JPH08252688A - Solder alloy for low-temperature joining, electronic apparatus using the same and its production - Google Patents
Solder alloy for low-temperature joining, electronic apparatus using the same and its productionInfo
- Publication number
- JPH08252688A JPH08252688A JP5933495A JP5933495A JPH08252688A JP H08252688 A JPH08252688 A JP H08252688A JP 5933495 A JP5933495 A JP 5933495A JP 5933495 A JP5933495 A JP 5933495A JP H08252688 A JPH08252688 A JP H08252688A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder alloy
- alloy
- low
- elongation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、低温接合用はんだ合
金、これを用いた電子機器およびその製造方法に関す
る。本発明は、特に、電子機器産業における回路配線基
板アセンブリにおいて使用されるはんだ合金に関し、こ
のはんだ合金は構成元素としてＰｂを含まず、しかもそ
れを用いた時のはんだ付け温度が従来の６３Ｓｎ−３７
Ｐｂはんだの融点よりも低いものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder alloy for low temperature bonding, an electronic device using the same, and a method for manufacturing the same. The present invention particularly relates to a solder alloy used in a circuit wiring board assembly in the electronic equipment industry, and this solder alloy does not contain Pb as a constituent element, and the soldering temperature when it is used is 63Sn-37 of the related art.
It is lower than the melting point of Pb solder.
【０００２】[0002]
【従来の技術】地球環境保全に対する国際的な意識の高
まりから、廃電子部品からのＰｂの溶出による水質汚染
がクローズアップされている。Ｐｂは、Ｓｎとの合金で
ある融点１８３℃の６３Ｓｎ−３７Ｐｂはんだとして、
電子機器の製造に広く用いられていることから、その代
替はんだ合金を開発することが急務となっている。ま
た、はんだ付け温度を低くすることは、吸湿した樹脂封
止ＬＳＩがはんだ接合時にパーケージクラックを生じる
のを防止することもできることから、電子機器の信頼性
の点でメリットがある。したがって、Ｐｂを構成元素に
含まない低温接合用はんだ合金を開発することは、極め
て有意義である。2. Description of the Related Art Due to increasing international awareness of global environmental protection, water pollution due to elution of Pb from waste electronic parts has been highlighted. Pb is 63Sn-37Pb solder having a melting point of 183 ° C. which is an alloy with Sn,
Since it is widely used in the manufacture of electronic devices, there is an urgent need to develop alternative solder alloys. In addition, lowering the soldering temperature can prevent the moisture-absorbed resin-sealed LSI from generating a package crack at the time of solder joining, which is advantageous in the reliability of the electronic device. Therefore, it is extremely significant to develop a solder alloy for low temperature bonding that does not contain Pb as a constituent element.
【０００３】Ｐｂを構成元素として含まない低融点合金
として、Ｓｎ，Ｉｎ，Ｂｉなどを構成元素とする６６Ｉ
ｎ−３４Ｂｉ（融点７２℃）、５２Ｉｎ−４８Ｓｎ（融
点１１７℃）、５７Ｂｉ−４３Ｓｎ（融点１３９℃）な
どが知られている。これらのうちで、６６Ｉｎ−３４Ｂ
ｉは、電子機器稼働時の内部温度が８０℃に達すること
を考慮するとはんだ合金としては実用に適さない。ま
た、５２Ｉｎ−４８Ｓｎは、Ｉｎが産出量に乏しく、高
価であることから、はんだ合金としての安定供給や価格
の点で問題が残る。５７Ｂｉ−４３Ｓｎは、融点、安定
供給性および価格の点では問題ないが、それ自体が硬く
て脆いという、望ましくない物性を有している。As a low melting point alloy containing no Pb as a constituent element, 66I containing Sn, In, Bi, etc. as a constituent element.
n-34Bi (melting point 72 ° C.), 52In-48Sn (melting point 117 ° C.), 57Bi-43Sn (melting point 139 ° C.) and the like are known. Of these, 66In-34B
Considering that the internal temperature reaches 80 ° C. when the electronic device is operating, i is not suitable for practical use as a solder alloy. In addition, 52In-48Sn has a problem in terms of stable supply and price as a solder alloy, since In is poor in production and is expensive. Although 57Bi-43Sn has no problem in terms of melting point, stable supply and price, it has undesired physical properties of being hard and brittle.
【０００４】電子機器におけるはんだ接合部は、単に電
子機器内でＬＳＩパッケージと回路配線基板とを電気的
に接合するだけではなく、ＬＳＩが発熱して熱膨張した
時に、はんだ自体が歪んで（弾塑性変形して）、ＬＳＩ
パッケージと回路配線基板との間の応力を緩和するとい
う役割をも担っている。したがって、はんだが十分な緩
和作用を発揮するには、負荷に応じて柔軟に弾塑性変形
するように、低いヤング率が求められる。もちろん、ヤ
ング率が低すぎると、はんだの引張強さも小さくなっ
て、接合強度が不足するようになる。したがって、通常
の電子機器で用いられている６３Ｓｎ−３７Ｐｂはんだ
のヤング率が４５０kg／mm2 程度であることから、６３
Ｓｎ−３７Ｐｂからの代替を行うには、低温接合用はん
だ合金のヤング率もこれと同等であることが求められ
る。The solder joint portion in an electronic device is not only to electrically join the LSI package and the circuit wiring board in the electronic device, but also when the LSI generates heat and thermally expands, the solder itself is distorted (elasticity). Plastic deformation), LSI
It also plays a role of relieving stress between the package and the circuit wiring board. Therefore, in order for the solder to exert a sufficient relaxation effect, a low Young's modulus is required so that the solder elastically and plastically deforms depending on the load. Of course, if the Young's modulus is too low, the tensile strength of the solder also becomes small, and the joint strength becomes insufficient. Therefore, since the Young's modulus of 63Sn-37Pb solder used in ordinary electronic equipment is about 450 kg / mm 2 ,
In order to substitute Sn-37Pb, the Young's modulus of the solder alloy for low temperature bonding is required to be equivalent to this.
【０００５】また、電子機器のＯＮ／ＯＦＦの繰り返し
による素子の熱膨張および収縮によりはんだが塑性変形
を繰り返すと、最悪の場合には、はんだ接合部に亀裂が
生じて断線することもある。したがって、はんだが塑性
変形の繰り返しに対して十分な耐久性を有するには、引
張試験時に大きく塑性変形して高い破断伸びを示すこと
が望まれる。６３Ｓｎ−３７Ｐｂはんだの破断伸びが３
０％程度であることから、低温接合用はんだ合金の破断
伸びは３０％以上であることが望ましい。Further, when the solder repeatedly undergoes plastic deformation due to thermal expansion and contraction of the element due to repeated ON / OFF of the electronic equipment, in the worst case, a crack may occur at the solder joint portion and disconnection may occur. Therefore, in order for the solder to have sufficient durability against repeated plastic deformation, it is desired that the solder undergo large plastic deformation during the tensile test and exhibit high elongation at break. Break elongation of 63Sn-37Pb solder is 3
Since it is about 0%, the fracture elongation of the solder alloy for low temperature bonding is preferably 30% or more.
【０００６】以上のことから、Ｐｂを構成元素に含まな
い低温接合用はんだ合金には、６３Ｓｎ−３７Ｐｂはん
だの代替用途として、４５０kg／mm2 程度のヤング率と
３０％以上の破断伸び値が要求される。From the above, a solder alloy for low temperature bonding which does not contain Pb as a constituent element is required to have a Young's modulus of about 450 kg / mm 2 and a breaking elongation value of 30% or more as an alternative application of 63Sn-37Pb solder. To be done.
【０００７】[0007]
【発明が解決しようとする課題】５７Ｂｉ−４３Ｓｎの
引張試験時のヤング率および破断伸びはそれぞれ５００
kg／mm2 および２０％程度であり、６３Ｓｎ−３７Ｐｂ
よりもヤング率が大きく、破断伸びが小さい。したがっ
て、５７Ｂｉ−４３ＳｎのＬＳＩと回路配線基板との間
のミスマッチ緩和能力や繰り返し塑性変形時の耐久能力
は、６３Ｓｎ−３７Ｐｂよりも劣り、これを６３Ｓｎ−
３７Ｐｂに代替して用いた場合、電子機器の長期的信頼
性低下が懸念される。The Young's modulus and elongation at break of the tensile test of 57Bi-43Sn are each 500.
kg / mm 2 and about 20%, 63Sn-37Pb
Has a higher Young's modulus and a smaller elongation at break. Therefore, the mismatch relaxation capability between the 57Bi-43Sn LSI and the circuit wiring board and the durability capability during repeated plastic deformation are inferior to those of 63Sn-37Pb.
When it is used in place of 37Pb, there is a concern that the long-term reliability of electronic equipment may deteriorate.
【０００８】本発明は、Ｐｂを構成元素として含まず、
はんだ接合部のミスマッチ緩和能力や繰り返し塑性変形
時の耐久能力が６３Ｓｎ−３７Ｐｂはんだと同等以上で
あって、６３Ｓｎ−３７Ｐｂはんだの融点よりも低い温
度で接合可能なはんだ合金を提供することを目的とす
る。The present invention does not contain Pb as a constituent element,
An object of the present invention is to provide a solder alloy in which the mismatch relaxation capability of the solder joint portion and the durability capability during repeated plastic deformation are equal to or higher than those of 63Sn-37Pb solder and which can be joined at a temperature lower than the melting point of 63Sn-37Pb solder. To do.
【０００９】[0009]
【課題を解決するための手段】本発明によれば、上記課
題を解決するため、重量％表示で、 Ｓｎ ３７〜５８ Ａｇ ０．１〜２．５ Ｂｉ 残部 からなることを特徴とする低温接合用はんだ合金が提供
される。According to the present invention, in order to solve the above-mentioned problems, a low temperature bonding, characterized by comprising Sn 37-58 Ag 0.1-2.5 Bi balance, expressed in weight percent. A solder alloy for use is provided.
【００１０】すなわち、本発明は、ＢｉとＳｎを主たる
構成元素とするはんだ合金において、Ａｇを０．１〜
２．５重量％の範囲で添加することによって、６３Ｓｎ
−３７Ｐｂはんだと同等のヤング率と破断伸びを有し、
はんだ接合部の応力緩和性や繰り返し塑性変形時の耐久
性の高いはんだ合金を実現したものである。驚くべきこ
とに、本発明者らは、Ｂｉ−Ｓｎ合金に第３元素として
Ａｇを添加し、しかもその添加量を２．５重量％以下に
することにより、融点上昇を起こすことなくヤング率を
所望のレベルまで低下でき、破断伸びを著しく増加でき
ることを見出したのである。この効果は、Ａｇを付加成
分として用いた場合だけに限られた特異の効果であり、
Ａｇに代えてＳｂ，Ｚｎ，Ｃｕ等を添加した場合には、
同様な効果は認められなかった（表２）。That is, according to the present invention, in a solder alloy containing Bi and Sn as main constituent elements, Ag is 0.1 to 0.1.
By adding in the range of 2.5% by weight, 63Sn
-It has Young's modulus and breaking elongation equivalent to -37Pb solder,
This is a solder alloy having a stress relaxation property of the solder joint and a high durability against repeated plastic deformation. Surprisingly, the inventors of the present invention added Ag as the third element to the Bi—Sn alloy and set the addition amount to 2.5% by weight or less, thereby increasing the Young's modulus without increasing the melting point. It has been found that it can be reduced to a desired level and the elongation at break can be significantly increased. This effect is a peculiar effect limited only when Ag is used as an additional component,
When Sb, Zn, Cu or the like is added instead of Ag,
No similar effect was observed (Table 2).
【００１１】Ｓｎ−Ｐｂ合金やＩｎ−Ｓｎ合金に、第３
元素としてＡｇを添加することは、従来より知られてい
ることではあるが、この添加の目的は高ヤング率化およ
び高強度化を図ることであり、本発明がＡｇの添加によ
って達成しようとする課題とは全く異なっている。Ａｇ
添加によるはんだの高強度化を教示する文献として、R.
J. Klein Wassink著、「ソルダリング イン エレクト
ロニクス」に、６０Ｓｎ−４０Ｐｂはんだの２０℃での
剪断強さが２０Ｎ／mm2 であるのに対し、６２Ｓｎ−３
６Ｐｂ−２Ａｇのそれが２８Ｎ／mm2 と、Ａｇの添加に
よって剪断強さが１．４倍になることが報告されてい
る。The Sn-Pb alloy and the In-Sn alloy have a third
Although adding Ag as an element is conventionally known, the purpose of this addition is to increase Young's modulus and strength, and the present invention aims to achieve it by adding Ag. It is completely different from the task. Ag
As a document teaching the strengthening of solder by addition, R.
J. Klein Wassink, "Soldering in Electronics," shows that 60Sn-40Pb solder has a shear strength of 20 N / mm 2 at 20 ° C, while 62Sn-3.
It is reported that that of 6Pb-2Ag is 28 N / mm 2, and that the addition of Ag increases the shear strength by 1.4 times.
【００１２】以上からわかるように、Ａｇを第３元素と
してＢｉ−Ｓｎ合金に２．５重量％以下の量で添加する
ことにより、ヤング率を所望のレベルまで低下でき、破
断伸びを著しく増加できるということは、全く予想外の
ことである。Ａｇの添加によって破断伸びが増加する挙
動は、０．１重量％という微量添加時から観察され、１
重量％添加時に破断伸びが最大値を示し、２．５重量％
添加時までその効果が得られることが確認された（図
１）。Ａｇ添加量が２．５重量％を超えると、破断伸び
はＡｇ未添加のＢｉ−Ｓｎ合金よりも小さくなる。な
お、Ａｇ添加量が１重量％である点を境に破断伸びが減
少し始めるのは、Ａｇ量の増加によって、硬くて脆いＡ
ｇ−Ｓｎ相が生成するためであると考えられる。また、
Ａｇ添加Ｂｉ−Ｓｎ合金の内部金属組織においては、Ａ
ｇ添加によって組織が微細化するとともに、空隙も減少
することが確認された。As can be seen from the above, the Young's modulus can be reduced to a desired level and the elongation at break can be remarkably increased by adding Ag as the third element to the Bi--Sn alloy in an amount of 2.5 wt% or less. That is totally unexpected. The behavior that the elongation at break increases with the addition of Ag has been observed since the addition of a small amount of 0.1% by weight.
The maximum elongation at break is 2.5% by weight when added.
It was confirmed that the effect was obtained until the time of addition (Fig. 1). If the amount of Ag added exceeds 2.5% by weight, the elongation at break becomes smaller than that of the Bi-Sn alloy without Ag added. It should be noted that the break elongation starts to decrease at the point where the amount of Ag added is 1% by weight because the hard and brittle A
It is considered that this is because the g-Sn phase is generated. Also,
In the internal metallographic structure of the Ag-added Bi-Sn alloy, A
It was confirmed that the addition of g makes the structure finer and reduces the voids.
【００１３】[0013]
【作用】Ｂｉ−Ｓｎ合金に第３元素としてＡｇを添加
し、しかもその添加量を２．５重量％以下に抑えること
で、融点上昇を起こすことなく、ヤング率を６３Ｓｎ−
３７Ｐｂはんだと同等のレベルまで低下させ、破断伸び
を６３Ｓｎ−３７Ｐｂはんだ以上に大きくすることがで
きた。By adding Ag as the third element to the Bi-Sn alloy and suppressing the addition amount to 2.5% by weight or less, the Young's modulus is 63Sn-without increasing the melting point.
It was possible to reduce the breaking elongation to a level equivalent to that of 37Pb solder and to increase the breaking elongation more than that of 63Sn-37Pb solder.
【００１４】[0014]
【実施例】下記の表１に重量％表示で示すＢｉ−Ｓｎ−
Ａｇ合金を用いて引張試験片を作製し、引張試験を行っ
て、破断伸びとヤング率を求めた。得られた破断伸びを
図１および図２に示し、それらの融点とともにヤング率
を併せて表１に示す。また、これらのうち、実験番号２
〜７および９〜１１（本発明例）のはんだ合金を用いて
回路配線基板を組み立てたところ、パッケージクラック
の発生もなく、良好にはんだ接合を行うことができた。EXAMPLES Bi-Sn-shown in weight% in Table 1 below.
Tensile test pieces were prepared using Ag alloy and subjected to a tensile test to determine the elongation at break and Young's modulus. The obtained breaking elongations are shown in FIGS. 1 and 2, and their melting points and Young's moduli are also shown in Table 1. Of these, experiment number 2
When a circuit wiring board was assembled using the solder alloys of Nos. 7 and 9 to 11 (examples of the present invention), good solder joining was possible without generation of package cracks.
【００１５】また、比較のため、第３元素としてＳｂ，
ＺｎおよびＣｕを用いた場合のヤング率および破断伸び
を表２に示す。For comparison, the third element, Sb,
Table 2 shows Young's modulus and elongation at break when Zn and Cu are used.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 [Table 2]
【００１８】[0018]
【発明の効果】以上説明したように、本発明によれば、
融点が６３Ｓｎ−３７Ｐｂはんだより低く、しかも６３
Ｓｎ−３７Ｐｂはんだを代替するに十分なヤング率、破
断伸びを有するはんだを作製できることから、従来より
も低い温度でのプリント板アセンブリが可能となり、Ｌ
ＳＩのプラスチックパッケージへのストレスを軽減で
き、製造する電子機器の信頼性を向上できる。また、こ
のはんだ合金は、はんだ成分中にＰｂを含んでいないた
め、人体や地球環境に対して安全である。As described above, according to the present invention,
Melting point is lower than 63Sn-37Pb solder, and 63
Since solder having sufficient Young's modulus and elongation at break for substituting Sn-37Pb solder can be produced, it becomes possible to assemble printed board at a lower temperature than before, and
The stress on the SI plastic package can be reduced, and the reliability of the electronic equipment to be manufactured can be improved. Moreover, since this solder alloy does not contain Pb in the solder component, it is safe for the human body and the global environment.
【図１】Ｂｉ−Ｓｎ−Ａｇ合金のＡｇ含有量と破断伸び
との関係を示すグラフ。FIG. 1 is a graph showing the relationship between the Ag content of a Bi—Sn—Ag alloy and the elongation at break.
【図２】Ｂｉ−Ｓｎ−Ａｇ合金のＡｇおよびＳｎ含有量
と破断伸びとの関係を示すグラフ。FIG. 2 is a graph showing the relationship between Ag and Sn contents of Bi—Sn—Ag alloy and elongation at break.
Claims (4)
用いて接合された部分を含む電子機器。2. An electronic device including a portion bonded by using the solder alloy for low temperature bonding according to claim 1.
用いて所定部分を接合することを含む電子機器の製造方
法。3. A method of manufacturing an electronic device, which comprises bonding a predetermined portion using the solder alloy for low temperature bonding according to claim 1.
れる請求項３記載の方法。4. The method according to claim 3, wherein the solder joining is performed at a temperature of 180 ° C. or lower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05933495A JP3347512B2 (en) | 1995-03-17 | 1995-03-17 | Solder alloy for low-temperature bonding, electronic device using the same, and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05933495A JP3347512B2 (en) | 1995-03-17 | 1995-03-17 | Solder alloy for low-temperature bonding, electronic device using the same, and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08252688A true JPH08252688A (en) | 1996-10-01 |
| JP3347512B2 JP3347512B2 (en) | 2002-11-20 |
Family
ID=13110335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05933495A Expired - Lifetime JP3347512B2 (en) | 1995-03-17 | 1995-03-17 | Solder alloy for low-temperature bonding, electronic device using the same, and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3347512B2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| EP1195217A1 (en) * | 1999-06-11 | 2002-04-10 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| JP2005288529A (en) * | 2004-04-05 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Solder material and soldered article |
| JP2006199833A (en) * | 2005-01-20 | 2006-08-03 | Sekisui Chem Co Ltd | Anisotropic conductive adhesive |
| JP2006294600A (en) * | 2005-03-15 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Conductive adhesive |
| JP2007123354A (en) * | 2005-10-25 | 2007-05-17 | Fujitsu Ltd | Method of manufacturing printed board for electronic apparatus, and electronic apparatus using the same |
| WO2008056676A1 (en) * | 2006-11-06 | 2008-05-15 | Victor Company Of Japan, Limited | Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board |
| JP2008183590A (en) * | 2007-01-30 | 2008-08-14 | Oki Electric Ind Co Ltd | Semiconductor device |
| JP2009111065A (en) * | 2007-10-29 | 2009-05-21 | Opnext Japan Inc | Optical semiconductor equipment |
| JP2013081989A (en) * | 2011-10-11 | 2013-05-09 | Shirogane:Kk | Low fusing point lead-free solder, and method for manufacturing the same |
| WO2014061085A1 (en) | 2012-10-15 | 2014-04-24 | 千住金属工業株式会社 | Soldering method for low-temperature solder paste |
| JP2017051984A (en) * | 2015-09-10 | 2017-03-16 | 株式会社弘輝 | Solder alloy and solder composition |
| JP2018122322A (en) * | 2017-01-31 | 2018-08-09 | 株式会社タムラ製作所 | Lead-free solder alloy, solder paste, electronic circuit board and electronic control device |
| JP2018202472A (en) * | 2017-06-08 | 2018-12-27 | 株式会社タムラ製作所 | Lead-free solder alloy |
| WO2021043708A1 (en) | 2019-09-06 | 2021-03-11 | Henkel Ag & Co. Kgaa | Solder alloy and solder paste containing said alloy |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220055494A (en) | 2019-09-11 | 2022-05-03 | 가부시키가이샤 신료 | Sn-Bi-In-based low-melting point junction member and manufacturing method thereof, and semiconductor electronic circuit and mounting method thereof |
| JP7080939B2 (en) | 2020-09-04 | 2022-06-06 | 株式会社新菱 | Low melting point bonding member and its manufacturing method, semiconductor electronic circuit and its mounting method |
-
1995
- 1995-03-17 JP JP05933495A patent/JP3347512B2/en not_active Expired - Lifetime
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| EP1195217A1 (en) * | 1999-06-11 | 2002-04-10 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| EP1195217A4 (en) * | 1999-06-11 | 2003-07-23 | Matsushita Electric Ind Co Ltd | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| US6702175B1 (en) | 1999-06-11 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| JP2005288529A (en) * | 2004-04-05 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Solder material and soldered article |
| JP2006199833A (en) * | 2005-01-20 | 2006-08-03 | Sekisui Chem Co Ltd | Anisotropic conductive adhesive |
| JP2006294600A (en) * | 2005-03-15 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Conductive adhesive |
| JP2007123354A (en) * | 2005-10-25 | 2007-05-17 | Fujitsu Ltd | Method of manufacturing printed board for electronic apparatus, and electronic apparatus using the same |
| WO2008056676A1 (en) * | 2006-11-06 | 2008-05-15 | Victor Company Of Japan, Limited | Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board |
| JP2008183590A (en) * | 2007-01-30 | 2008-08-14 | Oki Electric Ind Co Ltd | Semiconductor device |
| JP2009111065A (en) * | 2007-10-29 | 2009-05-21 | Opnext Japan Inc | Optical semiconductor equipment |
| JP2013081989A (en) * | 2011-10-11 | 2013-05-09 | Shirogane:Kk | Low fusing point lead-free solder, and method for manufacturing the same |
| WO2014061085A1 (en) | 2012-10-15 | 2014-04-24 | 千住金属工業株式会社 | Soldering method for low-temperature solder paste |
| KR20150048208A (en) | 2012-10-15 | 2015-05-06 | 센주긴조쿠고교 가부시키가이샤 | Soldering method for low-temperature solder paste |
| US9402321B2 (en) | 2012-10-15 | 2016-07-26 | Senju Metal Industry Co., Ltd. | Soldering method using a low-temperature solder paste |
| JP2017051984A (en) * | 2015-09-10 | 2017-03-16 | 株式会社弘輝 | Solder alloy and solder composition |
| JP2018122322A (en) * | 2017-01-31 | 2018-08-09 | 株式会社タムラ製作所 | Lead-free solder alloy, solder paste, electronic circuit board and electronic control device |
| JP2018202472A (en) * | 2017-06-08 | 2018-12-27 | 株式会社タムラ製作所 | Lead-free solder alloy |
| WO2021043708A1 (en) | 2019-09-06 | 2021-03-11 | Henkel Ag & Co. Kgaa | Solder alloy and solder paste containing said alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3347512B2 (en) | 2002-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08252688A (en) | Solder alloy for low-temperature joining, electronic apparatus using the same and its production | |
| JP3027441B2 (en) | High temperature solder | |
| WO2010122764A1 (en) | Soldering material and electronic component assembly | |
| WO1997046350A1 (en) | Solder for electronic part bonding electrodes, and soldering method | |
| JPH1133775A (en) | Tin-containing lead free solder alloy, its cream solder, and manufacture | |
| JP2006035310A (en) | Lead-free solder alloy | |
| TW201213552A (en) | Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY | |
| JP4401671B2 (en) | High temperature lead-free solder alloys and electronic components | |
| JP4844393B2 (en) | Die bonding method and electronic parts | |
| JP2008036691A (en) | Lead-free solder material, its production method, joined structure and electronic component packaging structure | |
| JP2558045B2 (en) | Eutectic solder with improved fatigue resistance | |
| KR20040063990A (en) | Lead-free soft solder | |
| JP3643008B2 (en) | Soldering method | |
| CN115461188A (en) | Lead-free solder paste with mixed solder powder for high temperature applications | |
| JP4595877B2 (en) | Semiconductor power module | |
| JP6848859B2 (en) | Solder alloy | |
| JP2009255176A (en) | Soldering composition and electronic component | |
| JP2008028413A (en) | Method for soldering electronic components | |
| Sigelko et al. | Overview of lead-free solders | |
| JP2008221330A (en) | Solder alloy | |
| JP7025208B2 (en) | Solder alloy | |
| US6824039B2 (en) | Lead free tin based solder composition | |
| JP3107483B2 (en) | No to low lead content solder alloy | |
| JP3815865B2 (en) | Lead-free solder alloy | |
| JP2004237357A (en) | High-temperature lead-free solder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20020430 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20020730 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080906 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080906 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090906 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090906 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100906 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100906 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110906 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120906 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120906 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130906 Year of fee payment: 11 |
|
| EXPY | Cancellation because of completion of term |