JPH08306761A - Substrate replacing method - Google Patents

Abstract

PURPOSE: To provide a method for replacing a substrate in which the time required for replacing a substrate with respect to the substrate mounting table at a processing section can be shortened. CONSTITUTION: A processed substrate on a substrate mounting table Tb is replaced by an unprocessed substrate by means of first and second substrate transfer hands 15U, 15L. In this process, the first substrate transfer hand 15U is advanced below the substrate mounting table Tb (Step S1) and then the first substrate transfer hand 15U is moved upward in order to receive a processed substrate Wb from the substrate mounting table Tb, while substantially at the same time, the second substrate transfer hand 15L mounting an unprocessed substrate is moved above the substrate mounting table Tb (Step S2). Subsequently, the first substrate transfer hand 15U is retreated from the processing section, while substantially at the same time, the second substrate transfer hand 15L is advanced above the substrate mounting table Tb (Step S3). Finally, the second substrate transfer hand 15L is lowered (Step S4) and the second substrate transfer hand 15L is retreated from the processing section (Step S5).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate exchanging method for supporting and conveying substrates such as glass rectangular substrates for liquid crystals, substrates for color filters and substrates for photomasks.

[0002]

2. Description of the Related Art Conventionally, as a coating / developing apparatus using this type of substrate exchanging method, one described in Japanese Patent Publication No. 2-132840 is known. That is, FIG. 10 is a plan view showing the photoresist film coating and developing apparatus 200. The coating / developing apparatus 200 includes a main body base 201, and a passage 202 is provided in the central portion of the main body base 201 in the arrow Y direction (lateral direction). Plural processing units ST are provided on both sides of the passage 202. On one side of the processing units ST, a pre-heating station 203 for heating the substrate W which has not been processed in any of the processing units ST to remove moisture and the like, and for cooling the pre-heated substrate W. A cooling station 204 and first and second heating stations 205 and 206 are provided. Further, on the other side of the processing section ST, first and second coating stations 20 for coating, for example, a photoresist film on the surface of the substrate W which has been preheated and cooled.
7,208 are provided. In addition, in the passage 202,
A substrate transfer device 220 that is movable in the direction Y is provided. The substrate carrying device 220 includes first and second substrate carrying hands 221 and 222.
The substrate transfer hands 221 and 222 are configured to independently receive or deliver the substrate W at the processing section ST.

A cassette C is provided on the side of the processing section ST.
A substrate loading / unloading unit 230 is provided for loading / unloading substrates with respect to 1 and C2. Further, the substrate loading / unloading unit 230 is provided with a substrate transfer device 232 for taking out or storing the substrates W from the cassettes C1 and C2. This substrate transfer device 232 is the first and second substrate transfer hands 221 and 222 of the substrate transfer device 220.
The substrate W is transferred between and.

In addition, the substrate transfer apparatus 220 carries in an unprocessed substrate which has not been processed in the processing section ST to each processing section ST, and which has been processed in the processing section. The substrate is carried out from the processing section, and as this step, a series of procedures shown in FIGS. 11 and 12 is performed. 11 and 12 show the processing unit ST
The process of carrying out the processed substrate Wb on the substrate mounting table 210 of the above with the first substrate transfer hand 221 and mounting the unprocessed substrate Wa on the second substrate transfer hand 222 on the substrate mounting table 210. Show. Hereinafter, FIG. 11 (A)-(D)
12 (E) to 12 (H). It should be noted that in this description, the processing unit ST includes a large number of stations 20.
3 to 208, one of the unprocessed substrates W is shown.
Let a be a substrate that has not been processed in this station, and treated substrate Wb be a substrate that has already been processed in this station.

The first substrate transfer hand 221 is advanced below the processed substrate Wb placed on the substrate platform 210 in the processing section ST (state of FIG. 11B). The first substrate transfer hand 221 is moved upward to receive the processed substrate Wb from the substrate platform 210 (see FIG. 1).
1 (C)). The first substrate transfer hand 221 is retracted outside the processing section ST (FIG. 11 (D)). The second substrate transport hand 222 is moved above the substrate platform 210 (FIG. 12 (E)). The second substrate transport hand 222 is advanced above the substrate platform 210 (FIG. 12 (F)). The second substrate transfer hand 222 is lowered to place the unprocessed substrate Wa on the substrate platform 210 (FIG. 12).
(G)). The second substrate transfer hand 222 is retracted outside the processing section ST (FIG. 12 (H)).

Through this series of steps, the processed substrate Wb is placed on the first substrate transfer hand 221, and the unprocessed substrate Wa is placed on the substrate platform 210.

[0007]

However, the above method of exchanging the substrate W requires 7 steps of
There has been a problem that it takes a long time to replace a substrate, in which a processed substrate in one processing unit ST is unloaded and an unprocessed substrate is loaded in the processing unit.

The present invention solves the above-mentioned problems of the prior art, and when replacing a processed substrate mounted on the substrate mounting table of the processing section with an unprocessed substrate, the time required for the replacement of the substrate. It is an object of the present invention to provide a substrate exchange method capable of shortening the time.

[0009]

SUMMARY OF THE INVENTION The present invention, which has been made to solve the above-mentioned problems, is to transfer a processed substrate, which has been processed in the processing section, from a substrate mounting table in the processing section to the outside of the processing section by a first substrate transfer hand. In the substrate exchanging method of unloading and carrying in an unprocessed substrate to the substrate mounting table by the second substrate transfer hand, the first substrate transfer hand not holding the substrate W is advanced below the processed substrate in the processing section. The first step, a step of moving the first substrate transfer hand upward to receive the processed substrate from the substrate mounting table by the first substrate transfer hand following the first step, and placing an unprocessed substrate outside the processing section. A second step of performing the step of moving the placed second substrate transfer hand above the substrate mounting table substantially at the same time, and following the second step, retracting the first substrate transfer hand out of the processing section. The third step of performing the step and the step of advancing the second substrate transfer hand above the substrate mounting table almost at the same time. Following the third step, the second substrate transfer hand is lowered to remove the unprocessed substrate from the substrate. The present invention is characterized by including a fourth step of mounting on the mounting table, and a fifth step of shunting the second substrate transport hand to the outside of the processing section, following the fourth step.

[0010]

In the present invention, the processed substrate placed on the substrate mounting table of the processing section is replaced with the unprocessed substrate by the first and second substrate transfer hands. Perform steps that do not interfere with each other at the same time.

That is, in the second step, the first substrate transfer hand is moved upward to receive the processed substrate from the substrate mounting table by the first substrate transfer hand, and the unprocessed substrate is placed outside the processing section. The step of moving the second substrate transfer hand above the substrate mounting table is performed almost simultaneously. In addition, in the third step, the step of retracting the first substrate transfer hand that has received the processed substrate to the outside of the processing unit and the second substrate transfer hand on which the unprocessed substrate is placed are above the substrate mounting table of the processing unit. The process of advancing to is also being performed almost at the same time. That is, by simultaneously performing the step of moving the first and second substrate transfer hands upward and the step of moving horizontally for advancing or retracting,
The number of steps to replace the substrate is reduced.

[0012]

Preferred embodiments of the present invention will be described below in order to further clarify the structure and operation of the present invention described above.

FIG. 1 is a side view showing an example of a substrate processing apparatus applicable to the substrate transfer apparatus according to the present invention, and FIG. 2 is a plan layout view of FIG. 1 seen from above. This substrate processing apparatus is an apparatus for performing a series of processing on a substrate.

In FIGS. 1 and 2, the substrate processing apparatus is provided with a processing unit section A1 for performing a series of processing on a substrate, and a substrate transfer apparatus 2 is provided in the transfer section A2, and this processing unit section A1 is provided. It is configured to carry the substrate in the direction X along.

The processing unit section A1 is divided into upper and lower two stages and arranged in parallel, and the lower stage C1 irradiates the substrate with ultraviolet rays to remove an organic substance adhering to the surface thereof. , A spin scrubber SS that supplies a cleaning liquid to the surface of the substrate to clean it, and a spin coater SC that applies a photoresist liquid to the surface of the substrate are in a direction X.
Are arranged in order. On the other hand, in the upper stage C2, hot plates HP1 and HP2 for heating the substrate, adhesion strengthening units AP1 and AP2 for applying an adhesion strengthening agent such as HMDS (hexamethyldisilazane) to the surface of the substrate, a hot plate HP3 for heating the substrate, and A cool plate CP1 for cooling the heated substrate, a hot plate HP4 for heating the substrate, and a cool plate CP2 for cooling the heated substrate are sequentially arranged along the direction X.

A substrate loading / unloading processing unit 4 for loading and unloading a substrate is provided at a side end portion (left-hand side in FIG. 2) of the transport unit A2.
Are provided, and the substrates are sequentially transferred to a processing unit such as the ultraviolet irradiation unit UV by a substrate transfer device 2 to be described later, and are subjected to a series of processing.

Next, the structure and operation of the substrate transfer device 2 will be described. FIG. 3 is a side view showing the substrate transfer device 2.

The substrate transfer device 2 includes a processing unit section A.
1 is arranged in the conveying path 6 (FIG. 2) facing the No. 1. In the transport passage 6, a guide rail 31 extending in the direction X is fixed to the bottom of the substrate processing apparatus main body, and a base 32 is reciprocally movable along the guide rail 31. The base 32 is provided with a supporting column portion 33 that accommodates an X driving mechanism (not shown). The X column is moved in response to a command from a controller (not shown) that controls the entire substrate processing apparatus. The drive mechanism operates to move the base 32 in the direction X.

The substrate transfer device 2 is provided with a substrate transfer hand mechanism 10. Substrate transfer hand mechanism 10
Has a pair of first and second substrate transfer hands 15U and 15L that are arranged one above the other.
Since the U and 15L have exactly the same configuration and peripheral mechanism, only the first substrate transfer hand 15U will be illustrated and described.

The substrate transfer hand mechanism 10 includes both hands 15
The vertical arm mechanism 12 that bends and extends to move the U and 15L in the direction Z, and the horizontal arm mechanism 14U that moves the first substrate transfer hand 15U in the direction Y (see FIG. 4).
And a horizontal arm mechanism 14L for moving the second substrate transfer hand 15L in the direction Y. The housing 13 is supported by the vertical arm mechanism 12. The housing 13 is a hollow box (see FIG. 4) that is open at both ends in the direction Y.
A pair of horizontal arm mechanisms 14U and 14L that can be bent and stretched are stored. Then, each horizontal arm mechanism 14U, 14
A first substrate transfer hand 15U and a second substrate transfer hand 15L are connected to the tip of L, respectively.

At the lower end of the carrier column 33, the motor 11 is
Is fixed, and the rotation of the motor 11 is transmitted to the drive gears 11a and 11b via a link mechanism. The vertical arm mechanism 12 is provided with arms 21 and 22 of substantially equal length, of which the end of the arm 21 is the drive gear 11b.
And the end 22a of the arm 22 is connected to the housing 13.

The vertical arm mechanism 12 is a so-called R-θ type arm mechanism. Therefore, when the motor 11 rotates, the arms 21 and 22 rotate as indicated by arrows θ1 and θ2, respectively, and the housing 13 translates in the direction Z while maintaining its posture. By switching the rotation direction of the motor 11, the direction of translation of the housing 13 in the direction Z is reversed.

Although not shown, another vertical arm mechanism having the same structure as the vertical arm mechanism 12 is provided on the opposite side of the housing 13 and is connected to the vertical arm by a connecting member (not shown) extending in the direction X. It is connected to the mechanism 12. Therefore, the driving force of the motor 11 is also transmitted to the opposite vertical arm mechanism via the connecting member, and the housing 13 is displaced in the direction Z without changing its posture while being supported at both ends.

Although the second substrate carrying hand 15L is also shown in FIG. 3, the structure thereof is almost the same as that of the first substrate carrying hand 15U. That is, the second substrate transfer hand 15L
Is connected to a horizontal arm mechanism 14L in the housing 13, and these can be moved in a direction Z and a direction Y by a motor 11L and a motor 33L (both not shown).

FIG. 4 shows the first substrate transfer hand 15U in the Y direction.
FIG. 14 is a partial perspective view of a horizontal arm mechanism 14U driven to
FIG. 5 is a plan view of the horizontal arm mechanism 14U in the housing 13. As shown in these figures, the housing 13
A horizontal arm mechanism 14U for driving the first substrate transfer hand 15U in the direction Y is provided therein, and a horizontal arm mechanism 14L for driving the second substrate transfer hand 15L in the direction Y is also provided, although not shown. Has been. Since these two horizontal arm mechanisms 14U and 14L have substantially the same configuration as each other, only the horizontal arm mechanism 14U will be described below. The horizontal arm mechanism 14U includes first and second arms 41 and 42 that are substantially equal in length, and the first arm 41 is in the connecting position 43 at the motor 33.
U (FIG. 3). The tip of the second arm 42 is connected to the first substrate transfer hand 15U via the hand drive unit 16.

This horizontal arm mechanism 14U is also constructed as an R-θ type arm mechanism, and when the motor 33U is rotated, the first and second arms 41, 42 move in the direction α1,
The first substrate transfer hand 15U turns to α2, and
It translates in the direction Y while maintaining its posture.

Therefore, when the second arm 42 is translated in the direction Y by driving the motor 33U, the first substrate transfer hand 15U is exposed to the outside from the housing 13 and the unit processing portion and the inside of the housing 13 are exposed. Move between.

The substrate holding mechanism 70 also includes an X-direction holding mechanism 70a for holding and holding the substrate W in the direction X, and a Y-direction holding mechanism 70b for holding and holding the substrate in the direction Y.

FIG. 6 shows the first and second substrate transfer hands 15.
It is an electronic control unit EC for controlling U and 15L.
The electronic control device EC includes a central control unit MPU having a CPU, ROM, RAM and the like built therein, and a motor drive circuit DDC. The central control unit MPU, in response to the control command, drives the first and second substrate transfer hands 15U and 15L in the direction Z via the motor drive circuit DDC, and the Z-direction drive motor 11 and the first substrate transfer hand 15U. Motor 33U for driving the Y direction in the Y direction, and motor 3 for driving the Y direction in which the second substrate transport hand 15L is driven in the Y direction.
3L and control.

Next, the hot plate HP is moved by the first and second substrate transfer hands 15U and 15L of the substrate transfer device 2.
A process of exchanging the substrate W in the processing unit such as 1 will be described.

FIG. 7 shows the first and second substrate transfer hands 15
FIGS. 8 and 9 are diagrams for explaining the operation of U and 15L, and FIGS. 8 and 9 are diagrams showing a process of actually exchanging the substrate W by the first and second substrate transfer hands 15U and 15L. In these figures, a substrate mounting table Tb is provided in the processing section, and the substrate W is delivered to the substrate mounting table Tb by the first and second substrate transfer hands 15U and 15L.

In FIG. 7 and FIG. 8, the first substrate carrying hand 15U moves in a loop from position P1a → position P1b → position P1c → position P1d. Here, the position P1a is a standby position where the substrate W is not placed on the first substrate transport hand 15U. Position P1b is the first substrate transfer hand 15U
Is a position immediately before receiving the processed substrate Wb and is a position below the substrate platform Tb. Position P1c is the first
The position where the substrate transfer hand 15U receives the processed substrate Wb and the position above the substrate platform Tb. The position P1d is a position when the first substrate transfer hand 15U carries out the processed substrate Wb from the processing section.

The second substrate carrying hand 15L moves in a loop from position P2a → position P2c → position P2d → position P2e. here,
The position P2a is a standby position where the unprocessed substrate Wa is placed on the second substrate transfer hand 15L. The position P2c is a position immediately before moving to the substrate mounting table Tb side. The position P2d is the second substrate transfer hand 15L.
Is a position immediately before passing the unprocessed substrate Wa to the substrate mounting table Tb, and is a position above the substrate mounting table Tb. Position P
2e is a position immediately after the second substrate transport hand 15L passes the unprocessed substrate Wa to the substrate platform Tb.

Next, with the first substrate transfer hand 15U,
A series of operations for carrying out the processed substrate Wb after the processing and carrying in the unprocessed substrate Wa to the substrate platform Tb by the second substrate transport hand 15L will be described.

In FIG. 8A, the first substrate transfer hand 15U is at the position P1a, does not hold the substrate,
The substrate transport hand 15L is in the position P2a and is in the start state where it holds the unprocessed substrate Wa. FIG.
From the state of (a), the first substrate transport hand 15U moves to the position P1b (step S1). This state is shown in FIG.

Subsequently, the first substrate transfer hand 15U moves upward and enters the position P1c to receive the processed substrate Wb from the substrate mounting table Tb by the first substrate transfer hand 15U. At the same time, the unprocessed substrate Wb is received. The second substrate transport hand 15L holding the substrate Wa is moved upward to the position P2c (step S2). This state is shown in Figure 8.
It is (c).

After that, the first substrate transfer hand 15U is moved to the position P1d, at the same time, the second substrate transfer hand 15L is moved from the position P2c to the position P2d, and the unprocessed substrate Wa is placed above the substrate mounting table Tb. Advance (step S3). This state is (FIG. 8 (d)).

Then, the first substrate carrying hand 15U is lowered and moved to the position P2e (step S4),
The unprocessed substrate Wa is placed on the substrate platform Tb (FIG. 8).
(State of (e)). Then, the second substrate transfer hand 15L is moved to the position P2a (step S5), and the original state is restored. (State of FIG. 8 (f)). This completes a series of steps. The substrate transfer apparatus 2 that has completed this step moves to another processing section and goes through the reverse steps to transfer the processed substrate Wb held by the first substrate transfer hand 15U to another processing section. After the substrate W is placed on the substrate platform Tb and the processing of the substrate W is completed, the second substrate transfer hand 15L is configured to receive the processed substrate Wb, or the processed substrate Wb is processed by another substrate transfer device. The unprocessed substrate Wa may be exchanged.

Therefore, in steps S2 and S3 shown in FIGS. 8B and 8C, the first and second substrate transfer hands 15U and 15L are simultaneously moved on paths that do not interfere with each other. The transfer process of the substrate W can be shortened and the productivity can be improved.

The present invention is not limited to the above embodiments, and can be implemented in various modes without departing from the scope of the invention.

[0041]

As described above, according to the substrate exchanging method of the present invention, the processed substrate placed on the substrate mounting table of the processing section is changed to the unprocessed substrate by the first and second substrate transfer hands. When exchanging, by simultaneously performing the steps in which the first and second substrate transfer hands do not interfere with each other, it is possible to reduce the number of steps and improve the productivity.

[Brief description of drawings]

FIG. 1 is a schematic side view showing a substrate processing apparatus including a substrate transfer apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the substrate processing apparatus as seen from above.

FIG. 3 is a side view showing a substrate transfer device.

FIG. 4 is a perspective view showing a peripheral portion of a substrate transfer hand of the substrate transfer device.

FIG. 5 is a plan view showing a peripheral portion of a substrate transfer hand.

FIG. 6 is a block diagram showing an electronic control device of the substrate transfer device.

FIG. 7 is an explanatory diagram illustrating the operation of first and second substrate transfer hands 15U and 15L.

FIG. 8 is an explanatory diagram illustrating a substrate exchanging process by the first and second substrate transfer hands 15U and 15L.

FIG. 9 is an explanatory diagram illustrating a step following FIG.

FIG. 10 is a schematic plan view showing a coating / developing apparatus 200 equipped with a conventional substrate transfer apparatus.

FIG. 11 is an explanatory diagram illustrating a substrate exchange process using a conventional substrate transfer hand.

12 is an explanatory diagram illustrating a step following the step of FIG.

[Explanation of symbols]

 ST ... Processing part Tb ... Substrate mounting table W ... Substrate Wa ... Unprocessed substrate Wb ... Processed substrate A1 ... Processing unit part A2 ... Transfer part 2 ... Substrate transfer device 4 ... Substrate loading / unloading process part 10 ... Substrate transfer hand mechanism 14U , 14L ... Horizontal arm mechanism 15U, 15L ... First and second substrate transfer hands 21, 22 ... Arms 41, 42 ... First and second arms 70 ... Substrate holding mechanism EC ... Electronic control device

Claims (1)

[Claims] 1. A processed substrate that has been processed in a processing unit is carried out of the processing unit by a first substrate transfer hand from a substrate mounting table in the processing unit, and an unprocessed substrate is transferred by a second substrate transfer hand in the substrate mounting table. In the method of exchanging a substrate, the first substrate transfer hand that does not hold the substrate is advanced below the processed substrate in the processing section, and the first substrate transfer hand is connected to the first step. A step of moving upward and receiving a processed substrate from the substrate mounting table by the first substrate transfer hand, and a step of moving the second substrate transfer hand on which an unprocessed substrate is mounted outside the processing section above the substrate mounting table. And the second step, which are performed almost simultaneously, a step of retracting the first substrate transfer hand to the outside of the processing section subsequent to the second step, and a step of moving the second substrate transfer hand above the substrate mounting table. The third step of performing the steps almost simultaneously, the fourth step of lowering the second substrate transfer hand to place the unprocessed substrate on the substrate mounting table, and the fourth step following the third step. And a fifth step of retracting the second substrate transfer hand to the outside of the processing section, the substrate exchanging method.