JPH082936B2 - Epoxy resin composition for semiconductor encapsulation - Google Patents

Description

TECHNICAL FIELD The present invention relates to an epoxy resin composition for semiconductor encapsulation. More specifically, the present invention relates to an epoxy resin composition for semiconductor encapsulation, which is excellent not only in thermal shock resistance but also in moisture absorption and moisture resistance after soldering.

(Background Art) Regarding epoxy resin as a material for semiconductor encapsulation,
For the purpose of imparting a low stress to the resin, it has been conventionally considered to use a silicon-based modifier, rubber, a low stress resin and the like.

However, in the situation of the investigation so far, there has been a serious problem that the conventional silicon-based modifiers and the like have a low stress and are incompatible with moisture resistance, which is an important performance for the sealing material.

In addition, as a recent trend, IC packages are becoming thinner and smaller, and user demands are becoming stricter, and semiconductor reliability is being evaluated by unprecedented accelerated evaluation. ing. As a typical example, there is evaluation of compound reliability in SDP and FP.

In such a situation, there is a further need to improve the moisture resistance of the package after absorbing moisture under certain conditions and after soldering, and to improve the crack resistance of the package in these treatments. . However,
In order to deal with these problems, the conventional methods for reducing the stress have limitations and are not satisfactory.

Therefore, it has been strongly desired to realize an epoxy resin composition for semiconductor encapsulation, which is excellent in crack resistance when it is subjected to thermal shock and is also excellent in moisture resistance, particularly moisture absorption and moisture resistance after soldering.

(Object of the Invention) The present invention has been made in view of the circumstances as described above, and improves the crack resistance at the time of composite treatment such as solder treatment after moisture absorption, and at the same time, improves the moisture resistance after these treatments. Another object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation that also improves

DISCLOSURE OF THE INVENTION In order to achieve the above-mentioned object, the epoxy resin composition for semiconductor encapsulation of the present invention is a reaction in which an epoxy resin or a phenol novolac resin is melted with a silicone rubber powder, a modified silicone resin and an alkoxysilane. It is characterized by containing the low stress modified epoxy resin or the low stress modified phenol novolac resin.

There is no particular limitation on the type of epoxy resin or phenol novolac resin for obtaining the low stress modified epoxy resin or low stress modified phenol novolac resin used in the present invention. What is usually used is appropriately used.

For example, as the epoxy resin, a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin,
Examples thereof include halogenated epoxy resin and bisphenol A type epoxy resin.

As the modified silicone resin, as a functional group, an epoxy group, an amino group, an epoxy glycol group, a carbinol group, an epoxy aralkyl group, an epoxy polyether group,
A silicone resin modified with a carboxyl group or the like can be used. Suitable examples include epoxy-modified silicone resin and amino-modified silicone resin. These modified silicone resins may be used alone or in combination of two or more.

The amount of the modified silicone resin added is not particularly limited, but is 0.5 to 20 with respect to 100 parts by weight of the base resin.
It is preferably used in the range of parts by weight.

The silicone rubber powder preferably has an epoxy group at a part of the molecule. This is because the epoxy group improves the compatibility and reactivity with the base epoxy resin, the phenol novolac resin, and the modified silicone resin. The content of the epoxy group is preferably 0.1 to 10% with respect to the silicone rubber powder.

The addition amount of the silicone rubber powder is preferably in the range of 0.5 to 20 parts by weight with respect to 100 parts by weight of the base resin.

As the alkoxysilanes, epoxy-modified ones are preferable. This is because the epoxy modification improves the compatibility and reactivity with the epoxy resin of the base resin, the wenol novolac resin, and the modified silicone resin, as in the case of the silicone rubber. The amount of alkoxysilane added is 0.1 to 100 parts by weight of the base resin.
10 parts by weight is preferred.

The epoxy resin composition for semiconductor encapsulation of the present invention is a mixture of an epoxy resin or a phenol novolac resin with a modified silicone resin, a silicone rubber powder and alkoxysilanes, and reacted at a temperature of about 80 to 170 ° C. for 0.5 to 20 hours. The low stress modified epoxy resin or the low stress modified phenol novolac resin obtained in this way is used.

Thus, by subjecting the epoxy resin or the phenol novolac resin to a low stress denaturing treatment in advance, thermal shock resistance not present in conventional encapsulants, and further soldering treatment after absorbing moisture, such as crack resistance after a composite treatment, An epoxy resin molding material for a sealing material having excellent moisture resistance can be obtained.

Further, in the low stress modified epoxy resin or the low stress modified phenol novolac resin for these encapsulants, an inorganic filler such as silica powder, a colorant, a flame retardant, etc. can be appropriately used as a compounding component. .

The epoxy resin composition of the present invention is also useful as a liquid sealing material or a phenol molding material because of its excellent properties.

Next, examples will be shown and the present invention will be described more specifically. Of course, the present invention is not limited by the following embodiments. It goes without saying that various modes are possible.

Example 1 5 g of amino-modified silicone to 160 g of epoxy resin,
Epoxy modified silicone 10g, silicone rubber powder 30g,
4 g of alkoxysilane was mixed and reacted at a temperature of 120 ° C. for 5 hours. Then, the product was cooled to obtain a modified epoxy resin.

An epoxy resin composition having the following composition was produced using this modified epoxy resin.

Modified epoxy resin 209 (g) Phenol novolac resin 90 Brominated epoxy resin 20 Antimony trioxide 30 Carnauba wax 4 C ₁₁ Z 3 Carbon black 4 Silica 640 Performance of semiconductor encapsulant using the obtained epoxy resin composition evaluated. As a sample, wiring a parallel aluminum pattern to the chip size of 2.3 × 3.2 mm (line width, spacing,
5μ, 5μ) aluminum TEG packaged in 18p SOP was used.

 The evaluation test conditions were as follows.

Moisture absorption: 133 ℃, 100% RH, 15 hours Half field: 260 ℃ / 10 seconds (solder immersion) PCT: 151 ℃, 100% RH (50% cumulative failure time) The results are shown in Table-1. there were. No cracks were observed after moisture absorption and soldering. Also,
The 50% failure time after moisture absorption, soldering and PCT treatment was also very good at 200 hours.

Example 2 5 g of amino-modified silicone to 160 g of epoxy resin,
30 g of silicone rubber powder and 4 g of alkoxysilane were mixed and reacted at 140 ° C. for 4 hours. Then, it cooled and the modified epoxy resin was obtained.

An epoxy resin composition having the following composition was produced using this modified epoxy resin.

Modified epoxy resin 195 (g) Phenolic novolac resin 90 Brominated epoxy resin 20 Antimony trioxide 30 Carnauba wax 4 C ₁₁ Z 3 Carbon black 4 Silica 640 The composition obtained was evaluated in the same manner as in Example 1. The results are shown in Table 1. Example 1
It was also excellent in thermal shock resistance and moisture resistance.

Example 3 To 160 g of phenol novolac resin, 5 g of amino-modified silicone, 10 g of epoxy-modified silicone, 30 g of silicone rubber powder and 4 g of alkoxysilane were mixed, and the mixture was mixed at 120 ° C. for 5 hours.
Allowed to react for hours.

A composition having the following composition was produced using the obtained modified phenol novolac resin.

Modified phenol novolac resin 139 (g) Epoxy resin 160 Brominated epoxy resin 20 Antimony trioxide 30 Carnauba wax 4 C ₁₁ Z 3 Carbon black 4 Silica 640 The performance of the composition obtained was evaluated in the same manner as in Example 1. The results are shown in Table 1.

No moisture absorption or cracks after soldering were observed. The 50% failure time after moisture absorption, soldering and PCT treatment was also 200 hours, which was excellent.

Comparative Example 1 For comparison, an epoxy resin composition having the following composition was produced.

Epoxy resin 160 (g) Phenol novolac resin 90 Brominated epoxy resin 20 Antimony trioxide 30 Carnauba wax 4 C ₁₁ Z 3 Carbon black 4 Coupling agent 4 Silica 640 This pre-modified epoxy resin and phenol novolac resin were used. The performance of the composition was evaluated in the same manner as in Example 1.

The results are shown in Table-1, which shows thermal shock resistance,
Both of the moisture resistance were far inferior to those of Examples 1 to 3.

Comparative Example 2 A composition was prepared by further adding 10 g of epoxy-modified silicone, 5 g of amino-modified silicone, and 30 g of silicone rubber to the composition used in Comparative Example 1.

The performance as a sealing material in this case was also evaluated in the same manner as in Example 1. As shown in Table-1, it was far inferior to Examples 1 to 3.

Comparative Example 3 The composition used in Comparative Example 1 was further supplemented with amino-modified silicone.
A composition containing 5 g and 30 g of silicone rubber was produced.

The performance as a sealing material in this case was also evaluated in the same manner as in Example 1, but as shown in Table 1, it was far inferior to Examples 1 to 3.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 23/31

Claims (1)

[Claims] 1. A low stress modified epoxy resin or a low stress modified phenol novolac resin obtained by melting and reacting an epoxy resin or a phenol novolac resin with a silicon rubber powder, a modified silicone resin and an alkoxysilane. Epoxy resin composition for semiconductor encapsulation.