JPH083021Y2 - 密着型画像読取り装置 - Google Patents
密着型画像読取り装置Info
- Publication number
- JPH083021Y2 JPH083021Y2 JP1989106086U JP10608689U JPH083021Y2 JP H083021 Y2 JPH083021 Y2 JP H083021Y2 JP 1989106086 U JP1989106086 U JP 1989106086U JP 10608689 U JP10608689 U JP 10608689U JP H083021 Y2 JPH083021 Y2 JP H083021Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- common electrode
- led
- image reading
- original
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989106086U JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989106086U JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0345659U JPH0345659U (US07223432-20070529-C00017.png) | 1991-04-26 |
JPH083021Y2 true JPH083021Y2 (ja) | 1996-01-29 |
Family
ID=31654833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989106086U Expired - Lifetime JPH083021Y2 (ja) | 1989-09-09 | 1989-09-09 | 密着型画像読取り装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH083021Y2 (US07223432-20070529-C00017.png) |
-
1989
- 1989-09-09 JP JP1989106086U patent/JPH083021Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0345659U (US07223432-20070529-C00017.png) | 1991-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4446364A (en) | Photoelectric converter on a transmissive substrate having light shielding | |
US4707747A (en) | Hand held scanning input device and system | |
US7209268B2 (en) | Line illuminating device | |
US6496285B1 (en) | Image reading apparatus | |
JPH03224354A (ja) | 照明系の改良された光電変換装置及び該装置を搭載した情報処理装置 | |
JP2001245113A (ja) | 光導波路を備えた接触型イメージセンサ | |
JPH11506381A (ja) | 指紋センサ装置 | |
JPH03201767A (ja) | 画像読み取り装置 | |
JPH09219768A (ja) | イメージセンサ | |
JPH083021Y2 (ja) | 密着型画像読取り装置 | |
JPH07162586A (ja) | 発光装置とそれを用いた密着型イメージセンサユニット | |
US7206102B2 (en) | Image reading apparatus with partially shielded light-receiving elements | |
JPH0514600A (ja) | 原稿読み取り装置 | |
JPS62279775A (ja) | 密着型イメ−ジセンサ | |
JPS61188964A (ja) | 密着型イメ−ジセンサ | |
JP3263271B2 (ja) | 画像読取装置 | |
JP2558471B2 (ja) | 読取り装置 | |
JPH0586105B2 (US07223432-20070529-C00017.png) | ||
JP3307978B2 (ja) | イメージセンサ | |
JPH071650U (ja) | 原稿読み取り装置 | |
JP3810928B2 (ja) | 画像読み取り装置 | |
KR0161468B1 (ko) | 밀착형 이미지 센서 | |
JPS5941629B2 (ja) | 文字図形読取装置 | |
JPS63288560A (ja) | 密着型イメ−ジセンサ | |
JPH01179564A (ja) | イメージセンサユニット |