JPH08288606A - Metallic core type printed board, its manufacture, and electric circuit board - Google Patents

Abstract

PURPOSE: To provide a method by which a highly practical metallic core type printed board on which a plurality of current paths can be formed by dividing a metallic core into metallic bodies and separating the metallic bodies from each other in accordance with the application and can block the transfer of heat can be manufactured and a highly reliable electric circuit board constituted of the printed board. CONSTITUTION: A metallic core type printed board has a metallic core 3 between two insulating plates 1 and 2. A metallic body 5 separated from the core 3 is formed in the core 3 by forming punched parts 8 on the periphery of the separating part 3a of the core 3, with connecting sections 4 being left, and laminating and sticking the plates 1 and 2 upon and to both surfaces of the core 3, and then, removing the connecting sections 4 by boring holes 6 after the punched parts 8 are filled up with an adhesive.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used in various electric devices, and more particularly, to a metal core type printed circuit board having a metal core formed between the printed circuit board and a method of manufacturing the same, and the above printed circuit board. The present invention relates to an electric circuit board configured by.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board has been used for mounting circuit components of electric equipment. In particular, in the case where a large current circuit is formed like a power supply circuit, the amount of heat generated by mounted components is large, and noise resistance and low ripple are required, a metal plate, a so-called metal core is formed on the entire inner layer of the printed circuit board. Using a metal core type printed circuit board that has this, the metal core absorbs heat to dissipate heat from the mounted components. Also, by using the metal core as a circuit conductor (for example, power line or ground line), the line It has been attempted to reduce the impedance and noise of the.

As shown in FIG. 7, such a printed circuit board has 1
The thin metal core 3 is an inner layer, and the upper and lower insulating plates 1 and 2 are laminated so as to sandwich the inner core, and these are laminated with an adhesive 7. Further, through holes TH are often formed in such a substrate for mounting a post-installed component or for conducting the upper and lower layers. In this case, holes H for through holes are provided in the metal core 3 in advance, and the insulating plates 1 and 2 are provided. After laminating and adhering, holes are formed on the insulating plate, and copper is plated on the holes. (See Figure 8)

[0004]

However, as described above, when the metal core layer is composed of one metal plate connected to each other, the heat generated by the mounted components spreads over the entire surface of the metal core, and the heat is generated. This causes another mounted component with low heat resistance to be heated, which adversely affects the electrical characteristics of the component and results in abnormal circuit operation. In addition, the heat diffusion effect of the metal core layer also absorbs solder heat during component mounting, making soldering difficult. In particular, manual soldering of post-mounted components that cannot be surface-mounted has extremely poor workability.

Also, when this metal core is used as a conductor for a circuit, since it is one metal plate that is connected, it can be used only in a current path of the same potential (for example, only one power supply line or only ground line). There is a restriction that it cannot be used.

The object of the present invention is to solve the above-mentioned drawbacks and to divide and separate the above-mentioned metal core into several metal bodies according to the intended use, thereby making it possible to form a plurality of current paths, and to form a substrate. It is an object of the present invention to provide a highly practical method of manufacturing a printed circuit board of a metal core type capable of blocking the heat transfer, and a highly reliable electric circuit board including the printed circuit board.

[0007]

That is, in the invention of the printed circuit board of the metal core type among the present invention, a metal core (3),
In a metal core type printed circuit board formed by adhering two insulating plates (1, 2) laminated so as to sandwich the metal core (3), the metal core (3) is the metal core (3).
A predetermined gap (8) is provided to separate the metal from, and the metal body (5) is formed by filling the gap with an adhesive (7).

In the invention of the method for manufacturing a metal core type printed circuit board among the present invention, a metal core type having a metal core (3) between two insulating plates (1, 2) is used. A method of manufacturing a printed circuit board, comprising forming a cutout portion (8) at a part of a periphery of a separation portion (3a) of the metal core (3), leaving a connection portion (4) at a part of the metal core (3). After laminating and adhering the insulating plates (1 and 2) so as to be sandwiched from both sides and filling the removed part (8) with an adhesive (7), the connecting part (4) is opened with a hole (6). Then, the metal body (5) separated from the metal core (3) was formed on the metal core (3).

In the invention of the electric circuit board of the present invention, the metal core (3) and the two insulating plates (1, 2) laminated so as to sandwich the metal core (3) are bonded together. An electric circuit board composed of a metal core type printed circuit board, the metal core (3) is separated from the metal core (3) with a predetermined gap, and the gap is filled with an adhesive. The metal body (5) thus formed was used as a conductor for a large current circuit or a heat transfer blocking part of a heat-generating electric component.

[0010]

[Operation] With the above structure, in the inventions of the printed circuit board and the electric circuit board of the present invention, since the formed metal body is electrically insulated from the metal core, it is used as a circuit conductor of various potentials. It will be possible. Further, since the metal body is separated from the metal core, heat transfer is cut off.

Further, in the invention of the method for manufacturing a printed circuit board of the present invention, the separation portion of the metal core is cut out so as to surround a part where a connecting portion is left, and insulating plates are laminated above and below the metal core. After bonding, the connecting portion is removed to form a metal body separated from the metal core. In this way, by connecting some of them before stacking and bonding so that the separated parts are supported by the metal core with the required strength, misalignment during the stacking and bonding process is prevented, and the metal core is accurately It becomes possible to divide / separate well, and it becomes possible to easily manufacture a printed board having a metal core layer on which a metal body is formed.

[0012]

EXAMPLE A characteristic of the method for manufacturing a metal core type printed circuit board according to the present invention is that a part of the metal core layer is formed separately from other parts. An example of the manufacturing method will be described. The laminated structure and bonding of the metal core 3 and the insulating plates 1 and 2 and the through-hole treatment are the same as those in the prior art shown in FIGS. 7 and 8, and their detailed description is omitted.

FIG. 1 is a view showing a metal core 3 as an inner layer,
When the metal core 3 is processed, the connecting portions 4 are left in two places, and the punched portion 8 is formed by punching so as to surround the separation portion 3a (the hatched portion in FIG. 1A), and this is processed into an island shape. The connecting portion 4 has a width such that the strength required for substrate processing can be maintained, and the formation location and the number thereof are not limited to this. or,
The separation place 3a is not limited to one place as in the present embodiment, but may be provided appropriately according to the use conditions.

Next, the metal core 3 processed as shown in FIG. 2 is sandwiched between the insulating plates 1 and 2 from both sides to be laminated, and simultaneously adhered and fixed by the adhesive 7 applied. At this time, as described above, since the separation portion 3a is supported by the metal core 3 with the required strength by the connecting portion 4, the separation portion 3a does not shift in the stacking, and after the bonding, the separation portion 3a does not move to the metal core extraction portion 8. The adhesive 7 penetrates and the separation point 3a is completely fixed.

After the insulating plates 1 and 2 are laminated and adhered, the connecting portion 4 is formed.
When a hole 6 is formed from the outside and the connecting portion 4 is removed, the island-shaped separating portion 3a is completely separated from the metal core 3 and a printed circuit board having a metal core 3 in which an independent metal body 5 is formed in the inner layer. Is created. The above is the method for manufacturing a printed circuit board according to the present invention. The printed circuit board manufactured in this manner is used, and an electric circuit board in which the metal body 5 of the metal core 3 is effectively used Examples will be described.

Since the metal body 5 is electrically separated and insulated from the metal core 3, it can be used as a conductor for a circuit, that is, an independent current path. An example is shown in which the body 5 is used as a circuit conductor for high current.

In the figure, the metal core 3 is divided into four metal core portions A, B, C and D, which are separated to form a metal body 5A,
5B, 5C, and 5D are formed, and the metal body 5B and the metal body 5 are further formed.
The resistor R1 is mounted between D and the resistor R2 is mounted between the metal body 5D and the metal body 5C.
-It is an example of the electric circuit board which comprised the electric current path of 5 C of metal bodies. In this case, if the conductor width of the metal body 5D serving as the intermediate current path is properly secured according to the current, an efficient electric circuit with less circuit loss can be formed. In addition, 6 is a hole opened to remove the connecting portion of the separation points A, B, C and D of the metal core 3.

Further, since the metal body 5 is a separate body, heat transfer with the metal core 3 is cut off. In FIG. 5, an embodiment of an electric circuit board configured to utilize this heat transfer cutoff effect is shown. Indicates. This figure shows parts with large heat value, parts with high heat resistance A1, A2, A3, A4 and parts with low heat value, or parts with low heat resistance (damaged or damaged by ambient heat). Parts that tend to be stable), B1,
This is an example in which B2 is mixed.

In the present invention, the parts A1, A2, A3, A4 are
Is arranged on a printed circuit board portion having a series of metal cores 3 having a relatively large conductor area, while parts B1 and B2 are arranged and mounted on a printed circuit board portion on which a small divided / separated metal body 5 is formed. Has been done. Therefore, part A1
, A2, A3, A4 heat is diffused to the metal core 3, and the real phase components are efficiently cooled. On the other hand, since the heat transfer from the metal core 3 is cut off in the parts B1 and B2, they are not easily affected by the heat generation and the circuit operation becomes stable.

Further, such heat transfer blocking effect is also effective for improving workability in mounting components. That is, in the case where a component which is difficult to mount on a surface is to be retrofitted by hand soldering, as shown in FIG. By forming a donut shape by forming a defect in a connected form (hatched portion in FIG. 6), the conductor area can be reduced, the diffusion of solder heat is suppressed, and the soldering work becomes extremely easy.

[0021]

As described above, according to the invention of the printed circuit board of the metal core type among the present invention, the formed metal body is electrically insulated from the metal core with a gap such as a removed portion, and Since it is thermally cut off, it has extremely high practical value.

Further, according to the invention of the method for manufacturing a metal core type printed circuit board among the present invention, when the printed circuit board is manufactured,
Missing in a state where the separated parts of the metal core are partially connected,
After the insulating plates are laminated and adhered from both sides, the metal parts separated from the others are formed in the metal core by deleting this connecting part. It will be supported by the metal core with strength,
There is no displacement during the lamination process. Therefore, the metal core can be accurately divided / separated, and the printed board having the metal core layer on which the metal body is formed can be easily manufactured. Further, according to the invention of the electric circuit board in the present invention, since the metal body of the metal core formed by the above method is electrically insulated from the metal core, it can be used as a conductor for a circuit. Thus, various current paths can be formed on the electric circuit board. In addition, since the metal body is a metal plate, the current capacity is extremely large, and it is possible to manufacture a stable electric circuit board with less circuit loss, noise, ripple, etc., even though it is a large current circuit circuit.

Further, since heat transfer is cut off between the metal body and the metal core, if a component having low heat resistance or a small amount of heat generation is mounted on the printed circuit board portion on which the metal body is formed, a heat generating component will be generated in the periphery. Even if it is mounted, it is hard to be affected by the heat, so that the circuit operation is stable and the reliability is improved.

Further, due to such a heat transfer blocking effect, by pulling out the metal core around the through-hole round for mounting in a donut shape, diffusion of solder heat at the time of mounting the component is prevented and the soldering work becomes easy. The workability in mounting the retrofit parts, which has been a bottleneck in the past, is significantly improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a process of manufacturing a metal core type printed circuit board according to the present invention, (a) is a plan view showing a processed state of a metal core, and (b) is a sectional view taken along line I-I thereof.

2A and 2B are views showing a manufacturing process of a metal core type printed circuit board, FIG. 2A is a plan view showing a state after laminating and adhering an insulator, and FIG. 2B is a sectional view taken along the line II.

FIG. 3 is a diagram showing a process of manufacturing a metal core type printed circuit board, in which (a) is a plan view showing punching processing after laminating and adhering an insulator, (b) is a sectional view taken along line I-I of FIG. c) is a II-II sectional view.

FIG. 4 is a diagram showing an electric circuit board according to the present invention.

FIG. 5 is a diagram showing an electric circuit board different from that of FIG. 4;

FIG. 6 is a diagram showing an electric circuit board different from that of FIG. 5;

FIG. 7 is a view showing a manufacturing process of a conventional metal core type printed circuit board, which is a cross-sectional view showing a state after lamination and pressure bonding of an insulator.

FIG. 8 is a view showing a manufacturing process of the same metal core type printed circuit board, and a sectional view showing a through-hole forming state.

[Explanation of symbols]

 1, 2 Insulation plate 3 Metal core 3a Separation point of metal core 4 Connection part 5 Metal body 6 Hole 7 Adhesive 8 Gap (removed part)

Claims (3)

[Claims] 1. A metal core (3) and the metal core (3)
In a printed circuit board of a metal core type, which is formed by adhering two insulating plates (1, 2) stacked so as to sandwich the metal core (3), the metal core (3) has a predetermined gap (8) from the metal core (3). ) Is provided and separated, and a metal core type printed board having a metal body (5) formed by filling an adhesive (7) in the gap. 2. A method of manufacturing a metal core type printed circuit board comprising a metal core (3) between two insulating plates (1, 2), wherein the metal core (3) is separated. (3a) Forming a cut-out portion (8) leaving a connecting portion (4) at a part of the periphery, and laminating and bonding the insulating plates (1, 2) so as to sandwich the metal core (3) from both sides. And the removed portion (8)
After the adhesive (7) is filled in, the connecting portion (4) is removed at the opening of the hole (6) to form a metal body (5) separated from the metal core (3) on the metal core (3). A method of manufacturing a metal core type printed circuit board, characterized in that. 3. A metal core (3) and the metal core (3).
An electric circuit board comprising a metal core type printed circuit board formed by adhering two insulating plates (1, 2) laminated so as to sandwich the metal core (3) with the metal core (3). A metal body (5) is formed by separating the metal body from (3) with a predetermined gap and filling the gap with an adhesive. The metal body (5) is a conductor for a large current circuit, or An electric circuit board, which is used as a heat transfer blocking portion of a heat-generating electric component.