JPH08271579A - Ic socket and ic test method employing it - Google Patents

Abstract

PURPOSE: To obtain an IC socket in which the operation for bringing a probe into contact with a contactor is facilitated. CONSTITUTION: A contactor 13 has a check terminal part 13f extending oppositely from a terminal part 13c touching an IC lead. The upper body has a flat space 12b-5 partitioned by a partition wall part 12b-3 . The check terminal part 13f is contained in the flat space 12b-5 . The upper body is provided with a guide hole 12b-4 for receiving a probe 15 at the position of a top plate part 12b-1 corresponding to the flat space 12b-5 . The probe 15 inserted into the guide hole 12b-4 comes into contact with the check terminal part 13f.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket and an IC test method using the IC socket. In recent years, the characteristics of ICs have improved, and strict output characteristics may be required for a certain lead among a plurality of leads. Therefore, the IC socket is required to be capable of accurately detecting the output potential of the IC lead.

[0002]

2. Description of the Related Art Generally, an IC socket is mounted on a printed circuit board. The electric potential of the lead of the IC to be electrically tested is usually detected from the terminal on the printed board through the pattern on the printed board.

Regarding the potential of a signal for which strict characteristics are required, in order to avoid the influence of noise on the pattern on the printed circuit board, the contact of the IC socket is penetrated through the lower surface of the printed circuit board and printed. The measurement was performed by applying a probe to the leg portion protruding from the lower surface of the substrate.

[0004]

A large number of legs project side by side on the lower surface of the printed circuit board. Therefore, it was difficult to apply the probe to only one target leg. This has become more difficult in recent years when the pitch of the legs is becoming narrower.

Further, in order to detect the IC lead potential with higher accuracy, it is necessary to apply a probe to a position closer to the IC lead.
It is necessary to apply the probe to the contactor of the C socket. However, when the IC is set in the IC socket, the contacts of the IC socket that are in contact with the IC leads are exposed to the outside with the IC leads aligned side by side at the same pitch.
Since the pitch of C lead tends to become narrower year by year, IC
It is very difficult to apply the probe to one contact of the socket.

Therefore, the present invention is an IC which solves the above problems.
An object is to provide a socket and an IC test method using the socket.

[0007]

According to a first aspect of the present invention, in an IC socket having a plurality of contacts incorporated in an IC socket body, a probe is inserted into the IC socket body, and the inserted probe. Is provided with a probe guide portion that guides to the one contactor.

According to a second aspect of the present invention, there is provided an IC socket in which a plurality of contacts are incorporated in an IC socket body.
The contact is configured to have a checking terminal portion, and a probe is inserted into a portion of the IC socket body corresponding to the checking terminal portion, and the inserted probe is attached to the checking terminal portion. The probe guide portion that leads to is provided.

According to a third aspect of the present invention, in the IC socket having a plurality of contacts incorporated in the IC socket body, the contacts having a contact terminal portion that comes into contact with the lead of the IC, the contacts are From the base side of the contact terminal portion, has a check terminal portion extending in a direction opposite to the contact terminal portion, the IC socket body, the probe is inserted into a portion corresponding to the check terminal portion, The probe has a probe guide portion that guides the inserted probe to the upper end portion of the checking terminal portion, and a support member that receives the lower end side of the checking terminal portion.

According to a fourth aspect of the present invention, the probe guide portion of the second or third aspect is configured by a guide hole formed in the top plate portion of the IC socket body. According to a fifth aspect of the present invention, the guide hole of the fourth aspect is configured to have a tapered shape that widens toward the top.

According to a sixth aspect of the present invention, the probe guide portion of the second or third aspect is configured by a slit formed at an end portion of the top plate portion of the IC socket body.
According to a seventh aspect of the present invention, in an IC socket having a plurality of contacts incorporated in an IC socket body, the contactors having contact terminal portions that come into contact with leads of an IC, the contact of the IC socket body is the contact. A probe is inserted into a portion corresponding to the terminal portion, and a guide hole for guiding the inserted probe to the contact terminal portion is provided.

According to an eighth aspect of the present invention, the guide hole of the seventh aspect has a tapered shape that widens toward the top. According to a ninth aspect of the present invention, the IC socket according to any one of the first to eighth aspects is used, a probe is inserted into the probe guide portion, and a part of the contact is brought into contact with the IC socket. IC installed
The test is done.

[0013]

According to the first aspect of the invention, the probe guide portion provides an insertion port into which the probe is inserted and acts to guide the inserted probe.
In the invention of claim 2, in the configuration in which the check terminal portion is provided and the probe guide portion is provided at a portion corresponding to the check terminal portion, the probe guide portion is arranged in a relatively large margin of the IC socket. Act to enable.

In the invention of claim 3, the support member acts so as to receive the pressing force of the probe. In the invention of claim 4, the structure in which the probe guide portion is used as the guide hole acts so as to allow the guide holes to be arranged in a staggered arrangement as needed.

According to the fifth and eighth aspects of the invention, the tapered guide hole serves to enlarge the opening of the upper surface of the top plate of the guide hole. In the invention of claim 6, the probe guide portion is configured by the slit formed at the end of the top plate portion,
It works so that it can be formed by utilizing the end portion of the top plate portion.

In the invention of claim 7, the structure in which the guide hole is provided at the portion corresponding to the contact terminal portion acts so that the probe can be brought into contact with a portion of the contact terminal closer to the IC lead. . In the ninth aspect of the invention, the configuration for performing the IC test using the IC sockets of the first to eighth aspects works so that the potential at a position close to the leads of the IC is detected.

[0017]

【Example】

[First Embodiment] (Embodiments of the Invention of Claims 1, 2, 3, 4, 5, and 9) As shown in FIGS. 2 and 3, the IC socket 10 is of an open top type and has one lower part. It comprises a body 11, an upper body 12 and a large number of contacts 13.

The lower body 11 and the upper body 12 constitute an IC socket body. Lower body 11 has an IC to be tested in the center
Has an IC mounting table portion 11a on which the
It has contactor planting portions 11b and 11c. Contact placement part 1
A large number of contacts 13 are aligned and fixed to the 1b in the Y direction.

The upper body 12 has a substantially rectangular frame shape, and has an opening window 12a having a size corresponding to the IC mounting table portion 11a at the center.
And has protruding portions 12b and 12c on both sides thereof. The upper body 12 is fitted to the lower body 11 so as to cover the lower body 11.

The contactor 13, as shown in FIG.
It is a plate shape manufactured by pressing a plate material,
A base portion 13a, a spring portion 13b extending from the base portion 13a in an arc shape, a beak-shaped contact terminal portion 13c directed in the X ₁ direction from the tip of the spring portion 13b, and a tip of the spring portion 13b, It has a convex portion 13d formed on the side opposite to the contact terminal portion 13c, a leg portion 13e directed in the Z ₂ direction from the base portion 13a, and a check terminal portion 13f.

The check terminal portion 13f is in the form of a small piece of a substantially rectangular shape, and the dimension a projects from the convex portion 13d in the X ₂ direction opposite to the contact terminal portion 13c. Here, the direction in which the checking terminal portion 13f projects is
The overhanging direction is not particularly limited, and the dimension a is relatively large.

As shown in FIG. 3, the contact 13 has a leg portion 1
3e is planted by penetrating the contactor planting portion 11b.
The spring portion 13b is elastically bent, and the spring force of the spring portion 13b causes the contact terminal portion 13c to press the IC mounting table portion 11a with a force F.

The projecting portion 12b of the upper body 12 includes a top plate portion 12b- ₁ , a cam portion 12b- ₂ , a partition wall portion 12b- ₃ , a guide hole 12b- ₄ as a probe guide portion, and a support block 14 as a supporting member. Have. As shown in FIG. 1, the partition wall portions 12b _{-3 project} from the top plate portion 12b _{-1 in the} Z ₂ direction and are arranged in a comb shape in the Y direction. This comb-shaped partition wall portion 12b _-3, relatively, bounded by and a flat partition walls 12b _-3 space 1
A large number of 2b- ₅ are formed side by side in the Y direction.

The cam portion 12b- ₂ is formed in each flat space 12b- ₅ . The guide hole 12b _-3 is provided on the top plate 12a _-1.
In addition, each flat space 12b- ₅ is formed. Guide hole 1
2b _-3 has a hole d ₁ having a size corresponding to the diameter d of the thin probe 15 having a circular cross section, and has a tapered shape that widens toward the upper side (Z ₁ direction). For this reason,
Of the guide holes 12b- ₄ , the opening 12b- _4a to the upper surface of the top plate portion 12b- ₁ is large and the probe 15 is easily inserted.

The flat space 12b_-FivePitch P₁Is narrow
Therefore, the guide hole 12b_-3Are arranged in a staggered pattern.
Guide hole 12b_-3Is the width corresponding to the above dimension a
Band-shaped part 12b _-7It is formed on. This strip
Minute 12b_-7Is a part corresponding to the check terminal portion 13f
Is.

Since the above dimension a is relatively large,
The width dimension w of the strip-shaped portion 26b- ₇ becomes large, so that it is easy to arrange the guide holes 12b- ₄ in a staggered manner. In each flat space 12b- ₅ , the check terminal portion 13f
Are fitted. The support member 14 has concave portions 12b on both end sides.
_It is fitted to _-6 , is laid horizontally, and is attached to the upper body 12, and supports the lower end surface 13f _-1 of the check terminal portion 13f.

Each guide hole 12b- ₄ faces the upper end surface 13f- ₂ of the check terminal portion 13f. Further, as shown in FIG. 3, the cam portion 12b- ₂ is in contact with the convex portion 13d. Next, attach the IC to the IC socket 10 having the above-mentioned configuration,
The operation when detecting a potential using the probe will be described.

The IC socket 10 is, as shown in FIG.
The legs 13e are soldered and mounted on the printed circuit board 20. The IC socket 10 has the structure I shown in FIG.
Used to test the electrical properties of C21. IC2
Reference numeral 1 denotes a surface mount type IC, which is an IC package 21a.
And leads 21b extending from both sides of the IC package 21a.

As shown in FIG. 4, the IC 21 pushes down the upper body 12 with a fingertip, places the IC 21 on the IC mounting table 11a through the opening window 12a, and places the fingertip on the upper body 1.
When it is separated from 2, it is mounted as shown in FIG. That is, when the upper body 12 is pushed down, the cam portion 12
b _-2 pushes the convex portion 13d, the contact terminal portion 13c is floating from the IC mounting base portion 17a, is outwardly (FIG. 4 in X ₂ direction) slightly retracted from the IC mounting base portion 11a. When the upper body 12 returns to the original position, the contact terminal portion 13c presses the lead 21b.

As shown by the chain double-dashed line in FIG. 5, connect the flove 15 to the IC socket 1 from above the IC socket 10.
0 and insert it in the target guide hole 12b- ₄ . As shown in FIG. 5, the tip of the probe tip 15 passes through the guide hole 12b _-4 and enters the flat space 12b _-5 ,
It contacts the target upper end surface 13f _-2 of the checking terminal 13f.

As a result, the potential of the lead 21b of the IC 21 is taken out by the probe 15 via the contact terminal portion 13a of the contactor 13 and the check terminal portion 13f and measured accurately. Here, firstly, the guide hole 12b _-4 is provided in the top plate portion 12b _-1, and _secondly , the guide hole 12b _-4.
b- ₄ has a taper shape that widens toward the upper end, and thirdly, the flat space 12b has one guide hole 12b- _4.
-5 , fourthly, the flat space 12b _-5 is partitioned from the adjacent flat spaces by a partition wall portion 12b _-3 , and fifthly, one flat space 12b _-5. Since the one check terminal portion 13f is accommodated therein, it is easy to insert the probe 15 into the target guide hole 12b _-4 , and the guide hole 1 for the probe 15 is used.
As long as it is inserted into 2b _-4 , the probe 15 comes into contact with the desired check terminal portion 13f safely and securely.

Further, as shown in FIG. 5, the lower end surface 13f _-1 of the checking terminal portion 13f is received by the support block 14. Therefore, even if pressure is applied by the probe 15, the pressure pushing the lead 21b of the contact terminal portion 13c does not decrease at all, and the contact terminal portion 13c and the lead 2b are not reduced.
1b is kept in a stable conductive state.

[Second Embodiment] (Claims 1, 2, 3, 6)
Embodiment 9 of the Invention) As shown in FIGS. 6 to 8, the IC socket 10A is a circular guide hole 12 of the IC socket 10 of the first embodiment.
Instead of b _-4 , a slit 30 as a probe guide portion
It is configured to have.

6 to 8, parts corresponding to those shown in FIGS. 1 to 5 are designated by the same reference numerals, and their description will be omitted. The slit 30 is formed by cutting out a part of the top plate portion 12b- ₁ of the upper body 12A to expose the upper end side of the flat space 12b- ₅ .

The probe 15A has a plate shape,
It is inserted into the flat space 12b- ₅ through the slit 30 and is brought into contact with the check terminal portion 13f. [Third Embodiment] (Embodiment of the Invention of Claims 2, 8 and 9) As shown in FIGS. 9 and 10, the IC socket 10B is
The guide hole 40 as a probe guide portion is provided at a position directly above the contact terminal portion 13c.

9 and 10, parts corresponding to those shown in FIGS. 1 to 5 are designated by the same reference numerals. The guide hole 40 has a tapered shape that widens toward the top.
The contact 13A has a shape that does not have the checking terminal portion 13f.

The probe 15 is inserted through the guide hole 40, inserted into the flat space 12b- ₅ , and brought into contact with the upper end surface 13c- ₁ of the contact terminal portion 13c.

[0038]

As described above, according to the first aspect of the present invention, as long as the probe is inserted into the probe guide portion, no matter how narrow the pitch of the contacts is, the probe can be installed in the two directions. The probe can be surely brought into contact with one contactor without making contact with one contactor, thereby improving operability.

According to the second aspect of the present invention, since the contactor is configured to have the checking terminal portion and the probe guide portion is provided at the portion corresponding to the checking terminal portion, the probe guide portion is IC. It can be placed in the socket with a relatively large space.

According to the invention of claim 3, in addition to the effect obtained by the invention of claim 2, it is prevented that the contact pressure of the contact terminal portion in contact with the lead of the IC is reduced by the pressing force of the probe. Therefore, there is an effect that the reliability of contact between the contact terminal portion and the lead can be maintained.

According to the fourth aspect of the present invention, the guide holes can be arranged in a staggered manner as needed, and therefore, even if the pitch of the contacts is small, the guide holes are arranged corresponding to each contact. You can do it. According to the inventions of claims 5 and 8,
It can be easily inserted into the guide hole.

According to the invention of claim 6, the probe guide portion can be formed by effectively utilizing the end portion of the top plate portion. According to the invention of claim 7, the probe can be brought into contact with a position closer to the lead of the IC.
It is possible to more accurately measure the potential of the lead.

According to the ninth aspect of the invention, the electric potential at the position close to the lead of the IC can be detected reliably by a simple operation.

[Brief description of drawings]

FIG. 1 is an exploded view of a main part of the IC socket of FIG.

FIG. 2 is a perspective view of an IC socket according to the first embodiment of the present invention.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a diagram illustrating an operation when mounting an IC.

FIG. 5 is a diagram for explaining detection of an electric potential using a probe.

FIG. 6 is a perspective view of an IC socket according to a second embodiment of the present invention.

FIG. 7 is an exploded view showing a main part of the IC socket of FIG.

FIG. 8 is a diagram showing a state when a probe is used.

FIG. 9 is a perspective view of an IC socket according to a third embodiment of the present invention.

FIG. 10 is a diagram showing a state when a probe is used.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 IC socket 11 Lower body 11a IC mounting base section 11b Contactor installation section 12 Upper body 12a Opening windows 12b, 12c Overhanging section 12b _-1 Top plate section 12b _-2 Cam section 12b _-3 Partition wall section 12b _-4 , 40 guide hole 12b _-5 flat space 12b _-6 recess 12b _-7 strip portions 13,13A contacts 13a base 13b spring portion 13c contact terminal 13c _-1 upper end surface 13d projecting portion 13e legs 13f check terminal section 13f _{- 1} Lower end surface 13f _-2 Upper end surface 14 Support block 15, 15A Probe 20 Printed circuit board 21 IC 21a IC package body 21b Lead 30 Slit

Claims (9)

[Claims] 1. An IC socket having a plurality of contacts incorporated in an IC socket body, wherein a probe is inserted into the IC socket body, and a probe guide portion for guiding the inserted probe to one contactor is provided. An IC socket characterized by being provided. 2. An IC socket having a plurality of contacts incorporated in an IC socket body, wherein the contacts have a checking terminal portion, and the checking terminal of the IC socket body is provided. An IC socket characterized in that a probe is inserted into a portion corresponding to the portion, and a probe guide portion for guiding the inserted probe to the checking terminal portion is provided. 3. An IC socket having a plurality of contacts incorporated in an IC socket body, the contacts having a contact terminal portion for contacting with a lead of an IC, wherein the contact portion is a base portion of the contact terminal portion. From the side, there is a check terminal portion extending in a direction opposite to the contact terminal portion, and in the IC socket body, a probe is inserted into a portion corresponding to the check terminal portion, and the inserted probe I has a probe guide portion that guides to the upper end surface of the checking terminal portion, and a support member that receives the lower end surface of the checking terminal portion.
C socket. 4. The probe guide portion according to claim 2 or 3,
An IC socket comprising a guide hole formed in a top plate portion of the IC socket body. 5. The IC socket according to claim 4, wherein the guide hole has a tapered shape that widens toward the top. 6. The probe guide portion according to claim 2 or 3,
An IC socket comprising a slit formed at an end of a top plate of the IC socket body. 7. An IC socket having a plurality of contacts incorporated in an IC socket body, wherein the contacts have a contact terminal portion that comes into contact with a lead of an IC, wherein the contact terminal is included in the IC socket body. An IC socket characterized in that a probe is inserted into a portion corresponding to the portion, and a guide hole for guiding the inserted probe to the contact terminal portion is provided. 8. The IC socket according to claim 7, wherein the guide hole has a tapered shape that widens toward the top. 9. The IC socket according to claim 1, wherein the probe is inserted into the probe guide portion and brought into contact with a part of the contactor to be mounted on the IC socket. The IC test method is characterized in that the IC test is performed.