JPH08264571A - Manufacture of solid-state image pickup element - Google Patents

Abstract

PURPOSE: To reduce a manufacturing cost by forming a package of a solid-state image pickup element of resin. CONSTITUTION: A sensor chip 10 is die-bonded to an island part 11 of a lead frame, and a lead part and an outer frame of a lead frame is bent vertically to the island part 11. After a lead frame whereon a sensor chip 10 is mounted is contained in a recessed part 13 of a die 12, the recessed part 13 is filled with thermosetting light transmitting resin 20 and heated to form a package. An unnecessary part of a lead frame is cut and a part of an outer frame is left in a side surface part of a package together with a lead part.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a method for manufacturing a solid-state imaging device such as a CCD image sensor.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing a cross section of a part of a conventional solid-state image pickup device. In the ceramic package 1,
The internal lead 3a and the external lead 3b connected to this
And a drive circuit for driving the element is connected to the external lead 3b exposed to the outside. Also,
A concave portion is formed in the ceramic package 1, and a sensor chip 2 having a photoelectric conversion element formed on one surface is housed in the concave portion. Then, the electrode pads of the sensor chip 2 are connected to the tips of the internal leads 3a exposed in the recesses by wire bonding. Further, the concave portion in which the sensor chip 2 is stored is sealed by mounting the glass plate 4 thereon.

However, in the solid-state image pickup device as described above, there are many cases in which the sensor chip 2 is die-bonded in the recess of the ceramic package 1 and then the sensor chip 2 and the internal lead 3a are wire-bonded. An assembly process is required. Further, in the case of performing color imaging, a step of attaching a color filter or the like is added, so that the number of assembly steps is further increased. Therefore, the cost is increased, and the frequency of dust and scratches attached to the light receiving surface of the sensor chip 2 during the assembly process is increased. In addition, since the ceramic package 1 itself is expensive, the reduction in yield in the assembly process is one of the major factors for cost increase.

Therefore, it has been proposed, for example, in Japanese Utility Model Laid-Open No. 1-113347 to mold the sensor chip with a transparent resin. If the sensor chip is molded with such a translucent resin, the assembly process is simplified as compared with the case where the ceramic package 1 is used, and an inexpensive solid-state imaging device can be provided.

[0005]

When a sensor chip is molded with a translucent resin, it is difficult to avoid air bubbles from entering the resin by using a normal molding method called transfer molding. The inclusion of air bubbles is a serious problem in a solid-state imaging device. That is, in the solid-state imaging device, since light is emitted to the sensor chip through the translucent resin, light is scattered when unnecessary bubbles or the like are present in the resin, and an image is not correctly formed on the sensor chip. . Therefore, the distortion of the image and the deterioration of the color reproducibility in the case of color image pickup will be caused.

Further, when the sensor chip is molded with resin, the position of the sensor chip must be accurately determined with respect to the optical system because the positional relationship between the sensor chip and the molding resin cannot be obtained accurately. There is also a problem that it cannot be done.

[0007]

The present invention has been made in order to solve the above-mentioned problems, and is characterized in that a semiconductor chip formed by arranging a plurality of photoelectric conversion elements in a matrix is read. A method of manufacturing a solid-state imaging device, which comprises die-bonding on a frame and resin-molding the semiconductor chip together with the lead frame, wherein the semiconductor chip is die-bonded to an island portion of the lead frame having a notch for positioning. When,
Bending the lead portion of the lead frame and an outer frame surrounding the lead portion substantially perpendicularly to the semiconductor chip, forming a package shape of the solid-state imaging device;
A step of accommodating the lead frame having the semiconductor chip mounted therein in a recess having a positioning pin for fixing the lead frame at a predetermined position, and filling the interior of the recess with a thermosetting translucent resin; And a step of heating and curing the filled translucent resin, and a step of thermally curing the translucent resin and then cutting the outer frame of the lead frame leaving a fixed length. The reference of the mounting position is obtained by the remaining portion of the outer frame of the lead frame.

As a result, air bubbles in the resin are sufficiently expelled at the time of molding and the internal stress of the resin is reduced, so that the light applied to the semiconductor chip through the package is not unnecessarily refracted. At the same time, when attaching the resin-molded solid-state imaging device to the circuit board, the circuit board and the solid-state imaging device are maintained in parallel by supporting the solid-state imaging device with the remaining portion of the outer frame left in parallel with the lead. Is done.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view in the order of steps for explaining a method for manufacturing a solid-state image pickup device according to the present invention, and FIG. 2 is a plan view of a lead frame used in the manufacturing method according to the present invention. Also,
FIG. 3 is a perspective sectional view showing the structure of the solid-state imaging device formed by the manufacturing method of the present invention. In FIG. 1, the lead portions of the lead frame are omitted to simplify the drawing.

The lead frame includes an island portion 11 to which the sensor chip 10 is die-bonded and a lead portion 17 arranged around the island portion 11. An outer frame 18 surrounds the island portion 11 and the lead portion 17. Is provided. First, as shown in FIG. 1A, a sensor chip 10 in which a plurality of light receiving elements are arranged in a matrix is die-bonded to a substantially center of an island portion 11 of a lead frame, and the sensor chip 10 and the lead portion 17 are connected. Wire bonding. At the time of this die bonding, the notch 16 provided in the island portion 11 is used as a reference for positioning. Next, lead part 1
7 and the outer frame 18 are bent substantially perpendicularly to the island portion 11, and this lead frame is formed into a recess 1 having a predetermined shape.
The sensor chip 10 side is housed in the mold 12 provided with 3 with the bottom surface facing the bottom.

The recess 13 of the mold 12 is formed as shown in FIG.
There is a step 14 for separating the lead frame from the bottom surface of the recess 13, and a positioning pin 15 is provided at the center of the step 14. The pin 15 meshes with a notch 16 provided in the island portion 11 to fix the island portion 11 at a predetermined position in the concave portion 13.

Subsequently, as shown in FIG.
3 is filled with a light-transmitting resin 20, and the light-transmitting resin 20 is heated and cured. When the translucent resin 20 is heat-cured as described above, the bubbles contained in the translucent resin 20 are expelled to the outside of the translucent resin 20, so that the bubbles are formed in the translucent resin 20. It will not occur. Therefore,
Light applied to the sensor chip 10 through the translucent resin 20 is not unnecessarily refracted by bubbles, so that light without distortion is supplied to the sensor chip 10.

Then, unnecessary portions 19 of the outer frame 18 of the lead frame shown by broken lines in FIG. 2 are cut. At this time, the outer frame 18 is cut so that a part thereof remains outside the translucent resin 20, and the remaining part is used for positioning. That is, the shape of the front side of the translucent resin 20 is determined by the mold 12, but the shape of the back side is not determined due to deformation during thermosetting, and the reference surface for attaching the solid-state imaging device to the substrate is not determined. Not exactly obtained. Therefore, the reference surface is obtained from a part of the outer frame 18 left outside the translucent resin 20.

According to the above-described manufacturing method, the solid-state imaging device can be obtained by molding the sensor chip with a translucent resin which is extremely inexpensive as compared with the ceramic package, so that the cost of the solid-state imaging device can be reduced. .

[0015]

According to the present invention, an extremely inexpensive and lightweight solid-state imaging device can be realized. In addition, since the sensor chip is irradiated with light having no distortion, distortion of an image and reduction in color reproducibility during color imaging are prevented, and a high-quality image can be supplied stably.

Further, the position of the sensor chip in the package can be set accurately, and at the same time, when the package is mounted on the circuit board, the circuit board and the sensor chip can be maintained horizontally. Therefore, the positioning between the sensor chip and the optical system can be accurately and easily achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a method for manufacturing a solid-state imaging device according to the present invention.

FIG. 2 is a plan view showing a structure of a lead frame used in the manufacturing method of the present invention.

FIG. 3 is a perspective sectional view showing a package shape of a solid-state imaging device manufactured by the manufacturing method of the present invention.

FIG. 4 is a perspective view showing the structure of a mold used in the manufacturing method of the present invention.

FIG. 5 is a perspective sectional view showing a structure of a conventional solid-state image sensor.

[Explanation of symbols]

 1 Ceramic Package 2, 10 Sensor Chip 3a, 3b Lead 4 Glass Plate 11 Island Part 12 Mold 13 Recess 14 Step 15 Positioning Pin 16 Notch 17 Lead Part 18 Outer Frame 19 Unnecessary Part of Outer Frame 20 Translucent Resin

Claims (1)

[Claims] 1. A method for manufacturing a solid-state image pickup device, comprising: bonding a semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix on a lead frame; and resin-molding the semiconductor chip together with the lead frame. A step of die bonding the semiconductor chip to an island portion of the lead frame having a notch for positioning, and a step of bending a lead portion of the lead frame and an outer frame surrounding the lead portion substantially perpendicularly to the semiconductor chip. And forming the package shape of the solid-state imaging device, storing the lead frame on which the semiconductor chip is mounted in a concave portion having positioning pins for fixing the lead frame in a predetermined position, and setting the inside of the concave portion with a thermosetting resin. A step of filling with a translucent resin, and a step of filling the translucent resin filled in the concave portion. A step of heating and curing, and a step of thermally curing the translucent resin and then cutting the outer frame of the lead frame with a certain length left, and the remaining portion of the outer frame of the lead frame. A method for manufacturing a solid-state imaging device, characterized in that a reference for a mounting position is obtained by.