JPH08281233A - Method of washing pipe - Google Patents

Method of washing pipe

Info

Publication number
JPH08281233A
JPH08281233A JP7116375A JP11637595A JPH08281233A JP H08281233 A JPH08281233 A JP H08281233A JP 7116375 A JP7116375 A JP 7116375A JP 11637595 A JP11637595 A JP 11637595A JP H08281233 A JPH08281233 A JP H08281233A
Authority
JP
Japan
Prior art keywords
pipe
ultrapure water
cleaning
wall surface
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7116375A
Other languages
Japanese (ja)
Inventor
Terutaka Sawara
輝隆 佐原
Akio Tanaka
明雄 田中
Masamitsu Ito
真実 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP7116375A priority Critical patent/JPH08281233A/en
Publication of JPH08281233A publication Critical patent/JPH08281233A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To utilize a difference in expansion and shrinkage between an inside wall surface of a pipe and dirt stuck on the wall surface by alternately feeding washing liquids having mutually different temps. in the pipe, to peel and remove the dirt from the wall surface and also to discharge the washing liquid remaining in the inside of the pipe by blowing gas. CONSTITUTION: A first feed unit 14 in a pipe washing device 10 feeds ultrapure water heated to a first setting temp. at a hot ultrapupre water production device 20 into a pipe 12 to be washed, via a feed piping 22. Also, a second feed unit 16 feeds ultrapure water cooled to a second setting temp. at an ultrapure water tank 30 provided with a cooling device 28 into the pipe 12 to be washed, via a feed piping 32. Besides, a gas feed unit 18 feeds gaseous nitrogen ejected from a gaseous nitrogen cylinder 38 into the pipe 12 to be washed, via a feed piping 40. Washing of an electropolished pipe 12 is performed by controlling the operation of each of control valves 27A, 37A, 43A respectively of feed units 14, 16, 18 with a control part. Namely dirt at the wall surface is peeled and removed by alternately feeding the washing liquids having mutually different temps. into the pipe.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、管洗浄方法に係り、特
に半導体集積回路等の製造に用いるガスや液を供給する
管の管洗浄方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pipe cleaning method, and more particularly to a pipe cleaning method for supplying a gas or liquid used for manufacturing semiconductor integrated circuits and the like.

【0002】[0002]

【従来の技術】一般に半導体集積回路等の製造設備で
は、少量の微小塵埃も製品不良の原因になることから、
製造に用いるガスや液を供給する配管系には、内壁面に
付着する微小塵埃や油分等の汚れを予め十分に除去した
管を用いる必要がある。従来この種の管の洗浄は、昇温
した洗浄液に管を浸漬したり、管内に所定温度の洗浄液
を流したりして洗浄している。
2. Description of the Related Art Generally, in a manufacturing facility for semiconductor integrated circuits and the like, even a small amount of fine dust causes defective products.
For the piping system for supplying gas or liquid used for manufacturing, it is necessary to use a tube from which dirt such as fine dust or oil adhering to the inner wall surface is sufficiently removed in advance. Conventionally, this type of pipe cleaning is performed by immersing the pipe in a cleaning liquid whose temperature has been raised or by flowing a cleaning liquid at a predetermined temperature into the pipe.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記洗
浄方法では、管内の壁面の微細な凹凸部等に付着する微
量の汚れまでは除去することができなかった。一方、半
導体集積回路の製造設備では、ますます進む高集積化に
対応するために、従来以上に清浄な配管材が要求されつ
つあり、従来方法の洗浄で残留することのあった前記汚
れを除去する必要が生じてきた。
However, according to the above-mentioned cleaning method, it is not possible to remove even a small amount of dirt attached to fine irregularities on the wall surface in the pipe. On the other hand, semiconductor manufacturing equipment for semiconductor integrated circuits is required to use cleaner piping materials than ever before in order to respond to the ever-increasing high integration, and removes the above-mentioned stains that may remain by conventional cleaning. The need has arisen.

【0004】本発明はこのような事情を鑑みてなされた
もので、管内の壁面に付着する微量の汚れを効果的に除
去することができる管洗浄方法を提供することを目的と
する。
The present invention has been made in view of the above circumstances, and an object thereof is to provide a pipe cleaning method capable of effectively removing a small amount of dirt adhering to the inner wall surface of a pipe.

【0005】[0005]

【課題を解決する為の手段】本発明は、前記目的を達成
するために、管内に洗浄液を流通させて前記管内の壁面
に付着している汚れを除去する管洗浄方法において、所
定温度の洗浄液を前記管内に所定時間流して前記管内を
洗浄する第1の洗浄工程と、前記所定温度の洗浄液とは
異なる温度の洗浄液を前記管内に所定時間流して前記管
内を洗浄する第2の洗浄工程と、前記第1及び第2の洗
浄工程の少なくとも一方の洗浄後に、前記管内に気体を
吹き込んで管内に残留する洗浄液を管外に排除する残留
洗浄液排出工程と、から成る洗浄操作を少なくとも1回
以上繰り返すことを特徴とする。
In order to achieve the above object, the present invention provides a pipe cleaning method of circulating a cleaning liquid in a pipe to remove dirt adhering to the wall surface of the pipe, and a cleaning liquid having a predetermined temperature. And a second cleaning step of cleaning the inside of the pipe by flowing a cleaning liquid having a temperature different from the cleaning liquid of the predetermined temperature for a predetermined time. A residual cleaning liquid discharge step of blowing a gas into the pipe to remove the cleaning liquid remaining in the pipe from the outside of the pipe after at least one of the first and second cleaning processes. Characterized by repeating.

【0006】[0006]

【作用】本発明によれば、異なる温度の洗浄液を管内に
交互に流通させることにより、管内の壁面及びその壁面
に付着した汚れはそれぞれ膨張又は収縮する。しかし、
管内の壁面とその壁面に付着した汚れの膨張率又は収縮
率や膨張する速さ又は収縮する速さが異なるため、壁面
とその壁面に付着した汚れとの接触面には空隙が生じ、
その空隙に洗浄液が浸透して汚れが壁面から剥離除去さ
れる。壁面から剥離した汚れは洗浄液中に溶解又は懸濁
し、洗浄液を管から排出する際に洗浄液に同伴されて除
去される。更には、気体を前記管内に吹き込んで管内に
残留する洗浄液を排除することにより、残留洗浄液に溶
解又は懸濁している汚れをも確実に除去する。
According to the present invention, by alternately flowing the cleaning liquids having different temperatures in the pipe, the wall surface in the pipe and the dirt attached to the wall surface respectively expand or contract. But,
Since the expansion rate or contraction rate of the wall surface in the pipe and the dirt attached to the wall surface and the expansion speed or the contraction speed are different, a gap is generated in the contact surface between the wall surface and the dirt attached to the wall surface.
The cleaning liquid permeates the voids, and the dirt is peeled off from the wall surface. The dirt peeled off from the wall surface is dissolved or suspended in the cleaning liquid, and is removed by being accompanied by the cleaning liquid when the cleaning liquid is discharged from the pipe. Further, by blowing a gas into the pipe to eliminate the cleaning liquid remaining in the pipe, the dirt dissolved or suspended in the residual cleaning liquid can be surely removed.

【0007】[0007]

【実施例】以下添付図面に従って本発明に係る管洗浄方
法の好ましい実施例について詳説する。図1には、本発
明に係る管洗浄方法に基づく管洗浄装置の構成図が示さ
れている。同図に示されるように、前記管洗浄装置10
は、主として、第1の設定温度に保たれた超純水を被洗
浄管12に供給する第1の供給ユニット14、第2の設
定温度(前記第1の設定温度と異なる設定温度)に保た
れた超純水を被洗浄管12に供給する第2の供給ユニッ
ト16、及び窒素ガスを被洗浄管12に供給するガス供
給ユニット18から構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the pipe cleaning method according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows a block diagram of a pipe cleaning apparatus based on the pipe cleaning method according to the present invention. As shown in FIG.
Is a first supply unit 14 for supplying ultrapure water kept at the first set temperature to the pipe 12 to be cleaned, and a second set temperature (set temperature different from the first set temperature). It is composed of a second supply unit 16 for supplying the dropped ultrapure water to the pipe to be cleaned 12, and a gas supply unit 18 for supplying nitrogen gas to the pipe to be cleaned 12.

【0008】前記第1の供給ユニット14は、超純水を
所望の温度に加熱する温超純水製造装置20を有し、こ
の温超純水製造装置20で第1の設定温度に加熱された
超純水を供給配管22を介して被洗浄管12に送水す
る。この温超純水製造装置20から被洗浄管12への超
純水の送水は、前記供給配管22の途中に設置されたポ
ンプ24を駆動することにより行われ、前記被洗浄管1
2に供給された超純水は、被洗浄管12に連結された循
環配管25を介して前記温超純水製造装置20に戻され
る。また、前記ポンプ24の下流側には、ポンプ24で
送水される超純水中に含まれる微粒子を捕捉除去するフ
ィルタ26が設置され、微粒子が被洗浄管12に流入す
るのを防止している。また、前記供給配管22及び循環
配管25には、制御バルブ27A、27Bがそれぞれ設
けられており、前記被洗浄管12に第2の供給ユニット
16又はガス供給ユニット18を接続する際は、この制
御バルブ27A、27Bを制御して、前記温超純水製造
装置20から被洗浄管12への超純水の供給を遮断す
る。この際、前記制御バルブ27Aは、超純水の送水す
る方向を切り替え、ポンプ24で送水された超純水を循
環配管25を介して前記温超純水製造装置20に戻し、
前記制御バルブ27Bは循環配管25を遮断する。尚、
この制御バルブ27A、27Bの作動は、図示しない制
御部により制御されている。
The first supply unit 14 has a warm ultrapure water producing device 20 for heating ultrapure water to a desired temperature, and the ultrapure water heated to the first set temperature by the hot ultrapure water producing device 20. Water is supplied to the pipe to be cleaned 12 via the supply pipe 22. The water supply of the ultrapure water from the hot ultrapure water producing device 20 to the pipe to be cleaned 12 is performed by driving a pump 24 installed in the middle of the supply pipe 22, and the pipe to be cleaned 1
The ultrapure water supplied to No. 2 is returned to the warm ultrapure water producing apparatus 20 through the circulation pipe 25 connected to the pipe to be cleaned 12. Further, a filter 26 for capturing and removing fine particles contained in the ultrapure water sent by the pump 24 is installed downstream of the pump 24 to prevent the fine particles from flowing into the pipe 12 to be cleaned. . Further, the supply pipe 22 and the circulation pipe 25 are provided with control valves 27A and 27B, respectively. When connecting the second supply unit 16 or the gas supply unit 18 to the pipe to be cleaned 12, this control is performed. The valves 27A and 27B are controlled to shut off the supply of ultrapure water from the warm ultrapure water producing apparatus 20 to the pipe 12 to be cleaned. At this time, the control valve 27A switches the direction in which the ultrapure water is sent, and returns the ultrapure water sent by the pump 24 to the hot ultrapure water producing apparatus 20 through the circulation pipe 25.
The control valve 27B shuts off the circulation pipe 25. still,
The operation of the control valves 27A and 27B is controlled by a control unit (not shown).

【0009】前記第2の供給ユニット16は、超純水を
所望の温度に冷却する冷却装置28が備えられた超純水
槽30を有し、この超純水槽30で第2の設定温度に冷
却された超純水を供給配管32を介して被洗浄管12に
送水する。この超純水槽30から被洗浄管12への超純
水の送水は、前記供給配管32の途中に設置されたポン
プ34を駆動することにより行われ、前記被洗浄管12
に供給された超純水は、被洗浄管12に連結された循環
配管35を介して前記超純水槽30に戻される。また、
前記ポンプ34の下流部には、ポンプ34で送水される
超純水中に含まれる微粒子を捕捉除去するフィルタ36
が設置され、微粒子が被洗浄管12に流入するのを防止
している。また、前記供給配管32及び循環配管35に
は、制御バルブ37A、37Bがそれぞれ設けられてお
り、前記被洗浄管12に第1の供給ユニット14又はガ
ス供給ユニット18を接続する際は、この制御バルブ3
7A、37Bを制御して、前記超純水槽30から被洗浄
管12への超純水の供給を遮断する。この際、前記制御
バルブ37Aは、超純水の送水する方向を切り替え、ポ
ンプ34で送水された超純水を循環配管35を介して前
記超純水槽20に戻し、制御バルブ37Bは循環配管3
5を遮断する。尚、この制御バルブ37A、37Bの作
動は前記制御部により制御されている。
The second supply unit 16 has an ultrapure water tank 30 equipped with a cooling device 28 for cooling the ultrapure water to a desired temperature. The ultrapure water tank 30 cools the ultrapure water to a second set temperature. The ultrapure water thus prepared is supplied to the pipe to be cleaned 12 via the supply pipe 32. The water supply of the ultrapure water from the ultrapure water tank 30 to the pipe 12 to be cleaned is performed by driving a pump 34 installed in the supply pipe 32.
The ultrapure water supplied to the above is returned to the ultrapure water tank 30 through a circulation pipe 35 connected to the pipe to be cleaned 12. Also,
A filter 36 for capturing and removing fine particles contained in the ultrapure water sent by the pump 34 is provided downstream of the pump 34.
Is installed to prevent fine particles from flowing into the pipe 12 to be cleaned. Further, the supply pipe 32 and the circulation pipe 35 are provided with control valves 37A and 37B, respectively. When connecting the first supply unit 14 or the gas supply unit 18 to the pipe to be cleaned 12, this control is performed. Valve 3
7A and 37B are controlled to cut off the supply of ultrapure water from the ultrapure water tank 30 to the pipe 12 to be cleaned. At this time, the control valve 37A switches the direction in which the ultrapure water is sent, returns the ultrapure water sent by the pump 34 to the ultrapure water tank 20 through the circulation pipe 35, and the control valve 37B sets the circulation pipe 3
Cut off 5. The operation of the control valves 37A and 37B is controlled by the control unit.

【0010】前記ガス供給ユニット18は、窒素ガスが
充填された窒素ガスボンベ38を有し、この窒素ガスボ
ンベ38から噴射される窒素ガスを、供給配管40を介
して被洗浄管12内に供給する。この被洗浄管12に供
給された窒素ガスは管内に残留した超純水を除去し、除
去された超純水は窒素ガスとともに被洗浄管12に連結
された排出配管41を介して管外に排出される。また、
前記供給配管40の途中には、供給する窒素ガス中に含
有する微粒子を補足的に除去するフィルタ42が設置さ
れ、ガス中の微粒子が被洗浄管12に流入するのを防止
している。また、前記供給配管40及び排出配管41に
は、制御バルブ43A、43Bがそれぞれ設けられてお
り、前記被洗浄管12に第1の供給ユニット14又は第
2の供給ユニット16を接続する際は、この制御バルブ
43A、43Bを制御して、前記窒素ガスボンベ38か
ら被洗浄管12への窒素ガスの供給を遮断する。尚、こ
の制御バルブ43A、43Bの作動は前記制御部により
制御されている。
The gas supply unit 18 has a nitrogen gas cylinder 38 filled with nitrogen gas, and supplies the nitrogen gas injected from the nitrogen gas cylinder 38 into the pipe 12 to be cleaned through a supply pipe 40. The nitrogen gas supplied to the pipe to be cleaned 12 removes the ultrapure water remaining in the pipe, and the removed ultrapure water is discharged together with the nitrogen gas to the outside of the pipe through the discharge pipe 41 connected to the pipe to be cleaned 12. Is discharged. Also,
A filter 42 for supplementarily removing fine particles contained in the supplied nitrogen gas is installed in the middle of the supply pipe 40 to prevent fine particles in the gas from flowing into the pipe 12 to be cleaned. Further, the supply pipe 40 and the discharge pipe 41 are provided with control valves 43A and 43B, respectively, and when connecting the first supply unit 14 or the second supply unit 16 to the pipe to be cleaned 12, The control valves 43A and 43B are controlled to cut off the supply of nitrogen gas from the nitrogen gas cylinder 38 to the pipe 12 to be cleaned. The operation of the control valves 43A and 43B is controlled by the control unit.

【0011】次に、前記の如く構成される管洗浄装置1
0を用いて本発明の管洗浄方法を説明する。尚、本実施
例では、被洗浄管12として、高洗浄度を要求される配
管設備に多く用いられるステンレス製の長さ4mの電解
研磨管を洗浄する実施例で説明する。予め、第1の供給
ユニット14の温超純水製造装置20及び第2の供給ユ
ニット16の冷却装置28を作動させて、第1の供給ユ
ニット14では超純水を80℃に加熱し、第2の供給ユ
ニット16では超純水を25℃に冷却しておく。これに
伴い、両供給ユニット14、16のポンプ24、34を
駆動し、両供給ユニット内の超純水をフィルタ26、3
6で循環濾過しておく。この際、制御バルブ27A、3
7Aは共に循環配管25、35側に切り替えておき、制
御バルブ27B、37Bは共に閉じておく。一方、ガス
供給ユニット18は、制御バルブ43A、43Bを共に
閉じた状態で、窒素ガスボンベ38を接続しておき、制
御バルブ43A、43Bを開けると窒素ガスが噴出する
状態にしておく。また、洗浄される電解研磨管12を所
定の位置に接続しておく。
Next, the pipe cleaning apparatus 1 constructed as described above.
0 is used to explain the tube cleaning method of the present invention. In this embodiment, as the pipe 12 to be cleaned, an electrolytic polishing pipe made of stainless steel and having a length of 4 m, which is often used in piping equipment requiring a high degree of cleaning, will be described. In advance, the hot ultrapure water producing device 20 of the first supply unit 14 and the cooling device 28 of the second supply unit 16 are activated to heat the ultrapure water to 80 ° C. in the first supply unit 14, In the supply unit 16, ultrapure water is cooled to 25 ° C. Along with this, the pumps 24 and 34 of both supply units 14 and 16 are driven to filter the ultrapure water in both supply units to the filters 26 and 3, respectively.
Circulate and filter at step 6. At this time, the control valves 27A, 3
7A is switched to the circulation pipes 25 and 35 side, and both control valves 27B and 37B are closed. On the other hand, in the gas supply unit 18, the nitrogen gas cylinder 38 is connected with the control valves 43A and 43B both closed, and the nitrogen gas is ejected when the control valves 43A and 43B are opened. Further, the electrolytic polishing tube 12 to be cleaned is connected to a predetermined position.

【0012】前記電解研磨管12の洗浄は、図2に示す
供給スケジュールに従って行われる。即ち、図示しない
制御部が、次のように各供給ユニットの制御バルブを作
動制御する。先ず、制御バルブ27Aを電解研磨管12
側に切り替えるとともに制御バルブ27Bを開き、80
℃に加熱された温超純水を電解研磨管12に3分間流通
させて管内を洗浄する。電解研磨管12に温超純水を3
分間流通させたら、制御バルブ27Aを循環配管25側
に切り替えるとともに制御バルブ27Bを閉じて、温超
純水の供給を遮断する。
The cleaning of the electrolytic polishing tube 12 is performed according to the supply schedule shown in FIG. That is, the control unit (not shown) controls the operation of the control valve of each supply unit as follows. First, the control valve 27A is connected to the electrolytic polishing tube 12.
Switch to the side and open the control valve 27B,
Warm ultrapure water heated to 0 ° C. is passed through the electrolytic polishing tube 12 for 3 minutes to clean the inside of the tube. Warm ultrapure water to electrolytic polishing tube 12
After circulating for a minute, the control valve 27A is switched to the circulation pipe 25 side and the control valve 27B is closed to shut off the supply of hot ultrapure water.

【0013】次に、制御バルブ43A、43Bを開き、
電解研磨管12に窒素ガスを10秒間噴射し、管内に残
留する温超純水を管外に排出する。窒素ガスを10秒間
噴射したら、制御バルブ43A、43Bを閉じて窒素ガ
スの噴射を遮断する。次に、制御バルブ37Aを電解研
磨管12側に切り替えるとともに制御バルブ37Bを開
き、25℃に冷却された冷超純水を電解研磨管12に2
分間流通させて管内を洗浄する。電解研磨管12に冷超
純水を2分間流通させたら、制御バルブ37Aを循環配
管35側に切り替えるとともに制御バルブ37Bを閉じ
て、冷超純水の供給を遮断する。
Next, open the control valves 43A and 43B,
Nitrogen gas is injected into the electropolishing tube 12 for 10 seconds, and the hot ultrapure water remaining in the tube is discharged to the outside of the tube. After injecting nitrogen gas for 10 seconds, the control valves 43A and 43B are closed to interrupt the injection of nitrogen gas. Next, the control valve 37A is switched to the electropolishing tube 12 side, the control valve 37B is opened, and cold ultrapure water cooled to 25 ° C. is supplied to the electropolishing tube 12.
The inside of the tube is washed by circulating it for a minute. After the cold ultrapure water is passed through the electrolytic polishing tube 12 for 2 minutes, the control valve 37A is switched to the circulation pipe 35 side and the control valve 37B is closed to cut off the supply of the cold ultrapure water.

【0014】再び、制御バルブ43A、43Bを開き、
電解研磨管12に窒素ガスを10秒間噴射し、管内に残
留する冷超純水を管外に排出する。窒素ガスを10秒間
噴射したら、制御バルブ43A、43Bを閉じて窒素ガ
スの噴射を遮断する。前記工程を3回繰り返し行い、洗
浄を終了する。この方法によれば、異なる温度の超純水
を交互に電解研磨管12内に流通させることにより、管
内の壁面及びその壁面に付着した汚れは膨張又は収縮す
る。しかし、管内の壁面とその壁面に付着した汚れは、
膨張率又は収縮率や膨張する速さ又は収縮する速さが異
なるため、壁面とその壁面に付着した汚れとの接触面に
は空隙が生じ、その空隙に洗浄液が浸透して汚れが壁面
から剥離除去される。また、洗浄後は管内に窒素ガスを
吹き込んで管内に残留する洗浄液を除去するようにした
ので、残留洗浄液に溶解又は懸濁している汚れも確実に
除去することができる。
Open the control valves 43A and 43B again,
Nitrogen gas is injected into the electropolishing tube 12 for 10 seconds, and cold ultrapure water remaining in the tube is discharged to the outside of the tube. After injecting nitrogen gas for 10 seconds, the control valves 43A and 43B are closed to interrupt the injection of nitrogen gas. The above steps are repeated 3 times to complete the washing. According to this method, the ultrapure water having different temperatures is alternately passed through the electrolytic polishing tube 12, whereby the wall surface inside the tube and the dirt attached to the wall surface expand or contract. However, the wall surface inside the pipe and the dirt attached to the wall surface are
Since the expansion rate or contraction rate and the expansion rate or the contraction rate are different, a gap is created on the contact surface between the wall surface and the dirt adhering to the wall surface, and the cleaning liquid permeates into the space to remove the dirt from the wall surface. To be removed. Further, after cleaning, nitrogen gas is blown into the pipe to remove the cleaning liquid remaining in the pipe, so that the dirt dissolved or suspended in the residual cleaning liquid can be surely removed.

【0015】この方法における電解研磨管12の洗浄効
果を調べるため、次のようにして、管内に残留する粒子
数を測定した。洗浄の終了した電解研磨管12の一方端
に窒素ガスボンベ44を連結し、フィルタ46を介して
前記電解研磨管12内に窒素ガスを8m/sで噴射す
る。他方端から流出する排気中の粒子濃度を気中粒子カ
ウンタ48で10分間計測する。
In order to investigate the cleaning effect of the electrolytic polishing tube 12 in this method, the number of particles remaining in the tube was measured as follows. A nitrogen gas cylinder 44 is connected to one end of the electropolishing tube 12 that has been cleaned, and nitrogen gas is injected into the electropolishing tube 12 through the filter 46 at 8 m / s. The particle concentration in the exhaust gas flowing out from the other end is measured by the air particle counter 48 for 10 minutes.

【0016】洗浄効果を比較するため、80℃に加熱さ
れた超純水を20分間(前記方法の合計通水時間と同一
時間)連続して流通させて洗浄した電解研磨管12と2
5℃に冷却された超純水を20分間連続して流通させて
洗浄した電解研磨管12についても同様の方法で管内に
残留する粒子数を測定した。各測定結果から各洗浄方法
による粒子除去率を表1に示す。
In order to compare the cleaning effects, the electrolytically polished tubes 12 and 2 which were cleaned by continuously circulating ultrapure water heated to 80 ° C. for 20 minutes (the same time as the total water-flowing time in the above method) were cleaned.
The number of particles remaining in the electropolished tube 12 washed with continuous flow of ultrapure water cooled to 5 ° C. for 20 minutes was also measured by the same method. Table 1 shows the particle removal rate by each cleaning method from each measurement result.

【0017】 表1からも分かるように、本実施例の管洗浄法は従来の
温度一定の超純水による洗浄方法に比べ粒子除去に有効
であることが分かる。
[0017] As can be seen from Table 1, the tube cleaning method of this example is more effective in removing particles than the conventional cleaning method using ultrapure water at a constant temperature.

【0018】このように、本実施例の管洗浄方法によれ
ば、従来の方法では除去できなかった粒子も除去可能に
なり、洗浄後の管内に残留する粒子数を低減できる。
尚、本実施例では、電解研磨管12に流通する超純水の
温度を80℃と25℃としたが、流通させる超純水の温
度の組み合わせは、これに限定されるものではなく、温
度が異なっていればよい。この際、温度差は大きいほう
がよい。
As described above, according to the pipe cleaning method of the present embodiment, particles which could not be removed by the conventional method can be removed, and the number of particles remaining in the pipe after cleaning can be reduced.
In the present embodiment, the temperature of the ultrapure water flowing through the electropolishing tube 12 was 80 ° C. and 25 ° C. However, the combination of the temperatures of the ultrapure water flowing is not limited to this, and the temperature Should be different. At this time, the larger the temperature difference, the better.

【0019】また、本実施例では1工程の洗浄を4回繰
り返し行ったが、繰り返す回数はこれに限定されるもの
ではなく、例えば5回でもよい。また、本実施例では、
電解研磨管12から超純水を除去するのに窒素ガスを噴
射して除去していたが、超純水を除去する気体はこれに
限定されるものではなく、危険性の少ない気体であれば
よく、例えば空気でもよい。
Further, in this embodiment, one step of washing was repeated four times, but the number of times of repeating is not limited to this, and may be five times, for example. Further, in this embodiment,
Nitrogen gas was injected and removed to remove ultrapure water from the electrolytic polishing tube 12, but the gas for removing ultrapure water is not limited to this, and any gas with a low risk may be used. It may be air, for example.

【0020】[0020]

【発明の効果】以上説明したように、本発明の管洗浄方
法によれば、異なる温度の洗浄液を管内に交互に流すこ
とにより、管内の壁面とその壁面に付着した汚れの膨張
率又は収縮率の差を利用して、壁面の汚れを剥離除去す
るようにしたので、汚れを確実且つ容易に除去すること
ができる。
As described above, according to the pipe cleaning method of the present invention, the expansion rate or contraction rate of the wall surface in the tube and the dirt adhering to the wall surface of the tube is caused by alternately flowing the cleaning liquids having different temperatures. Since the stain on the wall surface is peeled off and removed by utilizing the difference of the above, it is possible to surely and easily remove the stain.

【0021】これにより、従来の管洗浄方法では除去で
きなかった汚れも除去できるようになるので、管の洗浄
効果を向上させることができる。従って、本発明の管洗
浄方法は、例えば少量の塵埃も嫌う半導体製造に用いら
れる液体やガスの配管洗浄として極めて有効である。
As a result, it becomes possible to remove stains that could not be removed by the conventional pipe cleaning method, so that the pipe cleaning effect can be improved. Therefore, the pipe cleaning method of the present invention is extremely effective, for example, for cleaning pipes of liquids and gases used in semiconductor manufacturing, where a small amount of dust is disliked.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る管洗浄方法を適用する管洗浄装置
の構成図
FIG. 1 is a configuration diagram of a pipe cleaning apparatus to which a pipe cleaning method according to the present invention is applied.

【図2】管洗浄装置の操作スケジュール[Fig. 2] Operation schedule of pipe cleaning device

【図3】洗浄後の管内面に残留する粒子数を測定するの
に用いた装置の概略図
FIG. 3 is a schematic diagram of an apparatus used to measure the number of particles remaining on the inner surface of the pipe after cleaning.

【符号の説明】[Explanation of symbols]

10…管洗浄装置 12…被洗浄管(電解研磨管) 14…第1の供給ユニット 16…第2の供給ユニット 18…ガス供給ユニット 20…温超純水製造装置 30…超純水槽 38…窒素ガスボンベ DESCRIPTION OF SYMBOLS 10 ... Pipe cleaning device 12 ... Pipe to be cleaned (electrolytic polishing pipe) 14 ... First supply unit 16 ... Second supply unit 18 ... Gas supply unit 20 ... Warm ultrapure water production device 30 ... Ultrapure water tank 38 ... Nitrogen gas cylinder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 管内に洗浄液を流通させて前記管内の壁
面に付着している汚れを除去する管洗浄方法において、 所定温度の洗浄液を前記管内に所定時間流して前記管内
を洗浄する第1の洗浄工程と、 前記所定温度の洗浄液とは異なる温度の洗浄液を前記管
内に所定時間流して前記管内を洗浄する第2の洗浄工程
と、 前記第1及び第2の洗浄工程の少なくとも一方の洗浄後
に、前記管内に気体を吹き込んで管内に残留する洗浄液
を管外に排除する残留洗浄液排出工程と、から成る洗浄
操作を少なくとも1回以上繰り返すことを特徴とする管
洗浄方法。
1. A pipe cleaning method for flowing a cleaning liquid into a pipe to remove dirt adhering to a wall surface of the pipe, wherein a cleaning liquid having a predetermined temperature is flowed into the pipe for a predetermined time to clean the inside of the pipe. A cleaning step, a second cleaning step of cleaning the inside of the tube by flowing a cleaning solution having a temperature different from that of the predetermined temperature into the tube for a predetermined time, and after at least one of the first and second cleaning steps A pipe cleaning method comprising repeating a cleaning operation at least once, which comprises a step of blowing a gas into the pipe and discharging a cleaning liquid remaining in the pipe to the outside of the pipe.
JP7116375A 1995-04-18 1995-04-18 Method of washing pipe Pending JPH08281233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7116375A JPH08281233A (en) 1995-04-18 1995-04-18 Method of washing pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7116375A JPH08281233A (en) 1995-04-18 1995-04-18 Method of washing pipe

Publications (1)

Publication Number Publication Date
JPH08281233A true JPH08281233A (en) 1996-10-29

Family

ID=14685436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7116375A Pending JPH08281233A (en) 1995-04-18 1995-04-18 Method of washing pipe

Country Status (1)

Country Link
JP (1) JPH08281233A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011912A1 (en) 2000-08-08 2002-02-14 Ebara Corporation Method and device for preventing solid product from adhering to inner surface of exhaust gas pipe and exhaust gas treatment device with the device
JP2002273366A (en) * 2001-03-19 2002-09-24 Nippon Soda Co Ltd Pipe cleaning method
JP2003276039A (en) * 2002-03-26 2003-09-30 Fuji Photo Film Co Ltd Member washing method and solution film forming method using the same
JP2004050048A (en) * 2002-07-19 2004-02-19 Nomura Micro Sci Co Ltd Washing device for piping and ultrapure water making system provided with washing device for piping
JP2012115730A (en) * 2010-11-29 2012-06-21 Mitsubishi Heavy Ind Ltd Method of cleaning piping
JP2013030690A (en) * 2011-07-29 2013-02-07 Dainippon Screen Mfg Co Ltd Substrate processing apparatus, filter cleaning method, and filter cleaning apparatus
JP2017089995A (en) * 2015-11-12 2017-05-25 ユーキャン株式会社 Automatic drainage device and drainage method
JP2018134609A (en) * 2017-02-23 2018-08-30 オルガノ株式会社 Piping flushing method and water supply system
KR20190014773A (en) * 2017-08-03 2019-02-13 전연자 Cleaning method for water pipe
WO2020009260A1 (en) * 2018-07-03 2020-01-09 김병준 Tap water pipe cleaning method
CN111842354A (en) * 2020-06-18 2020-10-30 上海空间推进研究所 Integrated device and method for cleaning and blowing off metal corrugated hose for spaceflight
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011912A1 (en) 2000-08-08 2002-02-14 Ebara Corporation Method and device for preventing solid product from adhering to inner surface of exhaust gas pipe and exhaust gas treatment device with the device
JPWO2002011912A1 (en) * 2000-08-08 2004-07-08 株式会社荏原製作所 Method and apparatus for preventing solid product adhesion in exhaust gas pipe, and exhaust gas treatment apparatus provided with the same
KR100834519B1 (en) * 2000-08-08 2008-06-02 가부시키가이샤 에바라 세이사꾸쇼 Method and device for preventing solid product from adhering to inner surface of exhaust gas pipe and exhaust gas treatment device with the device
US7736440B2 (en) 2000-08-08 2010-06-15 Ebara Corporation Method and apparatus for preventing adherence of solid products in gas exhaust pipe and exhaust gas abatement device with same apparatus
JP2002273366A (en) * 2001-03-19 2002-09-24 Nippon Soda Co Ltd Pipe cleaning method
JP4596665B2 (en) * 2001-03-19 2010-12-08 日本曹達株式会社 Tube cleaning method
JP2003276039A (en) * 2002-03-26 2003-09-30 Fuji Photo Film Co Ltd Member washing method and solution film forming method using the same
JP2004050048A (en) * 2002-07-19 2004-02-19 Nomura Micro Sci Co Ltd Washing device for piping and ultrapure water making system provided with washing device for piping
JP2012115730A (en) * 2010-11-29 2012-06-21 Mitsubishi Heavy Ind Ltd Method of cleaning piping
JP2013030690A (en) * 2011-07-29 2013-02-07 Dainippon Screen Mfg Co Ltd Substrate processing apparatus, filter cleaning method, and filter cleaning apparatus
JP2017089995A (en) * 2015-11-12 2017-05-25 ユーキャン株式会社 Automatic drainage device and drainage method
JP2018134609A (en) * 2017-02-23 2018-08-30 オルガノ株式会社 Piping flushing method and water supply system
KR20190014773A (en) * 2017-08-03 2019-02-13 전연자 Cleaning method for water pipe
WO2020009260A1 (en) * 2018-07-03 2020-01-09 김병준 Tap water pipe cleaning method
CN111842354A (en) * 2020-06-18 2020-10-30 上海空间推进研究所 Integrated device and method for cleaning and blowing off metal corrugated hose for spaceflight
US20230135621A1 (en) * 2021-10-29 2023-05-04 Nomura Micro Science Co., Ltd. Method for starting up hot ultrapure water production system, and hot ultrapure water production system
US11926536B2 (en) * 2021-10-29 2024-03-12 Nomura Micro Science Co., Ltd. Method for starting up hot ultrapure water production system, and hot ultrapure water production system

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