JPH08307100A - Back-up jig and its manufacture - Google Patents
Back-up jig and its manufactureInfo
- Publication number
- JPH08307100A JPH08307100A JP7108360A JP10836095A JPH08307100A JP H08307100 A JPH08307100 A JP H08307100A JP 7108360 A JP7108360 A JP 7108360A JP 10836095 A JP10836095 A JP 10836095A JP H08307100 A JPH08307100 A JP H08307100A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- component
- jig
- backup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント板の両面に部
品を実装する際に用いるバックアップ治具とその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup jig used for mounting components on both sides of a printed board and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】プリント板の両面に部品を実装するに
は、以下のようにして行われる。図３（ａ）に示すよう
にＸ−Ｙテーブル１上に予め植設された複数のバックア
ップピン２上にプリント基板３を載せたあと、図示しな
いクランプ手段より図３（ａ）中の左右からプリント基
板３をクランプする。このとき、プリント基板３がクラ
ンプされることによる曲がりが、バックアップピン２の
存在により防止される。このあと、チップマウンタによ
りプリント基板３の一方側の面である上面に部品４を実
装する。2. Description of the Related Art Parts are mounted on both sides of a printed board in the following manner. As shown in FIG. 3 (a), after mounting the printed circuit board 3 on the plurality of backup pins 2 preliminarily planted on the XY table 1, the clamp means (not shown) is used from the left and right in FIG. 3 (a). The printed circuit board 3 is clamped. At this time, bending due to the clamp of the printed circuit board 3 is prevented by the presence of the backup pin 2. After that, the component 4 is mounted on the upper surface, which is one surface of the printed board 3, by the chip mounter.
【０００３】次に、図３（ｂ）に示すようにプリント基
板３を裏返してバックアップピン２上に載せ、前記と同
様にクランプしてプリント基板３の他方側の面である上
面にもチップマウンタにより部品４を実装する。Next, as shown in FIG. 3B, the printed circuit board 3 is turned upside down and placed on the backup pin 2, and clamped in the same manner as described above, and the chip mounter is also mounted on the upper surface which is the other surface of the printed circuit board 3. The component 4 is mounted by.
【０００４】[0004]
【発明が解決しようとする課題】ところが、プリント基
板を裏返して部品を実装する際に、プリント基板の一方
の面に先に実装した部品とバックアップピンとが干渉
し、バックアップピンが部品を損傷したり、更にはバッ
クアップピンによりプリント基板が変形して適正な実装
が行えないという問題が生じる。However, when the printed circuit board is turned over to mount the component, the component mounted first on one surface of the printed circuit board and the backup pin interfere with each other, and the backup pin damages the component. Moreover, the printed circuit board is deformed by the backup pin, and proper mounting cannot be performed.
【０００５】そこで本発明は、斯る課題を解決したバッ
クアップ治具とその製造方法を提供することを目的とす
る。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a backup jig and a method for manufacturing the backup jig that solve the above problems.
【０００６】[0006]
【課題を解決するための手段】斯る目的を達成するため
のバックアップ治具の構成は、発泡材等により形成され
るとともに、下面に部品を実装したプリント基板を載せ
たときに、部品がはいり込む凹部を上面に形成したこと
を特徴とし、バックアップ治具を製造する方法の構成
は、下面と周囲４方が閉塞された型枠の上面を、部品を
下面に取り付けたプリント基板で閉塞し、型枠の上面ま
で発泡材等を充填して硬化させることを特徴とする。The structure of a backup jig for achieving the above object is formed of foam material or the like, and when the printed board on which the parts are mounted is placed, the parts are removed. The structure of the method for manufacturing the backup jig is characterized in that the recessed portion to be inserted is formed on the upper surface, and the upper surface of the formwork closed on the lower surface and the four sides is closed by the printed board on which the parts are attached. It is characterized in that the upper surface of the mold is filled with a foam material or the like and cured.
【０００７】[0007]
【作用】プリント基板の両面に部品を実装するには、ま
ず従来と同様にしてプリント基板の一方の面に部品を実
装したのち、プリント基板を裏返して他方の面を上にし
た状態でバックアップ治具の上に載せる。このとき、バ
ックアップ治具の上面に形成されている凹部に部品がは
いり込むので、プリント基板は平面になるようにバック
アップ治具上で支持される。従って、プリント基板の他
方の面への部品の実装も適正に行われる。Operation: To mount components on both sides of the printed circuit board, first mount the component on one side of the printed circuit board in the same manner as in the conventional method, then turn over the printed circuit board and back up the other side. Place on top of the ingredients. At this time, since the component is inserted into the recess formed on the upper surface of the backup jig, the printed board is supported on the backup jig so as to be flat. Therefore, mounting of the component on the other surface of the printed circuit board is also properly performed.
【０００８】[0008]
【実施例】以下、本発明を図面に示す実施例に基づいて
詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.
【０００９】本発明によるバックアップ治具の製造方法
を、図１に示す。図のようにＸ−Ｙテーブル１上に周囲
４方を囲むようにして型枠５が載せられ、型枠５の上に
プリント基板３が載せられる。このときのプリント基板
３の下面は、部品４を最初に実装した一方の面となって
いる。そして、型枠５の内部へウレタン等の発泡材を流
し込むための注入パイプ６が型枠５に取り付けられてい
る。A method of manufacturing a backup jig according to the present invention is shown in FIG. As shown in the figure, the mold 5 is placed on the XY table 1 so as to surround four sides, and the printed circuit board 3 is placed on the mold 5. The lower surface of the printed board 3 at this time is one surface on which the component 4 is first mounted. An injection pipe 6 for pouring a foam material such as urethane into the mold 5 is attached to the mold 5.
【００１０】このように構成された注入パイプ６から型
枠５の内部へ発泡材としてのウレタンが注入され、型枠
５の上面の高さまで充填される。そして、ウレタンが硬
化して固まったあとに型枠５及びプリント基板３を取り
外すと、部品４のはいり込んでいた部分に凹部の形成さ
れたバックアップ治具ができる。Urethane as a foaming material is injected into the inside of the mold 5 from the injection pipe 6 thus constructed, and is filled up to the height of the upper surface of the mold 5. Then, when the mold 5 and the printed circuit board 3 are removed after the urethane has hardened and solidified, a backup jig having a recess formed in the part 4 into which the component 4 has been inserted is formed.
【００１１】このようにしてでき上がったバックアップ
治具は、以下のようにして使用する。図３（ａ）で示し
た従来のように、あるいはバックアップピン２に代えて
バックアップ治具でプリント基板３を支持した状態で、
プリント基板３の一方の面に部品４を実装したのちに、
プリント基板３を裏返して図２のようにバックアップ治
具７の上に載せる。すると、部品４がバックアップ治具
７の上面の凹部７ａの内部へはいり込む。従って、プリ
ント基板３をクランプして他方の面である上面にも部品
を実装する作業は、従来よりも適正に行うことができ
る。The backup jig thus prepared is used as follows. As in the conventional case shown in FIG. 3A, or in a state where the printed circuit board 3 is supported by a backup jig instead of the backup pin 2,
After mounting the component 4 on one surface of the printed circuit board 3,
The printed circuit board 3 is turned over and placed on the backup jig 7 as shown in FIG. Then, the component 4 slips into the recess 7 a on the upper surface of the backup jig 7. Therefore, the work of clamping the printed circuit board 3 and mounting the component on the other surface, that is, the upper surface, can be performed more appropriately than before.
【００１２】これにより、バックアップピンの配置を決
めるために従来より行っていた寸法測定、図面作成、加
工等の作業が不要になる。斯るバックアップ治具は、同
一のプリント板を大量に製造する場合に用いて好適なも
のである。As a result, the work of dimension measurement, drawing preparation, processing, etc., which has been conventionally performed for determining the arrangement of the backup pins, becomes unnecessary. Such a backup jig is suitable for use when a large number of identical printed boards are manufactured.
【００１３】[0013]
【発明の効果】以上の説明からわかるように、本発明に
よるバックアップ治具によればプリント基板の一方の面
に最初に実装した部品は、他方の面に部品を実装する際
にはバックアップ治具の上面に形成された凹部にはいり
込んで干渉しないので、従来のように部品を損傷したり
プリント基板を変形させたりすることなくプリント基板
を固定して他方の面にも部品を適正に実装することがで
きる。As can be seen from the above description, according to the backup jig of the present invention, the component first mounted on one surface of the printed circuit board is the backup jig when the component is mounted on the other surface. Since it does not go into the recess formed on the upper surface of the board and does not interfere with it, the printed circuit board is fixed and the component is properly mounted on the other surface without damaging the component or deforming the printed circuit board as in the past. be able to.
【００１４】また、バックアップ治具の製造方法によれ
ば下面に部品を実装したプリント基板で枠体の上面を塞
ぎ、枠体内に発泡材等を充填してバックアップ治具を形
成するので、バックアップ治具の凹部に部品が確実には
いり込むことにより、バックアップ治具を製造する際に
部品等の寸法測定，図面作成，加工等の作業を必要とせ
ず、バックアップ治具が簡単に製造できる。Further, according to the method of manufacturing the backup jig, the upper surface of the frame is closed by the printed board having the components mounted on the lower surface, and the foam is filled in the frame to form the backup jig. By surely inserting the component into the concave portion of the tool, it is possible to easily manufacture the backup jig without requiring work such as dimensional measurement of the component and the like, drawing drawing, and processing when manufacturing the backup jig.
【図１】本発明によるバックアップ治具の製造方法を示
す説明図。FIG. 1 is an explanatory view showing a method of manufacturing a backup jig according to the present invention.
【図２】本発明によるバックアップ治具の使用状態を示
す説明図。FIG. 2 is an explanatory view showing a usage state of a backup jig according to the present invention.
【図３】従来のバックアップ治具を用いたプリント基板
への部品の実装手順を示す説明図。FIG. 3 is an explanatory diagram showing a procedure for mounting components on a printed circuit board using a conventional backup jig.
１…Ｘ−Ｙテーブル ３…プリント基板 ４…部品 ５…型枠 ６…注入パイプ ７…バックアップ治具 ７ａ…凹部 1 ... XY table 3 ... Printed circuit board 4 ... Parts 5 ... Formwork 6 ... Injection pipe 7 ... Backup jig 7a ... Recess
Claims (2)
面に部品を実装したプリント基板を載せたときに、部品
がはいり込む凹部を上面に形成したことを特徴とするバ
ックアップ治具。1. A backup jig which is formed of a foam material or the like and has a concave portion on the upper surface into which a component is fitted when a printed circuit board on which the component is mounted is placed.
を、部品を下面に取り付けたプリント基板で閉塞し、型
枠の上面まで発泡材等を充填して硬化させることを特徴
とするバックアップ治具の製造方法。2. The lower surface and the upper surface of the mold, which is closed on four sides, are closed by a printed circuit board having components attached to the lower surface, and the upper surface of the mold is filled with a foam material or the like and cured. Backup jig manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7108360A JPH08307100A (en) | 1995-05-02 | 1995-05-02 | Back-up jig and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7108360A JPH08307100A (en) | 1995-05-02 | 1995-05-02 | Back-up jig and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08307100A true JPH08307100A (en) | 1996-11-22 |
Family
ID=14482769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7108360A Pending JPH08307100A (en) | 1995-05-02 | 1995-05-02 | Back-up jig and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08307100A (en) |
-
1995
- 1995-05-02 JP JP7108360A patent/JPH08307100A/en active Pending
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