 8 hasside edges 55, such that the distance therebetween, is less than the distance betweenside surfaces 21 of thelower housing portion 6. - The
current lead 4 is provided with a connection section at 60 which is pressed downwardly through the plane of the material forming the lead. Thissection 60 is formed with a straight portion at 62 and a U-shaped portion at 64, and it should be appreciated that theconnection portion 60 can be positioned within the opening 50 in theceramic housing part 8. Acentral aperture 66 is provided such that theaperture 66 is positionable over thecentral pin 14 of theceramic housing portion 6. An identical housing portion 6' is positioned at the upper region of the assembly as shown in Figure 1 to complete the assembly thereof. - With respect now to Figures 1 and 4, the assembly of the connection will be described in greater detail. The
substrate 2 is first positioned on top ofsurface 12 such that theaperture 40 overlies thepin 14 on theceramic porticn 6. Theceramic portion 8 is then placed above thesubstrate 2 with theaperture 50 overlying theaperture 40 of thesubstrate 2. Thehousing portion 8 will move somewhat laterally to allow for perfect alignment of theaperture 50 with theaperture 40. However thelower edge 56 of theceramic housing portion 8 is positionable against thecounter shoulder 18 on thehousing portion 6 to longitudinally align the twohousing portions - The
current lead 4 can now be positioned over thehousing portion 8 such that the projectingportion 60 is situated within theaperture 50 and such that theaperture 66 is positioned over thepin portion 14. This places the lower surface of thelead portion 4 directly against thesilver ring 11 found on thesubstrate 2. As mentioned above, the side counter ribs 23 upstand from thesurface 20 only enough to take up the thickness of thecurrent lead 4, whereas thecentral portion 22 upstands higher than thecounter ribs 23, as measured from thesurface 20. Therefore, when the housing portion 6' is positioned above thecurrent lead 4, the projecting portion 22' of the housing portion 6' is positioned within theportion 60 of thecurrent lead 4, and partially into the opening 50 of theceramic housing portion 8, with the lower aperture 24' being aligned with thepin 14. - It should be appreciated that as assembled, the
substrate 2 andcurrent lead 4 are sandwiched between the lower surface of portion 22' and thesurface 12 ofportion 6, as best shown in Figure 4. This also positions thesilver ring 11 intermediate thetrace 10 and a lower surface of thecurrent lead 4. As also shown in Figure 4, as assembled, the housing portion 6' has a lip portion 30' surrounding the lower aperture 24'. The lip portion 30' should be so profiled that, it extends throughaperture 66 of thecurrent lead 4, and will contact the upper surface of thesubstrate 2. This prevents anysilver 11 from flowing against theedge 40 of the substrate, thereby shorting it out. - In the preferred embodiment of the invention the material of the current lead should be resistant to rapid oxidation at the high working temperature. Options for such material are stainless steel, oxidation-resistance steel, or constantan. However in the preferred embodiment, the current lead should be nickel-plated to make the best interconnection.
- It has been found that when a nickel-plated metal has been used as the current lead, and that the
silver ring 11 is positioned intermediate thecurrent lead 4 and theplatinum trace 10, that when heated in air to 1000°C, the platinum dissolves in the molten silver, changing it into an alloy with a higher melting point, and that this formed a permanent interconnection between theplatinum trace 10 and thecurrent lead 4. - Figures 5-9 show an alternative embodiment of the invention where current leads are stamped at 104 to provide a projecting
contact section 160 for placement over thetrace portion 134 of thesubstrate 102.Ceramic housing 106 has aninner cavity 150 which can receive thelead 104, thesilver ring 111 and thesubstrate 102. Heating of the assembly would take place as previously mentioned above. - Finally a third embodiment of the invention is shown with respect to Figures 10 and 11 where
current leads 204 are formed by providing the base material withinlay silver 211 such that the projectingcontact portion 260 is formed at the inlay material such that the silver will be placed against the trace on the substrate.
Claims (12)
- An apparatus for forming a permanent electrical interconnection between a circuit trace (10) and a current lead (4) which is formable upon heating the apparatus to a first temperature, characterized in that the apparatus comprises a housing (6, 8, 6') to position the circuit trace (10) relative to the current lead (4), a precious metal component (11) being meltable at the first temperature, the circuit trace (10) comprising a material that interacts with the precious metal (11) at the first temperature to form an alloy having a melting point at a second temperature, that is higher than the first temperature, whereby this alloy permanently interconnects the circuit trace (10) and the current lead (4).
- The apparatus of Claim 1, characterized in that the circuit trace (10) includes platinum.
- The apparatus of Claim 1 or 2, characterized in that the precious metal component (11) is silver.
- The apparatus of any one of Claims 1-3, characterized in that the circuit trace (10) and the current lead (4), include an alignment feature (40, 66) engageable by a mating feature (14) of the housing to maintain positioning therein.
- The apparatus of any one of Claims 1-4, characterized in that the housing (6, 8, 6') includes a lip portion (30, 30') extending across the interface between the circuit trace (10) and the current lead (4) to prevent leakage of the precious metal therefrom at the first temperature.
- The apparatus of any one of Claims 1-5, characterized in that the first (6) and second (6) housings are identical.
- The apparatus of any one of Claims 1-6, characterized in that the housings (6, 8, 6') are stackable.
- A method of providing a permanent interconnection between a circuit trace (10) and a current lead (4), characterized by the steps of:
placing a precious metal (11) intermediate the circuit trace (10) and the current lead (4);
heating the precious metal (11), the circuit trace (10) and current lead (4) to a first temperature where the precicus metal (11) melts, whereby the precious metal (11) forms an alloy with the material of the circuit trace (11), having a melting point at a second temperature which is higher than the first temperature. - A method according to claim 8, characterized in that the conductive trace (10) is platinum printing.
- A method according to claim 8 or 9, characterized in that the precious metal (10) is silver.
- A method according to any of claims 8-10, characterized in that the first temperature is approximately 950°C.
- A method according to any of claims 8-11, further characterized by a ceramic housing (6, 8, 6') surrounding the connection.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9314038 | 1993-07-07 | ||
GB939314038A GB9314038D0 (en) | 1993-07-07 | 1993-07-07 | High temperature connection |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0633624A2 true EP0633624A2 (en) | 1995-01-11 |
EP0633624A3 EP0633624A3 (en) | 1996-06-05 |
Family
ID=10738419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94305023A Ceased EP0633624A3 (en) | 1993-07-07 | 1994-07-07 | High temperature connection. |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0633624A3 (en) |
GB (1) | GB9314038D0 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3424387A1 (en) * | 1984-07-03 | 1986-01-09 | Robert Bosch Gmbh, 7000 Stuttgart | Method for bonding electrical conductors to electrical printed conductors |
EP0480754A2 (en) * | 1990-10-11 | 1992-04-15 | Fujitsu Limited | Mounting device for mounting an electronic device on a substrate by the surface mounting technology |
-
1993
- 1993-07-07 GB GB939314038A patent/GB9314038D0/en active Pending
-
1994
- 1994-07-07 EP EP94305023A patent/EP0633624A3/en not_active Ceased
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3424387A1 (en) * | 1984-07-03 | 1986-01-09 | Robert Bosch Gmbh, 7000 Stuttgart | Method for bonding electrical conductors to electrical printed conductors |
EP0480754A2 (en) * | 1990-10-11 | 1992-04-15 | Fujitsu Limited | Mounting device for mounting an electronic device on a substrate by the surface mounting technology |
Also Published As
Publication number | Publication date |
---|---|
GB9314038D0 (en) | 1993-08-18 |
EP0633624A3 (en) | 1996-06-05 |
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