WO1991012967A1

WO1991012967A1 - Substrate for ink-jet head

Info

Publication number: WO1991012967A1
Application number: PCT/JP1991/000249
Authority: WO
Inventors: Yasutomo Watanabe
Original assignee: Canon Kabushiki Kaisha
Priority date: 1990-02-26
Filing date: 1991-02-26
Publication date: 1991-09-05
Also published as: EP0473786B1; EP0473786A1; ATE138854T1; DE69120002D1; ES2087999T3; JPH04211958A; JP3045793B2; EP0473786A4; DE69120002T2

Abstract

A substrate for an ink-jet head comprising: a pair of first distribution electrode layers disposed on a substrate through first electrode adhesion layers; a pair of second distribution electrode layers disposed on said pair of first distribution electrode layers each correspondingly to a relative one through second electrode adhesion layers; and heat generating resistor layers included in said first or second electrode adhesion layers and generating heat on impression of voltage through a pair of said first and second distribution electrode layers.

Description

Details

Substrate for ink head

Field of the invention

INDUSTRIAL APPLICABILITY The present invention is used for an ink jet head for discharging ink and recording an image of a character or the like by the discharged ink. It relates to a base for an ink jet head. The present invention also relates to an ink jet head using the ink jet head substrate. Furthermore, the present invention relates to an ink jet device including the above-mentioned head. The present invention includes a method for producing the S body for an ink jet head. Background of the Invention

Various ink jet recording methods have been proposed in the past. Among such proposals, for example, the ink jet described in U.S. Pat. No. 4,723,129 and U.S. Pat. The jet method has recently attracted attention as a typical example. In short, this method uses a thermal energy source to discharge ink, and performs recording using the discharged ink. The ink jet method enables high-density, high-definition, high-quality recording at a high speed, and furthermore, a head and a device. It has the advantage that it is relatively easy to achieve compaction and the like.

At this point, the head used in the above-mentioned ink jet method is referred to as a so-called base holiday (hereinafter, sometimes referred to as a “head substrate”). ), For example, as schematically shown in Fig. 3. In FIG. 3, FIG. 3 (a) is a schematic plan view, and is a schematic cross-sectional view taken along line D-D ′ of FIG. 3 (FIG. 3W is FIG. 3). The head substrate having the structure shown in FIG. 3 generally undergoes the steps shown in FIGS. 1 and 2! ?: It is manufactured. In FIG. 1, FIG. 1 (a) is a schematic plan view, and FIG. 1) is a schematic sectional view of FIG. 1). Also, in FIG. 2, FIG. 2 (a: 'is a schematic plan view, and FIG. (a) is a schematic cross-sectional view taken along the line D-D 'in FIG. Here, the manufacturing process of the head base will be described with reference to FIGS. 1 to 3. FIG.

Remind as the first) figures and first (b) figure, for example, H f B _z or found and the name Ru fever resistive layer eg T i or et ing layers in the order of absolute緣基plate 1 side or we this Form a material layer (two-layer structure layer) for forming the first electrode adhesion layer 2 to be laminated and a wiring electrode layer 3 made of a good conductive material such as A ^. A material layer is formed on the insulating substrate 1 by a film forming technique such as a vapor deposition method, a sputtering method, and a CVD method. Next, as shown in FIG. 2 (a) and FIG. 2 (b), the material layer for the electrode adhesion layer 2 and the material layer for the wiring electrode layer 3 which were formed earlier were compared. The turning is performed by the photolithography method. Then, as shown in FIGS. 3) and 30>), the material layer for the patterned wiring electrode layer 3 is further subjected to buttering to form an electrode. A part of the adhesive layer 2 is exposed to form a heating part 10. The heat generating portion 10 formed in this way depends on the material to be used, but may be used as it is in contact with the ink. However, in general, a protective layer is provided thereon mainly for the purpose of protecting the heat-generating portion from corrosion due to the ink and the like.

The head substrate is manufactured through such a manufacturing process. In addition, an ink jet having a plurality of discharge ports for discharging ink, which is used in the head base, is provided in an ink jet. G device has been commercialized.

With regard to the power of the ink jet device, it is a social demand that the recording speed be further improved and the image quality of the recorded image be further improved. The ideal ink jet head that meets these social demands is basically equipped with as many ink outlets as possible. Therefore, it can be said that those discharge ports are arranged at high density.

However, regarding the provision of the above-mentioned ink head, The following issues that have not been regarded as a problem so far will be revealed as what needs to be resolved. Immediately, defects such as missing pinholes occur in the photo-resist layer used for patterning of wiring electrodes on the head substrate. Defects reach the wiring electrode layer, etc., which is 1, or film defects such as pinholes cause electric heat during the film formation process. It may occur in the converter. This has a large effect on the yield in the case of producing a head substrate having a large number of discharge ports arranged at a high density. As described above, one of the typical situations is a disconnection of a wiring electrode schematically shown in part C of FIGS. 2 and 3.

This is a reasonable compromise in the case of head bases with relatively few outlets and their distribution density is not very high, even if the yield is relatively small. However, it is difficult to disregard a head substrate with a large number of discharge ports and a high density. In particular, a large number of high-density discharge ports are provided over the entire width of the recording area of the recording target member on which recording is to be performed, and an electrothermal transducer is provided corresponding to the large number of discharge ports. This is a remarkable technical section m in the so-called phenolic-type ink jet head, which is arranged on a large number of substrates at high density. Summary of the Invention

A main object of the present invention is to devise a structure of a wiring electrode portion of an ink jet head of a method of discharging ink by using thermal energy. Thus, it is an object of the present invention to provide an ink jet head that can solve the above-mentioned technical problems and significantly improve the reliability of the head itself. .

Another aspect of the invention has a heating resistor and an electrode connected to the heating resistor layer that generates the heat energy used to discharge the ink. By devising the structure of the electrothermal converter, the yield due to disconnection and the like caused by defects that may occur in the electrothermal converter The technical issue of deterioration can be solved mainly by keeping the energy of the headwork from affecting the strength of the head. It is to provide heads.

Still another object of the present invention is to provide an ink jet device in which a plurality of electrothermal transducers for generating heat energy used for discharging ink are densely arranged on a substrate. An ink jet head that can solve the above-mentioned technical problems that often appear in the jet head with a relatively simple structural device. It is to provide.

Another object of the present invention is to provide a large number of ejection ports for ejecting ink over the entire width of a recording area of a recording target member on which recording is to be performed, and A large number of electrothermal transducers corresponding to the outlets are more likely to become apparent in full-line ink jet heads that are densely arranged on the substrate. An object of the present invention is to provide an inkjet head which can solve a technical problem with a relatively simple structural device.

Still another object of the present invention is to provide a base for an ink jet head used for the above-described ink jet head, and an ink jet head including the head. An object of the present invention is to provide a method for manufacturing a head substrate for a nito device and an ink jet.

The present inventor has conducted extensive research to achieve the above-mentioned object, and as a result, has obtained knowledge based on the configuration as described below. In other words, in the conventional production of a head substrate, a pair of first electrode distribution layers has been provided on a substrate via a first electrode adhesion layer. In this case, the present inventor has attempted to form a stacked structure by further providing a pair of second wiring electrode layers thereon via a second electrode adhesion layer. As a result of the study, the following was found. ES3 By adopting such a configuration, the wiring layer of one of the provisional instructions, ie, the upper electrode layer: Even if a chip such as a gap or a wire is generated, the other wiring electrode is formed. Defects can be covered by layers As a result, the overall negative impact of defects can be reduced to substantially zero, which significantly increases the yield in manufacturing inkjet heads. It is the knowledge that it can help improve it.

The present inventors have applied this finding to the production of a head substrate. When the presence or absence of disconnection of the wiring electrode was examined for the obtained head substrate, the occurrence rate of disconnection was remarkably reduced as compared with the conventional case. In addition, an ink jet head was created from the obtained head substrate, and was attached to the main body of the apparatus, and recording was performed by actually discharging the ink. As a result, it has been a component of the invention that the inkjet head achieves the above object of the present invention.

The ink jet head substrate of the present invention thus completed has the following features.

A pair of first wiring electrode layers provided on the substrate via the first electrode adhesion layer;

A pair of second wiring electrode layers provided correspondingly to the pair of i-th wiring electrode layers and via a second electrode adhesion layer,

¾ ■ 有、

It is characterized in that the first electrode adhesion layer includes a heat generating resistance layer that generates heat when a voltage is applied through the pair of first and second wiring electrode layers.

In addition, the substrate for an ink jet head of the present invention comprises:

A pair of first wiring electrodes provided on the substrate via the first electrode adhesion layer;

A pair of second wiring electrode layers provided over the pair of first wiring electrode layers via a second electrode contact layer, and

有

It is characterized in that the second electrode adhesion layer includes a heating resistance layer that generates heat by applying a voltage through the pair of first and second wiring electrodes Jf. Further, the present invention provides an ink jet head using the above-described ink jet head substrate, an ink jet device provided with the head, and an ink jet device including the head. Includes a method for manufacturing ink jet substrates. Detailed description of the preferred embodiment

One embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 4 to FIG. 8 are schematic views showing examples of a substrate for an ink jet head according to the present invention in accordance with a manufacturing process. In FIG. 5, FIG. 5 (a) is a plan view, FIG. 5 (b: a sectional view taken along line B-B ′ of FIG. 5), and FIG. 5 (c) is a sectional view A of FIG. — Sectional view at A '. In these drawings, except for FIG. 5, symbols A--A 'and B--B' are omitted, but in all cases, the same parts as in FIG. 5 are viewed from the same direction. It is a drawing.

First, as shown in FIGS. 4 (a) and 4 (b), an alumina having a glaze layer on the surface and a thermally oxidized SiO ₂ layer on the surface were provided. Shi Li co down, or on absolute緣基plate 4 1 consisting of glass or the _{like, H f B 2, T a} a £: and T a S i, C r S i O, heat generating resistor layer composed of T i O _2, etc. The material layer of the first electrode adhesion layer 42 in which the layers consisting of Ti, Cr ri, Mo, W, etc. are laminated in this order from the bottom, and the layers of A £, Cu, Au, etc. And a material layer for the first wiring electrode layer 43. In the drawings (for example, FIG. 4), a layer before patterning is provided as a material layer in a solid pattern on one surface. For the sake of simplicity, the same reference numerals as those after patterning are also applied.

Next, as shown in FIGS. 5) to 5 (c), a photoresist (not shown) is applied, and exposure, development, baking, etc. are performed on the photoresist. Apply. Subsequently, by etching and resist separation, the patterning of the material layer of the first electrode adhesion layer 42 and the material layer of the first wiring electrode layer 43 is performed. Then, the pattern of the first electrode adhesion layer 42 and the pattern of the first wiring electrode 餍 43 are formed. In this example; i, for example, "A" in section-, photo 5 o

Disconnection has occurred in the first pole contact layer 42 and the first wiring layer 3 due to a defect in the register or the like.

G (a) FIGS. 6 to 6 (as shown in the figure, the material layer of the second electrode contact 4 made of Ti, Cr, Ni, Mo, W, etc. , Cu, Λu, etc., and a film of a material having the material of the second wiring electrode 5 .In this case, the second electrode adhesion layer 44 is formed on the second wiring electrode layer 45. On the other hand, the second electrode layer has etching selectivity, that is, the second electrode adhesion] 1 4 4 is used for etching the second wiring electrode layer 45. It is formed of a material that is not etched by the use of a chucking liquid, and the exposed portion at the defect portion A "is a second electrode adhesion layer. 44 and the second wiring electrode layer 45 are covered with the material layer.

Subsequently, as shown in FIG. 7 (a) to FIG. 7, in the same manner as described above, the second wiring electrode layer 4 is formed by the photolithography method. Form 5. The second wiring electrode layer 45 is formed by photo resist patterning, etching of the material layer of the second wiring electrode layer 45, and the second electrode. The adhesive layer 44 is formed by the etching of the material of the adhesive layer 4 and the separation of the photoresist. At this time, as shown in the drawing, the second electrode contact debris 44 and the second arrangement M4 5 o-portion are removed by etching to generate heat. Form minute 51. In this case, for example, a defect in the second wire electrode layer 45 is temporarily generated in the "Β" part of the figure, due to a defect in the i: toss and the like.

-, The lower layer (the 'iE-line electrode') and the first electrode adhesion layer

4 2 'O, which is not affected by two defects, does not lead to circuit breakage.

Z. No. 3 () Fig. No. 8) ^: As shown, 1 $.-Same as the above explanation, the heat-forming part is formed by the photolithographic method. The second wiring electrode 43 in 51 is etched to expose the first electrode adhesion extension 42 thereunder, thereby forming the heat generating portion 50. As described above, as described above, the second flotation exhibition 4 4 is an etching solution of m 2 ββ¾m 5ι5 with an etching solution. However, even if the defect is caused in the second ^ -ray layer 45 by the defect of the marble, etc., in this example, if ( Defects do not reach the first wiring electrode layer 43 or the first electrode adhesion H42).

As described above, protection is provided on the thin-film structure of the thin film formed on the substrate)! For example, the SiO ₂ layer is formed into a β-shape by sputtering to complete the formation of a base for an ink jet head.

The combination of the first wiring electrode layer / the second electrode adhesion layer and the second wiring electrode layer in the present embodiment is a combination of AJ2 layer / Ti layer. Ζ Α £ layer, Α layer / Cr Jl / A £ layer, Cu layer ZT i li ZCu layer, Au layer ZN i layer / Au layer, A J2 layer / Ta Si layer / Cu layer Etc. can be cited as preferred. Among them, the A layer / Ti layer and the A layer are most preferable.

Next, another embodiment of the present invention will be described in detail with reference to the drawings. 9 to 13 are schematic views showing another example of the ink jet head substrate according to the present invention in accordance with a manufacturing process. Also in FIG. 10, FIG. 1A (a) is a plan view, FIG. 10 (the figure 10 is a 10) is a sectional view taken along B—B ′ of FIG. 10, and FIG. FIG. 3A is a cross-sectional view taken along a line A-A ′ in FIG. In these drawings other than FIG. 10, the symbols of A-A 'and Β-Β' are omitted, but in all cases, the same parts as those in FIG. 10 are the same. It is a drawing viewed from the same direction.

First, as shown in FIGS. 9) and 9 (b), for example, Ti, Cr, i, and Mo are placed on an insulating substrate 21 made of the same material as that of the above-described embodiment. , W, and the like, and the first electrode contact material 22 made of A, Cu, Au, and the like, and the material waste of the first wiring electrode material 23 made of A, Cu, Au, and the like are formed. In the drawings (for example, FIG. 9), for the sake of simplicity, the pattern after patterning is also applied to the layer before the pattern, which is solid on one side. The same reference numerals are used.

Next, as shown in FIGS. 10 (a) to 10 (c), a photo resist (not shown) is applied, and then exposed, developed, backed up, and the like. Is performed. Subsequently, by performing etching and register separation, the first power The patterning of the material of the pole contact layer 22 and the material layer of the first wiring electrode layer 23 is completed. Here, the first electrode adhesion extension 22 and the first wiring electrode] 1 2 3 have an intermittent part formed as a part forming part ί 1 in a part thereof. In this example, for example, in the A portion, a disconnection has occurred in the first electrode adhesion layer 22 and the first wiring electrode layer 23 due to a defect in the photoresist or the like. .

Subsequently, Remind as in the first 1) Zu乃Optimum first 1 (Ji) _{Fig, H f B 2, T a} A £, T a S i, or C r S i O, T i 〇 _two equal The resulting heating resistance layer and Ti: Cr, Ni, Mo, W, etc., and the resulting layer are the lowering force, and the second electrode adhesion layer 24, which is laminated on this request. And a second wiring electrode layer 25 made of A, Cu, Au or the like. In this case, the second electrode adhesion layer 24 has an etching selectivity with respect to the second wiring electrode layer 25. That is, the second electrode adhesion layer 24 is made of a material that is not etched by the etching liquid that etches the second wiring electrode layer 25. , Are formed. Here, the exposed portion in the defective portion A "is covered by the material deformation of the second electrode contact layer 24 and the material of the second wiring electrode layer 25.

Subsequently, as shown in FIGS. 12 (a) to 12 (c), in the same manner as described above, the first photolithography method is used. The second distribution electrode 2δ is formed. The second wiring electrode 25 is formed by patterning with a photoresist, etching of the material layer of the second wiring electrode 25, and second electrode contact. It is formed by the removal of the layer 2 by etching and the separation of the photoresist. In this case, for example, even if a defect of the second wiring electrode 25 due to a photo resist defect or the like occurs in the “Β” part in the figure, the lower layer (the first Since the defect does not reach the wiring electrode layer 23 or the first electrode adhesion layer 22), it is not susceptible to repeated disconnection or the like.

Next, as shown in FIGS. 13 (a) to 13), the second wiring electrode is formed by the photolithography method in the same manner as described in the above (1). Part 2 (heating part 3]) was enotinated to form the second Exposing a part of 24, a heating part 30 is formed. At this time, as described above, since the second electrode adhesion layer 24 is not etched by the etching liquid of the second wiring electrode layer 25, the second electrode adhesion layer 24 is not etched. The electrode adhesion layer 24 is exposed as a heat generating portion 30 without any defect. In this step, even if a defect in the second wiring electrode layer 25 is caused by a defect in the photo resist or the like, the lower layer (the first wiring electrode layer 2 The defect does not reach 3 or the first electrode adhesion layer 2 2).

On the laminated structure of the thin films formed on the substrate as described above, for example, an S i 〇 _z layer is provided as a protection layer as a snow layer. It is formed by filing and completes the production of a substrate for an ink head.

The combination of the materials forming the laminated structure of the first wiring electrode layer Ζthe second electrode adhesion layer / the second wiring electrode layer in the present embodiment is as follows: Material layer Α layer, Α layer Cr layer + resistive material layer ZA 《layer, Cu layer / Tr layer + resistive material layer / Cu layer, Au layer i layer + resistive material layer / Aujf, A & M / Ύa Si layer / Cu layer etc. can be mentioned as preferred. Among them, A layer / Ti layer + resistive material layer A layer is most preferable.

Further, in this embodiment, since a step of no snow and no etching is performed before forming the material layer of the heat generating resistance layer, the surface on which the film is formed is smoothed and cleaned. And the adhesion of the heating resistance]! Can be improved.

As described in the above embodiment, in order to prevent disconnection of the wiring electrode due to lack of photoresist or a defect at the time of film formation, the second electrode adhesion layer is formed. 4 4 © As a material, a material having high selectivity with respect to the second wiring electrode layer, that is, an etching material for etching the second wiring electrode layer 45 In some cases, a material that is not etched is selected and used. For example, use A for the material of the first wiring electrode layer 42 and the second wiring electrode layer 45, use Ti for the material of the second electrode contact eyebrow 44, and use the second wiring electrode layer. 45 Use a mixture of acetic acid, phosphoric acid, and nitric acid as the etching solution for A, which is the material for 5, When performing reactive plasma matching using CF ₄ on T i, which is the material of the electrode adhesion layer 4, use the material of the wiring electrode layer 45 of No. 12. A & is etched by the above-mentioned etching mixture, but Ti, which is the material of the second electrode adhesion layer 44, is not etched. . Then, using the same photoresist, the reactive electrode of CF ₄ with respect to Ti, which is the material of the second electrode adhesion layer 44, is used. When the plasma etching is performed, the second electrode adhesion layer 44 is etched, but the material A of the first wiring electrode layer 43 is etched. No. Therefore, for example, even at the defective portion B ", the first wiring electrode layer 43 is not etched, so that no disconnection of the wiring electrode occurs. .

Furthermore, if there is a defect in the photoresist for forming the first wiring electrode layer, for example, as shown in a portion A of FIG. 5, the first wiring electrode layer has a defect. Etching is performed during formation, and the wiring electrode is disconnected. However, since the second wiring electrode layer 45 is formed thereon, the defective portion is covered and the disconnection does not occur in the portion A ".

In addition, in the manufacturing process of the above-described ink jet head substrate, the probability that the defective portion A "and the defective portion B occur at the same position is determined by the defect A〃. Is very small compared to the probability that each of the “defects B” will occur independently, so that the defect that occurs in each layer will not be affected until the completion of manufacturing. It does not survive. As a result, the disconnection of the wiring electrode can be substantially reduced to zero, the yield during the manufacturing process is dramatically improved, and a great effect on cost down is exerted. You.

FIG. 14 is a schematic view showing an example of an ink jet head made using the ink jet head substrate manufactured as described above. It is a perspective view. A portion i 103 of the electrothermal converter including the electrode 1104 is formed on the substrate 1102 (not shown), and the ink is placed on the top.

ΟA wall i 105 and a top plate 106 are provided. Ink 1 1 1 2 is connected to the ink jet head 1 1 0 1 through an ink storage chamber (not shown) or an ink supply line 1 107. Common sink room 1 1 Supplied to OS It is. In the figure, reference numeral 1109 denotes an ink supply pipe connector. The ink 1 1 1 2 lined up to the common ink chamber 1 1 108 is supplied to the ink path 1 1 1 0 by so-called capillary action, and is discharged to the ink path. Stability is maintained by forming a force and force at the outlet 1 1 1 1. Then, the heat generated by the heat generating portion 1103 of the electrothermal converter heats the ink on the heat generating portion 1103 rapidly, and causes the ink on the ink path to be heated. Air bubbles are formed in the ink, and ink is discharged from the discharge ports 1 1 1 1 based on the air bubbles. This figure shows a high-density orifice array called "JI" with a density of 16 orifices and a multi-orifice orifice with 18 or 256 orifices. The head is shown.

FIG. 15 is a schematic perspective view showing a main part of an example of an ink jet apparatus to which the ink jet head shown in FIG. 14 is attached. This ink jet device is a so-called serial scanning type device. In the figure, the ink head 208 is detachably mounted on a carriage 206 guided by a guide shaft 205, and the recording paper 202 ^ Scanning is performed in a direction that intersects almost perpendicular to the feeding direction. Reference numeral 201 denotes a feed roller, which feeds the recording paper 202 to a desired position on the plate 203. Reference numeral 204 denotes recovery means for maintaining the state of the discharge port in the home position Hp. The recovery means includes an elastic cap for covering the discharge port, a suction pump for sucking the ink from the discharge port, and the like.

The driving of the recording sheet conveying means, the head scanning means and the ejection recovery means of the ink jet recording apparatus, the driving of the recording head, and the like include, for example, the CP on the main machine side. It is controlled based on the command and signal output from the control means.

Fig. 16 shows an example of a full-line ink jet recording head in which the discharge ports are provided, for example, in a size of 100 m or more, corresponding to the entire width of the recording area of the recording paper. It is a typical perspective view shown. An ink jet head substrate 1 i 1 on which a plurality of semiconductor devices 1 1 2 such as driving ICs are mounted is used as a flat board. The flexible cable holding member 105, which is juxtaposed on the support plate 102 together with the flexible cable 104, and has rigidity, is made of a thin plate-like elastic body by a flexible cable holding member 105 and four screws 106. It is pressed through a certain holding rubber 107, and the wiring part of the base 111 and the flexible cable 104 are mechanically fixed and electrically connected. It has been done. Reference numeral 103 denotes an ink supply pipe for supplying the ink from both sides into the common ink chamber of the head, which is constituted by an elastic tube. In FIG. 14, the common ink chamber indicated by reference numeral 111 and the ink passage indicated by reference numeral 110 have a concave portion formed on the ink passage forming member 114 made of resin. It is formed. In FIG. 14, a large number of discharge ports denoted by reference numeral 111 are provided in parallel at a portion denoted by reference numeral i01 of the ink passage forming member 114. Then, these are adhered and fixed on the base body 11 1 to form an ink jet head.

FIG. 17 is a schematic perspective view showing the outline of an ink jet recording apparatus equipped with a full-line type ink jet recording head. In this figure, 365 is a transport belt for transporting a recording member such as paper. The transfer belt 365 transfers a recording member (not shown) along with the rotation of the transfer roller 365. The lower surface of the ink jet recording head 332 is a discharge port surface 331 in which a plurality of discharge ports are arranged corresponding to the recording area of the member to be recorded.

〔Example〕

Hereinafter, the present invention will be described in more detail with reference to examples.

Example 1

A vacuum chamber is placed on a support 41 made of single-crystal Si having a SiO ₂ film (film thickness: 2.75 μm) formed on the surface by thermal oxidation. Nba Ri by one within at H f B ₂ (purity 9 9.9% or more) and the child you are with the other one rodents door perform the scan Nono 'jitter Li in g, a heating resistor layer H f B ₂ A layer (layer: 1000 A) was formed. This snow ,. Conditions for phthalating are as follows: That was correct.

Suffering conditions

Target area: 8 inch ø

High frequency power: 150 VV

Support set temperature: 100

Film formation time: 20 minutes

Database-flops LESSON sheet catcher over 1 X 1 0- ⁵ P a following

Snout ring gas argon

Sputtering gas pressure 0.5 Pa

Next, switch the target to Ti (purity 99.9% or more),

Deposition time: 1 minute

With the exception of the buffering conditions, sputtering was performed in the same manner as described above, and a Ti layer (layer thickness: 50 persons) was formed. In this embodiment, stacking of these H f B ₂ layer and T i layer, a first electrode contact layer 4 2. In addition, switch the target to Α £ (purity 99.9% or more)

High frequency power: 500 W

Deposition time: 6 minutes

The sputtering conditions were the same as described above, and sputtering was performed to form an AJ2 layer (film thickness: 450 OA) to be the first wiring electrode layer 43. (Refer to Fig. 4) and Fig. 4W.

Next, the lamination and A layer of the H f B _z layer and T i layer, Roh, that by the full O door Li source graph I in the jar like the following: was ter-learning. First, a photo resist (trade name: OFPR 800, manufactured by Tokyo Ohka Co., Ltd.) is applied as a layer (layer thickness: 1.3'm) on the layer, and a conventional method is used. Exposure, development, and baking were performed according to. Next, a mixed solution of acetic acid, phosphoric acid, and nitric acid (acetic acid 9% by weight, phosphoric acid 73% by weight, nitric acid 2% by weight, and the remaining 16% by weight) was used as an etching solution. , The A £ layer was etched. Thereafter, performs error pitch packaging of a stack of a vacuum switch turbocharger down bar one within the H f B ₂ layer I by the re-A Figure 6-2 Operation Bue Tsu Chi ring in and T i layer, The photo resist was removed to complete pattern hunting (pattern width: 12 μrn, no, number of turns: 473 6). The conditions for this reactive fetching were as follows.

Reactive etching conditions

High frequency power 450 W

Etching time 時 5 minutes

Baie Ichisu flops of Tsu Shi turbocharger 1 X 1 0 - ³ P a following

Etching gas BC & ₃

Etching gas pressure 3 Pa

(See FIGS. 5 to 5 (c).)

Next, Ti (purity of 99.9% or more) is targeted in the vacuum chamber.

Film formation time: 4 minutes

By performing sputtering in the same manner as described above except for the sputtering conditions described above, the Ti layer (layer thickness: 200) serving as the second electrode adhesion layer 44 is obtained. A) was formed.

Furthermore, switch the target to A (purity 99.9% or more).

High frequency power: 500 W

Deposition time: 2 minutes

Spatter linking was performed in the same manner as described above except for the sputtering conditions, and an A layer (film thickness: 1500 persons) to be the second wiring electrode layer 45 was formed ( Thus, see FIGS. 6 (a) to 6 (c)).

Subsequently, photolithographic patterning was performed on the Ti and A £ layers as follows. First, the same photoresist as described above is applied as a layer (layer thickness: 1. Sm) on the A £ layer, and then exposed, developed, and so on in a conventional manner. A base king was applied. Then, the layer is etched using the same etching solution as described above, and then in a vacuum chamber.

Etching time: 4 minutes Etching gas: CF ₄

Except for reactive cutting conditions other than the above, etching of the Ti layer is performed by reactive etching, and the photolithography is performed. The pattern was removed by removing the register (pattern width: 8 m, number of patterns: 473 6). (See FIGS. 7 to 7 (c)). Next, the A layer serving as the first wiring electrode layer 43 was subjected to photolithography turning as follows. First, the same photoresist as that described above is applied as a layer (layer thickness: 1.3 m) on the layer A, and exposure, development, and cleaning are performed in accordance with a conventional method. A king was given. Next, using the same etching solution as described above, A / H-based etching was performed to remove the photoresist, and a heating section of 20 jum X 100 m in size was removed. 4736 (see FIGS. 8 (a) to 8 (c)).

On the laminated structure of the thin films formed on the substrate as described above, a SiO ₂ layer was formed as a protective layer by sputtering (layer thickness: 1, 3 μm), the creation of the ink jet head rest according to the present example was completed.

On the ink jet head substrate thus formed, the wall of the ink path 1 1 1 10 communicating with the discharge port 1 1 1 1 1 is coated with the photosensitive resin. By forming a glass top plate 1106 thereon, the ink jet head shown schematically in FIG. 14 is formed. The obtained ink jet head had 473 6 discharge ports corresponding to the above-described heat generating portion.

A total of 100 such inkjet heads were created. Example 2

The sputtering is performed on the same support 21 as in Example 1 using Ti (purity of 99.9% or more) as a target with a vacuum chamber 內. Thus, a Ti layer (layer thickness: 50 persons) to be the first electrode adhesion layer 22 was formed. did. The conditions for this sputtering were as follows:

Snow, lettering conditions

Target area 8 i n c h ø

RF power 1 δ 0 0 W

Support set temperature 100 ° C

Deposition time 1 minute

Base Presser 1 x 10 Pa or less

Spattling gas

Sputtering gas pressure 0.5 Pa

Formed.

Next, switch the target to A £ (> 99.9% purity)

High frequency power: 500 W

Deposition time: 6 minutes

For the other sputtering rings other than those described above, the snow and the lettering are performed in the same manner as described above, and AJ2M (film thickness: 45) serving as the first wiring electrode layer 23 is formed. 00 A) (see FIG. 9) and FIG. 9 (b).

Subsequently, the Ti layer and the A layer are subjected to photolithography as follows. Turning was performed. First, the same photoresist as in Example 1 was applied as a layer (thickness: 1.3 <"m) on layer A, and the layer was exposed to light in a conventional manner. Then, after the layer A was etched using the same etching liquid as in Example 1, the photolithography was performed. After that, the patterning of the T: 層 layer was performed by sputtering in the vacuum chamber. Turn width: 8 τη, number of patterns: 4 7 3 6 偭) The conditions of this sputtering were as follows.

Snotter etching conditions

RF power 500 W

Etching time 2 minutes

Etching gas Etching gas pressure: 0.5 Pa

(See FIGS. 10 to 10 (c)).

Subsequently, H f B _z (purity 9 9.9% or higher) in vacuum Chi catcher down bar within one of the data - as a Getting bets

During film formation: 20 minutes

Spatter-ring conditions other than are shorted with the spatter-rings were the same as described above in rows cormorants this, the heat generating resistor layer H f B ₂ layer (thickness: 1 0 0 OA) were formed.

Next, the target is switched to Ti (purity of 99.9% or more). Snow, under the same conditions as the lettering. By performing the sputtering, a Ti layer (layer thickness: 5 OA) was formed. In this embodiment, stacking of these H f B ₂ layer and T i layer, a second electrode contact layer 2 4.

In addition, switch the target to A (purity 99.9% or more),

High frequency power: 500 W

Deposition time: 2 minutes

Then, sputtering is performed under the same sputtering conditions as described above, and the second wiring electrode layer 25 is formed as a Α £ layer (film thickness: 150 A). (See FIGS. 11 to 11 (c)).

Subsequently, the layering of the HfB ₂ layer and the Ti layer and the A / P layer were patterned by photolithography as follows. First, the same photoresist as described above was applied as a layer (layer thickness: 1.3 m) on layer A, and exposure, development, and baking were performed in the usual manner. Was given. Next, the etching of the A layer was performed using the same etching solution as described above. After that, in the vacuum chamber

Reactive etching conditions

High frequency power 450 W

Etching time 5 minutes

Vesplet shear 1 1 0 Pa or less

Etching Gas BC £ 3 Etching gas pressure: 3 Pa

The product of the HfB 2 layer and the Ti eyebrows) is performed under the conditions described in (2) above, and the photo resist is removed to complete the patterning. (Pattern width: 12 m, number of patterns: 473 6). (See FIG. 12 to FIG. 12 (c)).

Next, patterning by photolithography was performed on the A layer serving as the first wiring electrode layer 23 as follows. First, the same photoresist as described above was applied as a layer (layer thickness: 1.3 m) on the layer, and then the IS light, development, and And a base king. Next, etching of the A £ layer is performed using the same etching solution as described above, and the photoresist is removed to obtain a 20 m X 100 0 «” πι size. 473 heat generating portions were formed (see FIGS. 13 to 13 (c)).

On the laminated structure of the thin films formed on the substrate as described above, a SiO ₂ layer is formed as a protective layer by sputtering (layer thickness: 1). .3 μm), the production of the substrate for an ink head according to this example was completed.

On the ink jet head substrate thus formed, the wall of the ink passage 111 connected to the discharge port 111 is exposed to light. It is formed by using a conductive resin, and furthermore, a glass top plate 1106 is provided thereon, so that the ink cartridge shown schematically in FIG. This ink jet head, which had a head, had 473 6 discharge ports corresponding to the above-mentioned heat generating portion.

A total of 100 pieces of this ink jet head were created. Comparative Example 1

Except that the second electrode contact eyebrows 44 and the second wiring electrode layer 45 are not provided and the thickness of the first wiring electrode layer 43 is set to 600. In the same manner as in Example 1, the ink jet head base and the base were provided. Created an ink jet head.

A total of 100 ink jet heads were created. Comparative Example 2

Example 1 except that the second electrode adhesion layer 24 and the second wiring electrode layer 25 were not provided and that the thickness of the first wiring electrode layer 23 was set to 600 OA. In the same manner as in 2, an ink jet head substrate and an ink jet head equipped with the substrate were prepared.

A total of 100 such inkjet heads were created. Comparative experiment

Each of the 100 ink jet head substrates obtained in Example 1, Example 2, Comparative Example 1 and Comparative Example 2 was subjected to disconnection at the wiring electrode. Was inspected for As a result, the rate of disconnection in Examples 1 and 2 was almost halved compared to Comparative Examples 1 and 2.

In addition, each of the 100 ink jet heads obtained in Example 1, Example 2, Comparative Example 1, and Comparative Example 2 was mounted on the same apparatus body, Recording was performed by discharging ink. As a result, compared to Comparative Examples 1 and 2, the recording heads of the ink jet heads of Example 1 and Example 2 were significantly superior.

INDUSTRIAL APPLICABILITY The present invention has an excellent effect in a recording head and a recording apparatus of a method of discharging ink using thermal energy.

Representative configurations and principles are disclosed in, for example, U.S. Patent Nos. 4,723,129 and 4,740,796. It is preferable to use the basic principles described. This method can be applied to both the so-called on-demand type and the continual-use type. In particular, in the case of the on-demand type, the liquid (ink) is retained. The sheet is placed in correspondence with the liquid channel, and the electrothermal transducer has a small temperature increase corresponding to the recorded information and giving a rapid temperature rise exceeding nucleate boiling. By applying at least one drive signal, heat energy is generated in the electrothermal transducer, causing the heat-acting surface of the recording head to have a film boiling gland. This is effective because air bubbles in the liquid (ink) can be formed in one-to-one correspondence with this driving signal. The liquid (ink) is ejected through the ejection opening by the growth and contraction of the bubble to form at least one droplet. If this drive signal is formed into a pulse shape, the growth and shrinkage of the bubbles are performed immediately and appropriately, so that a liquid (ink) having particularly excellent responsiveness can be discharged, which is more preferable. Such pulse-shaped drive signals are described in U.S. Pat.Nos. 4,463,359 and 4,345 = 2262. Such is suitable. Further, if the conditions described in U.S. Pat. No. 4,313,124 of the invention corresponding to the above-mentioned temperature rise rate of the heat acting surface are adopted, more excellent recording can be performed. Can be done. The configuration of the recording head includes a combination of a discharge port, a wave path, and an electrothermal converter (a linear liquid flow path or a right-angled liquid flow path) as disclosed in each of the above-mentioned specifications. U.S. Pat.No. 4,558,333, which discloses a configuration in which the heat acting portion is disposed in a bent region, and U.S. Pat. The structure using is also included in the present invention. In addition, Japanese Patent Application Laid-Open No. Sho 59-123370 discloses a configuration in which a common slit is used as a discharge section of an electrothermal converter for a plurality of electrothermal converters. The present invention is effective even with a configuration based on Japanese Patent Application Laid-Open No. 59-138641, which discloses a configuration in which a hole for absorbing a pressure wave of thermal energy is provided for a discharge portion. is there.

Further, a full-line type recording head having a length corresponding to the width of the maximum recording medium that can be recorded by the recording device is disclosed in the above specification. Depending on the combination of the multiple recording heads, either a configuration that satisfies the required height or a configuration as one integrally formed recording head may be used. These effects can be more effectively exerted.

In addition, by being attached to the main unit, electrical connection with the main unit is achieved. Supply of ink from the equipment or the main body of the device. The recording head of the interchangeable tip that enables line-up, or the force trimmer integrated with the recording head itself. The present invention is also effective when using a recording head of a judge type.

Further, the addition of a recovery means, a preliminary auxiliary means, etc. for the recording head provided as a configuration of the recording apparatus of the present invention can further stabilize the effect of the present invention. It is a good thing. To be more specific, a recording head, a cleaning means, a pressurizing or suctioning means, an electrothermal converter, or another heating element or a heating means for the recording head. It is also effective to perform the preliminary heating mode in which the preliminary heating means and the recording are ejected separately from the recording by the combination of these to perform stable recording.

Furthermore, the recording mode of the recording apparatus is not limited to the recording mode of only the mainstream color such as black, but may be realized by integrally configuring the recording head or by combining a plurality of recording heads. Although the present invention is good, the present invention is extremely effective for an apparatus provided with at least one full-color color of different colors or a full-color color by mixing colors.

In the above-described embodiments of the present invention, the description is made using the liquid ink. However, in the present invention, even if the ink is a solid at room temperature, the ink becomes softened by the chamber phenyl. However, it can be used. In the above-mentioned ink jet device, the ink itself is subjected to a temperature adjustment within a range of 30 ° C or more and 70 ° C or less, and the temperature of the ink is adjusted so that the viscosity of the ink is in a stable discharge range. Since control is generally performed, it is only necessary that the ink be in a liquid state when the use recording signal is applied. In addition, positively prevent the temperature rise due to thermal energy by using it as an energy to change the state of the ink from the solid state to the liquid state, or prevent the ink from evaporating. In this case, an ink that solidifies in a state of being left for the purpose of use is used, and in any case, the ink is liquefied by applying the heat energy according to the recording signal and the ink is liquefied. What is ejected as a liquid or when it reaches the recording medium is already The use of an ink having a property of being liquefied for the first time by thermal energy, such as a substance that starts to solidify rapidly, is also applicable to the present invention. In such a case, a porous seal as described in JP-A-54-56847 or JP-A-60-712260 is used. (1) In a state in which the liquid or the solid is held in the concave portion or the through hole, a configuration may be adopted in which the electrothermal converter faces the electrothermal converter. In the present invention, the most effective one for each of the above-mentioned inks is one that executes the above-mentioned film boiling method. Brief description of the plane

1 to 3 are schematic views showing an example of a conventional ink jet head substrate according to a manufacturing process thereof. FIGS. 1 (a) to 3 (a) are plan views, and FIGS. 1 (b) to 3 (b) are cross-sectional views.

FIG. 4 to FIG. 8 are schematic views showing an example of an ink jet head substrate of the present invention according to its manufacturing process. FIGS. 4 (a) to 8 (a) are plan views, FIGS. 4 (b) to 80>) and FIGS. 5 (c) to 8 (c) are cross-sectional views.

FIGS. 9 to 13 are schematic views showing another example of the ink jet head substrate of the present invention according to its manufacturing process. Fig. 9 (a) Figs. 13 to 13 (a) are plan views, Figs. 9 (b) to 13 (b) and 10 (c) Figs. Is a sectional view.

FIG. 14 is a schematic perspective view showing an example of an ink jet head.

FIG. 15 is a schematic perspective view showing an ink-jet apparatus in which the ink jet head shown in FIG. 14 is mounted.

FIG. 16 is a schematic perspective view showing an example of a funnel line type ink jet head in which discharge ports are provided over the entire width of a recording area of a recording member. .

Fig. 17 shows a case where a full-line ink jet head is mounted. FIG. 2 is a schematic perspective view showing the outline of an ink jet device.

Claims

Scope of request

(1) a pair of first wiring electrode layers provided on the substrate via the first electrode adhesion layer;

A pair of second wiring electrode layers provided on the pair of first wiring electrode layers corresponding to the pair of first wiring electrode layers via a second electrode close contact member;

Has,

An ink characterized in that the first electrode adhesion layer includes a heating resistance layer that generates heat by applying a voltage through the pair of first and second wiring electrode layers. Base for jet head.

(2) The ink jet head according to claim 1, wherein the second electrode adhesion layer is formed of a material having etching selectivity with respect to the second wiring electrode layer. Base for

(3) The substrate for an ink jet head according to claim 1, wherein the first electrode adhesion layer has a laminated structure including the heating resistance layer.

(4) The combination of materials forming a laminated structure of the first wiring electrode layer / the second electrode adhesion layer / the second wiring electrode layer is A liZ Tilf / A jg layer, A Layer / Cr layer ZA J2 Eyebrows, Cu layer ZT i layer / Cu layer, Au layer No Ni layer / Au layer, and A layer /

2. The substrate for an ink jet head according to claim 1, wherein the substrate is one of a Ta Si i-Cu layer.

(5) a pair of first wiring electrode layers provided on the substrate via a first electrode adhesion layer, and the pair of first wiring electrodes corresponding to the pair of first wiring electrode layers; A pair of second wiring electrode layers provided on the layer with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer comprises a pair of the first and second wiring layers. A substrate for an _ink jet head including a heating resistor layer that generates heat by applying a voltage via the wiring electrode layer; On the base, an ink path communicating with a discharge port for discharging the ink is provided corresponding to a heat generating portion of the heat generating resistance layer positioned between the pair of first and second wiring electrode layers. And an ink jet head that discharges ink from the outlet using thermal energy generated by the heat generating portion.

(6) The ink jet head according to claim 5, wherein the ink jet head is a full-line type having a plurality of the discharge ports over the entire width of a recording area of the recording member. Head for link jet.

(7) a pair of first wiring electrode layers provided on the substrate via the first electrode adhesion layer, and the pair of first wiring electrodes corresponding to the pair of first wiring electrode layers; A pair of second wiring electrode layers provided on the layer with a second electrode adhesion layer interposed therebetween, wherein the first electrode adhesion layer comprises a pair of the first and second wiring layers. A base for an ink jet head including a heat-generating resistor layer that generates heat by applying a voltage via the wiring electrode layer, and discharges ink onto the base; An ink path communicating with the outlet is provided corresponding to a heat generating portion of the heat generating resistance layer located between the pair of first and second wiring electrode layers, and the heat generating portion is generated. An ink jet head for discharging the ink from the discharge port by utilizing the heat energy generated by the heat sink;

Transport means for transporting a recording member on which recording is performed by the ink discharged from the discharge port of the ink jet head. Ink jet equipment.

(8) The ink jet head according to claim 7, wherein the ink jet head is a full-line type having a plurality of the discharge ports over the entire width of a recording area of the recording target member. Jetting device.

(9) a pair of first self-line electrode layers provided on the substrate via the first electrode adhesion layer;

A pair of second wiring layers provided on the pair of first wiring electrode layers via a second electrode adhesion layer corresponding to the pair of first wiring electrode layers. Of the wiring electrode,

And ―

An ink characterized in that the first electrode adhesion layer includes a heating resistance layer that generates heat when a voltage is applied through the pair of first and second wiring electrode layers. Substrate for jet head.

(10) The inkjet device according to claim 9, wherein the second electrode adhesion layer is formed of a material having etching selectivity with respect to the second wiring electrode layer. Base for heads.

(11) The substrate for an ink jet head according to claim 9, wherein the second electrode adhesion layer has a laminated structure including the heating resistance layer.

(12) The combination of the first wiring electrode layer / second electrode adhesion layer and the material forming the laminated structure of the second wiring electrode layer is A layer, T i layer + resistance material layer / Α layer,ノ layer Cr layer + resistive material layer ZA layer, Cu layer Tr layer + resistive material layer / Cu layer, Au layer Ni layer + resistive material layer Au layer, and A layer / T 10. The substrate for an ink jet head according to claim 9, which is any one of a Si layer and a ZCu layer.

(13) A pair of first self-line electrode layers formed on the substrate via the first electrode adhesion layer, and the pair of first wire electrode layers corresponding to the pair of first wiring electrode layers. A pair of second wiring electrode layers provided on the wiring electrode layer with a second electrode adhesion layer interposed therebetween, wherein the second electrode adhesion layer comprises the pair of first and second electrodes. (2) a substrate for an ink head including a heating resistor layer that generates heat by applying a voltage via the wiring electrode layer;

On the substrate, an ink path communicating with a discharge port for discharging the ink corresponds to a heat generating portion of the heat generating resistance layer located between the pair of first and second wiring electrode layers. An ink jet head, which is provided and discharges ink from the discharge port by using thermal energy generated by the heat generating portion.

(14) The amount by which the above-mentioned ink head is recorded on the recording member. 14. The ink jet head according to claim 13, wherein the ink jet head is a full-line type having a plurality of the discharge ports over the entire width of the region.

(15) A pair of first wiring electrode layers provided on the substrate with a first electrode adhesion layer interposed therebetween, and the pair of first wiring electrode layers corresponding to the pair of first wiring electrode layers. And a pair of second wiring electrode layers provided with a second electrode adhesion layer interposed therebetween, wherein the second electrode adhesion layer comprises a pair of the first and second wiring electrodes. A base for an ink jet head including a heating resistor layer that generates heat by applying a voltage through the layer, and communicates with a discharge port for discharging an ink on the base. An ink path is provided corresponding to a heat generating portion of the heat generating resistive layer located between the pair of first and second wiring electrode layers, and the heat energy generated by the heat generating portion is provided. An ink jet head for discharging ink from the discharge port by using the ink jet head,

(16) The ink jet recording head according to claim 15, wherein the ink jet head is a full-line type having a plurality of the discharge ports over the entire width of the recording area of the recording member. Cutout device.

(17) a step of sequentially forming a material layer of a first electrode adhesion layer and a material layer of a first wiring electrode layer on a substrate;

Material of the first wiring electrode layer)! Patterning to form the first wiring electrode layer;

Patterning the material layer of the first electrode adhesion layer to form the first electrode adhesion layer;

A second electrode contact layer having an etching selectivity with respect to the material layer of the second wiring electrode layer and the material layer of the second wiring electrode layer, on the first electrode contact layer. Forming a material layer of the second electrode contact layer on the substrate side, and sequentially forming the material layer of the second electrode adhesion layer on the substrate side; Forming the second wiring electrode layer by patterning the material of the second wiring electrode by etching.

Patterning the material layer of the second electrode adhesion layer to form the second electrode adhesion eyebrow;

A method for producing a substrate for an ink head, comprising:

(18) An intermittent portion is formed with respect to the first wiring electrode layer, the second electrode adhesion layer, and the second wiring electrode layer, and the first electrode is located at the intermittent portion. 18. The method for producing a base for an ink jet head according to claim 17, wherein the adhesive layer is a heat generating portion.

(19) An intermittent portion is formed with respect to the first electrode adhesion layer, the first wiring electrode layer, and the second wiring electrode layer, and the second electrode is located at the intermittent portion. 18. The method for producing a base for an ink jet head according to claim 17, wherein the adhesive layer is a heat generating portion.