JPH083134B2 - Ａｕ―Ｓｉ共晶接合用リードフレーム材料 - Google Patents

Ａｕ―Ｓｉ共晶接合用リードフレーム材料

Info

Publication number
JPH083134B2
JPH083134B2 JP2203990A JP20399090A JPH083134B2 JP H083134 B2 JPH083134 B2 JP H083134B2 JP 2203990 A JP2203990 A JP 2203990A JP 20399090 A JP20399090 A JP 20399090A JP H083134 B2 JPH083134 B2 JP H083134B2
Authority
JP
Japan
Prior art keywords
lead frame
bonding
frame material
group
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2203990A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0499137A (ja
Inventor
元久 宮藤
達也 木下
安啓 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2203990A priority Critical patent/JPH083134B2/ja
Priority to KR1019910012790A priority patent/KR930012180B1/ko
Publication of JPH0499137A publication Critical patent/JPH0499137A/ja
Publication of JPH083134B2 publication Critical patent/JPH083134B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2203990A 1990-08-02 1990-08-02 Ａｕ―Ｓｉ共晶接合用リードフレーム材料 Expired - Fee Related JPH083134B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2203990A JPH083134B2 (ja) 1990-08-02 1990-08-02 Ａｕ―Ｓｉ共晶接合用リードフレーム材料
KR1019910012790A KR930012180B1 (ko) 1990-08-02 1991-07-25 베어본딩용 리드프레임재료

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2203990A JPH083134B2 (ja) 1990-08-02 1990-08-02 Ａｕ―Ｓｉ共晶接合用リードフレーム材料

Publications (2)

Publication Number Publication Date
JPH0499137A JPH0499137A (ja) 1992-03-31
JPH083134B2 true JPH083134B2 (ja) 1996-01-17

Family

ID=16482955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2203990A Expired - Fee Related JPH083134B2 (ja) 1990-08-02 1990-08-02 Ａｕ―Ｓｉ共晶接合用リードフレーム材料

Country Status (2)

Country Link
JP (1) JPH083134B2 (ko)
KR (1) KR930012180B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059345A (en) * 1998-06-18 2000-05-09 Tachi-S Co., Ltd. Slide rail device for vehicle seat
JP4863130B2 (ja) 2009-05-22 2012-01-25 山一電機株式会社 基板接続用コネクタ、それを備える半導体装置用ソケット、ケーブル用コネクタ、および、ボードツーボードコネクタ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6152332U (ko) * 1984-09-10 1986-04-08

Also Published As

Publication number Publication date
KR930012180B1 (ko) 1993-12-24
KR920004591A (ko) 1992-03-27
JPH0499137A (ja) 1992-03-31

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