JPH08259384A - Closed tube-type epitaxial growth device - Google Patents
Closed tube-type epitaxial growth deviceInfo
- Publication number
- JPH08259384A JPH08259384A JP5733395A JP5733395A JPH08259384A JP H08259384 A JPH08259384 A JP H08259384A JP 5733395 A JP5733395 A JP 5733395A JP 5733395 A JP5733395 A JP 5733395A JP H08259384 A JPH08259384 A JP H08259384A
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- solution
- chamber
- sealed tube
- growth
- holding
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- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は回転式傾斜法による閉管
式液相エピタキシャル成長装置に関する。赤外線検知器
に使用されるHgCdTeの如く蒸気圧が高く分解し易
い化合物半導体の液相エピタキシャル成長(LPE成
長)には,傾斜法を用いた閉管式液相エピタキシャル成
長装置が広く使用されている。傾斜法は,封管中にソー
ス材料,エピタキシャル基板,及び溶液を封入し,ソー
ス材料に接触している溶液を封管を傾斜することにより
ソース材料から引き離し,エピタキシャル基板に接触さ
せてLEP成長を行う液相エピタキシャル成長法であ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a closed tube type liquid phase epitaxial growth apparatus using a rotary tilt method. A closed tube type liquid phase epitaxial growth apparatus using a gradient method is widely used for liquid phase epitaxial growth (LPE growth) of a compound semiconductor such as HgCdTe used in an infrared detector, which has a high vapor pressure and is easily decomposed. The tilt method encloses a source material, an epitaxial substrate, and a solution in a sealed tube, separates the solution in contact with the source material from the source material by tilting the sealed tube, and contacts the epitaxial substrate for LEP growth. This is a liquid phase epitaxial growth method.
【0002】かかるLPE法では,溶液組成を一定にす
るために,所定温度下で溶液をソース材料に接触させて
飽和溶液とし,その後溶液を成長温度に降温しエピタキ
シャル成長することが望ましい。In the LPE method, in order to make the solution composition constant, it is desirable to bring the solution into contact with the source material at a predetermined temperature to make a saturated solution, and then to cool the solution to a growth temperature for epitaxial growth.
【0003】このため,所定温度下で融液とソースとを
接触させ飽和させた後,溶液のみを成長室に移送できる
閉管式液相エピタキシャル成長装置が必要とされてい
る。Therefore, there is a need for a closed-tube type liquid phase epitaxial growth apparatus capable of transferring only the solution to the growth chamber after bringing the melt and the source into contact with each other to saturate them at a predetermined temperature.
【0004】[0004]
【従来の技術】半導体の液相エピタキシャル成長には,
浸漬法,ボートスライド法又は傾斜法(チッピング法)
が主に用いられる。図8は従来例断面図であり,液相エ
ピタキシャル成長装置の断面を表している。2. Description of the Related Art For liquid phase epitaxial growth of semiconductors,
Immersion method, boat slide method or tilt method (chipping method)
Is mainly used. FIG. 8 is a cross-sectional view of a conventional example, showing a cross section of a liquid phase epitaxial growth apparatus.
【0005】浸漬法は,図8(a)を参照して,ヒータ
44で加熱されたルツボ内の溶液41に,基板ホルダ4
3に水平に保持されたエピタキシャル基板42を浸漬し
て,基板42表面に半導体を析出させ堆積する。また,
ボートスライド法は,図8(b)を参照して,上面が水
平に設置された基板ホルダ43上面の窪みに基板42を
埋込み,その基板ホルダ43上面上を,溶液41を保持
するための貫通口を有するスライダ45を摺動させて,
溶液41を基板42上に移動する。In the dipping method, referring to FIG. 8A, the substrate holder 4 is immersed in the solution 41 in the crucible heated by the heater 44.
The epitaxial substrate 42 held horizontally at 3 is immersed to deposit and deposit a semiconductor on the surface of the substrate 42. Also,
In the boat slide method, referring to FIG. 8 (b), the substrate 42 is embedded in a recess in the upper surface of the substrate holder 43 whose upper surface is horizontally installed, and the upper surface of the substrate holder 43 is penetrated to hold the solution 41. Slide the slider 45 having a mouth,
The solution 41 is moved onto the substrate 42.
【0006】かかる浸漬法及びボートスライド法では,
基板ホルダ43又はスライダ45の移動機構を必要とす
るがこれらの機構を閉管内に配置することは難しく,通
常は開管式液相エピタキシャル成長装置として構成され
る。In the dipping method and the boat slide method,
Although a mechanism for moving the substrate holder 43 or the slider 45 is required, it is difficult to arrange these mechanisms in a closed tube, and it is usually constructed as an open tube type liquid phase epitaxial growth apparatus.
【0007】傾斜法は,図8(c)を参照して,傾斜し
て置かれた管状炉の高い位置の一端に基板42を置き,
低い位置にある他端に溶液41を保持して所定温度に昇
温した後,傾斜を逆に傾けることで,図8(c)に示す
ように基板42に溶液41を接触させ半導体を堆積す
る。In the tilting method, referring to FIG. 8 (c), a substrate 42 is placed at one end of a high position of a tubular furnace which is placed tilted,
After holding the solution 41 at the other end at the lower position and raising the temperature to a predetermined temperature, the solution 41 is brought into contact with the substrate 42 to deposit a semiconductor as shown in FIG. .
【0008】傾斜法の他の方式に回転式傾斜法がある。
図8(d)及び(e)は回転式傾斜法を適用した管状炉
の断面を表している。図8(d)を参照して,管の両端
を封じて製作された封管32を水平に設け,その封管3
2の上部に設けられた基板ホルダ30の下面に基板38
を保持し,底部に融液35を基板38と接触しないよう
に保持し,加熱する。昇温後,封管32をその中心軸廻
りに180度回転させて,融液35中に基板38を浸漬
し,半導体を堆積する。There is a rotary tilting method as another method of the tilting method.
FIGS. 8D and 8E show cross sections of a tubular furnace to which the rotary tilting method is applied. Referring to FIG. 8D, a sealed tube 32, which is manufactured by sealing both ends of the tube, is provided horizontally, and the sealed tube 3
2 is provided on the lower surface of the substrate holder 30 provided on the upper part of the substrate 38.
And the melt 35 is held at the bottom so as not to come into contact with the substrate 38 and heated. After the temperature is raised, the sealed tube 32 is rotated 180 degrees around its central axis, and the substrate 38 is immersed in the melt 35 to deposit the semiconductor.
【0009】上述した傾斜法は,融液の移動を炉体の傾
斜又は回転のみで行い,炉内に機械的移動手段を設ける
必要がないから,閉管式液相エピタキシャル成長装置へ
の適用が容易である。また,とくに回転式傾斜法では装
置構造が簡単という利点がある。このため,蒸気圧が高
く分解し易い半導体の堆積には,傾斜法,とくに回転式
傾斜法を用いた閉管式液相エピタキシャル成長装置が多
用される。The above-described tilting method allows the melt to be moved only by tilting or rotating the furnace body, and does not require any mechanical moving means in the furnace, and thus can be easily applied to a closed tube type liquid phase epitaxial growth apparatus. Is. In particular, the rotary tilt method has the advantage that the device structure is simple. Therefore, a closed-tube liquid-phase epitaxial growth system using the tilt method, especially the rotary tilt method, is often used for the deposition of semiconductors with high vapor pressure and easy decomposition.
【0010】しかし,閉管式の成長装置では,浸漬法の
ように多量の溶液を用いて,同一溶液から多数の基板に
順次半導体を堆積するという方法を採ることができな
い。このため,一回の成長毎に少量の溶液を計量しなけ
ればならず,微量成分の精密測定の困難性から,成長ご
との組成を一定にすることが難しい。However, the closed tube type growth apparatus cannot adopt a method of sequentially depositing semiconductors on a large number of substrates from the same solution by using a large amount of solution like the dipping method. For this reason, a small amount of solution must be weighed for each growth, and it is difficult to keep the composition constant for each growth due to the difficulty of precise measurement of trace components.
【0011】また,ボートスライド法のように,一つの
基板に堆積する毎に溶液とソース基板とを接触させ平衡
状態とすることで溶液組成を一定に保持するという方法
を採用することも困難である。このため,閉管式の成長
装置では,基板毎の半導体組成の変動が大きいという問
題を生ずる。It is also difficult to adopt a method such as the boat slide method in which the solution composition and the source substrate are brought into contact with each other every time they are deposited on one substrate to bring them into an equilibrium state so that the solution composition is kept constant. is there. Therefore, in the closed-tube type growth apparatus, there is a problem that the semiconductor composition varies greatly from substrate to substrate.
【0012】この問題を解決するため,回転式傾斜法に
おいてソース板を使用できる液相エピタキシャル成長装
置が考案され,特開昭59─79534号公報に開示さ
れている。In order to solve this problem, a liquid phase epitaxial growth apparatus which can use a source plate in the rotary tilting method was devised and is disclosed in Japanese Patent Laid-Open No. 59-79534.
【0013】この成長装置では,図8(e)を参照し
て,水平回転軸を有する円筒封管32の中に,断面L字
型の基板ホルダ30が,封管32の内壁にL字の上端が
密着するように設けられる。また,L字の垂直部分の両
側に基板38及びソース板40が保持される。初め,基
板38及びソース板40を水平に保持する回転位置に封
管32を固定し,原料を溶融して溶液35を形成する。
次いで,所定温度に達した後,封管32を反時計廻りに
180°回転し,ソース板40上に溶液35を移動させ
そのまま飽和溶液になるまで保持する。次いで,封管3
2を時計廻りに360°回転させ,円筒封管32下部の
溶液35に基板38を接触させてエピタキシャル成長を
行う。In this growth apparatus, referring to FIG. 8 (e), a substrate holder 30 having an L-shaped cross section is provided in a cylindrical sealed tube 32 having a horizontal rotation axis, and an L-shaped substrate holder 30 is formed on the inner wall of the sealed tube 32. It is provided so that the upper end is in close contact. Further, the substrate 38 and the source plate 40 are held on both sides of the L-shaped vertical portion. First, the sealed tube 32 is fixed at a rotational position where the substrate 38 and the source plate 40 are held horizontally, and the raw material is melted to form the solution 35.
Next, after reaching a predetermined temperature, the sealed tube 32 is rotated counterclockwise by 180 °, and the solution 35 is moved onto the source plate 40 and held until it becomes a saturated solution. Then, the sealed tube 3
2 is rotated clockwise by 360 ° to bring the substrate 38 into contact with the solution 35 below the cylindrical sealed tube 32 to perform epitaxial growth.
【0014】この成長装置によれば,溶液をソース板に
接触させて飽和させることができるので,組成変動を小
さくすることができる。しかし,基板を浸漬できるだけ
の多量の溶液を必要とする。また,原材料及びソース板
は極めて酸化し易いため,それらの表面に生じた酸化物
が溶液表面に浮き,結晶成長の障害になるという問題が
ある。さらに,基板をソース材及び溶液原料と同室内に
保持して昇降温するため,基板表面を汚染するおそれが
ある。とくに,基板よりも溶融温度が低い材料をソース
材として使用できない。さらにまた,異なる組成の半導
体を積層して成長することはできない。According to this growth apparatus, since the solution can be brought into contact with the source plate to be saturated, the composition fluctuation can be reduced. However, it requires a large amount of solution to immerse the substrate. Further, since the raw material and the source plate are extremely easily oxidized, the oxide generated on their surface floats on the surface of the solution, which causes a problem of crystal growth. Furthermore, since the substrate is held in the same chamber as the source material and the solution raw material to raise and lower the temperature, the substrate surface may be contaminated. In particular, a material whose melting temperature is lower than that of the substrate cannot be used as the source material. Furthermore, semiconductors having different compositions cannot be stacked and grown.
【0015】この問題のうち,溶液表面に浮遊する酸化
物を除去できる回転式傾斜法を用いた閉管式液相エピタ
キシャル成長装置が,特開昭62−163334に開示
されている。Among these problems, Japanese Patent Laid-Open No. 62-163334 discloses a closed tube type liquid phase epitaxial growth apparatus using a rotary tilting method capable of removing oxides floating on the surface of a solution.
【0016】図8(f)はその成長装置の縦断面図であ
る。封管32の中心を通る回転軸31は水平に設置され
る。封管32の両端に設けられた側板39により仕切ら
れた封管32内は,その中央に設けられた隔壁33によ
り2分割される。分割された一方の室には封管32の回
転軸31より上方に水平に基板38が設けられる。ま
た,他方の室には原材料36が封入される。この両室
は,隔壁33の下端に設けられた細い連通管34により
連結される。FIG. 8F is a vertical sectional view of the growth apparatus. The rotating shaft 31 passing through the center of the sealed tube 32 is installed horizontally. The inside of the sealed tube 32, which is partitioned by the side plates 39 provided at both ends of the sealed tube 32, is divided into two by a partition wall 33 provided at the center thereof. In one of the divided chambers, a substrate 38 is horizontally provided above the rotary shaft 31 of the sealed tube 32. The raw material 36 is enclosed in the other chamber. The two chambers are connected by a thin communication pipe 34 provided at the lower end of the partition wall 33.
【0017】この封管32を,管状炉に挿入して昇温し
原材料36を溶融する。溶液35は隔壁33下端の連通
管34を通り,基板38を保持する室に流入する。次い
で,成長温度まで降温したのち,封管32を回転軸31
廻りに回転して,基板38を溶液に浸漬することにより
エピタキシャル成長がなされる。The sealed tube 32 is inserted into a tubular furnace and the temperature is raised to melt the raw material 36. The solution 35 passes through the communication pipe 34 at the lower end of the partition wall 33 and flows into the chamber holding the substrate 38. Next, after the temperature is lowered to the growth temperature, the sealed tube 32 is attached to the rotary shaft 31.
Epitaxial growth is performed by rotating around and immersing the substrate 38 in the solution.
【0018】この装置では,原材料36の酸化物37は
溶液の表面に浮上し,細い連通管34を通過できない。
従って,基板38を保持する室に酸化物は入り込まない
ので欠陥の少ない半導体を堆積できる。In this apparatus, the oxide 37 of the raw material 36 floats on the surface of the solution and cannot pass through the narrow communicating pipe 34.
Therefore, since the oxide does not enter the chamber holding the substrate 38, a semiconductor with few defects can be deposited.
【0019】しかし,この装置には,ソース材を保持し
飽和溶液とするための装置が設けられていない。これを
先に述べたソース材を保持する回転式の装置と組み合わ
せても,同一室内に基板,ソース材及び溶液を保持した
まま温度の昇降をなさねばならず,基板の汚染を回避で
きず,また汚染原とならずかつ固形物にのみソース材料
が制限されるという問題は避けられない。さらに,エピ
タキシャル成長できる組成はソース材と溶液組成及び接
触時の温度により定まるから,組成の異なる半導体を,
特にドーパントの異なる半導体を積層して成長すること
ができない。However, this device is not provided with a device for holding the source material and forming a saturated solution. Even if this is combined with the above-mentioned rotary device that holds the source material, the temperature must be raised and lowered while holding the substrate, the source material, and the solution in the same chamber, and the contamination of the substrate cannot be avoided. In addition, the problem that the source material is not a pollutant and the source material is limited to solid matter is unavoidable. Furthermore, the composition that can be epitaxially grown is determined by the source material, the solution composition, and the temperature at the time of contact.
In particular, semiconductors having different dopants cannot be stacked and grown.
【0020】[0020]
【発明が解決しようとする課題】上述したように,従来
の封管式液相エピタキシャル結晶成長装置では,一室内
に基板とソース板を保持するため,ソース材料が制限さ
れ又基板の汚染を生ずるという問題がある。また,溶液
組成を変えることができないため,組成の異なるエピタ
キシャル成長層を積層して成長することができないとい
う欠点がある。As described above, in the conventional sealed tube type liquid phase epitaxial crystal growth apparatus, since the substrate and the source plate are held in one chamber, the source material is limited and the substrate is contaminated. There is a problem. Further, since the solution composition cannot be changed, there is a drawback that epitaxial growth layers having different compositions cannot be stacked and grown.
【0021】本発明は,回転式傾斜法を用いた封管式液
相エピタキシャル成長装置において,基板を保持する室
と,ソース板とを保持する室とを分離して設け,その間
を一方にのみ溶液の移動が可能な溶液導入路により連結
することにより,原材料を溶融して溶液とする昇温過程
及びソース板に接触して過飽和とする過程と,エピタキ
シャル成長過程とを,各別に分離された室で行うことを
可能とし,ソース材の制限が少なく,かつ汚染が少ない
閉管式液相エピタキシャル成長装置を提供することを目
的とする。According to the present invention, in a sealed tube type liquid phase epitaxial growth apparatus using a rotary inclination method, a chamber for holding a substrate and a chamber for holding a source plate are separately provided, and only one of them is used as a solution. , Which are connected to each other by a solution introduction path capable of moving, melts the raw material into a solution, raises the temperature, contacts the source plate and causes supersaturation, and the epitaxial growth process in separate chambers. It is an object of the present invention to provide a closed-tube liquid phase epitaxial growth apparatus that can be performed, has less source material restrictions, and has less contamination.
【0022】また,組成の異なるエピタキシャル成長層
を連続して堆積することができる閉管式液相エピタキシ
ャル成長装置を提供することを目的とする。It is another object of the present invention to provide a closed-tube type liquid phase epitaxial growth apparatus capable of continuously depositing epitaxial growth layers having different compositions.
【0023】[0023]
【課題を解決するための手段】図1は本発明の原理説明
断面図,図5は本発明の第二実施例断面図,図6は本発
明の第三実施例断面図であり,図1(a),図5
(a),図6(a)は液相エピタキシャル成長装置の回
転軸に平行な縦断面を,図1,図5及び図6の(b)〜
(e)はその回転軸に垂直な断面を表している。1 is a sectional view showing the principle of the present invention, FIG. 5 is a sectional view showing a second embodiment of the present invention, and FIG. 6 is a sectional view showing a third embodiment of the present invention. (A), FIG.
(A) and FIG. 6 (a) are vertical cross sections parallel to the rotation axis of the liquid phase epitaxial growth apparatus, and FIGS.
(E) represents a cross section perpendicular to the rotation axis.
【0024】上記課題を解決するための本発明の第一の
構成は,図1を参照して,水平な回転軸1を有する封管
2と,該封管2内を該回転軸1方向に分割する隔壁3に
より隔てられた第一の室4及び第二の室5と,該第一の
室4に入口7aを有し,該第一の室4と該第二の室5と
を連結する溶液導入路7とを備え,該入口7aは,該第
二の室5内の溶液面の最高位置より高い位置に設けられ
ることを特徴として構成し,及び,第二の構成は,図1
を参照して,第一の構成の閉管式エピタキシャル成長装
置において,該第二の室5の床面5aは,該第一の室5
の床面4aより該封管2の外周側に設けられていること
を特徴として構成し,及び,第三の構成は,図5を参照
して,水平な回転軸1を有する封管2と,該封管2内を
該回転軸1方向に分割する隔壁3により隔てられた第一
及び第二の室4,5と,該隔壁3を貫通して第一及び第
二の室4,5を接続する第一及び第二の溶液導入路7,
9とを有し,該第一の室4の床面4a,4bは,該封管
2の第一の回転位置R4で該第二の室5に流入した溶液
面より高い位置に設けられ,かつ該封管の第二の回転位
置R3で該第二の室の床面5bより低い位置に設けら
れ,該第一の溶液導入路7は,該第一の回転位置R4に
おける該第一の室4の床面4a近傍より低い位置に設け
られ,該第二の溶液導入路9は,該第二の回転位置R3
における該第二の室5の床面5b近傍より低い位置に設
けられたことを特徴として構成し,及び第四の構成は,
図1,図5を参照して,水平な回転軸1廻りに回転自在
に設けられた封管2と,該回転軸1方向に隣接して該封
管2内に設けられた溶液保持室4及び成長室5と,該成
長室5内壁面に設けられ,該回転軸1と平行に基板11
表面を保持する基板ホルダ11aと,該溶液保持室4内
壁面に設けられ,該基板11表面と平行にソース板12
表面を保持するソースホルダ12aと,該溶液保持室4
と該成長室5とを連結し,該溶液保持室4から該成長室
5へ向かい該回転軸1から離れる向きに設けられた管状
の溶液導入路7とを有し,該封管1を回転させて該溶液
保持室内4に保持された溶液8−1を該ソース板12に
接触させた後,再度該封管1を回転させて該溶液8−1
を該溶液導入路7を通して該成長室5へ流出させる封管
回転手段とを有することを特徴として構成し,及び,第
五の構成は,図6を参照して,水平な回転軸1を有する
封管2内に,溶液及びソース板12を室内に保持する溶
液保持室4,エピタキシャル基板11を室内に保持する
成長室5及びドーパント材13を室内に保持するドーパ
ント保持室6が,該封管2の内部を該回転軸1方向に3
分割する第一及び第二の隔壁3a,3bにより隔てられ
てこの順序で設けられ,該溶液保持室4と該成長室5と
を連結し,該封管2の第一の回転位置R4で該溶液保持
室4内に保持された溶液を該成長室5へ流出させる該第
一の隔壁3aに設けられた第一の溶液導入路7−1と,
該封管2の第二の回転位置R3で,該成長室5内の溶液
を該ドーパント保持室6へ移送するために該第二の隔壁
3bに設けられた第二の溶液導入路7−2と,該封管2
の第三の回転位置R4で,該ドーパント保持室6内の溶
液を該成長室5内へ移送するために該第二の隔壁3bに
設けられた第三の溶液導入路9とを有することを特徴と
して構成する。The first constitution of the present invention for solving the above-mentioned problems is, with reference to FIG. 1, a sealed tube 2 having a horizontal rotary shaft 1, and a inside of the sealed tube 2 in the direction of the rotary shaft 1. A first chamber 4 and a second chamber 5 separated by a dividing wall 3 and an inlet 7a in the first chamber 4, and the first chamber 4 and the second chamber 5 are connected to each other. 1 is provided with a solution introducing passage 7 for supplying the solution, and the inlet 7a is provided at a position higher than the highest position of the solution surface in the second chamber 5, and the second configuration is as shown in FIG.
In the closed tube type epitaxial growth apparatus having the first configuration, the floor surface 5a of the second chamber 5 is
The third configuration is characterized in that it is provided on the outer peripheral side of the sealed tube 2 with respect to the floor surface 4a, and the sealed tube 2 having a horizontal rotating shaft 1 is referred to with reference to FIG. , First and second chambers 4, 5 separated by a partition wall 3 that divides the sealed tube 2 in the direction of the rotation axis 1, and first and second chambers 4, 5 penetrating the partition wall 3. First and second solution introduction paths 7 for connecting
And the floor surfaces 4a, 4b of the first chamber 4 are provided at a position higher than the solution surface flowing into the second chamber 5 at the first rotation position R4 of the sealed tube 2, Further, it is provided at a position lower than the floor surface 5b of the second chamber at the second rotation position R3 of the sealed tube, and the first solution introducing passage 7 is provided at the first rotation position R4 at the first rotation position R4. The second solution introducing passage 9 is provided at a position lower than the vicinity of the floor surface 4a of the chamber 4, and the second solution introducing passage 9 has the second rotating position R3.
In the second chamber 5 is provided at a position lower than the vicinity of the floor surface 5b of the second chamber 5, and the fourth configuration is
With reference to FIGS. 1 and 5, a sealed tube 2 rotatably provided around a horizontal rotary shaft 1 and a solution holding chamber 4 provided in the sealed tube 2 adjacent to the rotary shaft 1 direction. And the growth chamber 5 and the substrate 11 provided on the inner wall surface of the growth chamber 5 in parallel with the rotation axis 1.
A substrate holder 11a for holding the surface and a source plate 12 provided on the inner wall surface of the solution holding chamber 4 in parallel with the surface of the substrate 11
Source holder 12a for holding the surface and the solution holding chamber 4
And a growth chamber 5 are connected to each other, and a tubular solution introduction path 7 is provided from the solution holding chamber 4 toward the growth chamber 5 and away from the rotation shaft 1, and the sealed tube 1 is rotated. Then, the solution 8-1 held in the solution holding chamber 4 is brought into contact with the source plate 12, and then the sealed tube 1 is rotated again to make the solution 8-1.
And a sealed tube rotating means for causing the solution to flow out into the growth chamber 5 through the solution introducing passage 7, and the fifth structure has a horizontal rotating shaft 1 with reference to FIG. The sealed tube 2 includes a solution holding chamber 4 for holding a solution and a source plate 12 inside the chamber, a growth chamber 5 for holding an epitaxial substrate 11 inside the chamber, and a dopant holding chamber 6 for holding a dopant material 13 inside the chamber. 3 inside the 2 in the direction of the axis of rotation
They are provided in this order separated by the first and second partition walls 3a and 3b to be divided, and connect the solution holding chamber 4 and the growth chamber 5 at the first rotation position R4 of the sealed tube 2. A first solution introducing passage 7-1 provided in the first partition wall 3a for allowing the solution held in the solution holding chamber 4 to flow into the growth chamber 5;
At the second rotation position R3 of the sealed tube 2, the second solution introducing passage 7-2 provided in the second partition 3b for transferring the solution in the growth chamber 5 to the dopant holding chamber 6 And the sealed tube 2
At a third rotation position R4, the third solution introducing passage 9 provided in the second partition 3b for transferring the solution in the dopant holding chamber 6 into the growth chamber 5 is provided. Configure as a feature.
【0025】[0025]
【作用】本発明の第一の構成では,図1を参照して,封
管の回転軸1と交叉する隔壁3により2室4,5に仕切
られた封管2が,回転軸1廻りに回転自在(一方向であ
っても,又必要により正逆回転であってもよい。)に水
平に保持される。この2室は,溶液導入路7により連結
される。なお,隔壁3は回転軸1と交叉すれば,平面又
は曲面であってもよく,また回転軸1と直交する必要も
ない。In the first construction of the present invention, referring to FIG. 1, the sealed tube 2 partitioned into the two chambers 4 and 5 by the partition wall 3 intersecting with the rotary shaft 1 of the sealed tube is arranged around the rotary shaft 1. It is horizontally held rotatably (may be in one direction, or may be forward / reverse rotation if necessary). The two chambers are connected by a solution introduction path 7. The partition wall 3 may be a flat surface or a curved surface as long as it intersects with the rotating shaft 1, and it need not be orthogonal to the rotating shaft 1.
【0026】図中,R1〜R4は封管2の回転位置を表
し,図1(a)〜(c)において,4つの回転位置に対
応して鉛直下方となる向きを表している。なお,図1
(a)〜(c)は,R4の回転位置に於ける鉛直断面を
表している。In the figure, R1 to R4 represent the rotational positions of the sealed tube 2, and in FIGS. 1A to 1C, they represent the vertically downward directions corresponding to the four rotational positions. Note that FIG.
(A)-(c) represents the vertical cross section in the rotation position of R4.
【0027】封管2の回転位置R4において,第一の室
4に保持されていた溶液8−4は,溶液導入路7を通り
第二の室5に流入する。この第一の室4に開口する溶液
導入路7の入口7aは,回転位置R4において第二の室
5に流入した溶液8の最高液面より高い位置に設けられ
る。従って,一旦第二の室5に流入した溶液8は,その
後の封管2の回転位置が変わっても,同一の溶液導入路
7を通って再度第一の室4へ逆戻りすることはない。即
ち,本発明に係る溶液導入路は,溶液を一方向にのみ移
送する。At the rotational position R4 of the sealed tube 2, the solution 8-4 held in the first chamber 4 flows into the second chamber 5 through the solution introducing passage 7. The inlet 7a of the solution introducing passage 7 opening to the first chamber 4 is provided at a position higher than the highest liquid level of the solution 8 flowing into the second chamber 5 at the rotation position R4. Therefore, the solution 8 once flowing into the second chamber 5 does not return to the first chamber 4 again through the same solution introducing passage 7 even if the rotation position of the sealed tube 2 changes. That is, the solution introducing passage according to the present invention transfers the solution in only one direction.
【0028】なお,かかる第二の室5の溶液8面の位置
は,第二の室5の床面5aの位置,第二の室の形状,例
えば横断面形状,縦断面形状,寸法を適切に設計するこ
とにより,所要の位置にすることができる。The position of the surface of the solution 8 in the second chamber 5 is appropriately set to the position of the floor surface 5a of the second chamber 5 and the shape of the second chamber, for example, the cross sectional shape, the vertical sectional shape, and the size. By designing it, the required position can be achieved.
【0029】次に,本構成の液相エピタキシャル装置の
使用法を説明する。初めに回転位置を例えばR1とし,
原材料を第一の室4に保持し加熱溶融して溶液8−1と
する。次に,封管2を回転して回転位置をR4とする。
この回転により,溶液8─1は,封管2内を例えば90
°移動して溶液8−4の位置に移動する。従って,この
溶液8−4は,溶液導入路7の入口7aから溶液導入路
7に流入し第二の室4に移送される。Next, a method of using the liquid phase epitaxial device of this structure will be described. First, set the rotation position to R1,
The raw materials are held in the first chamber 4 and heated and melted to form a solution 8-1. Next, the sealed tube 2 is rotated and the rotational position is set to R4.
By this rotation, the solution 8-1 moves inside the sealed tube 2 by, for example, 90 degrees.
Move to the position of solution 8-4. Therefore, the solution 8-4 flows into the solution introducing passage 7 from the inlet 7a of the solution introducing passage 7 and is transferred to the second chamber 4.
【0030】第二の室4には,この回転位置R4では溶
液8に触れない位置に基板11が保持されている。次い
で,第二の室5に移送された溶液8の温度が成長温度に
到達した後,封管2を回転して溶液8を基板11に接触
させ,エピタキシャル成長を行う。The substrate 11 is held in the second chamber 4 at a position where it does not come into contact with the solution 8 at the rotation position R4. Then, after the temperature of the solution 8 transferred to the second chamber 5 reaches the growth temperature, the sealed tube 2 is rotated to bring the solution 8 into contact with the substrate 11 to perform epitaxial growth.
【0031】本構成の液相エピタキシャル装置では,原
材料の溶解から,溶解した溶液の保持,さらに必要なら
ばソース板の保持と溶液を過飽和にするまでの過程と,
基板上へのエピタキシャル成長の過程とを異なる室で行
うことができる。このため,溶液の形成又は飽和溶液を
形成する間に生ずる基板の汚染を,極めて小さくするこ
とができる。さらに,本構成は,原材料が室温で液体で
あっても適用することができる。In the liquid phase epitaxial device of this constitution, the steps from the dissolution of the raw materials to the holding of the dissolved solution, and further to the holding of the source plate and the supersaturation of the solution, if necessary,
The process of epitaxial growth on the substrate can be performed in a different chamber. Therefore, the contamination of the substrate that occurs during the formation of the solution or the formation of the saturated solution can be made extremely small. Furthermore, this configuration can be applied even if the raw material is a liquid at room temperature.
【0032】本発明の第二の構成では,この回転位置R
4において,第一の室4の床面4aが,第二の室5に流
入した溶液8の最高液面よりも高い位置に作られる。な
お,本明細書において,室の「床面」とは,封管2の特
定された回転位置において封管内に設けられた室の底と
なる面,即ち,室の鉛直下方の内壁面を意味する。ま
た,第一及び第二の室4,5を接続する溶液導入路7
が,これらの室4,5のうち高い位置にある第一の室の
床面4aより下に設けられる。従って,この溶液導入路
7は,溶液を第一の室から第二の室に移送することがで
きる。In the second configuration of the present invention, this rotational position R
4, the floor surface 4a of the first chamber 4 is formed at a position higher than the highest liquid level of the solution 8 flowing into the second chamber 5. In the present specification, the “floor surface” of the chamber means the surface that is the bottom of the chamber provided inside the sealed tube at the specified rotation position of the sealed tube 2, that is, the inner wall surface below the chamber in the vertical direction. To do. In addition, a solution introducing path 7 connecting the first and second chambers 4 and 5
Is provided below the floor surface 4a of the first chamber in the higher position of these chambers 4, 5. Therefore, the solution introducing path 7 can transfer the solution from the first chamber to the second chamber.
【0033】さらに,本構成では,第二の室に流入した
溶液の液面は第一の室の床面よりも低く構成されるか
ら,第一の室内の溶液の全部を第二の室に移動すること
ができる。その一方,溶液が逆に第二の室から第一の室
に戻ることを完全に阻止することができる。Further, in this structure, since the liquid level of the solution flowing into the second chamber is lower than the floor surface of the first chamber, all the solution in the first chamber is transferred to the second chamber. You can move. On the other hand, it is possible to completely prevent the solution from returning from the second chamber to the first chamber.
【0034】本発明の第三の構成では,図5を参照し
て,2室4,5間に2つの溶液導入路が設けられる。第
一の溶液導入路7は,封管の第一の回転位置R4におい
て溶液を第一の室4から第二の室5に移送するもので,
上述した本発明の第二の構成と同様である。従って,封
管2をこの回転位置R4におくと,全ての溶液が第二の
室5に移送される。In the third configuration of the present invention, referring to FIG. 5, two solution introducing passages are provided between the two chambers 4 and 5. The first solution introducing passage 7 transfers the solution from the first chamber 4 to the second chamber 5 at the first rotation position R4 of the sealed tube,
It is similar to the second configuration of the present invention described above. Therefore, when the sealed tube 2 is placed at this rotation position R4, all the solution is transferred to the second chamber 5.
【0035】第二の溶液導入路9は,封管の第二の回転
位置R3において溶液を第二の室5から第一の室4に移
送するもので,上述した本発明の第一の構成と同様であ
る。従って,この構成では,溶液の一部を第二の室5に
残すこともできる。なお,この第二の溶液導入路9を第
二の構成と同様にして溶液の全部を第一の室に移送させ
ることもできる。The second solution introducing passage 9 transfers the solution from the second chamber 5 to the first chamber 4 at the second rotational position R3 of the sealed tube, and has the above-mentioned first construction of the present invention. Is the same as. Therefore, in this configuration, a part of the solution can be left in the second chamber 5. It should be noted that the second solution introducing passage 9 may be transferred to the first chamber in the same manner as the second configuration, so that the entire solution is transferred.
【0036】本構成では,封管2を,2つの回転位置R
4,R3に持ち来すように交互に回転することにより,
溶液を2つの室4,5の間で交互に移送することができ
る。従って,一旦成長に用いた溶液を,別室に導入して
ソース材又はドープ材に接触させた後,再度成長に用い
ることができる。このため,組成の異なるエピタキシャ
ル成長を続けて行うことができる。また,ソース材を一
つの室内の2ヶ所に設け,回転位置により何れか一方を
選択して溶液と接触させることもができる。従って,組
成が異なる2種又は3種のエピタキシャル成長層を積層
することができる。In this structure, the sealed tube 2 is moved to the two rotational positions R
4, by rotating alternately to bring to R3,
The solution can be transferred alternately between the two chambers 4, 5. Therefore, the solution used for growth can be introduced into another chamber, brought into contact with the source material or the doping material, and then used again for growth. Therefore, epitaxial growth with different compositions can be continued. It is also possible to provide the source material at two locations in one chamber and select either one depending on the rotation position to bring it into contact with the solution. Therefore, it is possible to stack two or three types of epitaxial growth layers having different compositions.
【0037】本発明の第四の構成では,図1を参照し
て,水平な回転軸1方向に並べて,溶液保持室4及び成
長室5とが封管2内に隣接して設けられる。溶液保持室
4及び成長室5内には,エピタキシャル基板11及びソ
ース板12が回転軸1に平行に保持される。この基板1
1及びソース板12は,封管2を基板11及びソース板
12が下にくる回転位置R2にまで回転することで,溶
液と接触させることができる。 溶液保持室4と成長室
5とは,溶液保持室4から成長室5へ向けて回転軸1か
ら離れる方向に設けられた管状の溶液導入路7により接
続される。この溶液導入路7は,封管2の回転位置R4
において,下方に向かい傾斜するため,溶液保持室4内
の溶液8−4を成長室5内に確実に移送する。なお,こ
の傾斜する溶液導入路7は,第一又は第二の構成にも適
用できる。In the fourth structure of the present invention, referring to FIG. 1, the solution holding chamber 4 and the growth chamber 5 are provided adjacent to each other in the sealed tube 2 side by side in the direction of the horizontal rotation axis 1. An epitaxial substrate 11 and a source plate 12 are held in the solution holding chamber 4 and the growth chamber 5 in parallel with the rotation axis 1. This board 1
1 and the source plate 12 can be brought into contact with the solution by rotating the sealed tube 2 to a rotation position R2 where the substrate 11 and the source plate 12 are located below. The solution holding chamber 4 and the growth chamber 5 are connected by a tubular solution introducing passage 7 provided in a direction away from the rotary shaft 1 from the solution holding chamber 4 to the growth chamber 5. The solution introducing path 7 is provided at a rotation position R4 of the sealed tube 2.
In the above, since it inclines downward, the solution 8-4 in the solution holding chamber 4 is reliably transferred into the growth chamber 5. The inclined solution introducing passage 7 can also be applied to the first or second configuration.
【0038】本構成の装置では,溶液保持室内4の溶液
8−1を封管2を回転してソース板12に接触させた
後,再度封管2を回転させて溶液8−1を溶液導入路7
を通して成長室5へ流出させ,成長温度に到達後封管2
を回転させて溶液8と基板11とを接触させ,エピタキ
シャル成長をおこなう。この装置では,原材料の溶融,
溶液温度の昇降,溶液の移送を全てソース板又は基板に
溶液を接触することなく行うことができる。また,ソー
ス板及び原材料と,基板とは別の室に分離して置かれ
る。このため,基板の汚染を考慮せずにこれらの処理温
度を自由に定めることができるから,広範な組成の制御
が可能となる。In the apparatus of this structure, the solution 8-1 in the solution holding chamber 4 is rotated by bringing the sealed tube 2 into contact with the source plate 12, and then the sealed tube 2 is rotated again to introduce the solution 8-1 into the solution. Road 7
Flow into the growth chamber 5 through the sealed tube 2 after reaching the growth temperature.
Is rotated to bring the solution 8 into contact with the substrate 11 to perform epitaxial growth. In this equipment, the melting of raw materials,
It is possible to raise and lower the solution temperature and transfer the solution without contacting the solution with the source plate or the substrate. In addition, the source plate, the raw material, and the substrate are separately placed in a separate chamber. Therefore, these processing temperatures can be freely set without considering the contamination of the substrate, and a wide range of compositions can be controlled.
【0039】本発明の第五の構成は,図6を参照して,
第四の構成で述べた溶液保持室4及び成長室5を有する
液相エピタキシャル成長装置に,ドーパント保持室6を
付加したものである。The fifth structure of the present invention will be described with reference to FIG.
A dopant holding chamber 6 is added to the liquid phase epitaxial growth apparatus having the solution holding chamber 4 and the growth chamber 5 described in the fourth configuration.
【0040】成長室5内で保持され,封管2の回転によ
りソース板に接触して飽和した溶液は,封管2の第一の
回転位置R4で第一の溶液導入路7−1を通して溶液保
持室4から結晶成長室5に移送される。なお,本構成の
溶液導入路は,すべて一方向に溶液を流し,逆流をゆる
さない。かかる溶液導入路は,上述の第一〜第四の構成
に係る溶液導入路と同様にして構成できる。The solution held in the growth chamber 5 and contacted with the source plate by the rotation of the sealed tube 2 to be saturated, passes through the first solution introducing passage 7-1 at the first rotation position R4 of the sealed tube 2 to form a solution. It is transferred from the holding chamber 4 to the crystal growth chamber 5. In addition, the solution introduction path of this configuration allows the solution to flow in one direction and does not allow backflow. The solution introducing path can be configured in the same manner as the solution introducing paths according to the first to fourth configurations described above.
【0041】移送された溶液は,成長室内で保持され成
長温度に達した後基板に接触されエピタキシャル成長が
なされる。その後,結晶室5内の溶液は,封管2を第二
の回転位置R3まで回転することで,ドーパント保持室
6に移送される。The transferred solution is held in the growth chamber, reaches the growth temperature, and then contacts the substrate for epitaxial growth. After that, the solution in the crystal chamber 5 is transferred to the dopant holding chamber 6 by rotating the sealed tube 2 to the second rotation position R3.
【0042】ドーパント保持室6内にはドーパント材1
3が保持されており,移送された溶液が所定温度に達し
た後,封管2を回転して溶液をドーパント材13に接触
して飽和溶液とする。次いで,封管2を第三の回転位置
R4まで回転し,第三の溶液導入路7−2を通してドー
パント保持室6内の溶液を再度成長室5に移送する。こ
の時第三の回転位置と第二の回転位置とが同一であって
も,本発明の溶液導入路を用いると,成長室5から溶液
保持室に逆流することはない。なお,第三の回転位置と
第二の回転位置とは異なっていてもよい。また,液体の
ドーパント材にも本構成の発明を適用することができ
る。The dopant material 1 is placed in the dopant holding chamber 6.
3 is held, and after the transferred solution reaches a predetermined temperature, the sealed tube 2 is rotated to bring the solution into contact with the dopant material 13 to make a saturated solution. Next, the sealed tube 2 is rotated to the third rotation position R4, and the solution in the dopant holding chamber 6 is transferred to the growth chamber 5 again through the third solution introducing passage 7-2. At this time, even if the third rotation position and the second rotation position are the same, backflow from the growth chamber 5 to the solution holding chamber will not occur if the solution introduction path of the present invention is used. The third rotation position and the second rotation position may be different. The invention of this configuration can also be applied to a liquid dopant material.
【0043】本構成では,ソース材に接触させて飽和さ
せた溶液によるエピタキシャル成長と,その溶液をドー
パント材に接触させた溶液によるエピタキシャル成長と
を続けて行うことができる。In this structure, the epitaxial growth using the solution saturated by contacting the source material and the epitaxial growth using the solution contacting the solution with the dopant material can be continuously performed.
【0044】本構成において,封管2の第四の回転位置
において,成長室5から溶液保持室4へ溶液を移送する
溶液導入路を増設することができる。このとき,第一〜
第四の回転一は全て異なるものにする。この構成では,
成長室5と溶液保持室4間の溶液の移送と,成長室5と
ドーパント材保持室6間の溶液の移送とを独立して行う
ことができる。In this configuration, a solution introducing passage for transferring the solution from the growth chamber 5 to the solution holding chamber 4 can be added at the fourth rotation position of the sealed tube 2. At this time,
The fourth revolution 1 is all different. With this configuration,
The transfer of the solution between the growth chamber 5 and the solution holding chamber 4 and the transfer of the solution between the growth chamber 5 and the dopant material holding chamber 6 can be performed independently.
【0045】従って,ソース板に接触させて飽和した第
一の溶液によるエピタキシャル成長と,ドーパント材に
接触させて飽和させた第二の溶液によるエピタキシャル
成長とを交互に重畳して行うことができる。これによ
り,2種の層が交互に積層した堆積層を製造することが
できる。Therefore, the epitaxial growth by the first solution saturated by contacting the source plate and the epitaxial growth by the second solution saturated by contacting the dopant material can be alternately superposed. This makes it possible to manufacture a deposited layer in which two types of layers are alternately laminated.
【0046】[0046]
【実施例】本発明の詳細を実施例を参照して説明する。
図2は,本発明の第一実施例斜視図であり,封管の部分
破断図を表している。なお,図2は図1の回転位置R4
の状態を表し,垂直軸をY軸に,水平軸をX,Z軸とし
ている。EXAMPLES Details of the present invention will be described with reference to examples.
FIG. 2 is a perspective view of the first embodiment of the present invention and shows a partially cutaway view of the sealed tube. 2 is the rotational position R4 of FIG.
The vertical axis is the Y axis and the horizontal axes are the X and Z axes.
【0047】図2を参照して,水平軸Z軸を回転軸1
(円筒軸でもある。)とする石英円筒からなる封管2
が,その両端で,石英又はカーボン製の側板14により
溶液を封入するように仕切られる。Referring to FIG. 2, the horizontal axis Z axis is set to the rotary axis 1
(It is also a cylinder axis.) A sealed tube 2 made of a quartz cylinder.
However, both ends thereof are partitioned by quartz or carbon side plates 14 so as to enclose the solution.
【0048】側板14で仕切られた封管2内部は,さら
に石英又カーボン製の隔壁3により溶液保持室4と成長
室5とに2分される。溶液保持室4及び成長室5は,そ
れぞれ石英又はカーボン板からなるソースホルダ12a
及び基板ホルダ11aにより上下に仕切られる。ソース
ホルダ12aの下面には板状のHgCdTeからなるソ
ース板12が,基板ホルダ11aの下面にはエピタキシ
ャル基板としてCdTe基板11が保持される。The inside of the sealed tube 2 partitioned by the side plate 14 is further divided into a solution holding chamber 4 and a growth chamber 5 by a partition wall 3 made of quartz or carbon. The solution holding chamber 4 and the growth chamber 5 are each provided with a source holder 12a made of quartz or a carbon plate.
And it is vertically divided by the substrate holder 11a. The source plate 12 made of plate-shaped HgCdTe is held on the lower surface of the source holder 12a, and the CdTe substrate 11 is held on the lower surface of the substrate holder 11a as an epitaxial substrate.
【0049】図3は,本発明の第一実施例動作説明図で
あり,封管の各種回転位置に於ける溶液保持室4及び成
長室5のXY断面を表している。図3(a)は,図2と
同一の回転位置での溶液保持室4の断面を表し,図3
(A)は,図2と同一の回転位置での成長室5の断面を
表している。FIG. 3 is a diagram for explaining the operation of the first embodiment of the present invention, showing XY cross sections of the solution holding chamber 4 and the growth chamber 5 at various rotational positions of the sealed tube. 3A shows a cross section of the solution holding chamber 4 at the same rotation position as in FIG.
(A) shows a cross section of the growth chamber 5 at the same rotation position as in FIG. 2.
【0050】図2及び図3(a)を参照して, 溶液保
持室4には,弓型の上部を水平に切断した断面形状の石
英又はカーボン製の部材であって,上面がソースホルダ
12aの下面に密接し,側面が封管2のX軸方向の内壁
面に密接する,床材15が設けられる。この床材15
は,ソースホルダ12aにより仕切られた溶液保持室4
の下部分のX軸方向の床面を高くするために設けられ
る。Referring to FIGS. 2 and 3A, the solution holding chamber 4 is a member made of quartz or carbon having a cross-sectional shape obtained by horizontally cutting the upper portion of an arc shape, and the upper surface thereof is the source holder 12a. Is provided with a floor material 15 that is in close contact with the lower surface of the and the side surface is in close contact with the inner wall surface of the sealed tube 2 in the X-axis direction. This floor material 15
Is the solution holding chamber 4 partitioned by the source holder 12a.
It is provided to raise the floor surface of the lower part in the X-axis direction.
【0051】隔壁3には1つの溶液導入路7が設けられ
る。溶液導入路7は,入口7aが溶液保持室4の下部分
の床材15の面の近くに開口し,水平に延びて封管2壁
面に近い位置の成長室5内に開口する出口7bを有す
る。この溶液導入路7の入口7aは,図3(a)及び
(A)の回転位置で,溶液8面より高い位置に設けら
れ,他方,この回転位置から180反転した回転位置
(図3(c)及び(C)を参照。)において,溶液8面
より高い位置に設けられる。The partition 3 is provided with one solution introducing passage 7. The solution introducing passage 7 has an inlet 7a opening near the surface of the floor material 15 in the lower part of the solution holding chamber 4 and an outlet 7b extending horizontally and opening in the growth chamber 5 near the wall surface of the sealed tube 2. Have. The inlet 7a of the solution introducing passage 7 is provided at a position higher than the surface of the solution 8 at the rotational position shown in FIGS. ) And (C)), it is provided at a position higher than the surface of the solution 8.
【0052】本実施例では,先ず,封管2を図2,図3
(a)及び(A)に示す回転位置に固定し,秤量した溶
液原材料を溶液保持室4の床上に置き,封管2の両端を
真空封止する。次いで,昇温して原材料を溶融して溶液
8とする。溶液8は,図3(a)を参照して,溶液保持
室4の下部に溜まる。このとき,溶液8面は入口7aよ
り下にあるので,溶液8は基板11を保持する成長室5
に流入しない。原材料が溶融した後,降温し,所定の温
度に安定するまでこの状態を維持する。In this embodiment, first, the sealed tube 2 is attached to the structure shown in FIGS.
The solution raw material, which is fixed at the rotational position shown in (a) and (A) and weighed, is placed on the floor of the solution holding chamber 4, and both ends of the sealed tube 2 are vacuum-sealed. Then, the temperature is raised to melt the raw material to form a solution 8. The solution 8 accumulates in the lower part of the solution holding chamber 4 with reference to FIG. At this time, since the surface of the solution 8 is below the inlet 7a, the solution 8 is kept in the growth chamber 5 holding the substrate 11.
Does not flow into. After the raw materials are melted, the temperature is lowered, and this state is maintained until the temperature stabilizes at a predetermined temperature.
【0053】次いで,封管2を,紙面に向かい反時計方
向に180°回転する。図3(b),(B)はその途中
の90°回転位置を,図3(c)及び(C)は180°
回転した位置を表す。この回転の間,溶液8面は常に入
口7aより低い位置にあるから,溶液は成長室5に流入
しない。この回転により,図3(c)及び(C)を参照
して,溶液8はソース板12表面に接触され,このまま
飽和するまで維持される。Next, the sealed tube 2 is rotated 180 ° counterclockwise toward the paper surface. 3 (b) and 3 (B) show the 90 ° rotational position in the middle, and FIGS. 3 (c) and 3 (C) show 180 ° rotational positions.
Indicates the rotated position. During this rotation, the surface of the solution 8 is always lower than the inlet 7a, so that the solution does not flow into the growth chamber 5. By this rotation, referring to FIGS. 3C and 3C, the solution 8 is brought into contact with the surface of the source plate 12 and maintained as it is until it is saturated.
【0054】次いで,封管2を反時計廻りにさらに略9
0°回転して,図(d)及び(D)に示す回転位置にも
ちきたす。この回転位置では,床材15が,図(d)を
参照して溶液保持室4内の下方に位置するため,床材1
5の上面が溶液保持室4の床面となる。溶液導入路7の
入口7aは,この床面と同じ高さに開設されているの
で,この床面が略水平になった時点では,溶液保持室4
内の溶液8は酸化物等の固形物を除いて全て溶液導入路
7を通り成長室5に流入する。成長室15内に流入した
溶液は,その表面が溶液保持室内の床材15の上面より
低く,かつ成長室内の基板11に接触しないように,基
板11の保持位置,溶液量及び成長室の容積が設計され
る。Then, the sealed tube 2 is further rotated counterclockwise by approximately 9
It is rotated by 0 ° and brought to the rotational position shown in FIGS. In this rotating position, the floor material 15 is located below the solution holding chamber 4 with reference to FIG.
The upper surface of 5 serves as the floor surface of the solution holding chamber 4. Since the inlet 7a of the solution introducing passage 7 is opened at the same height as this floor surface, when the floor surface becomes substantially horizontal, the solution holding chamber 4
All of the solution 8 in the solution flows into the growth chamber 5 through the solution introducing passage 7 except for solid matters such as oxides. The solution flowing into the growth chamber 15 has its surface lower than the upper surface of the floor material 15 in the solution holding chamber and does not come into contact with the substrate 11 in the growth chamber, the holding position of the substrate 11, the amount of the solution and the volume of the growth chamber. Is designed.
【0055】さらに,封管2を反時計廻りに90°回転
して,図4(e)及び(E)を参照して,最初の回転位
置にする。この回転位置で,降温し,溶液温度が成長温
度になるまで維持する。Further, the sealed tube 2 is rotated counterclockwise by 90 ° to the initial rotation position with reference to FIGS. 4 (e) and 4 (E). At this rotation position, the temperature is lowered and maintained until the solution temperature reaches the growth temperature.
【0056】次いで,封管2を反時計廻りに180°回
転する。90°回転した位置を表している図(f)及び
(F)を経過して,180°回転した位置で図(g)及
び(G)を参照して,溶液8は基板11表面に接触しエ
ピタキシャル成長がなされる。Next, the sealed tube 2 is rotated counterclockwise by 180 °. After passing through the figures (f) and (F) showing the position rotated by 90 °, the solution 8 contacts the surface of the substrate 11 with reference to the figures (g) and (G) at the position rotated by 180 °. Epitaxial growth is performed.
【0057】エピタキシャル成長後,図(h)及び
(H)を参照して,さらに封管2を180°回転して,
溶液8と基板11とを分離する。この回転方向は反時計
又は時計廻りのいずれでもよい。最後に,封管全体を冷
却してエピタキシャル成長を終了する。After the epitaxial growth, referring to FIGS. (H) and (H), the sealed tube 2 was further rotated by 180 °,
The solution 8 and the substrate 11 are separated. The direction of rotation may be counterclockwise or clockwise. Finally, the entire sealed tube is cooled to complete the epitaxial growth.
【0058】本実施例では,原材料を溶融する際に昇温
のオーバシュートを生じても,溶液がソース板と接触し
ていないため過剰のソース組成を含むことがないから,
溶液組成が安定する。In this embodiment, even if the temperature rise overshoot occurs when the raw materials are melted, the solution does not come into contact with the source plate and therefore does not contain an excessive source composition.
The solution composition becomes stable.
【0059】上記工程において,図3(c)及び(C)
の位置から,時計方向に180°逆回転して図3(a)
及び(A)と同様の状態に溶液をもちきたし,この状態
で成長温度近くに溶液温度を降下することもできる。そ
の後,再び時計方向に90°回転して図(d)及び
(D)の回転位置とし,溶液8を成長室に移送する。こ
の方法では,溶液8と基板11とを同一室内において高
温に晒す事態を避けることができるので,基板の汚染が
少なくなる。In the above process, FIG. 3 (c) and (C)
180 ° clockwise from the position shown in Fig. 3 (a)
Also, the solution is brought to the same state as in (A), and in this state, the solution temperature can be lowered close to the growth temperature. Then, the solution 8 is transferred to the growth chamber by rotating it again by 90 ° in the clockwise direction to the rotation position shown in FIGS. With this method, it is possible to avoid the situation where the solution 8 and the substrate 11 are exposed to high temperature in the same chamber, so that the contamination of the substrate is reduced.
【0060】本発明の第二の実施例は,図5を参照し
て,成長室5内に基板11を下面に水平に保持する基板
ホルダ11aが,溶液保持室4内にソース板12を下面
に水平に保持するソースホルダ12aが,第一実施例と
同様に,それぞれ成長室5及び溶液保持室4を上下に2
分して設けられる。なお,図5は回転位置R4(R4方
向が垂直下方になる回転位置。)における封管2の断面
を表し,図5(a)は縦断面,図5(b)及び(c)は
それぞれ成長室5及び溶液保持室4の横断面を表してい
る。In the second embodiment of the present invention, referring to FIG. 5, the substrate holder 11a for horizontally holding the substrate 11 on the lower surface in the growth chamber 5 and the source plate 12 for the lower surface in the solution holding chamber 4 are shown in FIG. The source holder 12a that holds the growth chamber 5 and the solution holding chamber 4 vertically in the same manner as in the first embodiment.
It is provided in minutes. 5 shows a cross section of the sealed tube 2 at a rotation position R4 (a rotation position in which the R4 direction is vertically downward). FIG. 5 (a) is a vertical cross section, and FIGS. 5 (b) and 5 (c) are growth diagrams, respectively. A cross section of the chamber 5 and the solution holding chamber 4 is shown.
【0061】溶液保持室4には,ソースホルダ12aの
ソース板12保持面と平行な床面4aを形成するために
床材16が設けられる。成長室5には,基板ホルダ11
aの保持面に垂直な床面5bを形成するための床材17
が設けられる。The solution holding chamber 4 is provided with a floor material 16 for forming a floor surface 4a parallel to the holding surface of the source plate 12 of the source holder 12a. The growth chamber 5 has a substrate holder 11
Floor material 17 for forming a floor surface 5b perpendicular to the holding surface of a
Is provided.
【0062】溶液を溶液保持室4から成長室5へ移送す
るための溶液導入路7の入口7aは床材16の床面近く
に設けられる。他方,溶液を成長室5から溶液保持室4
へ移送するための溶液導入路9の入口9aは床材17の
床面近くに設けられる。The inlet 7a of the solution introducing passage 7 for transferring the solution from the solution holding chamber 4 to the growth chamber 5 is provided near the floor surface of the floor material 16. On the other hand, the solution is transferred from the growth chamber 5 to the solution holding chamber 4
The inlet 9a of the solution introducing passage 9 for transferring to the floor material 17 is provided near the floor surface of the floor material 17.
【0063】初めに,図5(b)及び(c)を参照し
て,封管2の回転位置をR1におく。即ちR1方向が垂
直下方になるように封管2を回転して固定する。次に溶
液の原材料を溶液保持室4内に入れ,昇温して加熱溶融
し,溶液とする。次いで,封管2を反時計方向に90°
回転して回転位置R2とし,溶液をソース板12に接触
させ飽和溶液とする。First, referring to FIGS. 5 (b) and 5 (c), the rotational position of the sealed tube 2 is set to R1. That is, the sealed tube 2 is rotated and fixed so that the R1 direction is vertically downward. Next, the raw material of the solution is put into the solution holding chamber 4, heated and melted by heating to obtain a solution. Then, the sealed tube 2 is rotated 90 ° counterclockwise.
The solution is rotated to the rotation position R2, and the solution is brought into contact with the source plate 12 to form a saturated solution.
【0064】次いで,封管を回転位置R4まで180°
回転する。この結果,溶液保持室4の床面4aは,床材
16の上面となる。他方,成長室5の床面5aは,封管
2の内壁面となる。従って,床材16の上面に溜まった
溶液は,より低い成長室5の床面5aに移送される。Then, the sealed tube is rotated 180 ° to the rotation position R4.
Rotate. As a result, the floor surface 4a of the solution holding chamber 4 becomes the upper surface of the floor material 16. On the other hand, the floor surface 5a of the growth chamber 5 becomes the inner wall surface of the sealed tube 2. Therefore, the solution accumulated on the upper surface of the floor material 16 is transferred to the lower floor surface 5 a of the growth chamber 5.
【0065】次いで,成長温度に到達するまで維持した
のち,封管2を反時計方向に180°回転して,即ち回
転位置R1を経て回転位置R2にもちきたし,基板11
に溶液を接触させエピタキシャル成長を行う。Next, after maintaining the growth temperature until reaching the growth temperature, the sealed tube 2 is rotated counterclockwise by 180 °, that is, the rotation position R1 and then the rotation position R2.
The solution is contacted with and the epitaxial growth is performed.
【0066】次いで,封管2を回転位置R3にもちきた
す。このとき,成長室の床面5bは床材17の上面とな
り,他方,溶液保持室4の床面4bは封管2の内壁面と
なる。従って,溶液は全て,溶液保持室4内へ流出す
る。この状態で封管2を冷却してエピタキシャル成長を
終了する。Next, the sealed tube 2 is brought to the rotation position R3. At this time, the floor surface 5b of the growth chamber becomes the upper surface of the floor material 17, while the floor surface 4b of the solution holding chamber 4 becomes the inner wall surface of the sealed tube 2. Therefore, all the solution flows out into the solution holding chamber 4. In this state, the sealed tube 2 is cooled and the epitaxial growth is completed.
【0067】本構成では,エピタキシャル成長後に成長
室内に溶液を残さないから,エピタキシャル層表面の汚
染を防止することができる。本発明の第三実施例は,図
6を参照して,成長室5の左右に隔壁3a,3bにより
隔離された溶液保持室4とドーパント保持室6とを備え
た装置に関する。In this structure, since the solution is not left in the growth chamber after the epitaxial growth, the surface of the epitaxial layer can be prevented from being contaminated. The third embodiment of the present invention relates to an apparatus provided with a solution holding chamber 4 and a dopant holding chamber 6 which are separated from each other by partition walls 3a and 3b on the left and right sides of a growth chamber 5 with reference to FIG.
【0068】図6(a)は,回転位置R4における封管
2全体の縦断面,図6(b)はドーパント保持室の横断
面を,図6(c),(d)はそれぞれ隔壁3b及び3a
に近い位置での成長室の横断面を,図6(e)は溶液保
持室4の横断面を表している。FIG. 6 (a) is a longitudinal section of the entire sealed tube 2 at the rotational position R4, FIG. 6 (b) is a transverse section of the dopant holding chamber, and FIGS. 6 (c) and 6 (d) are partition walls 3b and 3, respectively. 3a
6 (e) shows the cross section of the growth chamber at a position close to, and FIG. 6 (e) shows the cross section of the solution holding chamber 4.
【0069】溶液保持室4内に,図6(e)を参照し
て,円筒状封管2の上下をそれぞれ水平に仕切るソース
ホルダ12a及び床材16が設けられる。板状のソース
材12はソースホルダ12aの下面に水平に保持され
る。In the solution holding chamber 4, referring to FIG. 6 (e), a source holder 12a and a floor material 16 for partitioning the top and bottom of the cylindrical sealed tube 2 horizontally are provided. The plate-shaped source material 12 is horizontally held on the lower surface of the source holder 12a.
【0070】成長室5内に,図6(c),(d)を参照
して,円筒状封管2を水平に仕切る基板ホルダ11a,
及び,基板ホルダ11a下面に密着して円筒状封管2を
垂直に仕切る床材17が設けられる。エピタキシャル基
板11は基板ホルダの下面に保持される。In the growth chamber 5, referring to FIGS. 6 (c) and 6 (d), the substrate holder 11a for partitioning the cylindrical sealed tube 2 horizontally,
Further, a floor material 17 is provided which is in close contact with the lower surface of the substrate holder 11a and vertically partitions the cylindrical sealed tube 2. The epitaxial substrate 11 is held on the lower surface of the substrate holder.
【0071】ドーパント保持室6内に,図6(b)を参
照して,上述した溶液保持室4と同様に,円筒状封管2
の上下をそれぞれ水平に仕切るドーパントホルダ13a
及び床材18が設けられる。板状のドーパント材13が
ドーパントホルダ13a下面に水平に保持される。In the dopant holding chamber 6, as in the solution holding chamber 4 described above with reference to FIG.
Holder 13a for horizontally partitioning the upper and lower sides
And floor material 18 are provided. The plate-shaped dopant material 13 is horizontally held on the lower surface of the dopant holder 13a.
【0072】溶液保持室4と成長室5とを隔てる隔壁3
aには,溶液保持室4の床面(床材16の上面)近くに
入口7−1aを有する溶液導入路7−1が設けられる。
成長室5とドーパント保持室6とを隔てる隔壁3bに
は,ドーパント保持室6から成長室5に溶液を移送する
ための溶液導入路7−2と,成長室5からドーパント保
持室6に溶液を移送するための溶液導入路9とが設けら
れる。溶液導入路7−2は,ドーパント保持室の床面
(床材18の上面)近くに入口7−2aを有し,溶液導
入路9は,回転位置R3の位置における成長室5の床面
(成長室5に表出する床材17の面)の近くに入口9a
を有する。Partition wall 3 separating the solution holding chamber 4 and the growth chamber 5
A solution introduction path 7-1 having an inlet 7-1a is provided in a near the floor surface of the solution holding chamber 4 (upper surface of the floor material 16).
The partition wall 3b separating the growth chamber 5 and the dopant holding chamber 6 has a solution introducing path 7-2 for transferring the solution from the dopant holding chamber 6 to the growth chamber 5, and a solution from the growth chamber 5 to the dopant holding chamber 6. A solution introducing path 9 for transferring is provided. The solution introducing passage 7-2 has an inlet 7-2a near the floor surface (upper surface of the floor material 18) of the dopant holding chamber, and the solution introducing passage 9 has a floor surface of the growth chamber 5 at the rotation position R3 ( Entrance 9a near the surface of the floor material 17 exposed to the growth chamber 5)
Have.
【0073】次に,本実施例の動作を説明する。図7は
本発明の第三実施例動作説明図であり,封管2の回転位
置と溶液の移動との関係を表している。なお,図中の矢
印は,溶液導入路の位置を表している。Next, the operation of this embodiment will be described. FIG. 7 is a diagram for explaining the operation of the third embodiment of the present invention, showing the relationship between the rotational position of the sealed tube 2 and the movement of the solution. The arrow in the figure indicates the position of the solution introduction path.
【0074】先ず,図6を参照して,封管2を回転位置
R1におき,溶液保持室4内の原材料を溶融し溶液とす
る。このとき,図7(a)を参照して,溶液8は,溶液
保持室4内に,ソース板12に触れずに保持される。な
お,この回転位置では,3つの溶液導入路7−1,7−
2,9は溶液面より上方に位置する。この状態で所定温
度まで降温し一定温度になるまで待つ。First, referring to FIG. 6, the sealed tube 2 is placed at the rotation position R1 and the raw materials in the solution holding chamber 4 are melted to form a solution. At this time, referring to FIG. 7A, the solution 8 is held in the solution holding chamber 4 without touching the source plate 12. At this rotation position, the three solution introducing paths 7-1, 7-
2, 9 are located above the solution surface. In this state, the temperature is lowered to a predetermined temperature and waits until a constant temperature is reached.
【0075】次いで,封管2を反時計方向に90°回転
し回転位置R2とする。図7(b)を参照して,溶液8
はソースホルダ12a上に溜りソース板12と接触す
る。このまま溶液が飽和するまで放置する。Next, the sealed tube 2 is rotated 90 ° counterclockwise to the rotation position R2. With reference to FIG. 7B, the solution 8
Collects on the source holder 12a and contacts the source plate 12. Let stand as it is until the solution is saturated.
【0076】次いで,封管2を回転位置R4まで回転す
る。図7(c)を参照して,このとき溶液保持室内の溶
液8は,溶液導入路7−1を通り成長室5に流入する。
同時に降温して溶液が成長温度に達するまで放置する。Then, the sealed tube 2 is rotated to the rotation position R4. Referring to FIG. 7C, at this time, the solution 8 in the solution holding chamber flows into the growth chamber 5 through the solution introducing passage 7-1.
At the same time, the temperature is lowered and the solution is left to stand until it reaches the growth temperature.
【0077】次いで,封管2を反時計廻りに,即ち回転
位置R1を経由して回転位置R2まで180°回転す
る。その結果,図7(d)を参照して,溶液8は基板ホ
ルダ11a上に溜り,溶液8と接触し,エピタキシャル
成長がなされる。Then, the sealed tube 2 is rotated 180 ° counterclockwise, that is, through the rotational position R1 to the rotational position R2. As a result, referring to FIG. 7 (d), the solution 8 accumulates on the substrate holder 11a, comes into contact with the solution 8, and epitaxial growth is performed.
【0078】エピタキシャル成長後,封管2を反時計方
向に90°回転し回転位置R3とする。図7(e)を参
照して,溶液8は,基板11から引き離され,床材17
上面に落ちたのち,溶液導入路9を通りドーパント保持
室6内に流入する。After the epitaxial growth, the sealed tube 2 is rotated 90 ° counterclockwise to the rotation position R3. With reference to FIG. 7E, the solution 8 is separated from the substrate 11 and the floor material 17
After falling on the upper surface, it flows into the dopant holding chamber 6 through the solution introducing passage 9.
【0079】次いで,再び一定の温度に昇温した後,封
管2を時計方向に90°回転し,回転位置R2におく。
図7(f)を参照して,溶液8はドーパントホルダ13
a上に溜りドーパント材13と接触する。このまま飽和
するまで放置する。Next, after the temperature is raised again to a constant temperature, the sealed tube 2 is rotated clockwise by 90 ° and placed at the rotation position R2.
Referring to FIG. 7F, the solution 8 is the dopant holder 13
It collects on a and contacts the dopant material 13. Leave as it is until saturated.
【0080】次いで,封管2を180°回転して回転位
置R4におく。図7(g)を参照して,溶液8はドーパ
ント保持室6内の床材18上面に落下し,溶液導入路7
−2を通り成長室5に流入する。この状態で溶液8が成
長温度に達するまで放置する。Next, the sealed tube 2 is rotated by 180 ° and placed at the rotation position R4. With reference to FIG. 7G, the solution 8 drops onto the upper surface of the floor material 18 in the dopant holding chamber 6, and the solution introduction path 7
-2 to flow into the growth chamber 5. In this state, the solution 8 is left to stand until it reaches the growth temperature.
【0081】溶液が成長温度に達し温度が安定した後,
封管2を反時計廻りに,即ち回転位置R1を経由して回
転位置R2まで180°回転する。図7(h)を参照し
て,溶液8は,基板11と接触してエピタキシャル成長
がなされる。After the solution reaches the growth temperature and stabilizes,
The sealed tube 2 is rotated counterclockwise, that is, 180 ° to the rotational position R2 via the rotational position R1. Referring to FIG. 7 (h), the solution 8 is brought into contact with the substrate 11 to be epitaxially grown.
【0082】成長後は,封管2を回転位置R3とし,溶
液8をドーパント保持室に流入させ,冷却してエピタキ
シャル成長を終了する。本実施例では,非常に簡単な装
置によって,2種類の半導体層を順次エピタキシャル成
長することができる。After the growth, the sealed tube 2 is set to the rotation position R3, the solution 8 is caused to flow into the dopant holding chamber, and it is cooled to end the epitaxial growth. In this embodiment, two kinds of semiconductor layers can be sequentially epitaxially grown with a very simple apparatus.
【0083】[0083]
【発明の効果】本発明によれば,ソース板と溶液とを接
触させて飽和するまでの工程と,エピタキシャル成長工
程とが別個の室でなされるため,基板の汚染が少なく,
良質のエピタキシャル層を製造することができる。ま
た,本発明の他の構成によれば,異なる組成のエピタキ
シャル層を順次堆積することができる。従って,本発明
は,半導体装置の特性向上に寄与するところが大きい。According to the present invention, since the steps of contacting the source plate with the solution to saturate and the epitaxial growth step are performed in separate chambers, the contamination of the substrate is small,
A good quality epitaxial layer can be manufactured. Further, according to another configuration of the present invention, epitaxial layers having different compositions can be sequentially deposited. Therefore, the present invention largely contributes to the improvement of the characteristics of the semiconductor device.
【図1】 本発明の原理説明断面図FIG. 1 is a sectional view for explaining the principle of the present invention.
【図2】 本発明の第一実施例斜視図FIG. 2 is a perspective view of a first embodiment of the present invention.
【図3】 本発明の第一実施例動作説明図(その1)FIG. 3 is a diagram for explaining the operation of the first embodiment of the present invention (No. 1)
【図4】 本発明の第一実施例動作説明図(その2)FIG. 4 is a diagram for explaining the operation of the first embodiment of the present invention (No. 2)
【図5】 本発明の第二実施例断面図FIG. 5 is a sectional view of a second embodiment of the present invention.
【図6】 本発明の第三実施例断面図FIG. 6 is a sectional view of a third embodiment of the present invention.
【図7】 本発明の第三実施例動作説明図FIG. 7 is an operation explanatory diagram of the third embodiment of the present invention.
【図8】 従来例断面図FIG. 8 is a sectional view of a conventional example.
1 回転軸 2 封管 3 隔壁 4 室(溶液保持室) 4a,4b,5a,5b 床面 5 室(成長室) 6 ドーパント保持室 7,9 溶液導入路 7a,9a 入口 7b,9b 出口 8 溶液 11 基板 11a 基板ホルダ 12 ソース板 12a ソースホルダ 13 ドーパント材 14 側板 15,16,17,18 床材 30,43 ホルダ 31 回転軸 32 封管 33 隔壁 34 連通管 35,41 溶液 36 原材料 37 酸化物 38,42 基板 39 側板 40 ソース板 44 ヒータ 45 スライダ 1 rotating shaft 2 sealed tube 3 partition wall 4 chamber (solution holding chamber) 4a, 4b, 5a, 5b floor surface 5 chamber (growth chamber) 6 dopant holding chamber 7, 9 solution introduction path 7a, 9a inlet 7b, 9b outlet 8 solution 11 Substrate 11a Substrate holder 12 Source plate 12a Source holder 13 Dopant material 14 Side plate 15, 16, 17, 18 Floor material 30, 43 Holder 31 Rotating shaft 32 Sealed tube 33 Partition wall 34 Communication tube 35, 41 Solution 36 Raw material 37 Oxide 38 , 42 substrate 39 side plate 40 source plate 44 heater 45 slider
Claims (5)
を該回転軸方向に分割する隔壁により隔てられた第一の
室及び第二の室と,該第一の室に入口を有し,該第一の
室と該第二の室とを連結する溶液導入路とを備え,該入
口は,該第二の室内の溶液面の最高位置より高い位置に
設けられることを特徴とする閉管式エピタキシャル成長
装置。1. A sealed tube having a horizontal rotating shaft, a first chamber and a second chamber separated by a partition wall dividing the sealed tube in the rotating shaft direction, and an inlet for the first chamber. And a solution introducing passage connecting the first chamber and the second chamber, wherein the inlet is provided at a position higher than the highest position of the solution surface in the second chamber. Closed tube epitaxial growth system.
長装置において,該第二の室の床面は,該第一の室の床
面より該封管の外周側に設けられていることを特徴とす
る閉管式エピタキシャル成長装置。2. The closed-tube epitaxial growth apparatus according to claim 1, wherein the floor surface of the second chamber is provided on the outer peripheral side of the sealed tube with respect to the floor surface of the first chamber. Closed tube type epitaxial growth equipment.
を該回転軸方向に分割する隔壁により隔てられた第一及
び第二の室と,該隔壁を貫通して第一及び第二の室を接
続する第一及び第二の溶液導入路とを有し,該第一の室
の床面は,該封管の第一の回転位置で該第二の室に流入
した溶液面より高い位置に設けられ,かつ該封管の第二
の回転位置で該第二の室の床面より低い位置に設けら
れ,該第一の溶液導入路は,該第一の回転位置における
該第一の室の床面近傍より低い位置に設けられ,該第二
の溶液導入路は,該第二の回転位置における該第二の室
の床面近傍より低い位置に設けられたことを特徴とする
閉管式エピタキシャル成長装置。3. A sealed tube having a horizontal axis of rotation, first and second chambers separated by a partition dividing the inside of the sealed tube in the direction of the axis of rotation, and first and second chambers penetrating the partition. A first and a second solution introducing passage connecting the two chambers, and a floor surface of the first chamber is a solution surface flowing into the second chamber at the first rotation position of the sealed tube. It is provided at a higher position and at a position lower than the floor surface of the second chamber at the second rotational position of the sealed tube, and the first solution introducing passage is provided at the second rotational position at the first rotational position. The first solution chamber is provided at a position lower than the vicinity of the floor surface, and the second solution introduction path is provided at a position lower than the vicinity of the floor surface of the second chamber at the second rotation position. Closed tube type epitaxial growth equipment.
た封管と,該回転軸方向に隣接して該封管内に設けられ
た溶液保持室及び成長室と,該成長室内壁面に設けら
れ,該回転軸と平行に基板表面を保持する基板ホルダ
と,該溶液保持室内壁面に設けられ,該基板表面と平行
にソース板表面を保持するソースホルダと,該溶液保持
室と該成長室とを連結し,該溶液保持室から該成長室へ
向かい該回転軸から離れる向きに設けられた管状の溶液
導入路とを有し,該封管を回転させて該溶液保持室内に
保持された溶液を該ソース板に接触させた後,再度該封
管を回転させて該溶液を該溶液導入路を通して該成長室
へ流出させる封管回転手段とを有することを特徴とする
閉管式液相エピタキシャル成長装置。4. A sealed tube rotatably provided around a horizontal rotation axis, a solution holding chamber and a growth chamber provided in the sealed tube adjacent to the rotation axis direction, and provided on a wall surface of the growth chamber. A substrate holder for holding the substrate surface parallel to the rotation axis, a source holder provided on the wall surface of the solution holding chamber for holding the source plate surface parallel to the substrate surface, the solution holding chamber and the growth chamber. And a tubular solution introducing path provided in a direction from the solution holding chamber to the growth chamber and away from the rotation axis, and the sealed tube is rotated to be held in the solution holding chamber. A closed-tube liquid phase, comprising: a sealed tube rotating means for rotating the sealed tube again after bringing the solution into contact with the source plate to allow the solution to flow out to the growth chamber through the solution introduction path. Epitaxial growth equipment.
びソース板を室内に保持する溶液保持室,エピタキシャ
ル基板を室内に保持する成長室及びドーパント材を室内
に保持するドーパント保持室が,該封管の内部を該回転
軸方向に3分割する第一及び第二の隔壁により隔てられ
てこの順序で設けられ,該溶液保持室と該成長室とを連
結し,該封管の第一の回転位置で該溶液保持室内に保持
された溶液を該成長室へ流出させる該第一の隔壁に設け
られた第一の溶液導入路と,該封管の第二の回転位置
で,該成長室内の溶液を該ドーパント保持室へ移送する
ために該第二の隔壁に設けられた第二の溶液導入路と,
該封管の第三の回転位置で,該ドーパント保持室内の溶
液を該成長室内へ移送するために該第二の隔壁に設けら
れた第三の溶液導入路とを有することを特徴とする閉管
式液相エピタキシャル成長装置。5. A sealed tube having a horizontal axis of rotation, a solution holding chamber for holding a solution and a source plate in a chamber, a growth chamber for holding an epitaxial substrate in a chamber, and a dopant holding chamber for holding a dopant material in the chamber, The inside of the sealed tube is divided into three parts in the direction of the rotation axis and is provided in this order by being divided by first and second partition walls, which connects the solution holding chamber and the growth chamber to each other. At the second rotation position of the sealed tube and the first solution introducing passage provided in the first partition wall for flowing the solution held in the solution holding chamber to the growth chamber at the rotation position of A second solution introducing passage provided in the second partition for transferring the solution in the chamber to the dopant holding chamber,
A third solution introducing passage provided in the second partition wall for transferring the solution in the dopant holding chamber into the growth chamber at the third rotation position of the sealed tube. Tube type liquid phase epitaxial growth system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5733395A JPH08259384A (en) | 1995-03-16 | 1995-03-16 | Closed tube-type epitaxial growth device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5733395A JPH08259384A (en) | 1995-03-16 | 1995-03-16 | Closed tube-type epitaxial growth device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08259384A true JPH08259384A (en) | 1996-10-08 |
Family
ID=13052651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5733395A Withdrawn JPH08259384A (en) | 1995-03-16 | 1995-03-16 | Closed tube-type epitaxial growth device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08259384A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015189875A1 (en) * | 2014-06-12 | 2015-12-17 | 富士電機株式会社 | Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing method |
US9716008B2 (en) | 2015-04-13 | 2017-07-25 | Fuji Electric Co., Ltd. | Apparatus for doping impurities, method for doping impurities, and method for manufacturing semiconductor device |
-
1995
- 1995-03-16 JP JP5733395A patent/JPH08259384A/en not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015189875A1 (en) * | 2014-06-12 | 2015-12-17 | 富士電機株式会社 | Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing method |
CN105793960A (en) * | 2014-06-12 | 2016-07-20 | 富士电机株式会社 | Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing method |
JPWO2015189875A1 (en) * | 2014-06-12 | 2017-04-20 | 富士電機株式会社 | Impurity adding apparatus, impurity adding method, and semiconductor device manufacturing method |
US10658183B2 (en) | 2014-06-12 | 2020-05-19 | Fuji Electric Co., Ltd. | Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing method |
US9716008B2 (en) | 2015-04-13 | 2017-07-25 | Fuji Electric Co., Ltd. | Apparatus for doping impurities, method for doping impurities, and method for manufacturing semiconductor device |
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