JPH08290574A - Laminated film device such as ink jet recording head and manufacture thereof - Google Patents

Abstract

PURPOSE: To form a wiring pattern electrically connected without step between wirings and to obtain a laminated film device having high reliability by forming the wirings on a board by selective oxidation of a conductive film. CONSTITUTION: A thermal storage layer 102 is formed on an Si substrate as a support substrate 101 by a thermal oxidation method, and a wiring layer is then formed by a sputtering method. The Al is formed by a photolithographic technology and a wiring part, a compounded electrode pattern are formed of resist, selectively oxidized by the compounding to form the wirings 104 and an insulating layer 105. Then, HfB2 is formed as a heating resistance layer 103 by a sputtering method, the partial pattern is formed by photolithographic technology, and a first protective layer 106 is formed of SiO2 and Ta by a sputtering method. The liquid channel and an ink discharge port 107 are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film device such as a semiconductor having a wiring on a substrate, a thermal head, and an ink jet recording head. TECHNICAL FIELD The present invention relates to a laminated film device suitable for an ink jet recording head in which ink is heated to generate bubbles, thereby ejecting ink droplets from an orifice for printing, and a manufacturing method thereof.

[0002]

2. Description of the Related Art An ink jet recording head in which ink in a flow path is heated by an energy generating element arranged on a substrate to generate bubbles, and ink droplets are discharged from an orifice for printing, For example, JP-A-5
It has been conventionally known in Japanese Patent Laid-Open No. 4-51837.
This ink jet recording method is different from other ink jet recording methods in that thermal energy is applied to the ink to obtain a driving force for ink droplet ejection. The recording head applied to this recording method is
In general, an ink ejection port provided for ejecting an ink droplet, a liquid path having a thermal action part for causing thermal energy for ejecting the ink droplet to act on the ink, and a liquid passage communicating with the ink ejection port, A heat generating resistance layer as an electrothermal converter that is an energy generating means, an upper protective layer for protecting the heat generating resistance layer from ink, a heat storage layer for storing thermal energy, and a support substrate for supporting the entire recording head. It is equipped with. In some cases, the upper protective layer is omitted.

In the above structure, in order to establish electrical connection with the electrothermal converter which is a means for generating thermal energy, a conductive film is usually formed and a wiring pattern is formed by selectively removing the conductive film. Is a general method and is a simple process that is used in semiconductors and thermal heads regardless of the ink jet recording head. In particular, Al (aluminum) is often used as a material, and a film is formed by a sputtering method, a CVD method, an evaporation method, a printing method, a wiring pattern is masked by a photolithography method except for unnecessary portions, and dry or wet etching is performed. It is formed by removing unnecessary portions.

[0004]

However, when a wiring pattern is formed by the above-mentioned etching method, a step between wirings becomes a problem. That is, as the miniaturization of the wiring progresses, the step of the wiring material cannot be ignored, and when the insulating layer is formed on the upper layer of the wiring, insufficient coverage of the step portion,
Concentration of stress in the upper layer film and unevenness of the surface occur, which causes a problem regarding its reliability. Further, when the conductive film as the wiring material is made thin, the above problems are alleviated, but there is a problem in that the thinning leads to an increase in wiring resistance and is not suitable for practical use. Therefore, in the conventional example, when etching the conductive film as the wiring material, a method of tapering the step portion is performed, or when forming the upper layer film,
A bias sputtering method, an SOG method, and an etch back method are used for step coverage and surface flattening, but the former is not suitable for miniaturization, and the latter has a problem that the process is complicated.

In view of the above, the present invention solves the above problems and forms a wiring pattern for establishing an electrical connection having no step between wirings, thereby forming a highly reliable semiconductor, a thermal head, an ink jet recording head, or the like. It is an object of the present invention to provide a laminated film device and a manufacturing method thereof.

[0006]

In order to achieve the above-mentioned object, the present invention provides a laminated film device such as a semiconductor having a wiring on a substrate, a thermal head, or an ink jet recording head, in which the wiring on the substrate is electrically conductive. It is formed by selective oxidation of the conductive film to form a wiring pattern having no steps. Further, the present invention is characterized in that the wiring is surrounded by an insulating layer formed of an oxide film of a wiring metal. In the above-described laminated film device of the present invention, the ink in the flow path is heated by the energy generating element arranged on the substrate to generate bubbles, thereby ejecting ink droplets from the orifice to perform printing. Further effects can be exhibited by applying it to the inkjet recording head. That is, by forming the wiring on the substrate for electrically connecting to the energy generating element in such an ink jet recording head by selective oxidation of the conductive film, it is possible to realize a highly reliable recording head. it can.

Further, in the above-mentioned method for manufacturing a laminated film device, the selective oxidation of the conductive film can be carried out by anodic oxidation of metal, ion implantation method, chemical conversion treatment or the like. In the present invention, a method of forming the insulating layer surrounding the wiring with the oxide film of the wiring metal can be performed by repeating selective oxidation of the conductive film.

[0008]

According to the present invention, as described above, in forming a wiring pattern on a substrate, for example, in a bubble jet recording head, a wiring pattern for making an electrical connection with an electrothermal converter which is means for generating thermal energy is formed. , A method of tapering a step portion at the time of etching a conductive film, which is not necessarily suitable as a miniaturization means as in the past, or a bias sputtering method or SO
The wiring pattern having no step is formed by forming the wiring pattern by selective oxidation of the conductive film without using the G method or the etch back method.

The present invention will be described below with reference to the drawings.
FIG. 1 is an enlarged plan view showing an example of the configuration near the substrate of an ink jet recording head of the present invention, and FIG. 2 is a sectional view taken along the line XY. In the figure, 101 is a substrate, and 102 is
Is a heat storage layer, 103 is a heating resistance layer, 104 is a wiring layer, 10
5 is an insulating layer formed of an oxide film of a wiring metal surrounding the wiring layer, 106 is a protective layer, 107 is a nozzle portion,
201 is a heat acting part. First, a first embodiment of the present invention will be described. As the energy generating element, an ordinary one can be used, and for example, an electrothermal converter such as a heating resistor is desirable. The shape and size of the heat acting portion may be the same as that of the conventional ink jet recording head. A Si substrate is usually used as a material forming the substrate. Other insulating materials such as Al ₂ O ₃ , SiO ₂ and glass may be used. As the wiring material, an inexpensive material having good thermal stability and a material having low resistivity are selected. In the first invention, aluminum suitable for chemical conversion treatment is used. Aluminum may contain some impurities such as Si and Cu in an amount of about 0.01 to 5% due to the constraints of the manufacturing process. As the chemical conversion treatment solution and the chemical conversion treatment method, an allodine method using an acidic solution containing chromate, a phosphate and a fluoride, an MBV method using an aqueous solution of anhydrous sodium carbonate and anhydrous sodium chromate, or sodium carbonate,
The EW method using an aqueous solution of sodium chromate and sodium silicate can be used. As the heat generating resistance layer, the wiring layer and the upper protective layer, those which are usually used in the ink jet recording head are used.

In the second embodiment of the present invention, the recording head is similar to the recording head in the first case,
The wiring pattern is formed by partial oxidation by selective ion implantation into the conductive film. Specifically, oxygen ions (O ⁺ ) are implanted using an ion implanter with an implantation energy of 20 Kev to 400 Kev and an ion implantation amount of 1 × 1.
Implantation on the substrate at 0 ¹⁶ to 1 × 10 ⁹ ions / cm ² .
By forming a wiring pattern by selectively oxidizing the conductive film on the substrate as described above, wiring without steps can be obtained.

[0011]

EXAMPLES The present invention will be described in detail below with reference to examples. Example 1 An ink jet recording head having the structure shown in FIGS. 1 and 2 was prepared as follows. Support substrate 1
As 01, a heat storage layer having a thickness of 3 μm was formed on the Si substrate by a thermal oxidation method, a CVD method, or a sputtering method. Next, Al as a wiring layer was formed in a thickness of 5000 angstrom by a sputtering method. By using a photolithography technique for this Al, a wiring portion having the structure shown in FIG. 1 and an electrode pattern for chemical conversion treatment were formed with a resist. Further, selective oxidation was performed by chemical conversion treatment to form the wiring 104 and the insulating layer 105. Next, HfB ₂ was deposited as a heating resistance layer 103 by a sputtering method to a thickness of 0.1 μm, and a partial pattern was formed by a photolithography technique. Further, as the first protective layer 106, SiO ₂ and Ta are each formed by sputtering to 0.
5 μm and 1.0 μm were laminated to form a film. The heater board prepared as described above is used to form the liquid passage and the ink discharge port 107 by a usual method, and the width 200 as shown in FIG.
mm ink jet recording head was completed. In FIG. 3, 301 is an ink ejection port, and 302 is an ink supply port.

[Other Embodiments] In the present invention, the present invention is not limited to the above-mentioned embodiments, but can be carried out in the following other methods, that is, the chemical conversion treatment method is a general method. Yes, the Alodine method, the MBV method, and the EW method are also possible. Also, instead of the chemical conversion treatment method, O ⁺
It is also possible to perform selective ion implantation with, for example, implanted ion species O ⁺ , implantation energy of 300 Kev,
The injection is performed at 1 × 10 ¹⁸ ions / cm ² . Also,
Although aluminum is given as an example of the wiring material, a conductive material such as Cu may be used depending on the case and is not particularly limited. Furthermore, the ion species for ion implantation may be an ion species other than O ⁺ depending on the case, and is not particularly limited.

The present invention provides excellent effects particularly in an ink jet recording type recording head and recording apparatus in which flying droplets are formed by utilizing thermal energy among the ink jet recording systems. For its typical structure and principle, see, for example, US Pat. No. 47.
No. 23129 and No. 47407796, the present invention is preferably carried out by using these basic principles. This recording method is applicable to both the so-called on-demand type and the continuous type.
To briefly explain this recording method, a nucleate boiling phenomenon occurs in the liquid (ink) corresponding to the recorded information in the electrothermal converter arranged corresponding to the sheet or liquid path holding the liquid (ink). By applying at least one drive signal for providing a rapid temperature rise that causes a film boiling phenomenon, thermal energy is generated and film boiling occurs on the heat acting surface of the recording head. In this way, the bubbles can be formed in a one-to-one correspondence by the drive signal applied from the liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. Due to the growth and contraction of the bubbles, the liquid is ejected through the ejection port to form at least one droplet. It is more preferable to make this drive signal into a pulse shape because bubbles can be immediately and appropriately grown and contracted, so that liquid (ink) ejection with excellent responsiveness can be achieved.
As the pulse-shaped drive signal, US Pat. No. 446 is used.
Those described in 3359 and 4345262 are suitable. It should be noted that US Pat. No. 4,313,121, which discloses an invention relating to the rate of temperature rise on the heat acting surface
When the conditions described in the specification No. 4 are adopted, more excellent recording can be performed. As the configuration of the recording head, in addition to the configuration in which the ejection port, the liquid flow passage, and the electrothermal converter as disclosed in each of the above specifications are combined (straight liquid flow passage or right-angled liquid flow passage), As disclosed in U.S. Pat. No. 4,558,333 and U.S. Pat. No. 4,459,600, the present invention also includes a configuration in which the heat acting portion is arranged in the bending region. In addition, for a plurality of electrothermal converters, a configuration in which a common slit is used as a discharge port of the electrothermal converter is disclosed in Japanese Patent Laid-Open No. 123670/1984.
Japanese Patent Laid-Open No. 13846/1984, which discloses a structure in which an opening for absorbing a pressure wave of thermal energy is made to correspond to a discharge portion.
The present invention is also effective in the configuration based on Japanese Patent Laid-Open No. Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of a recording medium which can be recorded by a recording device. The full line head may be a full line configuration formed by combining a plurality of print heads as disclosed in the above specification, or may be a single full line print head integrally formed. In addition, by being attached to the main body of the device, it can be electrically connected to the main body of the device and can be supplied with ink from the main body of the replaceable chip type recording head, or integrally provided on the recording head itself. The present invention is also effective when the cartridge type recording head described above is used. In addition, in the recording apparatus of the present invention,
It is preferable to add recovery means to the recording head, auxiliary auxiliary means, or the like because the recording apparatus of the present invention can be made more stable. Specific examples of these are capping means for the recording head,
Cleaning means, pressurization or suction means, electrothermal converter or other heating element, or a preheating means by a combination of these, means for performing a predischarge mode for discharging other than recording are added. Doing so is also effective for stable recording. Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, but the recording head may be integrally configured or a combination of a plurality of recording heads, but different. The present invention is extremely effective for an apparatus provided with at least one of a multi-colored color and a full-colored color.

In the embodiments of the present invention described above, the liquid ink is used for explanation. However, in the present invention, either an ink which is solid at room temperature or an ink which is in a softened state at room temperature is used. Can be used. In the above-mentioned inkjet device, the temperature of the ink itself is generally adjusted within the range of 30 ° C. or higher and 70 ° C. or lower to control the temperature of the ink so that the viscosity of the ink is within the stable ejection range. Any liquid may be used as long as the ink is liquid.
In addition, the excessive temperature rise of the head or ink due to thermal energy is positively prevented by using it as the energy for changing the state of the ink from the solid state to the liquid state, or the state is left for the purpose of preventing the evaporation of the ink. It is also possible to use an ink which is solidified by. In any case, liquefaction occurs only when heat energy is applied, such as when the ink is liquefied by applying heat energy according to the recording signal and ejected as an ink liquid, or when it begins to solidify when it reaches the recording medium. The use of ink having the property of applying is also applicable to the present invention. Such ink is
JP-A-54-56847 or JP-A-60-7
As described in Japanese Patent No. 1260, it may be configured to face the electrothermal converter in a state of being held as a liquid or a solid in the recess or the through hole of the porous sheet. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method. FIG. 4 is an external perspective view showing an example of an inkjet recording apparatus (IJRA) in which the recording head obtained by the present invention is mounted as an inkjet head cartridge (IJC). In the figure, reference numeral 20 is an ink jet head cartridge (IJC) having a nozzle group for ejecting ink to face the recording surface of the recording paper fed onto the platen 24. Reference numeral 16 is a carriage HC that holds the IJC 20, and is connected to a part of a drive belt 18 that transmits the driving force of the drive motor 17, and is slidable with two guide shafts 19A and 19B arranged in parallel with each other. By doing so, reciprocating movement over the entire width of the recording paper of the IJC 20 is possible. 26 is a head recovery device, which is an IJ
It is arranged at one end of the movement path of C20, for example, at a position facing the home position. The head recovery device 26 is operated by the driving force of the motor 22 via the transmission mechanism 23, and the IJC 20 is capped. In association with the capping of the IJC 20 by the cap portion 26A of the head recovery device 26, ink is sucked by an appropriate suction means provided in the head recovery device 26 or by an appropriate pressure means provided in an ink supply path to the IJC 20. The ink is pressure-fed and the ink is forcibly discharged from the ejection port to perform the ejection recovery process such as removing the thickened ink in the nozzle. Further, the IJC is protected by capping at the end of recording or the like. Reference numeral 30 denotes a blade as a wiping member, which is disposed on the side surface of the head recovery device 26 and is made of silicon rubber. The blade 31 is held by the blade holding member 31A in a cantilever form,
Similar to the head recovery device 26, it is operated by the motor 22 and the transmission mechanism 23 and can be engaged with the ejection surface of the IJC 20. As a result, the blade 31 is projected into the movement path of the IJC 20 at an appropriate timing in the recording operation of the IJC 20 or after the ejection recovery process using the head recovery device 26, and the ejection surface of the IJC 20 is moved along with the movement operation of the IJC 20. It wipes off condensation, wetness, dust, etc.

[0015]

According to the present invention, when forming a wiring pattern on a substrate as described above, a taper is formed on a step portion which is not necessarily suitable as a miniaturization means for forming a wiring pattern as in the prior art. By using a very simple and inexpensive means of selectively oxidizing the conductive film, the wiring pattern is not subjected to the bias sputtering method, the SOG method, and the etchback method, which are complicated processes.
A wiring pattern without steps can be formed, and a structure in which the wiring is surrounded by an insulating layer formed of an oxide film of a wiring metal can be adopted, and a highly reliable multilayer film device such as an inkjet recording head can be realized. it can.

[Brief description of drawings]

FIG. 1 is an enlarged plan view showing one structural example near a heater board of an inkjet recording head according to the present invention.

2 is a plan view taken along the line XY of FIG. 1. FIG.

FIG. 3 is a perspective view showing one configuration example in the vicinity of an ejection port of the inkjet recording head according to the present invention.

FIG. 4 is a perspective view showing an example of a recording apparatus including an inkjet recording head according to the present invention.

[Explanation of symbols]

 16 Carriage 17 Drive Motor 18 Drive Belts 19A, 19B Guide Shaft 20 Inkjet Head Cartridge 22 Cleaning Motor 23 Transmission Mechanism 24 Platen 26 Head Rotating Device 26A Cap Part 30 Blade 30A Blade Holding Member 101 Support Substrate 102 Heat Storage Layer 103 Heat Generation Resistance Layer 104 Electrode layer 105 First protective layer 106 Second protective layer 107 Third protective layer 201 Thermal action section 301 Ink ejection port 302 Ink supply port

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location C25D 11/04 301 H01L 49/00 H01L 49/00 B41J 3/04 103H // B41J 2/335 3 / 20 111E

Claims (7)

[Claims] 1. A laminated film device such as a semiconductor having a wiring on a substrate, a thermal head, and an ink jet recording head, wherein the wiring on the substrate is formed by selective oxidation of a conductive film. Film device. 2. The laminated film device according to claim 1, wherein the wiring is surrounded by an insulating layer formed of an oxide film of a wiring metal. 3. The ink jet recording head according to claim 1, wherein the energy generating element disposed on the substrate heats the ink in the flow path to generate bubbles, thereby ejecting ink droplets from the orifice. An ink jet recording head adapted to perform printing, wherein the wiring on the substrate for electrically connecting to the energy generating element is formed by selective oxidation of a conductive film. Jet recording head. 4. The method for manufacturing a laminated film device according to claim 1, wherein the conductive film is selectively oxidized by anodic oxidation of a metal. 5. The method for manufacturing a laminated film device according to claim 1, wherein the selective oxidation of the conductive film is performed by an ion implantation method. 6. The method of manufacturing a laminated film device according to claim 1, wherein the conductive film is selectively oxidized by chemical conversion treatment. 7. The method for manufacturing a laminated film device according to claim 1, wherein the insulating layer surrounding the wiring is formed of an oxide film of a wiring metal by repeating selective oxidation of the conductive film. A method for manufacturing a laminated film device, comprising: