JPH08265084A - Chip filter - Google Patents

Abstract

PURPOSE: To mount a very small sized form of one chip onto a printed circuit board with high density through the provision of an RC or an LC function. CONSTITUTION: First to 4th internal electrodes 1-14 are provided in the inside of a bare chip 16 made of a rectangular ceramic dielectric material, and 1st and 2nd internal electrodes 11, 12 appear respectively at a 1st corner 16a and a 2nd corner of the pair chip 16 and 3rd and 4th internal electrodes 13, 14 appear respectively at a 3rd corner 16c and a 4th corner. A 1st resistive layer 21 is formed from the 1st corner 16a and the 2nd corner on the surface of the bare chip 16 and the 2nd resistive layer 22 is formed over the 2nd and 4th corners on the rear side of the bare chip 16. A 1st external electrode 31 electrically connected with the 1st internal electrode 11 and the 1st resistive layer 21, a 2nd external electrode electrically connected with the 1st and 2nd resistive layers 21, 22 and the 2nd internal electrode 12, a ground electrode in continuity with the 3rd external electrode 13, a 3rd external electrode electrically connected with a 4th internal electrode 14 and the 2nd resistive layer 22 are baked respectively to the 1st to 4th corners.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type filter mountable on the surface of a printed circuit board. More specifically, the present invention relates to a chip-type filter suitable for a low-pass filter, a high-pass filter, and a chip-type filter suitable for other filters.

[0002]

BACKGROUND OF THE INVENTION Thick film circuit boards have been manufactured commercially since the early 1950s. This circuit product was based on a network of resistors formed by screen printing on a ceramic substrate. The resistor of this circuit had a carbon-based composition, the conductor was Ag, and the substrate was alumina or steatite. If the substrate is made of BaTiO ₃ or a dielectric having a high relative dielectric constant close to BaTiO ₃ , the substrate that is the dielectric becomes a capacitor, and an RC (resistance value R of the resistor, capacitance C of the capacitor) circuit can be made thereafter. Soon found. It has been found that if the resistor pattern is placed on the capacitor, the capacitance is continuously changed, so that the distributed RC function can be obtained. It has been found that this RC distributed network has properties that are useful as high frequency filters and cannot be obtained with filters composed of separate R and C components. It should be noted that these products used a dielectric ceramic substrate as a capacitor, and were composed of a resistance pattern formed on the surface and a conductor circuit having a structure for connection inside the substrate. Later thin film technology was used for similar purposes. For example, Ta / Ta ₂ O ₅ technology was developed to create RC networks, and Ta ₂ O ₅
As the dielectric, some of these are distributed RC
There was a type feature.

[0003]

However, the conventional R
Since the C filter has a substrate made of a dielectric material and is relatively large, it is not suitable for mounting on a printed circuit board, and has not been formed into a chip shape for surface mounting on a substrate. It is an object of the invention to provide RC or L
It is intended to provide a chip type filter having a function of C (inductance L of inductor, capacitance C of capacitor) and capable of being mounted on a printed circuit board at high density.

[0004]

As shown in FIGS. 1 to 6, a first chip type filter 10 of the present invention is made of a rectangular ceramic dielectric material, and has a first internal electrode 11 and a first internal electrode 11 inside the chip. 2 internal electrode 12, 3rd internal electrode 13 and 4th
The internal electrode 14 is provided, the first internal electrode 11 is formed so as to appear in the first corner portion 16a, and the second internal portion is formed in the second corner portion 16b.
The third corner 16c is formed so that the internal electrode 12 appears.
Is formed so that the third internal electrode 13 that faces the first and second internal electrodes 11 and 12 through the ceramic dielectric is exposed, and the third internal electrode 13 and the ceramic dielectric are provided at the fourth corner 16d. The bare chip 16 formed so that the opposing fourth internal electrode 14 appears, and the first and second internal electrodes 11, 12 and the ceramic dielectric over the first corner portion 16a and the second corner portion 16b of the surface of the bare chip 16. The first resistance layer 21 formed so as to face each other through the second corner portion 16b and the fourth corner portion 16d on the back surface of the bare chip 16 and so as to face the fourth internal electrode 14 through the ceramic dielectric. The second resistance layer 22 formed on the first chip, the first outer electrode 31 baked on the first corner 16a of the bare chip 16 so as to be electrically connected to the first internal electrode 11 and the first resistance layer 21, respectively. Second outer electrode 32 burned so as to be electrically connected to the first resistance layer 21, the second internal electrode 12, and the second resistance layer 22, respectively, and the third corner portion of the bare chip 16 in the second corner portion 16b of the chip 16. 16c, a ground electrode 17 burned so as to conduct to the third internal electrode 13, and 4th corner 16d of the bare chip 16 burned so as to conduct to the fourth internal electrode 14 and the second resistance layer 22, respectively. And 3 external electrodes 33.

As shown in FIGS. 8 to 11, the second aspect of the present invention is described.
The chip-type filter 50 of No. 1 is composed of a rectangular ceramic dielectric, is provided with the first internal electrode 11, the second internal electrode 12, the third internal electrode 13, and the fourth internal electrode 14 inside the chip, and has the first corner portion. 16a is formed so that the first internal electrode 11 appears, the second corner electrode 16b is formed so that the second internal electrode 12 appears, and the third corner part 16c is formed with the first and second internal electrodes 11 and 12 and the ceramic. It is formed so that the third internal electrodes 13 facing each other via the dielectric material appear, and the fourth corner portion 1 is formed.
Bare chip 16 formed so that fourth internal electrode 14 that faces third internal electrode 13 via a ceramic dielectric appears in 6d, and first corner portion 16a of the surface of bare chip 16
To the second corner 16b and the first and second internal electrodes 1
The first inductor layer 51 formed so as to face the first and the second dielectric layers 12 through the ceramic dielectric, the second corner portion 16b and the fourth corner portion 16d on the back surface of the bare chip 16, and the fourth
The second inductor layer 52 formed so as to face the internal electrode 14 with the ceramic dielectric interposed therebetween, and the bare chip 16
Of the first internal electrode 11 and the first inductor layer 51 on the first corner 16a of the first external electrode 31 and the second corner 16b of the bare chip 16 on the first external electrode 31.
The second external electrode 32 baked so as to be electrically connected to the inductor layer 51, the second internal electrode 12, and the second inductor layer 52, and the third internal electrode 13 is electrically connected to the third corner portion 16c of the bare chip 16. Baked ground electrode 17
And the fourth internal electrode 1 on the fourth corner 16d of the bare chip 16.
4 and the second inductor layer 52, and the third external electrode 33 baked so as to be electrically connected to each other.

The first chip type filter 10 of the present invention is
It is made by a wet laminating method or a dry laminating method. First, a BaTiO ₃ -based or Pb-based dielectric ceramic powder, an organic binder, a plasticizer, and an organic solvent are mixed to prepare a dielectric paste or a dielectric slurry. In the wet lamination method,
After this dielectric paste is laminated by a curtain coating method on a ceramic dielectric layer on a base plate and dried, a conductive paste is screen-printed on this dielectric layer at intervals to be dried on the same plane. Many fourth internal electrodes 1
4 is formed. A dielectric paste is similarly laminated on the internal electrodes 14, and then a conductive paste is screen-printed and dried to form a large number of third internal electrodes 13. Next, a dielectric paste is similarly laminated on the internal electrodes 13, and then a conductive paste is screen-printed and dried to obtain a large number of first and second internal electrodes 11, 12.
Are formed on the same plane at predetermined intervals. Further, a dielectric paste is similarly laminated on these internal electrodes 11 and 12. The laminated body is subjected to binder removal processing and then fired, and the first and second resistance layers 2 are formed on the front and back surfaces of the sintered body.
The pastes 1 and 22 are respectively screen-printed, dried and fired.

The first resistance layer 21, the first and second internal electrodes 11 and 12, the third internal electrode 13, and the fourth internal electrode 14
Then, the second resistance layer 22 is formed so as to substantially overlap with each other when viewed from above, as shown in FIGS. Also, if the first and second resistance layers 21 and 22 have a substantially rectangular shape that is slightly smaller or larger than the third internal electrode 13 as long as a desired resistance value is obtained, the first and second resistive layers 21 and 22 have substantially the same shape as the third internal electrode 13. It may be formed in a large size or in another shape. In this sintered body, the first resistance layer 21 and the first internal electrode 11 appear in the first corner 16a, and the first resistance layer 11, the second internal electrode 12, and the second resistance layer 22 appear in the first corner 16a. Adjacent second corner 16
b, and the third internal electrode 13 has the first corner 16a.
Appearing in the third corner 16c opposite to, and further the fourth internal electrode 1
4 and the second resistance layer 22 are adjacent to the first corner 16a
It is cut into a rectangular chip shape so as to appear in the corner 16d.
A conductive paste is applied to the first corner portion 16a of the obtained bare chip 16 so as to be electrically connected to the first resistance layer 21 and the first internal electrode 11 and baked to form the first external electrode 31, and the second external electrode 31 is formed.
The first resistance layer 21, the second internal electrode 12 and the second
A conductive paste is applied so as to be electrically connected to the resistance layer 22 and baked to form the second external electrode 32. Further, a conductive paste is applied to the third corner portion 16c of the bare chip 16 so as to be electrically connected to the third internal electrode 13 and baked to form the ground electrode 17, and the fourth internal electrode 14 and the second resistor 16 are formed at the fourth corner portion 16d. A conductive paste is applied so as to be electrically connected to the layer 22 and baked to form the third external electrode 33.

In order to manufacture the chip type filter 10 by a dry lamination method, a film of the above dielectric slurry is dried by a doctor blade method or the like to form a ceramic green sheet, and a ceramic green sheet is formed on the green sheet. The fourth internal electrode 14 is formed as in the wet lamination method. After the green sheet is laminated on the internal electrode 14, the third internal electrode 1 is formed on the green sheet by the wet lamination method.
3 is formed. Next, after stacking the green sheet on the internal electrode 13, the first and second internal electrodes 11 and 12 are formed on the green sheet in the same manner as the wet stacking method. Further, the green sheet is laminated on these internal electrodes 11 and 12. Thereafter, the laminated body is fired, the first and second resistance layers 21 and 22 are formed, the sintered body is made into chips, as in the wet lamination method, and finally the first to third external electrodes 31 are formed.
~ 33 and the ground electrode 17 are formed.

The second chip type filter 50 of the present invention is the first chip type filter 50 except that the first and second resistance layers 21 and 22 of the first filter 10 are replaced with first and second inductor layers 51 and 52, respectively. It is manufactured in the same manner as the filter 10 of No. 1. In both the first and second chip type filters 10 and 50, it is preferable to form the insulating film 18 on the surfaces of the first and second resistance layers 21 and 22 or the surfaces of the first and second inductor layers 51 and 52. The insulating film 18 is made of SiO ₂
A film containing as a main component is preferable. As a method of forming the insulating film 18, a thick film forming method in which a glass paste is applied and baked, a physical vapor deposition method (PVD method) such as a vacuum vapor deposition method, a sputtering method, an ion plating method, or a chemical vapor deposition method (CVD) is used. Method). The insulating film 18 may be formed after or before the external electrodes 31 to 33 and the ground electrode 17 are formed on the bare chip 16 cut into chips, or the resistance of the ceramic sintered body is cut before cutting into chips. Layers 21 and 22 and inductor layer 5
You may form on the surface of 1,52.

[0010]

The first chip type RC filter 10 has a resistance circuit including the first external electrode 31, the first resistance layer 21, and the second external electrode 32, the second external electrode 32, the second resistance layer 22, and the third external electrode. A resistance circuit composed of the electrode 33, a distributed capacitance circuit composed of the third internal electrode 13, the first and second internal electrodes 11, 12 and the dielectric of the bare chip 16 interposed therebetween, the third internal electrode 13 and the 4 internal electrodes 14 and a distributed capacitance circuit made of a dielectric material of the bare chip 16 interposed therebetween, which is shown by an equivalent circuit in FIG.

The second chip type LC filter 50 includes a first outer electrode 31, a first inductor layer 51 and a second outer electrode 32.
An inductor circuit including a second external electrode 32, a second inductor layer 52 and a third external electrode 33, a third internal electrode 13, a first and second internal electrode 1
1, 12 and a distributed capacitance circuit composed of a dielectric material of a bare chip 16 interposed therebetween, and a third internal electrode 1
The third and fourth internal electrodes 14 and the distributed capacitance circuit made of the dielectric material of the bare chip 16 interposed therebetween are shown in an equivalent circuit of FIG.

The surfaces of the resistance layers 21 and 22 and the inductor layer 5
When the insulating films 18 are respectively formed on the surfaces of 1, 52, first, Ni plating is performed to improve the solder heat resistance of the external electrodes 31 to 33 and the ground electrode 17, or Sn plating is performed to improve the solderability. When applied to the external electrodes 31 to 33 and the ground electrode 17, the plating does not directly adhere to the resistance layers 21 and 22 or the inductor layers 51 and 52, and the resistance value and the inductance do not change. Secondly, the chip type filter 10
Alternatively, the filter characteristics do not change even when the usage environment of 50 is high temperature and high humidity.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings. <Embodiment 1> As shown in FIGS. 1 to 6, a first chip type filter 10 of the present invention is an RC filter, and a bare chip 16 made of a ceramic dielectric and first to fourth internal electrodes 11 to 14 are used. , First and second resistance layers 21 and 22, first to third external electrodes 31 to 33, and a ground electrode 17. The chip type filter 10 is manufactured by the following method. First, a ceramic dielectric green sheet made of a Pb-based relaxor material is laminated to form a ceramic dielectric layer, and then an Ag-based thick film paste is screen-printed in a predetermined pattern and dried to form equal intervals in the same plane. A large number of 4th
An internal electrode 14 is formed (FIGS. 1, 2 and 6), and a ceramic dielectric layer having the same shape and size as the above-mentioned ceramic dielectric layer is laminated thereon so as to cover all the internal electrodes 14. did.

At a position on the ceramic dielectric layer corresponding to the fourth internal electrode 14, a substantially rectangular pattern having a width about twice that of the individual patterns of the fourth internal electrode 14 and the same length as A is formed.
The g-based thick film paste is screen-printed and dried to form a large number of third internal electrodes 13 (FIGS. 1, 2 and 5), and the above-mentioned internal electrodes 13 are all covered thereon. A ceramic dielectric layer having the same shape and size as the ceramic dielectric layer was laminated. At a position corresponding to the third internal electrode 13 on the ceramic dielectric layer, an Ag-based thick film paste is screen-printed with a pattern having the same width as the individual patterns of the third internal electrode 13 and a length of about half, and dried. By doing so, a large number of sets of first and second internal electrodes 11 and 12 spaced from each other by a predetermined distance were formed (FIGS. 1, 2, and 4).
On top of this, a ceramic dielectric layer having the same shape and size as the above-mentioned ceramic dielectric layer was laminated so as to cover all the internal electrodes 11 and 12.

Next, the laminated body is fired so that the dielectric layers each have a thickness of 5 to several hundred μm and the first to fourth internal electrodes 11 are formed.
After forming a plate-shaped ceramic sintered body containing 14 to 14, RuO ₂ -based thick film paste is formed on the surface of the sintered body at a position corresponding to the first and second internal electrodes 11 and 12. By screen printing and baking on
A first resistance layer 21 having a thickness of several 100 μm is formed (FIGS. 1 to 3), and a RuO ₂ thick film paste is screen-printed on a back surface of the sintered body in a predetermined pattern at a position corresponding to the fourth internal electrode 14 and baked. By doing so, the second resistance layer 22 having a thickness of 5 to several hundreds μm and having substantially the same shape and size as the first resistance layer 21 was formed (FIGS. 1, 2 and 6). These resistance layers 21 and 22 are formed in a substantially rectangular shape slightly smaller than the third internal electrode 13.

The first corner portion 11 of the first internal electrode 11
a is a first internal protrusion 11b protruding outward in the same plane.
Is formed, and the second corner portion 12a of the second inner electrode 12 is formed with the second inner protrusion 12b protruding outward in the same plane (FIG. 4). Third corner portion 1 of third internal electrode 13
3a is a third internal protrusion 13 protruding outward in the same plane.
b is formed (FIG. 5), and a fourth internal protrusion 14b is formed on the fourth corner portion 14a of the fourth internal electrode 14 so as to project outward in the same plane (FIG. 6). The first and second corner portions 21a and 21b of the first resistance layer 21 are respectively formed with first and second surface protrusions 21c and 21d protruding outward in the same plane (FIG. 3), and the second resistance layer. First and second rear surface protrusions 22c and 22d, which protrude outward in the same plane, are formed on the second and fourth corner portions 22a and 22b of 22 (FIG. 6).

Next, the sintered body was cut into rectangular chips with a diamond saw for each of the first resistance layers 21. The bare chip 16 thus obtained is barrel-polished to expose the first internal protrusions 11b of the first internal electrodes 11 and the first surface protrusions 21c of the first resistance layer 21 at the first corners 16a thereof, and the first corners are exposed. The second inner protrusion 12b of the second inner electrode 12, the second front protrusion 21d of the first resistance layer 21, and the first back protrusion 22 of the second resistance layer 22 are formed at the second corner 16b adjacent to the portion 16a.
c and the third inner protrusion 13b of the third inner electrode 13 are exposed at the third corner 16c facing the first corner 16a.
And the fourth corner 1 adjacent to the first corner 16a.
6d includes a fourth inner protrusion 14b of the fourth inner electrode 14 and a second inner protrusion 14b.
The second back surface protrusions 22d of the resistance layer 22 were exposed.

At the first corner 16a of the bare chip 16, Ag-
Applying a conductive paste of Pd and baking it to form the first internal protrusion 1
1b and the first surface protrusion 21c are electrically connected to each other, the first outer electrode 31 is formed, and the second corner portion 16b is coated with a conductive paste of Ag-Pd and baked to form the second inner protrusion 12b and the second inner protrusion 12b.
The second external electrode 32 is formed so as to be electrically connected to the front surface projection 21d and the first back surface projection 22c, and Ag− is formed at the third corner 16c.
Applying a conductive paste of Pd and baking it to form the third internal protrusion 1
The ground electrode 17 is formed so as to be electrically connected to 3b, and the fourth corner portion 16d is coated with a conductive paste of Ag-Pd and baked to be electrically connected to the fourth inner protrusion 14b and the second back protrusion 22d. The electrode 33 was formed. Bare chip 1
Glass paste is applied to the surfaces of the first and second resistance layers 21 and 22 of No. 6 and baked to have a thickness of 5 containing SiO ₂ as a main component.
By forming the insulating films 18, 18 (FIGS. 1 and 2) each having a thickness of several tens of μm, the chip-type RC filter 10 is formed.
Was produced.

<Second Embodiment> Second chip type filter 50
Is an LC filter, and a ceramic sintered body is formed in the same manner as in Example 1. As shown in FIGS. 8 to 11, the RuO ₂ thick film paste of Example 1 is applied to the front and back surfaces of this ceramic sintered body. Instead of, a thick film paste of ferrite or ferromagnetic material was screen-printed and fired in the same manner as in Example 1.
As a result, the first and second inductor layers 51 and 52 having a thickness of 5 to several 100 μm were formed. After that, a chip type LC filter 50 was produced in the same manner as in Example 1. Reference numerals 51c and 51d denote first and second surface protrusions respectively formed on the first and second corner portions 51a and 51b of the first inductor layer 51, and 52c and 52d denote the second inductor layer 5
The second and fourth corner portions 52a and 52b are the first and second backside protrusions, respectively. 8 to 11, the same reference numerals as those of the above-described first embodiment indicate the same parts.

[0020]

As described above, the chip type filter of the present invention has the third internal electrode and the first internal electrode formed inside the chip.
Since capacitors are respectively constituted by the second and fourth internal electrodes and the first and second resistance layers or the first and second inductor layers are formed on the front surface and the back surface of the chip, the RC can be realized in a very small form of one chip. Alternatively, it can have an LC function and can be mounted on a printed circuit board with high density. Further, if an insulating film is formed on the surface of the first and second resistance layers or the surface of the first and second inductor layers, the plating is performed on the first and second resistance layers or the first and second resistance layers during the plating process of the external electrode and the ground electrode. Even if the chip type filter is not directly attached to the inductor layer and the use environment of the chip type filter is high temperature and high humidity, the filter characteristics do not change.

[Brief description of drawings]

FIG. 1 is a cross-sectional view taken along the line AA of FIG. 3 showing a state in which an insulating film is formed on the surface of a resistance layer of a chip type filter according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line BB of FIG. 3 showing a state in which an insulating film is formed on the surface of the resistance layer of the chip type filter.

FIG. 3 is a plan view of a chip filter showing a state before an insulating film is formed on the surface of a resistance layer.

4 is a cross-sectional view taken along the line CC of FIG.

5 is a cross-sectional view taken along line DD of FIG.

6 is a sectional view taken along line EE of FIG.

FIG. 7 is an equivalent circuit diagram thereof.

FIG. 8F of FIG. 10 showing a state in which an insulating film is formed on the inductor layer surface of the chip type filter according to the second embodiment of the present invention.
-F line sectional view.

9 is a cross-sectional view taken along line GG of FIG. 10 showing a state in which an insulating film is formed on the inductor layer surface of the chip type filter.

FIG. 10 is a plan view of the chip filter showing a state before an insulating film is formed on the surface of the inductor layer.

11 is a sectional view taken along line HH of FIG.

FIG. 12 is an equivalent circuit diagram thereof.

[Explanation of symbols]

 10,50 Chip type filter 11-14 Internal electrode 16 Bare chip 16a-16d Corner 17 Grounding electrode 18 Insulating film 21,22 Resistance layer 31-33 External electrode 51,52 Inductor layer

Claims (4)

[Claims] 1. A first internal electrode (11) and a second internal electrode (12) formed of a rectangular ceramic dielectric material inside a chip.
And a third internal electrode (13) and a fourth internal electrode (14) are provided so that the first internal electrode (11) appears at the first corner (16a) and the second corner (16b). Is formed so that the second internal electrode (12) appears, and the first and second inner electrodes are formed at the third corner (16c).
The third internal electrode (13) facing the internal electrodes (11, 12) through the ceramic dielectric is formed to appear, and the third internal electrode (13) and the ceramic are formed at the fourth corner (16d). A bare chip (16) formed so that a fourth internal electrode (14) facing each other via a dielectric appears; a first corner portion (16a) of the bare chip (16);
Over the corner (16b) and the first and second internal electrodes (11, 1)
2) a first resistance layer (21) formed so as to face the ceramic dielectric body, a second corner (16b) on the back surface of the bare chip (16) and a fourth
A second portion formed so as to extend to the corner portion (16d) and face the fourth internal electrode (14) through the ceramic dielectric.
A resistance layer (22) and a first outer portion baked on the first corner (16a) of the bare chip (16) so as to be electrically connected to the first internal electrode (11) and the first resistance layer (21), respectively. The electrode (31) and the first resistance layer on the second corner (16b) of the bare chip (16)
(21), the second internal electrode (12), and the second external electrode (32) baked so as to be electrically connected to the second resistance layer (22), respectively.
A ground electrode (17) burned to the third corner (16c) of the bare chip (16) so as to be electrically connected to the third internal electrode (13), and a fourth corner () of the bare chip (16). 16d) A chip-type filter having the fourth internal electrode (14) and the third external electrode (33) baked so as to be electrically connected to the second resistance layer (22). 2. The chip type filter according to claim 1, wherein the surfaces of the first and second resistance layers (21, 22) are each covered with an insulating film (18). 3. A first internal electrode (11) and a second internal electrode (12) formed of a rectangular ceramic dielectric material inside a chip.
And a third internal electrode (13) and a fourth internal electrode (14) are provided so that the first internal electrode (11) appears at the first corner (16a) and the second corner (16b). Is formed so that the second internal electrode (12) appears, and the first and second inner electrodes are formed at the third corner (16c).
The third internal electrode (13) facing the internal electrodes (11, 12) through the ceramic dielectric is formed to appear, and the third internal electrode (13) and the ceramic are formed at the fourth corner (16d). A bare chip (16) formed so that a fourth internal electrode (14) facing each other via a dielectric appears; a first corner portion (16a) of the bare chip (16);
Over the corner (16b) and the first and second internal electrodes (11, 1)
2) a first inductor layer (51) formed so as to face the ceramic dielectric, and a second corner portion (16b) of the back surface of the bare chip (16) and a fourth inductor layer (51).
A second inductor layer (52) formed over the corner (16d) and facing the fourth internal electrode (14) via a ceramic dielectric; and a first corner (16a) of the bare chip (16). ), A first external electrode (31) burned so as to be electrically connected to the first internal electrode (11) and the first inductor layer (51), and a second corner portion (16b) of the bare chip (16). A second external electrode (32) burned so as to be electrically connected to the first inductor layer (51), the second internal electrode (12), and the second inductor layer (52), and the bare chip (16) A ground electrode (17) burned so as to be electrically connected to the third internal electrode (13) at a third corner (16c) of the fourth internal portion (16c), and a fourth internal portion at a fourth corner (16d) of the bare chip (16). A chip type filter including an electrode (14) and a third external electrode (33) baked so as to be electrically connected to the second inductor layer (52). 4. The chip type filter according to claim 3, wherein the surfaces of the first and second inductor layers (51, 52) are each covered with an insulating film (18).