JP3045793B2 - Inkjet head, substrate for inkjet head, inkjet apparatus, and method for manufacturing substrate for inkjet head - Google Patents

Abstract

A substrate for an ink-jet head comprising: a pair of first distribution electrode layers disposed on a substrate through first electrode adhesion layers; a pair of second distribution electrode layers disposed on said pair of first distribution electrode layers each correspondingly to a relative one through second electrode adhesion layers; and heat generating resistor layers included in said first or second electrode adhesion layers and generating heat on impression of voltage through a pair of said first and second distribution electrode layers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base for an ink jet head used for an ink jet head for discharging ink and recording an image such as a character by the discharged ink. The present invention also relates to an inkjet head using the inkjet head substrate. Furthermore, the present invention relates to an ink jet device provided with the head. The present invention includes a method for manufacturing the substrate for an inkjet head.

[0002]

2. Description of the Related Art Various types of ink jet recording systems have been proposed in the past. Among such proposals, the ink jet system described in, for example, US Pat. No. 4,723,129 and US Pat. No. 4,740,796 has recently attracted attention as a representative one. . In short, this method uses thermal energy to eject ink and performs recording with the ejected ink. Such an ink-jet system has the advantage that high-density, high-definition, and high-quality recording can be performed at high speed, and that the head and apparatus can be relatively easily made compact. ing.

A typical structure of a so-called base (hereinafter, sometimes referred to as a "head base") constituting a head used in the above-described ink jet system is as follows.
For example, this is schematically shown in FIG. In FIG. 3, (a) is a schematic plan view, and (b) is (a).
It is a typical sectional view in the DD 'line of the figure. The head base having the configuration shown in FIG. 3 is generally manufactured through the steps shown in FIGS. In FIG.
(A) is a schematic plan view, and (b) is a schematic cross-sectional view of (a). 2A is a schematic plan view, and FIG. 2B is a schematic cross-sectional view taken along line DD ′ in FIG. Here, the manufacturing process of the head base will be described with reference to FIGS.

As shown in FIGS. 1 (a) and 1 (b),
For example, the first of HfB ₂ or the heating resistor layer and for example, a Ti layer Ru Lana are laminated in this order from the insulating substrate 1 side
Material layer for forming the electrode adhesion layer 2 (two-layer constituent layer)
And a wiring electrode layer 3 made of a good conductive material such as Al
Is formed on the insulating substrate 1 by a thin film forming technique such as a vapor deposition method, a sputtering method, and a CVD method. Next, as shown in FIGS. 2A and 2B, the material layer for the electrode adhesion layer 2 and the material layer for the wiring electrode layer 3 which have been formed previously are patterned by photolithography. Apply. Next, as shown in FIGS. 3A and 3B, the patterned wiring electrode layer 3 is formed.
The material layer is further patterned to expose a part of the electrode adhesion layer 2 to form the heat generating portion 10. The heating portion 10 thus formed depends on the material used,
The ink may be used as it is in contact with the ink. However, in general, a protective layer is provided thereon mainly for the purpose of protecting the heat generating portion from corrosion due to ink or the like.

[0005] A head substrate is manufactured through such a manufacturing process. An ink jet apparatus using this head substrate and having an ink jet head having a plurality of ejection ports for ejecting ink has been commercialized.

[0006]

With respect to the ink jet apparatus, there is a social demand for further improving the recording speed and the image quality of the recorded image. An ideal inkjet head that satisfies these social demands basically has as many ink outlets as possible, and these outlets are densely arranged. it can.

However, with respect to providing the above-described ink jet head, items that have not been regarded as a problem until now appear as those requiring a solution as described below. That is, in the head substrate, defects such as pinholes and defects occur in the photoresist layer used for patterning the wiring electrodes and the like, thereby affecting the wiring electrode layer and the like to be patterned, Alternatively, a film defect such as a pinhole may be generated in the electrothermal transducer during the film forming process. In the case where a head base in which a large number of discharge ports are arranged at a high density is produced, this ultimately greatly affects the yield. The situation mentioned above,
As a typical example, there is a disconnection of a wiring electrode schematically shown in a portion C of FIGS. 2 and 3.

[0008] This point is that in the case of a head base having relatively few discharge ports and their disposition density is not so high, a compromise can be made even if the yield is relatively small. When the head bases are arranged at a high density, there is a problem that it is difficult to neglect. In particular, a large number of high-density ejection ports are provided over the entire width of the recording area of the recording member on which recording is performed, and a large number of electrothermal transducers are densely arranged on the substrate corresponding to the large number of the ejection ports. This is a remarkable technical problem in the so-called full line type ink jet head.

[0009]

SUMMARY OF THE INVENTION The main object of the present invention is to provide:
The ink jet head can solve the above-mentioned technical problem and remarkably improve the reliability of the head itself by devising a structure of a wiring electrode portion of the ink jet head of a method of discharging ink using thermal energy. It is to provide.

Another object of the present invention is to devise a structure of an electrothermal converter having a heating resistor layer and an electrode connected to the heating resistor layer for generating thermal energy used for discharging ink. In order to solve the technical problems such as yield reduction due to disconnection etc. caused by defects that may occur in the electrothermal transducer, it is possible to solve the problem while mainly keeping thermal energy from affecting the strength of the head It is an object of the present invention to provide an ink jet head capable of performing the above.

[0011] Still another object of the present invention is to provide an ink-jet head in which a plurality of electrothermal transducers for generating thermal energy used for ejecting ink are arranged on a substrate at high density. An object of the present invention is to provide an ink jet head which can solve the above technical problem with a relatively simple structural device.

Another object of the present invention is to provide a large number of ejection ports for ejecting ink over the entire width of a recording area of a recording member on which recording is to be performed. An ink jet head that can solve the above-mentioned technical problem that tends to be more apparent in a full line type ink jet head in which a large number of electrothermal transducers are arranged on a substrate with a relatively simple structure. It is to provide.

Still another object of the present invention is to provide a substrate for an ink jet head used for the above-described ink jet head, an ink jet apparatus having the head, and a method of manufacturing a substrate for an ink jet head.

The inventor of the present invention has earnestly studied to achieve the above-mentioned object, and as a result, has obtained knowledge based on the following configuration. That is, in the production of a conventional head base,
It has been practiced to provide a pair of first wiring electrode layers on a substrate via a first electrode adhesion layer. In this case, the present inventor has attempted to construct a stacked structure by further providing a pair of second wiring electrode layers thereon with a second electrode adhesion layer interposed therebetween.

As a result, the following has been found. In other words, by adopting such a configuration, even if a defect such as a defect or disconnection occurs in one of the provisional command wiring electrodes, the defect can be covered by the other wiring electrode layer. It is a finding that the adverse effect can be substantially reduced to zero, which leads to a remarkable improvement in the production yield of the inkjet head.

The present inventors have applied this finding to the manufacture of a head base. When the presence or absence of disconnection of the wiring electrode was examined for the obtained head substrate, the occurrence rate of disconnection was remarkably reduced as compared with the related art. Also, an ink jet head is created from the obtained head substrate,
It was mounted on the apparatus main body and ink was actually ejected to perform recording. As a result, it was found that the inkjet head achieves the above object of the present invention.

The completed ink jet head substrate according to the present invention comprises a pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wiring electrodes. A pair of second wiring electrode layers provided on a corresponding one of the electrode layers with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer is formed by the first electrode adhesion layer; And the second
And a heating resistance layer that generates heat when a voltage is applied through the wiring electrode layer.

Further, the substrate for an ink jet head of the present invention corresponds to a pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wiring electrode layers. And a pair of second wiring electrode layers provided thereon with a second electrode adhesion layer interposed therebetween, wherein the second electrode adhesion layer comprises a pair of the first and second wirings. It is characterized by including a heating resistance layer that generates heat by applying a voltage through the electrode layer.

The present invention further includes an ink-jet head using the above-described ink-jet head substrate, an ink-jet apparatus having the head, and a method of manufacturing the ink-jet head substrate.

An embodiment of the present invention will be described below in detail with reference to the drawings.

FIGS. 4 (a), 4 (b) through 8 (a),
(B), (c) is a schematic diagram which shows the manufacturing process of the base material for inkjet heads which concerns on one Example of this invention.
In each of the drawings, (a) is a top view, (b) is a cross-sectional view taken along line BB 'in (a), and (c) is a cross-sectional view taken along line AA' in (a). FIG. In these drawings, FIG.
In the drawings other than the above, the reference numerals AA 'and BB' are omitted, but all of them are the same parts as those in FIG. 5 viewed from the same direction.

First, as shown in FIGS. 4A and 4B, an insulating substrate made of alumina having a glaze layer on its surface, silicon having a thermally oxidized SiO ₂ layer on its surface, or glass. HfB ₂ , TaAl, Ta
A heating resistance layer made of Si, CrSiO, TiO ₂ or the like and T
a material layer of the first electrode adhesion layer 42 in which layers made of i, Cr, Ni, Mo, W, etc. are laminated in this order from the bottom;
A material layer of the first wiring electrode layer 43 made of l, Cu, Au or the like is formed. In the drawings (for example, FIG. 4), the same reference numerals as those after patterning are also given to the layers before patterning which are provided as solid material layers on one surface, for the sake of simplicity.

Next, as shown in FIGS. 5A, 5B, and 5C, a photoresist (not shown) is applied, and is exposed, developed, baked, and the like. Subsequently, the material layer of the first electrode adhesion layer 42 and the material layer of the first wiring electrode layer 43 are patterned by performing etching and resist peeling, and the pattern of the first electrode adhesion layer 42 and the first The pattern of the wiring electrode layer 43 is formed. In the present example, for example, in the A ″ portion, the first electrode adhesion layer 42 and the first wiring electrode layer 43 are disconnected due to a photoresist defect or the like.

Subsequently, as shown in FIGS. 6A, 6B and 6C, the material layer of the second electrode adhesion layer 44 made of Ti, Cr, Ni, Mo, W, etc. And a material layer of the second wiring electrode layer 45 made of Cu, Au, or the like. In this case, the second electrode adhesion layer 44 serves as the second wiring electrode layer 45
Has etching selectivity with respect to That is, the second electrode adhesion layer 44 is formed of a material that is not etched by an etching solution for etching the second wiring electrode layer 45. Here, the exposed portion in the defective portion A ″ is covered with a material layer of the second electrode adhesion layer 44 and a material layer of the second wiring electrode layer 45.

Subsequently, FIG. 7A, FIG.
As shown in (c), the second wiring electrode 45 is formed by photolithography in the same manner as described above.
The second wiring electrode 45 is formed by patterning with a photoresist, etching a material layer of the second wiring electrode 45,
It is formed by etching the material layer of the second electrode adhesion layer 44 and removing the photoresist. At this time, as shown in the drawing, a part of the second electrode adhesion layer 44 and a part of the second wiring electrode layer 45 are removed by etching to form a heat generating portion forming portion 51. Here, for example, even if a defect of the second wiring electrode 45 due to a defect of the photoresist or the like occurs in the B ″ portion in the drawing, the lower layer (the first wiring electrode layer 43 or the first electrode adhesion layer 42) may be formed. ) Is not affected, so that the circuit is not broken.

Next, as shown in FIGS. 8A, 8B and 8C, the second wiring electrode layer 43 in the heat generating portion forming portion 51 is formed by photolithography in the same manner as described above. Is etched to form a first electrode adhesion layer 42 thereunder.
Is exposed to form the heat generating portion 50. At this time, as described above, the second electrode adhesion layer 44 becomes the second wiring electrode layer 45.
Therefore, even if a defect occurs in the second wiring electrode layer 45 due to a photoresist defect or the like, the lower layer (the first wiring electrode layer 43 or the first electrode The defect does not reach the layer 42).

On the laminated structure of the thin films formed on the substrate as described above, for example, a SiO ₂ layer is formed as a protective layer by sputtering, and the formation of the substrate for the ink jet head is completed.

It should be noted that the combination of the materials forming the laminated structure of the first wiring electrode layer / the second electrode adhesion layer / the second wiring electrode layer in the present embodiment is an Al layer / T
i layer / Al layer, Al layer / Cr layer / Al layer, Cu layer / Ti
Layer / Cu layer, Au layer / Ni layer / Au layer, Al layer / TaS
An i-layer / Cu layer and the like can be mentioned as preferable ones. Among them, Al layer / Ti layer / Al layer is most preferable.

Next, another embodiment of the present invention will be described in detail with reference to the drawings.

FIGS. 9 (a) and 9 (b) to FIGS. 13 (a), (b) and (c) are schematic views showing the steps of manufacturing a substrate for an ink jet head according to another embodiment of the present invention. FIG. In each drawing, (a) is a top view, (b) is a cross-sectional view taken along the line BB 'in (a), (c)
The figure is a cross-sectional view taken along the line AA 'of FIG. In these drawings other than FIG. 10, reference numerals AA 'and BB' are omitted in the drawings other than FIG. .

First, as shown in FIGS. 9A and 9B, for example, Ti, Cr, Cr, Ni, Mo, W, etc. are placed on an insulating substrate 21 made of the same material as in the above-described embodiment. And a material layer of the first electrode adhesion layer 22 of Al, Cu, A
A material layer of the first wiring electrode layer 23 made of u or the like is formed. Note that, in the drawings (for example, FIG. 9), the same reference numerals as those after patterning are given for simplicity to the layers before patterning which are provided as a material layer in a one-sided solid state.

Next, as shown in FIGS. 10A, 10B, and 10C, a photoresist (not shown) is applied, and is exposed, developed, baked, and the like. Subsequently, patterning of the material layer of the first electrode adhesion layer 22 and the material layer of the first wiring electrode layer 23 is completed by performing etching and resist stripping. Here, the first electrode adhesion layer 2
An intermittent portion is formed in the second and first wiring electrode layers 23 as the heat generating portion forming portion 31. In this example, for example, in the A ″ portion, the first electrode adhesion layer 22 and the first wiring electrode layer 23 are disconnected due to a defect of the photoresist or the like.

Subsequently, (a), (b) and (c) of FIG.
HfB ₂ , TaAl, TaSi, CrS
iO, the heating resistor layer made of TiO ₂ or the like and Ti, Cr, N
a material layer of the second electrode adhesion layer 24 in which layers made of i, Mo, W, etc. are laminated in this order from the bottom, and Al, Cu, Au
And a second wiring electrode layer 25 made of the same. In this case, the second electrode adhesion layer 24 has etching selectivity with respect to the second wiring electrode layer 25. That is, the second electrode adhesion layer 24 is formed of a material that is not etched by the etching solution for etching the second wiring electrode layer 25. Here, the exposed portion in the defective portion A ″ is the second portion.
Material layer of the electrode adhesion layer 24 and the second wiring electrode layer 25
Material layer.

Subsequently, FIGS. 12 (a), (b),
As shown in (c), the second wiring electrode 25 is formed by photolithography in the same manner as described above.
This second wiring electrode 25 is formed by patterning with a photoresist, etching the material layer of the second wiring electrode 25,
It is formed by removing the second electrode adhesion layer 24 by etching and removing the photoresist. Here, for example, even if a defect of the second wiring electrode 25 due to a defect of the photoresist or the like occurs in the B ″ part in the drawing, the lower layer (the first wiring electrode layer 23 or the first electrode adhesion layer 22) may be formed. ) Does not reach the defect, so that the circuit is not broken.

Next, FIGS. 13 (a), (b) and (c)
As shown in FIG. 5, a part of the second wiring electrode layer 25 (the heat generating portion forming portion 31) is etched by the photolithography method in the same manner as described above, and the second electrode adhesion layer 24 is formed.
Is exposed to form a heat generating portion 30. At this time, as described above, since the second electrode adhesion layer 24 is not etched by the etchant for the second wiring electrode layer 25, no defect occurs in the second electrode adhesion layer 24.
It is exposed as the heating part 30. In this step, even if a defect in the second wiring electrode layer 25 occurs due to a defect in the photoresist or the like, in this example, a lower layer (the first wiring electrode layer 2
3 and the first electrode adhesion layer 22) are not affected.

On the laminated structure of the thin films formed on the substrate as described above, for example, an SiO ₂ layer is formed as a protective layer by sputtering, and the formation of the substrate for the ink jet head is completed.

It should be noted that the combination of the materials forming the laminated structure of the first wiring electrode layer / second electrode adhesion layer / second wiring electrode layer in this embodiment is an Al layer / T
i layer + resistive material layer / Al layer, Al layer / Cr layer + resistive material layer / Al layer, Cu layer / Ti layer + resistive material layer / Cu layer, A
u layer / Ni layer + resistance material layer / Au layer, Al layer / TaSi
Layer / Cu layer and the like can be mentioned as preferable ones. Among them, Al layer / Ti layer + resistance material layer / A
One layer is most preferred.

In this embodiment, since the step of sputter etching is performed before forming the material layer of the heat-generating resistor layer, the surface on which the film is formed is smoothed and cleaned, and the heat-generating resistor layer is adhered. Performance can be improved.

As described in the above embodiment,
In order to prevent disconnection of the wiring electrode due to a photoresist defect or a defect during film formation, a material having etching selectivity with respect to the second wiring electrode layer is used as the material of the second electrode adhesion layer 44. That is, the second wiring electrode layer 45
A material that is not etched is selected and used depending on an etching material for etching the material. For example, Al is used as a material of the first wiring electrode layer 43 and the second wiring electrode layer 45, Ti is used as a material of the second electrode adhesion layer 44,
A mixed solution of acetic acid, phosphoric acid, and nitric acid is used as an etchant for Al, which is a material of the second wiring electrode layer 45, and CF ₄ is used for Ti, which is a material of the second electrode adhesion layer 44. When active plasma etching is performed, Al, which is the material of the second wiring electrode layer 45, is etched by the etching mixture, but Ti, which is the material of the second electrode adhesion layer 44, is not etched. Next, when the same photoresist is used and reactive plasma etching is performed on Ti as a material of the second electrode adhesion layer 44 with CF ₄ , the second electrode adhesion layer 44 is etched. Al, which is the material of the first wiring electrode layer 43, is not etched. Therefore, for example, even at the defective portion B ″, the first wiring electrode layer 43 is not etched, so that the wiring electrode is not disconnected.

Further, if there is a defect in the photoresist for forming the first wiring electrode layer, the wiring electrode is etched at the time of forming the first wiring electrode layer, for example, as indicated by the portion A ″ in FIG. However, since the second wiring electrode layer 45 is formed thereon, the defective portion is covered, so that the disconnection does not occur in the A ″ portion.

In addition, in the above-described manufacturing process of the ink jet head substrate, the probability that the defective portion A ″ and the defective portion B ″ occur at the same place is that the defective portion A ″ and the defective portion B ″ are respectively Since the probability of occurrence of a single layer is extremely small, substantially zero, defects generated in each layer do not remain affected until the completion of manufacturing.
As a result, the disconnection of the wiring electrode can be substantially reduced to zero, the yield during the manufacturing process is remarkably improved, and the cost is greatly reduced.

FIG. 14 is a schematic perspective view showing an example of an ink-jet head manufactured using the ink-jet head substrate manufactured as described above. Substrate 110
2. Heating portion 110 of electrothermal transducer including electrode 1104 on 2
3 (the protective layer is not shown), on which the ink path wall 1105 and the top plate 1106 are provided. The ink 1112 is supplied from a not-shown ink storage chamber to a common ink chamber 1108 of the inkjet head 1101 through an ink supply pipe 1107. In the figure, reference numeral 1109 denotes an ink supply tube connector. The ink 1112 supplied to the common ink chamber 1108 is supplied to the ink path 1110 by a so-called capillary phenomenon, and the ejection port 11 communicates with the ink path.
The stabilization is maintained by forming a mechanic at 11. Then, when the heat generating portion 1103 of the electrothermal transducer generates heat, the ink on the heat generating portion 1103 is rapidly heated, and bubbles are formed in the ink in the ink path, and the ink is discharged from the discharge port 1111 based on the bubble. . In this figure,
A multi-ejection port ink jet head having 128 or 256 ejection ports is shown in a high-density ejection port array having an ejection port density of 16 / mm.

FIG. 15 is a schematic perspective view showing a main part of an example of an ink jet apparatus equipped with the ink jet head shown in FIG. This ink jet device is a so-called serial scanning type device. In the figure, the ink jet head 208 includes a guide shaft 2
The recording paper 202 is removably mounted on a carriage 206 guided by the recording paper 05 and scans in a direction substantially perpendicular to the conveying direction of the recording paper 202. Reference numeral 201 denotes a transport roller that transports the recording paper 202 to a desired position along a platen 203. Reference numeral 204 denotes the state of the discharge port at the home position H.
It is a recovery means for keeping good at p. The recovery means includes an elastic cap for covering the ejection port, a suction pump for sucking ink from the ejection port, and the like.

The driving of the recording paper transporting means, the head scanning means and the ejection recovery means, and the driving of the recording head of the ink jet recording apparatus are performed in accordance with commands and signals output from control means including a CPU of the apparatus main body. It is controlled based on.

FIG. 16 is a schematic perspective view showing an example of a full-line type ink jet recording head provided with, for example, 1000 or more ejection ports corresponding to the entire width of the recording area of the recording paper. An inkjet head substrate 111 on which a plurality of semiconductor devices 112 such as a driving IC are mounted is juxtaposed on the support plate 102 together with the flexible cable 104,
Flexible cable holding members 105 and 4 having rigidity
The two screws 106 are pressed via a pressing rubber 107 which is an elastic body, so that the wiring portion of the base 111 and the flexible cable 104 are mechanically fixed and electrically connected. Reference numeral 103 denotes an ink supply tube for supplying ink from both sides into the common ink chamber of the head, and is formed of an elastic tube. A part of the common ink chamber is formed by a concave portion provided in a member made of resin, and a part of the discharge port 101 is formed similarly. These are adhered and fixed on the base 111 to form an ink jet head.

FIG. 17 is a schematic perspective view showing an outline of an ink jet recording apparatus equipped with a full line type ink jet recording head. In the figure, reference numeral 365 denotes a transport belt for transporting a recording member such as paper. The transport belt 365 transports a recording member (not shown) as the transport roller 364 rotates. The lower surface of the ink jet recording head 332 is an ejection port surface 331 in which a plurality of ejection ports are arranged corresponding to the recording area of the member to be recorded.

[0047]

According to the present invention, it is possible to prevent a disconnection or the like caused by a defect that may occur in the electrothermal transducer of the ink jet head substrate, and to prevent a reduction in manufacturing yield.

[0048]

The present invention will be described in more detail with reference to the following examples.

Example 1 HfB ₂ was placed in a vacuum chamber on a support 41 made of a Si single crystal having a SiO ₂ film (film thickness: 2.75 μm) formed by thermal oxidation on the surface. (Purity 9
(9.9% or more) as a target to perform sputtering, whereby an HfB ₂ layer (layer thickness: 1) serving as a heating resistance layer
000 °). The conditions for this sputtering are:
It was as follows.

Sputtering conditions Target area: 8 inchφ High frequency power: 1500 W Support setting temperature: 100 ° C. Film formation time: 20 minutes Base pressure: 1 × 10 ⁻⁵ Pa or less Sputtering gas: argon Sputtering gas pressure: 0.5 Pa The target was switched to Ti (purity of 99.9% or more), and sputtering was performed in the same manner as described above except for the film forming time: 1 minute to form a Ti layer (layer thickness: 50 °). In this embodiment, the lamination of the HfB ₂ layer and the Ti layer becomes the first electrode adhesion layer 42.

Further, the target was Al (purity: 99.9%).
The sputtering was performed in the same manner as described above except for the high-frequency power: 5000 W and the film formation time: 6 minutes to form an Al layer (film thickness: 4500 °) to be the first wiring electrode layer 43 ( As described above, FIG.
(B)).

Subsequently, the lamination of the HfB ₂ layer and the Ti layer and the Al layer were patterned by photolithography as follows. First, a photoresist (trade name: OFPR800, manufactured by Tokyo Ohka Co., Ltd.) is applied on the Al layer as a layer (layer thickness: 1.3 μm), which is exposed, developed, and baked in a conventional manner. did. Then
The Al layer was etched using a mixture of acetic acid, phosphoric acid and nitric acid (acetic acid 9% by weight, phosphoric acid 73% by weight, nitric acid 2% by weight, balance 16% by weight) as an etching solution. After that, the stack of the HfB ₂ layer and the Ti layer is etched by reactive etching in a vacuum chamber,
The photoresist was removed to complete the patterning (pattern width: 12 μm, number of patterns: 4736).
The conditions of this reactive etching were as follows.

Reactive etching conditions High-frequency power: 450 W Etching time: 5 minutes Base pressure: 1 × 10 ⁻³ Pa or less Etching gas: BCl ₃ etching gas pressure: 3 Pa (see FIGS. 5A to 5C) Next, Ti (purity 99.9% or more) in a vacuum chamber
A Ti layer (layer thickness: 200 °) to be the second electrode adhesion layer 44 was formed by performing sputtering under the same sputtering conditions as described above except that the film formation time was 4 minutes.

Further, the target was Al (purity: 99.9%).
Sputtering was performed in the same manner as described above except for the high-frequency power: 5000 W and the deposition time: 2 minutes to form an Al layer (film thickness: 1500 °) to be the second wiring electrode layer 45 ( As described above, FIG.
(C)).

Subsequently, the Ti layer and the Al layer were patterned by photolithography as follows. First, the same photoresist as described above was applied as a layer (layer thickness: 1.3 μm) on the Al layer, and was exposed, developed, and baked in a conventional manner. Then
The Al layer was etched using the same etching solution as described above. Thereafter, in a vacuum chamber, etching time: 4 minutes Etching gas: Reactive etching conditions other than CF ₄ are the same as those described above, the Ti layer is etched by reactive etching, and the photoresist is removed to complete the patterning. (Pattern width: 8 μm, number of patterns: 4736)
(See FIGS. 7A to 7C).

Next, the Al to be the first wiring electrode layer 43
The layers were patterned by photolithography as follows. First, the same photoresist as described above is applied as a layer (layer thickness: 1.3 μm) on the Al layer,
Exposure, development, and baking were performed on the film in a conventional manner. Next, using the same etching solution as described above,
The layer was etched, and the photoresist was removed to form 4736 heating parts having a size of 20 μm × 100 μm (see FIGS. 8A to 8C).

On the laminated structure of the thin films formed on the substrate as described above, S was formed as a protective layer by sputtering.
An iO ₂ layer was formed (layer thickness: 1.3 μm), and the formation of the inkjet head substrate according to this example was completed.

On the ink jet head substrate thus formed, a wall of an ink path 1110 communicating with the discharge port 1111 is formed using a photosensitive resin, and a glass top plate 1106 is further formed thereon. By providing
4 was obtained. This ink jet head had 4736 ejection ports corresponding to the above-described heat generating portions.

This ink jet head has a total of 10
0 were created.

Example 2 The first electrode adhesion layer 22 was formed on the same support 21 as in Example 1 by sputtering in a vacuum chamber using Ti (purity of 99.9% or more) as a target. A Ti layer (layer thickness: 50 °) was formed. The conditions for this sputtering were as follows.

Sputtering conditions Target area: 8 inchφ High frequency power: 1500 W Support setting temperature: 100 ° C. Film formation time: 1 minute Base pressure: 1 × 10 ⁻⁵ Pa or less Sputtering gas: argon Sputtering gas pressure: 0.5 Pa

Next, the target was Al (purity: 99.9%).
Sputtering was performed in the same manner as described above except for the high-frequency power: 5000 W and the film formation time: 6 minutes to form an Al layer (film thickness: 4500 °) to be the first wiring electrode layer 23 ( As described above, FIG.
(B)).

Subsequently, the Ti layer and the Al layer were patterned by photolithography as follows. First, the same photoresist as in Example 1 was applied as a layer (thickness: 1.3 μm) on the Al layer, and this was exposed, developed, and baked in a conventional manner. Next, using the same etching solution as in Example 1, the Al layer was etched, and then the photoresist was removed. After that, the T
The i-layer was patterned (pattern width: 8 μm, number of patterns: 4736). The conditions of this sputter etching were as follows.

Sputter etching conditions High frequency power: 500 W Etching time: 2 minutes Etching gas: Argon Etching gas pressure: 0.5 Pa (see above, FIGS. 10A to 10C) Subsequently, HfB ₂ was placed in a vacuum chamber. (Purity 99.9%
The HfB ₂ layer (thickness: 1000 °) serving as a heat-generating layer was formed by performing sputtering under the same conditions as described above except that the film formation time was 20 minutes.

Next, the target was Ti (purity 99.9%).
Above), and sputtering is performed under the same conditions as the above-described Ti sputtering, and a Ti layer (layer thickness: 50 °)
Was formed. In this embodiment, the lamination of the HfB ₂ layer and the Ti layer becomes the second electrode adhesion layer 24.

Further, the target was Al (purity: 99.9%).
The sputtering was performed in the same manner as described above except for the high-frequency power: 5000 W and the film formation time: 2 minutes, thereby forming an Al layer (film thickness: 1500 °) to be the second wiring electrode layer 25 ( As described above, FIG.
(C)).

Subsequently, the lamination of the HfB ₂ layer and the Ti layer and the Al layer were patterned by photolithography as follows. First, the same photoresist as described above was applied as a layer (layer thickness: 1.3 μm) on the Al layer, and was exposed, developed, and baked in a conventional manner. Next, the Al layer was etched using the same etching solution as described above. Then, in a vacuum chamber, reactive etching conditions High frequency power: 450 W Etching time: 5 minutes Base pressure: 1 × 10 ⁻³ Pa or less Etching gas: BCl ₃ Etching gas pressure: 3 Pa HfB ₂ layer and Ti layer And the photoresist was removed to complete the patterning (pattern width: 12 μm, number of patterns: 4736) (see FIGS. 12A to 12C).

Next, the Al to be the first wiring electrode layer 23 is formed.
The layers were patterned by photolithography as follows. First, the same photoresist as described above is applied as a layer (layer thickness: 1.3 μm) on the Al layer,
Exposure, development, and baking were performed on the film in a conventional manner. Next, using the same etching solution as described above,
The layer was etched, and the photoresist was removed to form 4736 heating portions having a size of 20 μm × 100 μm (see FIGS. 13A to 13C).

On the laminated structure of the thin films formed on the substrate as described above, S was formed as a protective layer by sputtering.
An iO ₂ layer was formed (layer thickness: 1.3 μm), and the formation of the inkjet head substrate according to this example was completed.

On the ink jet head substrate thus formed, a wall of an ink path 1110 communicating with the discharge port 1111 is formed using a photosensitive resin, and a glass top plate 1106 is further formed thereon. By providing
4 was obtained. This ink jet head had 4736 ejection ports corresponding to the above-described heat generating portions. A total of 100 ink jet heads were made.

(Comparative Example 1) An example was performed except that the second electrode adhesion layer 44 and the second wiring electrode layer 45 were not provided, and the layer thickness of the first wiring electrode layer 43 was set to 6000 °. In the same manner as in Example 1, a substrate for an inkjet head and an inkjet head having the substrate were prepared.

This ink jet head has a total of 10
0 were created.

Comparative Example 2 An example was performed except that the second electrode adhesion layer 24 and the second wiring electrode layer 25 were not provided, and the thickness of the first wiring electrode layer 23 was set to 6000 °. In the same manner as in 2, an ink jet head substrate and an ink jet head provided with the substrate were prepared.

This ink jet head has a total of 10
0 were created.

(Comparative Experiment) With respect to each of the 100 ink jet head substrates obtained in Example 1, Example 2, Comparative Example 1, and Comparative Example 2, the presence or absence of disconnection at the wiring electrode was inspected. As a result, Examples 1 and 2 were compared with Comparative Examples 1 and 2.
The incidence of disconnection was almost halved.

Also, 100 ink jet heads each obtained in Example 1, Example 2, Comparative Example 1, and Comparative Example 2 were mounted on the same apparatus main body, and recording was performed by actually discharging ink. Was. As a result, compared to Comparative Examples 1 and 2, the recording quality of the ink jet heads of Example 1 and Example 2 was much better.

The present invention has an excellent effect in a recording head and a recording apparatus of a type in which ink is ejected using thermal energy.

The typical configuration and principle are described, for example, in US Pat. Nos. 4,723,129 and 4,740.
It is preferable to use the basic principle disclosed in the specification of Japanese Patent No. 796. This method can be applied to both the so-called on-demand type and the continuous type. In particular, in the case of the on-demand type, liquid (ink)
By applying at least one drive signal corresponding to the recorded information and providing a rapid temperature rise exceeding nucleate boiling, to the electrothermal transducer disposed corresponding to the sheet or the liquid path in which is held, This is effective because thermal energy is generated in the electrothermal transducer, and the film is boiled on the heat-acting surface of the recording head. As a result, bubbles in the liquid (ink) can be formed in one-to-one correspondence with the drive signal. The liquid (ink) is ejected through the ejection opening by the growth and contraction of the bubble to form at least one droplet. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are performed immediately and appropriately, so that the ejection of a liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable. Examples of the drive signal in the form of a pulse include those described in U.S. Pat.
Suitable are those described in US Pat. No. 45,262. If the conditions described in U.S. Pat. No. 4,313,124 relating to the temperature rise rate of the heat acting surface described above are adopted, more excellent recording can be performed.

As the configuration of the recording head, in addition to the combination of the discharge port, the liquid path, and the electrothermal converter (linear liquid flow path or right-angle liquid flow path) as disclosed in the above-mentioned respective specifications, U.S. Pat. No. 4,558,333 and U.S. Pat.
A configuration using the specification of Japanese Patent No. 459600 is also included in the present invention. In addition, Japanese Unexamined Patent Publication No. Sho 59-123670 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal converter for a plurality of electrothermal converters. The present invention is also effective as a configuration based on JP-A-59-138461 which discloses a configuration corresponding to a discharge unit.

Further, as a full-line type recording head having a length corresponding to the width of the maximum recording medium that can be recorded by the recording apparatus, a combination of a plurality of recording heads disclosed in the above-mentioned specification is used. Either a configuration that satisfies the length or a configuration as one integrally formed recording head may be used, but the present invention can more effectively exert the above-described effects.

In addition, the print head is replaceable with a print head of a replaceable chip type, which can be electrically connected to the main body of the apparatus or supplied with ink from the main body of the apparatus, or is integrated with the print head itself. The present invention is also effective when a cartridge-type recording head provided in a fixed manner is used.

It is preferable to add recovery means for the printhead, preliminary auxiliary means, and the like provided as components of the printing apparatus of the present invention, since the effects of the present invention can be further stabilized. To be more specific, a capping unit, a cleaning unit, a pressure or suction unit, a preheating unit using an electrothermal converter, another heating element, or a combination thereof, for the recording head. ,
Performing a preliminary ejection mode in which ejection is performed separately from printing is also effective for performing stable printing.

Further, the recording mode of the recording apparatus is not limited to the recording mode of only the mainstream color such as black, but may be a single recording head or a combination of a plurality of recording heads. The present invention is also very effective for an apparatus provided with at least one of full colors by color mixture.

In the embodiments of the present invention described above, the description is made using the liquid ink. However, in the present invention, the ink which is solid at room temperature or the ink which becomes soft at room temperature is used. Can be used. In general, in the above-described ink jet device, the temperature of the ink itself is adjusted within a range of 30 ° C. or more and 70 ° C. or less to control the temperature so that the viscosity of the ink is in a stable ejection range. It is sufficient if the ink is in a liquid state.
In addition, positively prevent the temperature rise due to thermal energy by using the energy of the state change of the ink from the solid state to the liquid state, or use ink that solidifies in a standing state to prevent evaporation of the ink. In any case, heat energy is applied by heat energy, such as one in which ink is liquefied and ejected as an ink liquid by application of heat energy according to a recording signal, or one which already starts to solidify when reaching a recording medium. The use of an ink that liquefies for the first time is also applicable to the present invention. In such a case, as described in JP-A-54-56847 or JP-A-60-71260, the ink is held as a liquid or solid substance in the concave portion or through hole of the porous sheet, It is good also as a form which opposes an electrothermal transducer. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

[0085]

As described above, according to the present invention,
In the inkjet head substrate, disconnection or the like caused by a defect that may occur in the electrothermal transducer can be prevented, and a decrease in manufacturing yield can be prevented.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are a schematic top view and a schematic cross-sectional view showing an example of a conventional ink jet head substrate in accordance with a manufacturing process.

FIGS. 2 (a) and 2 (b) are a schematic top view and a schematic cross-sectional view showing an example of a conventional base for an ink jet head according to its manufacturing process.

FIGS. 3A and 3B are a schematic top view and a schematic cross-sectional view showing an example of a conventional ink-jet head substrate according to a manufacturing process thereof.

FIGS. 4 (a) and 4 (b) are a schematic top view and a schematic cross-sectional view illustrating a substrate for an inkjet head according to an embodiment of the present invention in accordance with the manufacturing process.

FIGS. 5A, 5B, and 5C are a schematic top view and a schematic cross-sectional view illustrating a substrate for an inkjet head according to an embodiment of the present invention in accordance with the manufacturing process. is there.

FIGS. 6A, 6B, and 6C are a schematic top view and a schematic cross-sectional view illustrating a substrate for an inkjet head according to an embodiment of the present invention in accordance with the manufacturing process. is there.

FIGS. 7A, 7B, and 7C are a schematic top view and a schematic cross-sectional view illustrating a substrate for an inkjet head according to an embodiment of the present invention in accordance with the manufacturing process. is there.

FIGS. 8A, 8B, and 8C are a schematic top view and a schematic cross-sectional view showing a substrate for an inkjet head according to an embodiment of the present invention in accordance with the manufacturing process. is there.

FIGS. 9A and 9B are a schematic top view and a schematic sectional view showing an inkjet head substrate according to another embodiment of the present invention in accordance with the manufacturing process.

FIGS. 10 (a), (b), and (c) show a substrate for an inkjet head according to another embodiment of the present invention.
It is a schematic top view and a schematic sectional view shown according to the manufacturing process.

FIGS. 11A, 11B, and 11C show an inkjet head substrate according to another embodiment of the present invention.
It is a schematic top view and a schematic sectional view shown according to the manufacturing process.

FIGS. 12A, 12B, and 12C show an inkjet head substrate according to another embodiment of the present invention.
It is a schematic top view and a schematic sectional view shown according to the manufacturing process.

FIGS. 13A, 13B, and 13C show an inkjet head substrate according to another embodiment of the present invention.
It is a schematic top view and a schematic sectional view shown according to the manufacturing process.

FIG. 14 is a schematic perspective view illustrating an example of an inkjet head.

FIG. 15 is a schematic perspective view showing an inkjet apparatus to which the inkjet head shown in FIG. 14 is mounted.

FIG. 16 is a schematic perspective view showing an example of a full-line type ink jet head provided with discharge ports over the entire width of a recording area of a recording member.

FIG. 17 is a schematic perspective view showing an outline of an ink jet apparatus equipped with a full line type ink jet head.

[Explanation of symbols]

 21, 41 Insulating substrate 22, 42 First electrode adhesion layer 23, 43 First wiring electrode layer 24, 44 Second electrode adhesion layer 25, 45 Second wiring electrode layer 30, 50 Heating resistance layer (heating part) 31, 51 Heat generation resistance layer forming portion 101 Discharge port 102 Support member 103 Ink supply tube 104 Flexible cable 105 Flexible cable pressing member 106 Screw 107 Pressing rubber 111 Ink jet head base 112 Semiconductor device 201 Transport roller 202 Recording paper 203 Platen 204 Ink Recovery system 205 Guide shaft 206 Carriage 207 Belt transmission mechanism 208 Inkjet recording head 331 Discharge port surface 332 Inkjet recording head 364 Conveying roller 365 Conveying belt 1101 Inkjet head 1102 Substrate 1103 Heating section 1 04 electrode 1105 ink path walls 1106 ceiling plate 1107 ink supply pipe 1108 common ink chamber for 1109 ink supply tube connector 1110 ink path 1111 ejection openings 1112 ink

Claims (19)

(57) [Claims] 1. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. A pair of second wiring electrode layers provided on the electrode layer with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer is formed by the pair of first and second wiring layers. A base for an ink jet head, comprising: a heat generating resistance layer that generates heat by applying a voltage through a wiring electrode layer. 2. The ink jet head substrate according to claim 1, wherein said second electrode adhesion layer is formed of a material having etching selectivity with respect to said second wiring electrode layer. 3. The substrate for an ink jet head according to claim 1, wherein the first electrode adhesion layer has a laminated structure including the heating resistance layer. 4. A combination of materials forming a laminated structure of the first wiring electrode layer / the second electrode adhesion layer / the second wiring electrode layer is Al layer / Ti layer / Al layer, Al layer
2. The substrate for an ink jet head according to claim 1, wherein the substrate is any one of a layer / Cr layer / Al layer, a Cu layer / Ti layer / Cu layer, an Au layer / Ni layer / Au layer, and an Al layer / TaSi layer / Cu layer. . 5. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. A pair of second wiring electrode layers provided on the electrode layer with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer is formed by the pair of first and second wiring layers. An ink-jet head base including a heat-generating resistor layer that generates heat by application of a voltage via a wiring electrode layer; and on the base, an ink path communicating with a discharge port that discharges ink is provided with the pair of first and second ink paths. And a heating portion of the heating resistor layer located between the second wiring electrode layers, and is provided to discharge ink from the discharge ports using heat energy generated by the heating portion. Characteristic inkjet head. 6. The ink-jet head according to claim 5, wherein said ink-jet head is a full-line type having a plurality of said discharge ports over the entire width of a recording area of a recording member. 7. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. A pair of second wiring electrode layers provided on the electrode layer with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer is formed by the pair of first and second wiring layers. An ink-jet head base including a heat-generating resistor layer that generates heat by application of a voltage via a wiring electrode layer; and on the base, an ink path communicating with a discharge port that discharges ink is provided with the pair of first and second ink paths. An ink jet head which is provided corresponding to a heat generating portion of the heat generating resistance layer located between the second wiring electrode layer and discharges ink from the discharge port using thermal energy generated by the heat generating portion. And the ink discharged from the discharge port of the inkjet head. An ink jet apparatus, comprising: a conveying unit that conveys a recording member on which recording is performed. 8. The ink jet apparatus according to claim 7, wherein the ink jet head is a full line type having a plurality of the ejection ports over the entire width of a region on the recording member where recording is performed. 9. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. A pair of second wiring electrode layers provided on the electrode layer with a second electrode adhesion layer interposed therebetween, wherein the second electrode adhesion layer is provided with the pair of first and second electrodes. A base for an ink jet head, comprising: a heat generating resistance layer that generates heat by applying a voltage through a wiring electrode layer. 10. The substrate for an ink jet head according to claim 9, wherein said second electrode adhesion layer is formed of a material having etching selectivity with respect to said second wiring electrode layer. 11. The substrate for an ink jet head according to claim 9, wherein said second electrode adhesion layer has a laminated structure including said heat generating resistance layer. 12. The combination of materials forming a laminated structure of the first wiring electrode layer / second electrode adhesion layer / second wiring electrode layer is Al layer / Ti layer + resistive material layer / Al
Layer, Al layer / Cr layer + resistance material layer / Al layer, Cu layer / T
The inkjet head substrate according to claim 9, wherein the substrate is any one of an r layer + a resistance material layer / Cu layer, an Au layer / Ni layer + a resistance material layer / Au layer, and an Al layer / TaSi layer / Cu layer. 13. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. On the electrode layer,
And a pair of second wiring electrode layers provided via a second electrode adhesion layer, wherein the second electrode adhesion layer is provided via the pair of first and second wiring electrode layers. A substrate for an ink-jet head including a heat-generating resistor layer that generates heat by the application of a voltage, wherein an ink path communicating with a discharge port for discharging ink is provided on the substrate with the pair of first and second wiring electrodes. An ink jet head which is provided corresponding to a heat generating portion of the heat generating resistive layer located between the layers, and discharges ink from the discharge port using thermal energy generated by the heat generating portion. 14. The ink-jet head according to claim 13, wherein said ink-jet head is a full-line type having a plurality of said discharge ports over the entire width of a recording area of a recording member. 15. A pair of first wiring electrode layers provided on a substrate via a first electrode adhesion layer, and the pair of first wirings corresponding to the pair of first wiring electrode layers. On the electrode layer,
And a pair of second wiring electrode layers provided via a second electrode adhesion layer, wherein the second electrode adhesion layer is provided via the pair of first and second wiring electrode layers. A substrate for an ink-jet head including a heat-generating resistor layer that generates heat by the application of a voltage, wherein an ink path communicating with a discharge port for discharging ink is provided on the substrate with the pair of first and second wiring electrodes. An ink jet head that is provided corresponding to a heat generating portion of the heat generating resistance layer located between the layers, and that uses a thermal energy generated by the heat generating portion to discharge ink from the discharge port; and An ink jet apparatus comprising: a conveying unit that conveys a recording member on which recording is performed by ink discharged from the discharge port. 16. The ink-jet apparatus according to claim 15, wherein said ink-jet head is a full-line type having a plurality of said discharge ports over the entire width of a region where said recording member is recorded. 17. A semiconductor device having a first electrode adhesion layer provided on a substrate.
And a pair of first wiring electrode layers.
On the pair of first wiring electrode layers corresponding to the wire electrode layers,
A pair of second wirings provided via the second electrode adhesion layer
An electrode layer, the first electrode adhesion layer or the first
2 in any one of the electrode contact layers.
That generate heat when voltage is applied through the wiring electrode layer of
Manufacture of a substrate for an inkjet head on which a heating part is formed
A granulation method, wherein the material layer of the first electrode contact layer on the substrate first
Forming a first wiring electrode layer by sequentially patterning a material layer of the first wiring electrode layer; forming a first wiring electrode layer by patterning the material layer of the first wiring electrode layer; by patterning the material layer of the layer, said forming a first electrode contact layer, the first on the electrode contact layer, the material layer and the second wiring electrode of the second wiring electrode layer a material layer of said having etching selectivity second electrode contact layer to the material layer of the layer,
The material layer of the second electrode contact layer and the substrate side, a step of sequentially depositing a material layer of the second wiring electrode layer is patterned by etching, forming the second wiring electrode layer And forming a second electrode adhesion layer by patterning a material layer of the second electrode adhesion layer. A method for manufacturing a substrate for an ink jet head, comprising: 18. An intermittent portion is formed between the first wiring electrode layer, the second electrode contact layer, and the second wiring electrode layer, and the first electrode contact located at the intermittent portion is formed. The method for manufacturing a substrate for an ink jet head according to claim 17, wherein the layer is the heat generating portion. 19. An intermittent portion is formed between the first electrode contact layer, the first wiring electrode layer, and the second wiring electrode layer, and the second electrode contact located at the intermittent portion is formed. The method for manufacturing a substrate for an ink jet head according to claim 17, wherein the layer is the heat generating portion.