JP3192757B2 - Printhead substrate, inkjet printhead substrate, inkjet printhead, inkjet printing apparatus, and inkjet printhead substrate manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording head base in which an electrothermal transducer and a recording functional element are integrally formed on a substrate, and an ink jet recording head employing this recording head base.

[0002]

2. Description of the Related Art In a recording apparatus such as a copying machine, a facsimile apparatus, a word processor, an output printer of a host computer, and a video output printer, recording is performed on a recording medium such as paper using heat. For example, in the case of a recording apparatus of an ink jet recording system, recording is performed by causing ink to foam by heat according to a recording signal, and ejecting and flying the ink from an ejection port by the energy of the foaming. Heat is also used in recording on thermal paper or recording by a thermal transfer method. In the case of recording using such heat, it is necessary to reduce the size of the heat source in order to increase the recording density, and an electrothermal conversion element, which is a heat source, is mounted on a substrate such as silicon using photolithography technology. An integrated one is used. At this time, a recording functional element used for driving the electrothermal transducer may be provided integrally on the substrate. Here, a substrate in which at least an electrothermal conversion element is integrally formed on a substrate is referred to as a recording head substrate.

Such a substrate for a recording head has a structure in which an electrically insulating interlayer film, an electrically resistive heat generating layer, and an electrically insulating protective film are formed in this order on a substrate such as silicon. . SiO ₂ , SiO, SiN or the like is used for the interlayer film and the protective film, and HfB ₂ or the like is used for the heat generating layer. Further, a wiring layer made of aluminum or the like is provided to energize a predetermined portion of the heat generating layer to generate heat. Then, for the purpose of prolonging the life of the heat generating portion (heater portion) of the heat generating layer and stabilizing the characteristics, after depositing the interlayer film and before depositing the heat generating layer, the surface of the interlayer film is removed by high frequency etching (reverse sputtering). A method of exposing a clean surface and exposing a clean surface by high-frequency etching the surface of the heat generating layer after depositing the heat generating layer and before depositing the protective film is performed. FIG. 5 is a flowchart showing an example of a conventional method for manufacturing a printhead base.

A conventional manufacturing method will be described in more detail with reference to FIG. After forming a recording functional element on a substrate such as silicon, an SiO ₂ layer serving as an interlayer film is formed by sputtering (step 131). A through hole is formed in the interlayer film so that a wiring for electrically connecting the recording functional element and the electrothermal transducer can penetrate the interlayer film (step 132). Then, the surface of the interlayer film is slightly removed by high frequency etching (reverse sputtering) to expose a clean surface (step 133). Next, HfB ₂ serving as a heating layer
A layer and an aluminum layer for wiring are sequentially formed, the aluminum layer is patterned for forming wiring, and the HfB ₂ layer is patterned for forming a heater portion (step 134). In this state, portions of the HfB ₂ layer that become heat generating portions are exposed, and other portions are below or removed from the wiring (aluminum layer). Subsequently, the surface of the exposed portion of the HfB ₂ layer is slightly shaved by high frequency etching to expose a clean surface (step 135), and an SiO ₂ layer serving as a protective film is formed by sputtering (step 13).
6). Finally, a tantalum layer serving as a top protection layer is formed (step 137), and the tantalum layer and the protection film are patterned into a given shape to obtain a recording head substrate.

[0005]

The heating layer is generally made of a metal boride or nitride, and a metal oxide, SiO ₂ or SiO is used for an interlayer film or a protective film. For this reason, the heat generating layer is sandwiched between layers having a high oxygen concentration, and oxidation of the material forming the heat generating layer and mixing and diffusion of impurities into the heat generating layer occur, thereby deteriorating the characteristics as an electrothermal conversion element. Had been brought.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a recording head substrate which prevents oxidation of a heating layer serving as a heater and contamination of impurities and does not cause deterioration of characteristics of an electrothermal transducer, and ink jet recording using the recording head substrate. A head and an inkjet recording apparatus are provided.

[0007]

Means for Solving the Problems] serial for recording head substrate of the present invention has an electrothermal conversion element group for generating thermal energy, said electrothermal transducer element is electrically insulating interlayer film and the electric resistance in the heat generating layer and the electrically insulating protective layer and the recording head substrate is a structure laminated sex, density and -OH groups in the interlayer film side interface of the heat generating layer - density of O groups are both 3. 0 × 10 ¹⁴ pieces / cm ² or less and also
At the interface between the heat generating layer and the protective film,
The density is 3.0 × 10 ¹⁴ pieces / cm ² or less .

[0008]

[0009] substrate for Lee inkjet recording head of the present invention has an electrothermal conversion element group for generating thermal energy, said electrothermal transducer element is an electrically insulating interlayer film and the electrical resistance of the heating layer And a protective film having an electrical insulating property, and a density of -OH groups at an interface between the heat generating layer and the interlayer film.
The density of the O group is not more than 3.0 × 10 ¹⁴ / cm ^{2, and} at the interface between the heat generating layer and the protective film,
When the density of OH groups is 3.0 × 10 ¹⁴ / cm ² or less
You .

[0010]

[0011] A method of manufacturing a substrate for a Lee inkjet recording head of the present invention, an electro-thermal variations for generating thermal energy
A group of heat exchange elements, wherein the electrothermal conversion element is an electrically insulating layer.
An interlayer, an electric resistance heating layer and an electrically insulating protective film
Manufacture of a substrate for an inkjet recording head having a layered structure
Forming the interlayer film in the fabrication method,
Vacuum heating and high frequency etching were performed on the interlayer
Then, by forming the heating layer, the layer of the heating layer
The density of -OH groups and the density of -O groups at the interface between
A step of not more than 3.0 × 10 ¹⁴ / cm ² ,
Apply vacuum heating or high frequency etching to the heating layer
After that, by forming the protective film, the heating layer
The density of the -OH group at the interface on the protective film side is 3.0 ×
Having a step of not more than 10 ¹⁴ pieces / cm ^2.
It is a sign .

[0012]

[0013]

DETAILED DESCRIPTION OF THE INVENTION The present invention, -OH group, -O group, water, O ₂ and O
It has been made based on the finding that the presence of such a substance on the surface and the bottom surface of the heat generating layer has a significant effect on the heater characteristics of the electrothermal transducer. That is, in the present invention, by reducing the oxygen concentration in the upper and lower films sandwiching the heat generating layer serving as a heater, −
Both the density of the OH group and the density of the -O group are 3.0 × 10 ¹⁴ / cm ²
By doing so, the oxidation of the heat generating layer and the diffusion and mixing of impurities into the heat generating layer are suppressed, and the characteristics of the recording head base are improved. Further, by performing vacuum heating (vacuum baking), the density of these -OH groups and -O groups can be reduced.

In the present invention, as the heat generating layer, an electric resistance layer can be used without particular limitation.
It is preferable to use TaN from the viewpoint of durability and the like.
It is desirable to use a stoichiometrically low oxygen concentration for the interlayer film and the protective film.
Alternatively, SiON can be preferably used, and for the protective film, for example, SiN can be preferably used.

[0015]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing the configuration of a recording head substrate according to one embodiment of the present invention.

The substrate for a recording head is a silicon substrate 1
0, an insulating layer 12 made of SiO ₂ or the like, an electrically insulating interlayer film 14, a heat generating layer 15 made of tantalum nitride (TaN), an aluminum wiring layer 16, an electrically insulating protective film 17, The protective layer 18 is made of tantalum and sequentially laminated. Aluminum wiring layer 1
6 is partially missing, and the heat-generating layer 15 and the protective film 17 form an interface at the missing part, and this part becomes the heat-generating part 20. The silicon substrate 10 includes an n-type semiconductor portion provided by a known silicon semiconductor process and a p-type semiconductor portion.
Diodes 11 are formed by mixing mold semiconductor portions. The diode 11 is a recording functional element in the recording head substrate. In the anode electrode portion and the cathode electrode portion of the diode 11, through holes are provided in the insulating layer 12. At the interface between the insulating layer 12 and the interlayer film 14,
Aluminum electrode layer 1 patterned into a predetermined shape
3 are provided. The aluminum electrode layer 13 is also formed inside the through hole provided in the insulating layer 12,
As a result, electrical connection between the predetermined portion of the silicon substrate 10 and the aluminum electrode layer 13 is secured.

The interlayer film 14 includes an aluminum electrode layer 13
A through-hole (through-hole) is formed corresponding to.
Thereby, the heating layer 15 formed on the interlayer film 14 is formed.
Is bonded to the aluminum electrode layer 12 at this through hole. On the heating layer 15, the heating layer 15
An aluminum wiring layer 16 for supplying a current to the substrate is formed. These heat generating layer 15 and aluminum wiring layer 16
Are patterned in a predetermined shape, and the upper surface of the heat generating layer 15 is joined only to the aluminum wiring layer 16 except for the heat generating portion 20. Therefore, the heating portion 20
When a voltage is applied to the aluminum wiring layers 16 on both sides sandwiching the current, the current is concentrated on the heat generating portion 20 to generate heat. The protective film 17 is provided on the entire surface (however, the upper surface in the drawing) of the recording head substrate except for a portion where the aluminum wiring layer 16 is electrically connected to the outside. Is formed.

Here, the interface between the heat generating layer 15 and the interlayer film 14,
The interface between the heat generating layer 15 and the protective film 16 will be described. This
In the recording head substrate described above, the boundary between the heat generating layer 15 and the interlayer film 14
-OH group density on the surface and-OGroup density
3.0 × 10¹⁴Pieces / cm^TwoIt is as follows. Also fever
Layer 15ofProtective film 16~ sideAt the interface, the density of -OH groupsDegree
3.0 × 10¹⁴Pieces / cm^TwoIt is as follows. in this way
By regulating the density of -O and -OH groups at each interface
The characteristics of the heat generating layer 15 are hardly deteriorated,
To obtain a recording head substrate with improved performance and reliability
become.

Next, a method of manufacturing the recording head substrate will be described with reference to the flowchart of FIG.

A recording functional element such as a diode 11 is formed on a silicon substrate 10 in advance, and an insulating layer 12 and an aluminum wiring layer 13 are formed by a known semiconductor process or photolithography process. First, S
An interlayer film 14 made of iON, SiN, or the like is formed by a CVD method (Step 101). Then, the interlayer film 14
A through hole is opened at a predetermined position (step 10).
2). Subsequently, high-frequency etching (reverse sputtering) and heating in vacuum (vacuum baking) are performed to expose the clean surface of the interlayer film 14 and to remove -O groups, -OH groups and moisture on the surface (step 103). ) . Next, a tantalum nitride film to be the heat generating layer 15 is formed, an aluminum film to be the aluminum wiring layer 16 is formed, and the aluminum film is patterned to form the aluminum wiring layer 1 having a predetermined wiring pattern.
The heating layer 15 is formed by patterning the tantalum nitride film into a predetermined shape (step 104).

Next, the exposed surface of the heat generating layer 15 is cleaned.
Target, tetrafluoromethane (CF _Four) Introduce high lap
Wave etching (step 105) or true
Heating is performed in the air (step 106), and the heat generating layer 15 is heated.
-O groups, -OH groups and water on the surface of are removed. That
After that, a SiN layer serving as the protective film 16 is formed by a CVD method.
(Step 107), a tantalum layer to be the protection layer 17 is formed.
Film (step 108) and remove the tantalum and SiN layers
Each of them is patterned (step 109).
The substrate for the recording head is completed.

Next, the manufacturing process of the recording head of this embodiment will be described in more detail with numerical values.

In step 101, the interlayer film 14 is formed.
Is SiH_Four+ N_TwoO or SiH _Four+ NH_ThreeIntroduce
SiO 2 by plasma CVD_xN_y(However, 0.9 ≦
x ≦ 1.8, 0.8 ≦ y ≦ 1.2) or SiN_x(However
1.3 ≦ x ≦ 2.2).
You. Then, in step 102, a normal photolithography
Through holes are formed in the interlayer film 14 by a luffing process.
You. In the conventional manufacturing process of a recording head substrate, a through-hole
After opening the holes, the organic solvent and pure
Washing with water is performed. In this embodiment, this cleaning is performed.
After that, as a process before the deposition of the heat generating layer 15,
High frequency etching (reverse sputtering)
An empty baking process is performed.

In this high frequency etching and vacuum baking process, first, the interlayer film 14 is formed by high frequency sputtering at a total pressure of 2 mTorr and a DC power of 400 W by about 20 to 80 °.
Shaving to expose a clean surface. Thereafter, the total pressure is 5 to 15 mTorr while keeping the vacuum without contacting the atmosphere.
And flowing Ar + N ₂ to keep the substrate temperature at 200 ° C.
The substrate is left for 10 to 90 seconds to perform vacuum baking. At this time, the flow rate of N ₂ is set to 13 to 20 sccm, preferably 1 to 20 sccm.
And 6～19Sccm, partial pressure ratio of Ar N ₂ is 18
27%, preferably 22-26%, more preferably 24% (step 103) . Thereafter, the DC power is 0.5 to 2.5 k by a reactive sputtering method.
While applying W, a tantalum nitride film to be the heating layer 15 is deposited (part of Step 104).

By manufacturing the recording head substrate in this way, it is possible to remove substances such as -O groups, -OH groups, and moisture which affect the life of the heater constituted by the heat generating layer 15, The heat generating layer 15 can be deposited while suppressing the reattachment of these substances, and the aluminum electrode layer 13 can be deposited.
The effect that the electrical resistance at the contact portion between the heat generating layer 15 and the heat generating layer 15 can be reduced is obtained.

In general, it is said that water (H ₂ O molecules) adhering to the surface of the substrate (substrate) adheres to the surface of the substrate by a few tenths of a second over the —OH group adhering or binding to the surface of the substrate. I have. Therefore, the density of -OH groups and -O groups on the surface when high-frequency etching and vacuum baking were performed before depositing the heat generating layer 15 were quantified, and the relationship with heater characteristics was examined. The results are shown in Table 1. As a condition for the vacuum baking, the partial pressure of N ₂ gas with respect to (N ₂ + Ar) was set to 24%. The measurement of the densities of -OH groups and -O groups was performed using a total reflection infrared spectrophotometer.
Further, the heater life is represented by the number of drive pulses until the heater (heat generating portion) is broken when an ink jet recording head is formed using this recording head substrate. Similarly, the resistance change rate indicates the resistance value of the heater after printing on 1000 sheets of recording paper as an ink jet recording head by the amount of change from the resistance value in the initial state. It is a desirable parameter that the resistance change amount is as close to ± 0 as possible.

[0027]

[Table 1] From this table, it can be seen that by performing high frequency etching and vacuum baking before depositing the heat generating layer 15, a recording head substrate having extremely good characteristics can be obtained.

Further, after the heat generating layer 15 and the aluminum wiring layer 16 are deposited and patterned,
There is a possibility that a substance affecting the life of the heat generating layer 5 is attached to the upper surface of the heat generating layer 15. Therefore, in this embodiment, the protective film 1
Before depositing the layer 7, a material that affects the life of the heat generating layer 15 is employed by adopting a process of vacuum baking performed by leaving it in a plasma CVD apparatus or high-frequency etching performed by introducing CF _4. Could be removed.

In vacuum baking, the recording head substrate immediately before forming the protective film 17 is placed in a plasma CVD apparatus,
It is carried out by allowing to stand for 0 to 120 minutes after reaching background pressure and a temperature of 200 ° C. The standing time is desirably 2 to 10 minutes.
After that, SiH ₄ + NH ₃ is introduced into the plasma CVD apparatus, and after reaching a predetermined degree of vacuum, plasma may be generated to form the protective film 17. In the high-frequency etching using CF ₄ , first, a recording head substrate immediately before a protective film is formed is installed in a plasma CVD apparatus, at a temperature of 200 ° C., an input power of 30 W, and a flow rate of CF ₄ of 600 sccm. This is performed by cutting the surface of the heat generating layer 15 by about 50 °. After that, the protective film 17 may be deposited in the same manner as in the case of vacuum baking.

Table 2 shows the results obtained when vacuum baking and high frequency etching were performed and when they were not performed.
3 shows the relationship between the —OH group density on the upper surface of the heat generating layer and the heater characteristics. The measurement was performed in the same manner as in Table 1 described above. From this table, it can be seen that by performing at least one of vacuum baking and high frequency etching before depositing the protective film 17, a recording head substrate having extremely good characteristics can be obtained.

[0031]

[Table 2] Next, the configuration of an ink jet recording head using the recording head substrate of the present invention will be described with reference to FIG.

The recording head substrate 100 having the above-described structure is provided with a liquid path wall member 50 made of a photosensitive resin or the like for forming a liquid path 505 communicating with the plurality of discharge ports 500.
1 and a top plate 502 having an ink supply port 503 are attached to form a recording head 510 by an inkjet recording method. In this case, the heat generating portions of the electrothermal conversion elements of the recording head substrate 100 are arranged corresponding to the bottoms of the liquid passages 505, respectively. Ink supply port 5
The ink injected from 03 is temporarily stored in an internal common liquid chamber 504 and supplied to each liquid path 505. Here, when the electrothermal transducer corresponding to the liquid path 505 is driven, a heat-generating portion of the electrothermal transducer generates heat, and the heat causes the ink to foam. By the energy of the foaming, the ink in the corresponding liquid path 505 is discharged from the discharge port 500 at the tip of the liquid path 505, whereby the ink jet recording is performed.

Next, an ink jet recording apparatus using the recording head of the present invention will be described with reference to FIG. FIG. 4 shows an inkjet recording apparatus 700 to which the present invention is applied.
It is an outline perspective view showing an example of.

The recording head 510 is mounted on a carriage 720 which engages with a spiral groove 721 of a lead screw 704 which rotates via driving force transmission gears 702 and 703 in conjunction with forward and reverse rotation of a driving motor 701. And
The carriage 720 is driven by the power of the drive motor 701.
At the same time, it is reciprocated along the guide 719 in the directions of arrows a and b. The recording paper P is conveyed onto a platen 706 by a recording medium feeding device (not shown). Paper press plate 70 provided opposite platen 706
5 presses the recording paper P against the platen 706 over the moving direction of the carriage 720.

Photocouplers 707 and 708 are provided near one end of the lead screw 704. The photocouplers 707 and 708 are home position detecting means for confirming the presence of the lever 709 attached to the carriage 720 in this region and switching the rotation direction of the drive motor 701. A cap member 711 is provided to cap the entire ejection surface of the print head 510 when printing is paused, and the cap member 511 is supported by the support member 710. Also, the cap member 711
Suction means 712 for sucking the inside is provided. The suction means 712 is connected to the recording head 5 through the opening 713 in the cap.
This is for performing suction recovery of 10. The main body support plate 716 supports a cleaning blade 714 and a moving member 715 that enables the cleaning blade 714 to move in the front-rear direction. Cleaning blade 71
Needless to say, No. 4 is not limited to this embodiment, and a known cleaning blade can be applied to this embodiment. The lever 717 for starting suction for suction recovery moves with the movement of the cam 718 engaged with the carriage 720. The movement of the driving force from the driving motor 701 is controlled by the lever 717 by known transmission means such as clutch switching. A print control unit (not shown) that gives a signal to the heat generating unit 110 (FIG. 4) of the recording head 510 and controls the driving of each mechanism described above is provided on the apparatus main body side.

The ink jet recording apparatus 700 having the above-described configuration is used for the recording paper P conveyed on the platen 706.
On the other hand, the recording head 510 performs recording while reciprocating over the entire width of the recording paper P. Since the recording head 510 is manufactured by the method described above, high-precision and high-speed recording is performed. Is possible.

In the above description, an example in which the recording head substrate is employed in an ink jet recording head has been described. However, the recording head substrate according to the present invention can be applied to, for example, a thermal head substrate. is there.

The present invention provides an excellent effect particularly in a recording head and a recording apparatus of an ink jet recording system in which flying droplets are formed by utilizing thermal energy and recording is performed among the ink jet recording systems.

Representative configurations and principles thereof are disclosed in, for example, US Pat. Nos. 4,723,129 and 4,740,796, and the present invention is based on these basic principles. preferable. This recording method can be applied to both on-demand type and continuous type.

The recording method will be described briefly. An electrothermal transducer disposed corresponding to a sheet or a liquid path holding a liquid (ink), a liquid (ink) corresponding to recording information, or the like. By applying at least one drive signal for exceeding the nucleate boiling phenomenon and giving a rapid temperature rise that causes the film boiling phenomenon, heat energy is generated, and film boiling occurs on the heat-acting surface of the recording head. . As described above, since bubbles corresponding to the drive signal applied to the electrothermal converter from the liquid (ink) can be formed one-to-one, it is particularly effective for an on-demand type recording method. The liquid (ink) is ejected through the ejection hole by the growth and shrinkage of the bubble to form at least one droplet. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are performed immediately and appropriately, so that the ejection of a liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable. As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,434,262 are suitable. In addition,
U.S. Patent No. 43 of the invention relating to the rate of temperature rise of the heat acting surface
If the conditions described in the specification of JP-A-13124 are adopted, more excellent recording can be performed.

The configuration of the recording head is a combination of a discharge hole, a liquid flow path, and an electrothermal converter (a linear liquid flow path or a right-angle liquid flow path) as disclosed in the above-mentioned respective specifications. In addition, U.S. Pat.No. 4,558,333, U.S. Pat.
As disclosed in the specification of Japanese Patent No. 459600, the present invention also includes a configuration in which the heat acting portion is arranged in a bent region.

In addition, JP-A-59-123670 discloses a configuration in which a common slit is used as a discharge hole of an electrothermal converter for a plurality of electrothermal converters, or a pressure wave of thermal energy is absorbed. The present invention is also effective in a configuration based on Japanese Patent Application Laid-Open No. 138461/1984, which discloses a configuration in which the opening to be made corresponds to the discharge section.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of a recording medium that can be recorded by a recording apparatus. The full line head may be a full line configuration by combining a plurality of recording heads as disclosed in the above specification, or may be a single full line recording head formed integrally.

In addition, the print head is replaceable with a print head of a chip type which can be electrically connected to the main body of the apparatus and can supply ink from the main body of the apparatus, or is integrated with the print head itself. The present invention is also effective when a cartridge-type recording head provided in a fixed manner is used.

It is preferable to add recovery means for the printhead, preliminary auxiliary means, and the like to the recording apparatus of the present invention because the recording apparatus of the present invention can be further stabilized. If these are specifically mentioned, a capping unit, a cleaning unit, a pressurizing or suction unit, a preheating unit using an electrothermal converter or another heating element or a combination thereof, a recording head, It is also effective to add a means for performing a preliminary ejection mode for performing another ejection in order to perform stable printing.

Further, the recording mode of the recording apparatus is not limited to a mode for recording only the mainstream color such as black, but may be a mode in which a recording head is integrally formed or a configuration in which a plurality of recording heads are combined. However, the present invention is extremely effective for an apparatus provided with at least one of multiple colors of different colors or full color by mixing colors.

In the embodiments of the present invention described above, liquid ink is used. However, in the present invention, ink which is solid at room temperature or ink which becomes soft at room temperature is used. Can be used. In general, in the above-described ink jet device, the temperature of the ink itself is adjusted within a range of 30 ° C. or more and 70 ° C. or less to control the temperature so that the viscosity of the ink is in a stable ejection range. It is sufficient if the ink is in a liquid state.

In addition, an excessive temperature rise of the head and the ink due to thermal energy is positively prevented by using the energy of the state change from the solid state to the liquid state of the ink, or the purpose is to prevent the evaporation of the ink. For example, an ink that solidifies in a standing state may be used. In any case, the ink is liquefied for the first time by the application of heat energy, such as one in which the ink is liquefied and ejected as an ink liquid by application of the heat energy according to the recording signal, or one which already starts to solidify when reaching the recording medium. The use of an ink having the following properties is also applicable to the present invention.

Such an ink is disclosed in JP-A-54-56847 or JP-A-60-71260.
A configuration may be adopted in which the liquid sheet or the solid substance is held as a liquid or solid substance in the recesses or through holes of the porous sheet and faces the electrothermal converter.

In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

[0051]

Recording head substrate of the present invention as described above, according to the present invention includes: a density of -OH groups in the interlayer film side interface of the heat generating layer - by regulating the density of the O group, and the heating layer <br /> by regulating the density of the -OH groups in the protective layer side interface, such as mixed oxide or impurities of the heating layer is prevented, there is an effect that will have good properties. Further, in the method for producing a substrate for an inkjet recording head of the present invention,
Vacuum heat treatment and high frequency etching before forming the heating layer
By applying vacuum heating or high-frequency etching before forming the protective film.
-OH groups on the surface portion of the heating layer, - such as the removal O group and water
By regulating the density of -OH groups and the density of -O groups,
Thus, it is possible to produce a product having good characteristics.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view illustrating a configuration of a printhead base according to an embodiment of the present invention.

FIG. 2 is a flowchart showing an example of a method for manufacturing the recording head base of FIG.

FIG. 3 is a schematic perspective view showing the appearance of an ink jet recording head according to one embodiment of the present invention.

FIG. 4 is a perspective view illustrating an example of an ink jet recording apparatus.

FIG. 5 is a flowchart showing an example of a conventional method for manufacturing a printhead base.

DESCRIPTION OF SYMBOLS 10 Silicon substrate 11 Diode 12 Insulating layer 13 Aluminum electrode layer 14 Interlayer film 15 Heating layer 16 Aluminum wiring layer 17 Protective film 18 Protective layer 20 Heating portion 100 Recording head base 101-109, 131-138 Step 500 Discharge port 501 Liquid path wall member 502 Top plate 503 Ink supply port 504 Common liquid chamber 505 Liquid path 700 Ink jet recording device 701 Drive motor 704 Lead screw 705 Paper press plate 706 Platen 720 Carriage

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Hiroshi Sugitani 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (56) References JP-A-5-169701 (JP, A) JP-A-5 JP-A-131666 (JP, A) JP-A-4-101855 (JP, A) JP-A-4-212866 (JP, A) JP-A-3-246046 (JP, A) JP-A-3-234536 (JP, A) (58) Fields surveyed (Int. Cl. ⁷ , DB name) B41J 2/05 B41J 2/16

Claims (9)

(57) [Claims] 1. An electrothermal conversion element group for generating thermal energy, wherein said electrothermal conversion element is formed by laminating an electrically insulating interlayer film, an electrically resistive heating layer and an electrically insulating protective film. in the structure in which the recording head substrate, density and -OH groups in the interlayer film side interface of the heat generating layer - together with the density of the O group, are both 3.0 × 10 ¹⁴ / cm ² or less, wherein Density of -OH groups at the interface between the heat generating layer and the protective film.
Is 3.0 × 10 ¹⁴ / cm ² or less . 2. An electrothermal conversion element group for generating thermal energy, wherein the electrothermal conversion element is formed by laminating an electrically insulating interlayer film, an electrically resistive heating layer and an electrically insulating protective film. in the ink jet recording head substrate is a structure, and density of the -OH groups in the interlayer film side interface of the heat generating layer - density of O groups, together are both 3.0 × 10 ¹⁴ / cm ² or less, -OH group density at the interface between the heat generating layer and the protective film
Is 3.0 × 10 ¹⁴ / cm ² or less . 3. An ink jet recording head based body according to claim 2 in which the heating layer is made of TaN. 4. The substrate for an ink jet recording head according to claim 2 , wherein the interlayer film is made of SiN or SiON. 5. The substrate for an ink jet recording head according to claim 2 , wherein the protective film is made of SiN. 6. An electrothermal converter for generating thermal energy.
A group of heat exchange elements, wherein the electrothermal conversion element is an electrically insulating layer.
An interlayer, an electric resistance heating layer and an electrically insulating protective film
Manufacture of a substrate for an inkjet recording head having a layered structure
Row in granulation method, a step of forming the interlayer film, the vacuum heating and RF etching with respect to the interlayer film
After the heat generation layer is formed, the heat generation layer is formed in front of the heat generation layer.
Density of -OH groups and -O groups at the interlayer side interface
To 3.0 × 10 ¹⁴ / cm ² or less, and applying vacuum heating or high-frequency etching to the heat generating layer.
After performing the above-mentioned heating, by forming the protective film,
2. the density of -OH groups at the interface of the layer on the protective film side;
A step of 0 × 10 ¹⁴ / cm ² or less, for an ink jet recording head
A method for manufacturing a substrate . 7. ejection and an ink jet recording head substrate according to claim 2, the liquid paths provided corresponding to the heat generating portion of the electrothermal transducer element, the liquid for recording communicating with the liquid passage are discharged an ink jet recording head having an outlet, a. 8. The ink jet recording head according to claim 7 , wherein a plurality of ejection ports are provided over the entire width of the recording area of the recording medium. 9. A head according to claim 8, the ink jet recording apparatus characterized by comprising, means for mounting said ink jet recording head.