JPH08279586A - Semiconductor device and unit of the device - Google Patents

Abstract

PURPOSE: To improve the mountability, maintainability and heat dissipating property of a semiconductor device and the semiconductor device unit which is mounted in a nearly vertical standing state on a mounting board. CONSTITUTION: A semiconductor device 10 comprises semiconductor chips 12 and boards 13 which has wirings 16 electrically connected with the semiconductor chips 12 on insulating films 15 and has external connecting terminals 17 formed by bending parts of the wirings 16. The semiconductor device unit 20 comprises the semiconductor devices 10, poles 21 for attaching the semiconductor devices 10 in a standing state by the engagement with holes 19 made through the semiconductor device 10, and side plates 22 and 23 supporting the poles 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a semiconductor device unit, and more particularly to a semiconductor device and a semiconductor device unit mounted in a substantially vertical state on a mounting substrate. In recent years, a mounting structure in which a plurality of semiconductor devices are stacked has been attracting attention as a means for improving the mounting density of semiconductor devices.

On the other hand, there has been proposed a semiconductor device which employs a so-called vertical package in which the semiconductor device is mounted upright on a mounting substrate as a means for improving the mounting density. Therefore, it is possible to further improve the packaging density by stacking the semiconductor devices having the vertical package structure.

[0003]

2. Description of the Related Art In recent years, there has been proposed a semiconductor device which employs a so-called vertical package structure in which a semiconductor device is mounted upright on a mounting substrate in order to improve mounting density. This vertical semiconductor device is configured to be mounted in a state where a resin package is erected on a mounting substrate.

FIG. 15 shows a semiconductor device 1 which is an example of a conventional vertical semiconductor device. In the figure,
A resin package 2 has a semiconductor chip 3 sealed inside. The semiconductor chip 3 is mounted on the stage 5 and embedded in the resin package 2. Reference numeral 4 denotes a plurality of leads, each having an inner lead portion 4a connected to the semiconductor chip 3 and an outer lead portion 4b extending outward from one side surface of the resin package 2. Further, a predetermined tip portion of each outer lead portion 4b is bent, so that the mountability on the mounting substrate 6 (shown in FIGS. 16 and 17) is improved.

The semiconductor device 1 having the above structure is mounted in a state where the resin package 2 is erected with respect to the mounting substrate 6 so that the outer lead portion 4b is connected to the mounting substrate during mounting. By mounting the resin package 2 on the mounting substrate in the upright state in this manner, the mounting space required for mounting the semiconductor device 1 on the mounting substrate 6 is a surface where the outer lead portion 4b of the resin package 2 extends. The area (indicated by reference numeral 2a) is sufficient.

Therefore, the vertical semiconductor device 1 has, for example, a Q
A mounting space can be made smaller than that of a semiconductor device in which a large area surface of a resin package such as a FP (Quad Flat package) is mounted so as to face a mounting substrate, and the mounting density of the semiconductor device 1 can be improved. it can.

16 and 17 show a plurality of vertical semiconductor devices 1 arranged side by side in order to further improve the packaging density (hereinafter, a plurality of semiconductor devices 1 are arranged side by side). A unit that is installed and called a semiconductor device unit). The semiconductor device unit 7 shown in each drawing is a unit in which six vertical semiconductor devices 1 are laterally stacked. Conventional semiconductor device unit 7
The semiconductor device unit 7 is formed by mounting the individual semiconductor devices 1 close to each other on the mounting substrate 6.

[0008]

However, in the conventional semiconductor device 1 shown in FIG. 15, since the leads 4 are used as the external connection terminals, the lead pitch cannot be reduced, and therefore, a large number of electrodes are provided. There is a problem that it cannot be applied as a package of the semiconductor chip 3.

Further, in the conventional semiconductor device 1, since the semiconductor chip 3 is mounted on the stage 5 and the entire semiconductor chip 3 and the stage 5 are sealed with the resin package 2, the semiconductor device 1 becomes large. There was a problem that it would end up. Further, since the resin package 2 has a low thermal conductivity, there is a problem that the heat dissipation efficiency is not good in the configuration in which the semiconductor chip 3 is sealed with the resin package 2.

Further, as described above, the conventional semiconductor device unit 7 has a structure in which the plurality of semiconductor devices 1 are individually mounted on the mounting substrate 6, and therefore, as shown in FIG.
The height of each semiconductor device 1 with respect to the mounting substrate 6 may differ after mounting. As described above, when the semiconductor device units 7 in which the heights of the individual semiconductor devices 1 are different are to be housed in the small electronic device housing, the semiconductor device 1 is projected beyond the predetermined size (FIG. 16). The semiconductor device 1a in 1 corresponds to this), and there is a problem that the semiconductor device unit 7 may not be able to be housed in the electronic device housing due to this.

On the contrary, when the semiconductor device 1 is lower than the predetermined size (the semiconductor device 1b in FIG. 16 corresponds to this), the lead 4 (specifically, the outer lead portion 4b) is crushed. There is a problem in that the electrical connection with the mounting substrate 6 may become defective due to the above-mentioned state.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a vertical semiconductor device which is downsized and has improved heat dissipation efficiency. Another object of the present invention is to provide a semiconductor device with improved assemblability and mountability.

[0013]

In order to solve the above-mentioned problems, the present invention is characterized by the following means. A semiconductor device according to the invention of claim 1 is
A semiconductor chip and the semiconductor chip are mounted on an insulating film, and wiring electrically connected to the semiconductor chip is formed on the insulating film, and a part of the wiring is bent to form an external component. And a substrate having a connection terminal portion formed thereon.

According to the invention described in claim 2,
In the semiconductor device described above, the insulating film is removed at a bent portion of the wiring.

According to the invention of claim 3, the invention according to claim 1
Alternatively, in the semiconductor device according to the second aspect, a part of the wiring is covered with a resin. The invention according to claim 4 is characterized in that, in the semiconductor device according to any one of claims 1 to 3, the substrate is mounted in a substantially vertical state with respect to a mounting substrate. Is.

According to the invention of claim 5, claim 1
The semiconductor device according to any one of items 1 to 4, wherein a part of the semiconductor chip is exposed to the outside from the substrate.

According to the invention described in claim 6,
5. In the semiconductor device according to any one of 5 to 5, an extension portion extending outward from a position where the semiconductor chip is arranged is formed on the substrate, and an attachment portion is formed on the extension portion. It is a feature.

According to the invention described in claim 7, claim 6
In the semiconductor device described above, the mounting portion is a hole. According to an eighth aspect of the present invention, there is provided a semiconductor device unit in which the plurality of semiconductor devices according to the sixth or seventh aspect are engaged with a mounting portion formed on the semiconductor device, and the semiconductor device is in a standing state. It is characterized by comprising a mounting member to be mounted and a holding member for holding the mounting member.

According to the invention described in claim 9,
In the semiconductor device unit described above, as the mounting member, a pole having a groove portion that engages with the mounting portion is formed at a mounting position of the semiconductor device is used.

According to a tenth aspect of the present invention, in the semiconductor device unit according to the ninth aspect, a fixing member is fitted into the pole, and the semiconductor device mounted on the pole is fixed by the fixing member. It is characterized by having done.

[0021]

The above-mentioned means operate as follows. According to the invention described in claim 1, since the wiring formed on the substrate is formed on the insulating film, the pitch of the adjacent wiring can be made smaller than that of the leads formed from the lead frame, and a large number of wirings can be formed. It becomes possible to deal with a semiconductor chip having an electrode.

Since the external connection terminal portion is formed by bending a part of the wiring, the external connection terminal portion can be easily formed and the structure of the semiconductor device can be simplified. Further, since the semiconductor chip is mounted on the insulating film, it is not necessary to separately provide a stage, and since the insulating film has a function of protecting the semiconductor chip, the resin package can be sealed, so that the semiconductor device Can be made thinner.

According to the second aspect of the present invention, the wiring can be made flexible by removing the insulating film at the bent portion of the wiring. Therefore, even if there is a variation in height in the wiring portion that functions as an external connection terminal, the variation in the wiring can be absorbed by the flexibility of the wiring, and the electrical connection with the mounting board can be ensured during mounting. It can be carried out.

Further, according to the third aspect of the invention, since the wiring is partially covered with the resin, it is possible to prevent the wiring from being damaged. Further, according to the invention of claim 4, the board is mounted in a substantially vertical state with respect to the mounting board, so that the mounting area of the semiconductor device on the mounting board can be reduced.

According to the fifth aspect of the invention, the heat dissipation of the semiconductor chip can be improved by exposing a part of the semiconductor chip from the substrate to the outside.
According to the invention as set forth in claim 6, by forming the extension part extending outward from the position where the semiconductor chip is arranged on the substrate, and forming the attachment part on the extension part, the attachment is achieved. The semiconductor device can be mounted using the section, and the mountability of the semiconductor device can be improved.

According to the invention of claim 7, since the mounting portion is formed by the hole, the mounting portion can be realized with a simple structure. According to the invention of claim 8, the plurality of semiconductor devices are mounted on the mounting member by engaging the mounting portion held by the holding member with the mounting portion.
Therefore, it is possible to reliably stack a plurality of semiconductor devices in a standing state.

Further, according to the ninth and tenth aspects of the present invention, by using as the mounting member a pole having a groove portion that engages with the mounting portion at the mounting position of the semiconductor device is used, a plurality of poles can be formed with a simple structure. The semiconductor devices can be stacked in an upright state.

[0028]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a semiconductor device 10 which is an embodiment of the present invention. This semiconductor device 10 has a mounting board 1
1 (illustrated in FIG. 4), which is a vertical semiconductor device provided upright, and has an extremely simple configuration including a semiconductor chip 12, a substrate 13, a resin member 14, and the like.

The substrate 13 has one side 15 of the insulating film 15.
a (outer surface in this embodiment; hereinafter referred to as wiring formation surface)
This is a so-called TAB (Tape Automated Bonding) tape having a structure in which the wiring 16 is formed in a predetermined pattern. The semiconductor chip 12 has an insulating film 15 that constitutes the substrate 13.
It is mounted on the surface 15b (hereinafter referred to as the chip mounting surface) opposite to the wiring forming surface.

In addition, a through hole (not shown) electrically connected to the wiring 16 is formed at a position where the semiconductor chip 12 is mounted on the substrate 13, and the semiconductor chip 1 is formed.
The bumps (not shown) formed in 2 are flip-chip bonded to the upper portions of the through holes. This allows
The semiconductor chip 12 and the wiring 16 are electrically connected.

The substrate 13 is flexible and can be bent freely. In this embodiment, the substrate 13 is bent at the portion (the lower end portion in the drawing) where the semiconductor device 10 is connected to the mounting substrate 11 during mounting, and the insulating film 15a at the bent tip portion is bonded to the semiconductor chip 12. It has been configured.

Further, the insulating film 1 is provided at the bent portion.
5 is removed, and only the wiring 16 is bent into a substantially U shape. This bent portion is a portion connected to the mounting board 11, and hereinafter, this portion of the wiring 16 is referred to as an external connection terminal 17. In addition, as described above, the external connection terminal 1
Since the insulating film 15 is not disposed at the position where 7 is formed, the external connection terminal 17 is configured to be flexible in the vertical direction in the figure. The work of removing the insulating film 15 is
It can be easily performed by using etching or the like.

Further, an extension portion 18 extending upward from the position where the semiconductor chip 12 is disposed is formed at the upper end of the substrate 13, and the extension portion 18 has a mounting hole 19 serving as a mounting portion.
Are formed. The mounting hole 19 can be easily formed because it is only necessary to form a hole in the insulating film 15 (the mounting hole 19 will be described later in detail).

The wiring forming surface 15 of the insulating film 15
A resin member 14 is provided at a. This resin member 1
Reference numeral 4 is made of, for example, an epoxy resin or the like, and has a function of protecting the wiring 16. Therefore, the wiring 16 is the insulating film 1.
Even if the wiring 16 is formed outside the wiring 5, it is possible to reliably prevent the wiring 16 from being damaged.

Further, since the resin member 14 is provided to protect the wiring 16 and it is not necessary to seal the semiconductor chip 12, the thickness thereof is the same as that of the conventional structure for sealing the entire semiconductor chip. It can be made thinner than the semiconductor device 1 (see FIG. 15). Therefore, the semiconductor device 10 can be thinned.

On the other hand, one surface of the semiconductor chip 12 (left side surface in FIG. 1) is protected by abutting the insulating film 15, and part of the other surface (right side surface in FIG. 1) is an insulating film 15a. Protected by. Therefore, the semiconductor chip 12 is protected by the insulating film 1
5, 15a can be surely performed. Further, in a portion of the semiconductor chip 12 not covered with the insulating films 15 and 15a, that is, a portion exposed to the outside,
Since the heat generated in the semiconductor chip 12 is efficiently radiated to the outside, the heat radiation efficiency can be improved.

In the case of a semiconductor chip which does not require a high heat dissipation efficiency, a resin member may be arranged in the portion indicated by the one-dot chain line in FIG. 1 to further protect the semiconductor chip 12. . As described above, the semiconductor device 10 has the configuration in which the semiconductor chip 12 is mounted on the substrate 13 configured as a TAB tape and the external connection terminal 17 is formed by bending a part of the substrate 13. It has an extremely simple structure. In addition, the semiconductor chip 12
Insulating films 15 and 15a for protecting the substrate 13
The thickness of the semiconductor device 10 is reduced by using this method. Furthermore, the insulating film 1 of the semiconductor chip 12
In the portion where 5 is not arranged, the heat arranged in the semiconductor chip 12 can be efficiently dissipated,
The heat dissipation characteristics can also be improved.

FIG. 3 shows a semiconductor device 10A which is a modification of the semiconductor device 10 shown in FIGS. In the semiconductor device 10 shown in FIGS. 1 and 2, the mounting hole 19 serving as the mounting portion is formed. However, in general, T
Sprocket hole 1 which is a positioning hole on the AB tape
9A is formed in advance. In this modification, this sprocket hole 19A is used as a mounting hole.
With this configuration, the sprocket hole 19A
Since it is not necessary to separately provide the mounting hole 19, the manufacturing process of the semiconductor device 10A can be simplified.

Subsequently, the semiconductor device 10 having the above-mentioned structure
A semiconductor device unit having a configuration in which (1) is vertically stacked is described. 4 and 5 show a semiconductor device unit 20 which is a first embodiment of the present invention. FIG.
Shows the semiconductor device unit 20 with the semiconductor device 10 mounted, and FIG. 5 shows the semiconductor device unit 20.
It shows the semiconductor device unit 20 in a state in which is not attached.

The semiconductor device unit 20 is composed of a plurality of semiconductor devices 10, a pole 21 as a mounting member, side plates 22 and 23 as a holding member, a top plate 24, and the like. The diameter of the pole 21 is slightly larger than the diameter of the mounting hole 19 formed in the semiconductor device 10.

Further, a groove portion 25 that engages with the extending portion 18 is formed at the mounting position of the pole 21 where the semiconductor device 10 is mounted. Further, the side plates 22 and 23 are formed with insertion holes 26 and 27 through which the pole 21 is inserted. Further, the top plate 24 is arranged above the side plates 22 and 23 which are arranged apart from each other, and has a function of fixing the side plates 22 and 23.

To assemble the semiconductor device unit 20 having the above structure, first, the pole 21 is inserted into the mounting hole 19 formed in the semiconductor device 10, and the extending portion 18 formed in the semiconductor device 10 is formed in the groove 25. Insert. As a result, each semiconductor device 10 is attached to the pole 21.

The plurality of semiconductor devices 10 are connected to the pole 21.
The fixing disks 28 and 29 are inserted from both sides of the pole 21 in the state of being attached to the. This fixing disk 28,29
Are configured to fit tightly into the pole 21. However, it is configured such that it can be moved along the pole 21 by being strongly biased.

When the plurality of semiconductor devices 10 and the fixing disks 28 and 29 are mounted on the pole 21 as described above, the side plates 22 and 23 are mounted from both sides of the pole 21. At this time, the pole 21 is inserted into the insertion holes 26 and 27 formed in the side plates 22 and 23. Next, the ten plate 24 is adhered to the upper portions of the side plates 22 and 23. Thereby, each side plate 22, 23
Is fixed.

Further, the fixing disks 28 and 29 inserted through the pole 21 are moved outward to move the side plates 22 and 2 respectively.
The inner surface of 3 is contacted. Thereby, the side plates 22, 23
On the other hand, the pole 21 is also fixed, and the semiconductor device unit 20 is completed. As described above, the semiconductor device unit 20 includes the pole 21, the side plates 22 and 23, and the top plate 2.
4 and the fixing disks 28 and 29 have a simple structure, and the assembly can be easily performed as described above.

On the other hand, in the assembled state of the semiconductor device unit 20, the lower end portion of the external connection terminal 17 of each semiconductor device 10 is slightly larger than the lower end positions of the side plates 22 and 23 (indicated by an arrow H in FIG. 4). It is configured to project by the amount). Therefore, when the lower ends of the side plates 22 and 23 are in contact with the mounting board 11, the external connection terminals 17 are pressed by the amount indicated by the arrow H.

As described above, the insulating film 15 is not provided in the portion where the external connection terminal 17 is formed, and the structure is such that it is flexible. Therefore, by pressing the external connection terminal 17 as described above, the external connection terminal 17 is flexibly connected to the electrode portion (not shown) formed on the mounting substrate 11.

At this time, the mounting hole 19, the groove 25, the insertion hole 2
Due to the existence of errors in the formation positions of 6, 27, etc.,
Even if the height of the external connection terminals 17 varies, the variation is absorbed by the flexibility of the external connection terminals 17. Therefore, the electrical connection between the external connection terminal 17 and the mounting substrate 11 can be surely made, and the mountability of the semiconductor device unit 20 that collectively mounts the plurality of semiconductor devices 10 can be improved. You can

FIG. 6 and FIG. 7 show a semiconductor device unit 30 which is a second embodiment of the present invention. 6 and 7, the same components as those of the semiconductor device unit 20 according to the first embodiment shown in FIGS. 4 and 5 are designated by the same reference numerals and the description thereof will be omitted.

The semiconductor device unit 30 according to the present embodiment.
Is characterized in that the mounting member 31 is composed of a pole 32 and a plurality of spacers 33 inserted into the pole 32. The pole 32 has a diameter slightly larger than the diameter of the mounting hole 19 formed in the semiconductor device 10, like the pole 21 provided in the semiconductor device unit 20 according to the first embodiment. In addition, the spacer 3
The reference numeral 3 has a length substantially equal to the spacing pit of the predetermined semiconductor device 10 in the mounted state, and has a pipe shape so that it can be inserted into the pole 32.

To assemble the semiconductor device unit 30 having the above structure, first, the semiconductor device 10 and the spacer 33 are alternately inserted into the pole 32. As a result, each semiconductor device 10 and the spacer 33 are attached to the pole 32. Further, with the plurality of semiconductor devices 10 and the spacers 33 mounted on the pole 32, the fixing disks 28 and 29 are inserted from both sides of the pole 32. Then, by inserting the pole 32 into the insertion holes 26 and 27 formed in the side plates 22 and 23, the pole 32 is inserted into the side plates 22 and 2.
Wear 3. Next, the ten plate 2 is placed on the side plates 22 and 23.
4 is adhered and the side plates 22 and 23 are fixed.

Further, the fixing disks 28 and 29 inserted through the pole 32 are moved to fix the pole 32 to the side plates 22 and 23, whereby the semiconductor device unit 20 is completed. According to the semiconductor device unit 30 configured as described above, since the plurality of semiconductor devices 10 are clamped by the extension portions 18 having the mounting holes 19 formed therebetween being sandwiched by the spacers 33, the adjacent semiconductor devices 10 are arranged. Position can be kept constant.

Therefore, the adjacent semiconductor devices 10 can be prevented from interfering with each other, and the semiconductor devices 10 can be reliably positioned with respect to the mounting substrate 11.
Further, since the spacer 33 also has a function of clamping the semiconductor device 10, the configuration of the mounting member 31 can be simplified.

FIG. 8 shows a semiconductor device unit 40 which is a third embodiment of the present invention. Note that FIG. 8 shows only the mounting member 41 and the holding member 42 of the semiconductor device unit 40, and the illustration of the semiconductor device 10 is omitted. The semiconductor device unit 40 according to the present embodiment is characterized in that the mounting member and the holding member are integrated. FIG. 8 (A)
FIG. 8 is a development view of a member (hereinafter referred to as a frame body 43) in which the mounting member 41 and the side plates 42a and 42b serving as holding members are integrated, and FIG. 8B is a view showing an assembled state of the frame body 43. is there.

As shown in FIG. 8A, the frame 43 is a rectangular metal plate member 45 before assembly, and the mounting member 41 is formed by cutting the position shown by the solid line A in the drawing. At the same time, a hole 44 is formed at a predetermined position. The metal plate member 45 is bent at the positions indicated by broken lines B to D in FIG.
The frame body 43 shown in (B) is formed. As is clear from each figure, the left side portion of the metal plate member 45 from the broken line B is the side plate 42a, and the right side portion of the metal plate member 45 from the broken line C is the side plate 42b. Further, in the assembled state, the left end portion of the mounting member 41 in the drawing is inserted into and supported by the hole 44.

The semiconductor device 10 is mounted on the frame body 43 by first forming a bend at the positions of broken lines C and D, then inserting the semiconductor device 10 into the mounting member 41, and then folding at the position of broken line B. It is sufficient to perform music formation. As described above, in the semiconductor device unit 40 according to the present embodiment, the structure of the semiconductor unit 40 can be simplified by integrating the mounting member 41 and the side plates 42a and 42b serving as holding members.

FIG. 9 shows a semiconductor device unit 50 which is a fourth embodiment of the present invention. It should be noted that FIG. 9 shows only the mounting member and the holding member of the semiconductor device unit 50, and the illustration of the semiconductor device 10 is omitted. The present embodiment is characterized in that a coil spring member 51 is used as a mounting member. The coil spring member 51 has side plates 52 and 53, both ends of which are holding members.
It is fixed to.

The coil spring member 51 is
By applying a bending force as shown by an arrow in FIG. 10 (A) at the left and right positions, a gap portion 54 is formed as shown in FIG. 10 (B). The semiconductor device 10 is mounted and fixed to the coil spring member 51 by sandwiching the extending portion 18 formed in the semiconductor device 10 in the gap portion 54 and releasing the bending force.

As described above, the coil spring member 51 is used as the mounting member, and the extending portion 18 serving as the mounting portion of the semiconductor device 10 is fixed by being sandwiched between the coil spring member 51. The semiconductor device 10 can be securely fixed. Further, the mounting hole 19, the fixing disk 28, which is required in the other embodiments,
Since 29 is unnecessary, the number of parts can be reduced and the cost of the semiconductor device unit 50 can be reduced.

FIG. 11 shows a semiconductor device unit 60 which is a fifth embodiment of the present invention. In the semiconductor device unit 60 according to the present embodiment, a plurality of plate-like mounting members 62 are arranged in a substantially flat state on a plate-like holding member 61, and the semiconductor device 10 is fixed to the mount members 62. It is characterized by that.

The holding member 61 and the mounting member 62 are both formed of a metal material having good thermal conductivity (eg, aluminum), and are bonded or welded, or integrally molded, as shown in FIG. It is shaped like a comb. Further, in the present embodiment, the semiconductor chip 12 mounted on the semiconductor device 10 is fixed to the mounting member 62 by adhering the semiconductor chip 12 to the mounting member 62 using an adhesive having good thermal conductivity. It is said that.

The semiconductor device unit 60 having the above structure
According to this, by fixing the semiconductor device 10 to the mounting member 62 arranged in a substantially hanging state from the holding member 61, each semiconductor device 10 can be reliably positioned, and the adjacent semiconductor devices 10 can be positioned. It is possible to prevent interference.

Both the holding member 61 and the mounting member 62 are made of a material having good thermal conductivity, and the adhesive for bonding the semiconductor device 10 to the mounting member 62 is also selected to have good thermal conductivity. Has been done. Further, the semiconductor chip 12 is directly bonded to the mounting member 62. Therefore, the holding member 61 and the mounting member 62 can be made to function as a heat radiation fin, and the heat radiation efficiency of the semiconductor chip 10 can be improved.

FIG. 13 shows a semiconductor device unit 70 which is a sixth embodiment of the present invention. In the semiconductor device unit 70 according to the present embodiment, as shown in FIG. 14, a slit 71 is formed as a mounting portion in the extending portion 18 of the semiconductor device 10B, and a fitting groove 73 is fitted in the mounting member 72 into the slit 71. It is characterized by having a configuration in which Moreover, the mounting member 72 is held by side plates 74 and 75 which are holding members.

The width dimension (dimension in the height direction) of the slit 71 is set to be substantially equal to the wall thickness dimension of the mounting member 72, and the length of the fitting groove 73 is set so that the extending portion 18 of the semiconductor device 10B is free. The length is set so that it can be inserted in the fitted state. Therefore, in order to mount the semiconductor device 10B on the mounting member 72, first, the extending portion 18 formed on the semiconductor device 10B is formed.
Is inserted into a fitting groove 73 formed in the mounting member 72, and then is slid laterally to form the slit 71 and the fitting groove 73.
(Specifically, it is engaged with the mounting member 72 on the side edge of the fitting groove 73).

The semiconductor device 10B is mounted on the mounting member 72 by such a simple operation. Further, if it is necessary to perform more rigid fixing, the extending portion 18 and the mounting member 72 may be bonded with an adhesive after the mounting operation is completed. According to the semiconductor device unit 70 configured as described above, the semiconductor device 10B is attached to the mounting member 72 by fitting the slit 71 formed as the mounting portion in the semiconductor device 10B into the fitting groove 73 formed in the mounting member 72. Therefore, the mountability of the semiconductor device 10B to the mounting member can be improved.

The position of the semiconductor device 10B is set in the fitting groove 7
3 is determined by the formation position, so that by accurately forming the fitting groove 73, the arrangement position of the adjacent semiconductor device 10B can be kept constant. Therefore, the adjacent semiconductor devices can be prevented from interfering with each other, and the semiconductor devices 10B can be reliably positioned with respect to the mounting substrate.

[0068]

As described above, according to the present invention, the following various effects can be realized. According to the invention described in claim 1, the pitch of the adjacent wirings can be made smaller than that of the lead formed from the lead frame, and it becomes possible to deal with the semiconductor chip having a large number of electrodes.

Since the external connection terminal portion is formed by bending a part of the wiring, the external connection terminal portion can be easily formed and the structure of the semiconductor device can be simplified. Further, since the semiconductor chip is mounted on the insulating film, it is not necessary to separately provide a stage, and since the insulating film has a function of protecting the semiconductor chip, the resin package can be sealed, so that the semiconductor device Can be made thinner.

According to the second aspect of the present invention, even if there is a variation in height in the wiring portion functioning as an external connection terminal, the variation in the wiring can be absorbed by the flexibility of the wiring. At the time of mounting, the electrical connection with the mounting board can be surely made.

According to the third aspect of the invention, since the wiring is partially covered with the resin, the wiring can be prevented from being damaged. Further, according to the invention of claim 4, the board is mounted in a substantially vertical state with respect to the mounting board, so that the mounting area of the semiconductor device on the mounting board can be reduced.

According to the fifth aspect of the invention, the heat dissipation of the semiconductor chip can be improved by exposing a part of the semiconductor chip from the substrate to the outside.
Further, according to the invention of claim 6, it becomes possible to mount the semiconductor device by using the mounting portion, and the mountability of the semiconductor device can be improved.

According to the invention of claim 7, since the mounting portion is formed by the hole, the mounting portion can be realized with a simple structure. According to the invention of claim 8, it is possible to reliably stack a plurality of semiconductor devices in an upright state.

Further, according to the inventions of claims 9 and 10, a plurality of poles having a simple structure are used by using as the mounting member a pole having a groove portion engaging with the mounting portion at the mounting position of the semiconductor device. The semiconductor devices can be stacked in an upright state.

[Brief description of drawings]

FIG. 1 is a side view for explaining a semiconductor device that is a first embodiment of the present invention.

FIG. 2 is a front view for explaining the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a front view for explaining a semiconductor device which is a modification of the first embodiment.

FIG. 4 is a side view for explaining the semiconductor device unit according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a state in which the semiconductor device of the semiconductor device unit according to the first embodiment of the present invention is not mounted.

FIG. 6 is a side view for explaining a semiconductor device unit that is a second embodiment of the present invention.

FIG. 7 is a perspective view showing a mounting member used in a second embodiment of the present invention.

FIG. 8 is a diagram for explaining a semiconductor device unit that is a third embodiment of the present invention.

FIG. 9 is a perspective view for explaining a semiconductor device unit that is a fourth embodiment of the present invention.

FIG. 10 is a view for explaining a coil spring member used in the fourth embodiment of the present invention.

FIG. 11 is a side view for explaining a semiconductor device unit that is a fifth embodiment of the present invention.

FIG. 12 is a perspective view showing a holding member and a mounting member used in a fifth embodiment of the present invention.

FIG. 13 is a perspective view for explaining a semiconductor device unit that is a sixth embodiment of the present invention.

FIG. 14 is a front view showing a semiconductor device used in a sixth embodiment of the present invention.

FIG. 15 is a perspective view showing an example of a conventional semiconductor device.

FIG. 16 is a diagram for explaining a semiconductor device unit which is an example of the related art.

FIG. 17 is a diagram for explaining a semiconductor device unit which is an example of the related art.

[Explanation of Codes] 10, 10A, 10B Semiconductor Device 11 Mounting Substrate 12 Semiconductor Chip 13 Substrate 14 Resin Member 15 Insulating Film 15a Wiring Forming Surface 15b Chip Mounting Surface 16 Wiring 17 External Connection Terminal 18 Extending Part 19 Mounting Hole 20, 30 , 40 Semiconductor device unit 21, 32 Pole 22, 23, 42a, 42b, 52, 53, 74, 75
Side plate 24 Top plate 25 Groove portion 26, 27 Insertion hole 28, 29 Fixing disk 31, 41 Mounting member 33 Spacer 43 Frame body 45 Plate member 51 Coil spring member 54 Gap portion 61 Holding member 62, 72 Mounting member 71 Slit 73 Fitting groove

Claims (10)

[Claims] 1. A semiconductor chip, the semiconductor chip being mounted on an insulating film, a wiring electrically connected to the semiconductor chip is formed on the insulating film, and a part of the wiring is folded. A semiconductor device comprising: a substrate formed by bending to form an external connection terminal portion. 2. The semiconductor device according to claim 1, wherein the insulating film is removed at a bent portion of the wiring. 3. The semiconductor device according to claim 1, wherein a part of the wiring is covered with resin. 4. The semiconductor device according to claim 1, wherein the substrate is mounted in a substantially vertical state on a mounting substrate. 5. The semiconductor device according to claim 1, wherein a part of the semiconductor chip is exposed to the outside from the substrate. 6. The semiconductor device according to claim 1, wherein an extension portion extending outward from a position where the semiconductor chip is provided is formed on the substrate, and the extension portion is formed. A semiconductor device characterized in that a mounting portion is formed on the. 7. The semiconductor device according to claim 6, wherein the mounting portion is a hole. 8. A plurality of semiconductor devices according to claim 6, a mounting member that engages with a mounting portion formed on the semiconductor device, and mounts the semiconductor device in an upright state; A semiconductor device unit, comprising: a holding member for holding. 9. The semiconductor device unit according to claim 8, wherein the mounting member is a pole having a groove portion that engages with the mounting portion formed at a mounting position of the semiconductor device. unit. 10. The semiconductor device unit according to claim 9, wherein a fixing member is fitted into the pole, and the semiconductor device mounted on the pole is fixed by the fixing member. unit.