JPH08300564A - Manufacture of laminate - Google Patents

Manufacture of laminate

Info

Publication number
JPH08300564A
JPH08300564A JP7113418A JP11341895A JPH08300564A JP H08300564 A JPH08300564 A JP H08300564A JP 7113418 A JP7113418 A JP 7113418A JP 11341895 A JP11341895 A JP 11341895A JP H08300564 A JPH08300564 A JP H08300564A
Authority
JP
Japan
Prior art keywords
varnish
base material
thermosetting resin
resin varnish
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7113418A
Other languages
Japanese (ja)
Other versions
JP3207332B2 (en
Inventor
Yasushi Takimoto
恭史 瀧本
Takahisa Iida
隆久 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP11341895A priority Critical patent/JP3207332B2/en
Publication of JPH08300564A publication Critical patent/JPH08300564A/en
Application granted granted Critical
Publication of JP3207332B2 publication Critical patent/JP3207332B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PURPOSE: To provide good warping properties, dimension stability and the like by laminating two prepregs prepared by heat drying a laminate formed by overlapping a glass fiber non-woven cloth on a varnished surface applying thermosetting resin varnish on one face of a paper base. CONSTITUTION: Thermosetting resin varnish 2 is applied on the upper face of a continuous base 1 in the given film thickness by a coater 3. Although varnish 2 can be used as it is, if an inorganic filler irradiated the punching properties and dimension stability are improved, and through-hole reliability in also improved, and thermal expansion coefficient in the Z direction gets smeller. Resin varnish 2 is applied to the continuous base and then a glass non-woven cloth 4 is overlapped, while resin varnish is applied from the rear face. Then heat drying is carried out through a drying device 6 and thermosetting resin impregnated prepregs composed of the glass non-woven cloth overlapped on the continuous base are prepared. Two prepregs thus prepared are overlapped with the glass non-woven cloth 4 on the inner side and heat and pressure molded.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、特に電気通信、電子機
器、通信機器等に使用される印刷回路板用として好適な
積層板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated board suitable for a printed circuit board used in telecommunications, electronic equipment, communication equipment and the like.

【0002】[0002]

【従来の技術】民生用電子機器の小型化、高機能化が進
み、それに用いられる印刷回路基板として、ガラス不織
布を中間層基材とし、ガラス織布を表面層基材とした構
成で、エポキシ樹脂を含浸させ加熱加圧成形した積層板
(以下、コンポジット積層板という)が使用されてい
る。最近このようなコンポジット積層板に対し、従来こ
の分野で使用されている紙基材フェノール樹脂積層板と
同等の打抜加工性、低コスト化要求されるようになって
きた。
2. Description of the Related Art Consumer electronic devices have become smaller and more sophisticated, and as a printed circuit board used for them, glass nonwoven fabric is used as an intermediate layer base material and glass woven fabric is used as a surface layer base material. A laminate (hereinafter referred to as a composite laminate) impregnated with a resin and heat-pressed is used. Recently, such composite laminates have been required to have the same punching workability and lower cost as those of the paper-based phenolic resin laminates conventionally used in this field.

【0003】また産業用電子機器分野においても、低コ
スト化の必要性からガラス織布を使用しないか又はその
使用量を減らしたコンポジット積層板が使用されるよう
になったきたが、性能上ガラス織布基材積層板より種々
の点で劣り、これと同等の寸法変化、反りが小さいこと
が要求されるようになってきた。
Further, in the field of industrial electronic equipment, composite laminated plates without glass woven cloth or with a reduced amount of glass cloth have come to be used because of the need for cost reduction. It is inferior to the woven fabric substrate laminate in various points, and it has been required to have the same dimensional change and small warpage as those.

【0004】[0004]

【発明が解決しようとする課題】コンポジット積層板に
対する上記のような種々の要求に対して、中間層基材と
してガラス不織布を使用しないで、ガラス単繊維を配合
した樹脂ワニスを使用することが検討されたが、寸法変
化や反りは改良されるものの、製造上種々の問題点があ
り、実用化には未だ至っていない。一方、低コスト化の
ために、ガラス織布や不織布の割合を小さくすることも
検討されているが、性能上あるいは製造上の制約から低
コスト化も容易ではない。このような現状から、本発明
はコンポジット積層板としての性能を維持しながら、工
程を短縮し、低コスト化をも達成することを目的として
種々検討した結果、完成されたものである。
In order to meet the various demands for composite laminates as described above, it is considered to use a resin varnish containing a single glass fiber without using a glass nonwoven fabric as an intermediate layer base material. However, although the dimensional change and the warp are improved, there are various problems in manufacturing and they have not yet been put into practical use. On the other hand, it has been studied to reduce the proportion of glass woven fabric or non-woven fabric for cost reduction, but cost reduction is not easy due to performance or manufacturing restrictions. Under these circumstances, the present invention has been completed as a result of various studies aimed at shortening the steps and achieving cost reduction while maintaining the performance as a composite laminate.

【0005】[0005]

【課題を解決するための手段】本発明は、下塗り処理し
た長尺の紙基材の片面から熱硬化性樹脂ワニスを塗布す
る工程、前記基材のワニス塗布面にガラス繊維不織布を
重ね合わせる工程、これらの積層物を加熱乾燥してプリ
プレグを得る工程、このプリプレグ2枚を前記不織布を
内側にして重ね合わせ加熱加圧成形する工程を有するこ
とを特徴とする積層板の製造方法に関するもので有り、
製造工程が簡単で連続成形が可能であり、性能上も従来
のコンポジット積層板と同等以上のものを得ることが出
来る。本発明において、プリプレグを製造するまでの工
程の一例(概略)を図1に示す。
According to the present invention, a step of applying a thermosetting resin varnish from one surface of a long paper base material subjected to an undercoating treatment, and a step of superposing a glass fiber nonwoven fabric on the varnish application surface of the base material. And a step of obtaining a prepreg by heating and drying these laminates, and a step of superposing two sheets of the prepreg with the non-woven fabric inside to heat and press-mold the laminate. ,
The manufacturing process is simple, continuous molding is possible, and it is possible to obtain the same or better performance than the conventional composite laminated board in terms of performance. In the present invention, an example (outline) of steps up to the production of a prepreg is shown in FIG.

【0006】巻き出し装置から巻き出された長尺基材
(1)の上面に熱硬化性樹脂ワニス(2)をコーター
(3)により所定の膜厚になるように塗布する。この長
尺基材としては、低コスト化、打ち抜き性の面から紙基
材が適用される。この紙基材としてはクラフト紙、リン
ター紙等が使用されるが、湿潤強度を上げるため、予め
紙基材をフェノール樹脂、メラミン樹脂等で処理するこ
とが好ましい。また吸湿絶縁性を向上させるため、下塗
り処理を施したものが好ましく使用される。この下塗り
樹脂は、フェノール樹脂、メラミン樹脂等が用いられ、
付着樹脂量としては、5〜25重量%が好ましい。
A thermosetting resin varnish (2) is applied to the upper surface of the long base material (1) unwound from the unwinding device by a coater (3) so as to have a predetermined film thickness. As the long base material, a paper base material is applied from the viewpoints of cost reduction and punchability. Kraft paper, linter paper and the like are used as the paper base material, but it is preferable to pretreat the paper base material with a phenol resin, a melamine resin or the like in order to increase the wet strength. Further, in order to improve the moisture absorption insulating property, an undercoated one is preferably used. As the undercoat resin, a phenol resin, a melamine resin or the like is used,
The amount of the attached resin is preferably 5 to 25% by weight.

【0007】本発明で用いられる熱硬化性樹脂ワニスに
おける熱硬化性樹脂はエポキシ樹脂が望ましいが、この
ほか、ポリイミド樹脂、不飽和ポリエステル樹脂、フェ
ノール樹脂などを用いる事ができる。かかる熱硬化性樹
脂ワニスはそのままでも使用することが出来るが、無機
充填材を配合することが好ましい。無機充填材を加える
と、打抜加工性や寸法安定性を維持・向上させるととも
に、Z方向の熱膨張率が小さくなるのでスルーホール信
頼性を向上させることが可能である。かかる無機充填材
としては、水酸化アルミニウム、炭酸カルシウム、クレ
ー、タルク、シリカ等であり、樹脂に対する配合割合は
10〜200重量%が好ましい。10重量%以下では、
スルーホール信頼性の向上効果が小さく、200重量%
を越えると無機充填材の配合が困難となる。
The thermosetting resin in the thermosetting resin varnish used in the present invention is preferably an epoxy resin, but in addition to this, a polyimide resin, an unsaturated polyester resin, a phenol resin or the like can be used. Although such a thermosetting resin varnish can be used as it is, it is preferable to add an inorganic filler. When an inorganic filler is added, punching workability and dimensional stability are maintained and improved, and the coefficient of thermal expansion in the Z direction is reduced, so that it is possible to improve through hole reliability. Such inorganic fillers include aluminum hydroxide, calcium carbonate, clay, talc, silica and the like, and the compounding ratio with respect to the resin is preferably 10 to 200% by weight. Below 10% by weight,
Through-hole reliability improvement effect is small, 200% by weight
If it exceeds, it becomes difficult to mix the inorganic filler.

【0008】熱硬化性樹脂ワニスの固形分は、通常、無
機充填材を配合しない場合は60〜80重量%、無機充
填材を配合する場合は65〜90重量%(無機充填材も
固形分として計算)である。熱硬化性樹脂ワニスの塗布
量は、以下の工程において使用されるガラス不織布の目
付け量、あるいは長尺基材の下面に樹脂ワニスを塗布す
る場合はこの樹脂ワニスの塗布量によっても変化する
が、通常長尺基材1m2あたり、ワニス固形分600〜
1400g程度であり、塗布厚み(乾燥前)は0.2〜
1.0mm程度である。
The solid content of the thermosetting resin varnish is usually 60 to 80% by weight when the inorganic filler is not blended, and 65 to 90% by weight when the inorganic filler is blended (the inorganic filler is also a solid content. Calculation). The coating amount of the thermosetting resin varnish varies depending on the basis weight of the glass non-woven fabric used in the following steps, or the coating amount of the resin varnish when coating the resin varnish on the lower surface of the long base material, Normally, the solid content of varnish is 600 ~ per 1 m 2 of long substrate.
It is about 1400 g, and the coating thickness (before drying) is 0.2 to
It is about 1.0 mm.

【0009】コーター3としては、コンマロールコータ
ー、ナイフコーター、ダイスコーター、リバースコータ
ー等があるが、塗工厚みが0.2〜1.0mmと厚いた
め、ワニス粘度を高粘度にする必要がある。このため高
粘度ワニスを塗工できる方式、例えばコンマロールコー
ター、ナイフコーターが好ましい。
As the coater 3, there are a comma roll coater, a knife coater, a die coater, a reverse coater, etc., but since the coating thickness is as thick as 0.2 to 1.0 mm, it is necessary to make the varnish viscosity high. . Therefore, a method capable of applying a high-viscosity varnish, for example, a comma roll coater or a knife coater is preferable.

【0010】長尺基材に前記熱硬化性樹脂ワニスを塗工
した後、上面よりガラス不織布(4)を重ね合わせ、一
方裏面からは、以下に説明するように、熱硬化性樹脂ワ
ニスを塗工する。この塗工は通常ロールコーター(5)
により行われるが、これに限定されるものではない。ガ
ラス不織布は、通常目付け量20〜150g/m2 のも
のが使用される。裏面から長尺基材に塗工される熱硬化
性樹脂ワニスは、はじめに塗工された熱硬化性樹脂ワニ
スが長尺基材に十分含浸されないものを補うためのもの
で、塗工・含浸される樹脂量は少なくて良く、均一に含
浸させるためには樹脂固形分10〜30重量%のものが
使用される。
After coating the thermosetting resin varnish on a long base material, a glass nonwoven fabric (4) is overlaid on the upper surface thereof, while the back surface is coated with the thermosetting resin varnish as described below. Work. This coating is usually a roll coater (5)
However, the present invention is not limited to this. As the glass nonwoven fabric, one having a basis weight of 20 to 150 g / m 2 is usually used. The thermosetting resin varnish applied to the long base material from the back side is to compensate for the thermosetting resin varnish that was initially applied not being sufficiently impregnated into the long base material. The amount of resin used may be small, and a resin having a solid content of 10 to 30% by weight is used for uniform impregnation.

【0011】その後、乾燥装置(6)を通して加熱乾燥
することにより、長尺基材上にガラス不織布が重ね合わ
された熱硬化性樹脂含浸プリプレグを得る。加熱乾燥条
件は、基材の全厚さが厚いので、通常よりやや強い条件
とし、120〜180℃、1〜5分間程度である。その
後、プリプレグをカッター(7)により所定長さに切断
する。あるいは、切断しないで連続成形に供することも
可能である。
After that, a thermosetting resin-impregnated prepreg in which a glass nonwoven fabric is laminated on a long base material is obtained by heating and drying through a drying device (6). Since the total thickness of the base material is thick, the heating and drying conditions are slightly stronger than usual, and are 120 to 180 ° C. and about 1 to 5 minutes. Then, the prepreg is cut into a predetermined length by a cutter (7). Alternatively, it may be subjected to continuous molding without cutting.

【0012】このようにして得られたプリプレグは、ガ
ラス不織布側を内側にして2枚重ね合わせ加熱加圧成形
する。この成形は、通常所定長さに切断したプリプレグ
2枚を重ね合わせ多段プレスにて加熱加圧成形するが、
切断しない長尺のプリプレグ2枚を一方を上下逆向きに
して連続的に加熱加圧することもできる。樹脂がエポキ
シ樹脂の場合は通常前者の成形方法が行われ、この成形
条件は、含浸された樹脂の流動性にもよるが、通常は従
来のコンポジット積層板の場合と同様に、温度150〜
180℃、圧力20〜70kg/c 、時間60〜12
0分間が適当である。また、不飽和ポリエステル樹脂の
場合では、低圧成形が可能な後者の連続成形方法を採用
することができる。
The prepreg thus obtained is heated and pressure-molded by stacking two sheets with the glass nonwoven fabric side inside. In this molding, two prepregs, which are usually cut to a predetermined length, are stacked and heated and pressed by a multi-stage press.
It is also possible to continuously heat and press two long prepregs, which are not cut, with one of them upside down. When the resin is an epoxy resin, the former molding method is usually performed, and the molding condition is usually 150 ° C to 150 ° C as in the case of the conventional composite laminated plate, although it depends on the fluidity of the impregnated resin.
180 ° C, pressure 20-70 kg / c, time 60-12
0 minutes is appropriate. Further, in the case of unsaturated polyester resin, the latter continuous molding method capable of low pressure molding can be adopted.

【0013】なお、長尺基材に始めの熱硬化性樹脂を塗
工した後、ガラス不織布を重ね合わせる前に加熱による
乾燥工程を挿入してもよい。この乾燥工程で溶剤を蒸発
させることにより、ガラス不織布を重ね合わせた後の加
熱乾燥において樹脂のBステージ化が容易となる。
After the initial thermosetting resin has been applied to the long base material, a drying step by heating may be inserted before the glass nonwoven fabrics are laminated. By evaporating the solvent in this drying step, it becomes easy to convert the resin into the B stage in the heat drying after the glass nonwoven fabrics are superposed.

【0014】以上のような工程で、コンポジット積層板
を得ることができるが、本発明においては、長尺の紙基
材に熱硬化性樹脂ワニスを塗布した後にガラス不織布を
重ね合わせるので、後の裏面から樹脂ワニスを塗工する
場合を含めても塗布・含浸工程が簡単であり、コストの
高いガラス織布、ガラス不織布の量も少なくすることが
できるので、低コスト化を達成することができる。
A composite laminated plate can be obtained by the steps as described above. In the present invention, however, the glass non-woven fabric is superposed after the thermosetting resin varnish is applied to the long paper base material. Even if the resin varnish is applied from the back side, the application / impregnation process is simple, and the cost of expensive glass woven cloth and glass nonwoven cloth can be reduced, so that cost reduction can be achieved. .

【0015】[0015]

【実施例】次に本発明の実施例を比較例とともに具体的
に説明する。
EXAMPLES Next, examples of the present invention will be specifically described together with comparative examples.

【0016】《実施例1》長尺基材である、水溶性フェ
ノール樹脂を樹脂付着量25〜30%となるように一次
処理したクラフト紙を巻きだし、続いてこれに次の配合
からなる無機充填材配合ワニスAをナイフコーターによ
り厚さ0.9mm(乾燥前)になるように塗工した。 (ワニスA配合) エポキシ樹脂 100重量部 (硬化剤ジシアンジアミドと硬化促進剤を含む) 無機充填材(水酸化アルミニウム) 80重量部 超微粒子シリカ 20重量部 溶剤(メチルセロソルブ) 50重量部 次いで、上面側から目付け量75g/m2 のガラス不織
布(日本バイリーン製EPー4075)を重ね合わせ、
クラフト紙の裏面に次の配合のワニスBをロールコータ
ーにより塗布した。 (ワニスB配合) エポキシ樹脂(上記と同じ) 30重量部 溶剤(メチルセロソルブ) 70重量部
Example 1 A kraft paper, which is a long-sized base material, which is first treated with a water-soluble phenolic resin so as to have a resin adhesion amount of 25 to 30%, is unwound, and subsequently, an inorganic material having the following composition is used. Varnish A containing a filler was applied by a knife coater to a thickness of 0.9 mm (before drying). (Combined with varnish A) Epoxy resin 100 parts by weight (including curing agent dicyandiamide and curing accelerator) Inorganic filler (aluminum hydroxide) 80 parts by weight Ultrafine particle silica 20 parts by weight Solvent (methyl cellosolve) 50 parts by weight Next, upper surface side The glass non-woven fabric with a basis weight of 75 g / m 2 (EP-4075 manufactured by Nippon Vilene) is overlaid,
Varnish B having the following composition was applied to the back surface of the kraft paper using a roll coater. (Combining varnish B) Epoxy resin (same as above) 30 parts by weight Solvent (methyl cellosolve) 70 parts by weight

【0017】続いて、上記のワニスA及びBが塗工され
た基材を、乾燥装置により140℃で3分間加熱乾燥
し、紙基材及びガラス不織布からなるプリプレグを得
た。次にこのプリプレグ2枚をガラス不織布面を内側に
して重ね合わせ、更にその両面に18μm厚の銅箔を重
ね、成形温度165℃、圧力60kg/cm2 で90分
間積層成形して、厚さ1.6mmの銅張り積層板を得
た。
Subsequently, the base material coated with the above varnishes A and B was heated and dried at 140 ° C. for 3 minutes by a drying device to obtain a prepreg composed of a paper base material and a glass nonwoven fabric. Next, two of these prepregs are laminated with the glass nonwoven fabric side facing inward, 18 μm thick copper foil is further laminated on both sides, and laminated for 90 minutes at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 to obtain a thickness of 1 A copper-clad laminate of 0.6 mm was obtained.

【0018】《実施例2》長尺基材である未処理のクラ
フト紙を巻きだし、以下実施例と同様にして、上記ワニ
スA及びBを使用してプリプレグを得、このプリプレグ
と銅箔とを積層成形して厚さ1.6mmの銅張り積層板
を得た。 《比較例1》実施例1において得られた無機充填材配合
ワニスAをガラス不織布(日本バイリーン製 EP40
75)に含浸乾燥して、中間層用プリプレグを作製し
た。次に、実施例1において得られたワニスBをガラス
織布(日東紡績製 WE−18K RB−84)に樹脂含
有量が30〜40%になるように含浸、乾燥し表面層用
プリプレグを作製した。次いで、中間層用プリプレグを
所定枚数重ね、その上下に表面層用プリプレグを重ね、
さらにその両面に18μm厚の銅箔を重ね合わせ加熱加
圧成形して厚さ1.6mmの銅張り積層板を作製した。 《比較例2》未処理のクラフト紙に桐油変性率35%の
レゾール樹脂を含浸させプリプレグを作製し、このプリ
プレグ8枚とその両表面の接着剤付き銅箔とを1組とし
て加熱加圧成形して厚さ1.6mmの銅張り積層板を作
製した。
<Example 2> Untreated kraft paper, which is a long base material, was unwound, and a prepreg was obtained using the above-mentioned varnishes A and B in the same manner as in the following examples. Was laminated to obtain a copper-clad laminate having a thickness of 1.6 mm. << Comparative Example 1 >> The inorganic filler-containing varnish A obtained in Example 1 was used as a glass non-woven fabric (EP40 manufactured by Nippon Vilene).
75) and impregnated and dried to prepare an intermediate layer prepreg. Next, the varnish B obtained in Example 1 was impregnated into a glass woven fabric (WE-18K RB-84 manufactured by Nitto Boseki) so that the resin content was 30 to 40%, and dried to prepare a prepreg for a surface layer. did. Next, a predetermined number of intermediate layer prepregs are stacked, and the surface layer prepregs are stacked above and below it,
Further, a copper foil with a thickness of 18 μm was superposed on both sides of the copper foil and heat-pressed to produce a copper-clad laminate having a thickness of 1.6 mm. << Comparative Example 2 >> Untreated kraft paper is impregnated with a resole resin having a tung oil modification rate of 35% to prepare a prepreg, and 8 pieces of this prepreg and copper foil with adhesive on both surfaces thereof are combined as a set under heat and pressure. Then, a copper-clad laminate having a thickness of 1.6 mm was produced.

【0019】以上の実施例及び比較例で得られた銅張り
積層板について、打ち抜き加工性、反り、寸法変化率、
Z軸方向熱膨張率、吸湿後の電気絶縁性を測定した。そ
の結果を表1に示す。
With respect to the copper-clad laminates obtained in the above Examples and Comparative Examples, punching workability, warpage, dimensional change rate,
The coefficient of thermal expansion in the Z-axis direction and the electrical insulation after moisture absorption were measured. Table 1 shows the results.

【0020】[0020]

【表1】 [Table 1]

【0021】なお、製造コストについては、実施例の方
法は工程が単純であり、コストの高いガラス織布を使用
しておらず、ガラス不織布の使用量も少ないので、実施
例で得られた積層板は比較例で得られたものに比べ20
〜30%程度低コスト化することができた。
Regarding the manufacturing cost, the method of the embodiment has a simple process, does not use a high-cost glass woven cloth, and uses a small amount of the glass nonwoven fabric. The plate is 20 compared to that obtained in the comparative example.
The cost could be reduced by about 30%.

【0022】[0022]

【発明の効果】本発明により得られた積層板は、反り特
性や寸法安定性が良好であり、Z方向熱膨張率が小さ
く、吸湿後の電気絶縁性の低下が無く、打抜き加工性に
優れ、しかも低コスト化も達成される。製造工程も簡単
であるので、工業的な積層板の製造方法として好適であ
る。
The laminate obtained according to the present invention has good warp characteristics and dimensional stability, a small coefficient of thermal expansion in the Z direction, no decrease in electrical insulation after moisture absorption, and excellent punching workability. Moreover, cost reduction can be achieved. Since the manufacturing process is also simple, it is suitable as an industrial laminated plate manufacturing method.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の製造工程において、プリプレグを作
製するまでの工程を示す概略断面図。
FIG. 1 is a schematic cross-sectional view showing the steps until a prepreg is manufactured in the manufacturing process of the present invention.

【符号の説明】[Explanation of symbols]

1 長尺基材 2 ワニス 3 コーター 4 ガラス不織布 5 ロールコーター 6 乾燥装置 7 カッター 8 プリプレグ 1 Long base material 2 Varnish 3 Coater 4 Glass nonwoven fabric 5 Roll coater 6 Drying device 7 Cutter 8 Prepreg

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B32B 31/20 7148−4F B32B 31/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location B32B 31/20 7148-4F B32B 31/20

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 長尺の紙基材の片面側から熱硬化性樹脂
ワニスを塗布する工程、前記繊維基材のワニス塗布面に
ガラス繊維不織布を重ね合わせる工程、これらの積層物
を加熱乾燥してプリプレグを得る工程、このプリプレグ
2枚を前記不織布を内側にして重ね合わせ加熱加圧成形
する工程を有することを特徴とする積層板の製造方法。
1. A step of applying a thermosetting resin varnish from one side of a long paper base material, a step of overlaying a glass fiber nonwoven fabric on the varnish application surface of the fiber base material, and heating and drying the laminate. And a step of obtaining two prepregs with the non-woven fabric inside, and heat-pressing the two prepregs.
【請求項2】 前述の長尺基材として、下塗り処理を施
した紙基材を用いることを特徴とする積層板の製造方
法。
2. A method for producing a laminated board, wherein a paper base material subjected to an undercoating treatment is used as the long base material.
JP11341895A 1995-05-11 1995-05-11 Manufacturing method of laminated board Expired - Lifetime JP3207332B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11341895A JP3207332B2 (en) 1995-05-11 1995-05-11 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11341895A JP3207332B2 (en) 1995-05-11 1995-05-11 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH08300564A true JPH08300564A (en) 1996-11-19
JP3207332B2 JP3207332B2 (en) 2001-09-10

Family

ID=14611757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11341895A Expired - Lifetime JP3207332B2 (en) 1995-05-11 1995-05-11 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP3207332B2 (en)

Also Published As

Publication number Publication date
JP3207332B2 (en) 2001-09-10

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