JPH08250854A - Manufacture of electronic circuit device - Google Patents
Manufacture of electronic circuit deviceInfo
- Publication number
- JPH08250854A JPH08250854A JP4845595A JP4845595A JPH08250854A JP H08250854 A JPH08250854 A JP H08250854A JP 4845595 A JP4845595 A JP 4845595A JP 4845595 A JP4845595 A JP 4845595A JP H08250854 A JPH08250854 A JP H08250854A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic circuit
- circuit device
- continuity
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子回路装置の製造方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic circuit device.
【０００２】[0002]
【従来の技術】近年、電子回路装置は高性能・高信頼性
化等が特に要求されている。2. Description of the Related Art In recent years, electronic circuit devices have been particularly required to have high performance and high reliability.
【０００３】以下に従来の電子回路装置について説明す
る。図２は従来の電子回路装置の断面図である。従来の
電子回路装置の厚膜印刷基板は、まず、穴加工１１ａを
施したＡｌ2Ｏ3等を主成分とした絶縁基板１１上に所定
の配線パターン１２と同時に穴加工１１ａ部分に表裏の
配線パターンを導通させるスルーホール１２ａをＡｇＰ
ｄ・Ａｇ・ＡｇＰｔ・Ａｕ・ＡｇＰｄＰｔ等を主成分と
する厚膜導体材料（ペースト）を用いて、スクリーン印
刷によって膜形成乾燥し、焼成を行う。A conventional electronic circuit device will be described below. FIG. 2 is a sectional view of a conventional electronic circuit device. A thick film printed circuit board of a conventional electronic circuit device is configured such that a predetermined wiring pattern 12 is formed on an insulating substrate 11 containing Al 2 O 3 or the like as a main component, which has been subjected to the hole processing 11a, and wiring on the front and back sides of the hole processing 11a is performed simultaneously. The through hole 12a for conducting the pattern is AgP
A thick film conductor material (paste) containing d, Ag, AgPt, Au, AgPdPt as a main component is used to form a film by screen printing, followed by drying and firing.
【０００４】次に、次工程も同様に所定の印刷抵抗体１
３をＲｕＯ2系・ＬａＢ6系・ＳｎＯ 2系等を主成分とす
る厚膜抵抗材料（ペースト）を用いて、スクリーン印刷
によって膜形成乾燥し、焼成をする。保護ガラス１４も
同様にＰｂＯ−Ｂ2Ｏ3−ＳｉＯ2系・ＰｂＯ−Ｂ2Ｏ3−
ＺｎＯ系等を主成分とする厚膜絶縁材料（ペースト）を
用いて、スクリーン印刷で膜形成乾燥し、焼成を行って
いた。Next, in the next step as well, a predetermined printed resistor 1 is similarly provided.
RuO 32System / LaB6System / SnO 2System is the main component
Screen printing using thick film resistance material (paste)
The film is formed, dried, and fired. Protective glass 14 also
Similarly, PbO-B2O3-SiO2System / PbO-B2O3−
Thick film insulating material (paste) mainly composed of ZnO
Using, film formation by screen printing, drying and baking
I was there.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の製造方法では、穴加工を施した絶縁基板を用いて表
裏配線パターンを導通させるスルーホール形成を行う
と、スルーホールの端面コーナー部１２ｂでスルーホー
ルが断線しやすいという課題を有していた。However, in the above-mentioned conventional manufacturing method, when a through hole is formed to conduct the front and back wiring patterns by using an insulating substrate having a hole, a through hole is formed at the end face corner portion 12b of the through hole. There was a problem that the hole is easily broken.
【０００６】本発明は上記従来の課題を解決するもの
で、表裏配線パターンを導通させるスルーホール形成を
行ってもスルーホールを断線させることなく表裏の配線
パターンを導通させる電子回路装置の製造方法を提供す
ることを目的とする。The present invention solves the above-mentioned conventional problems, and provides a method of manufacturing an electronic circuit device in which front and back wiring patterns are conducted without disconnecting the through holes even when a through hole is formed to conduct the front and back wiring patterns. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明は、スルーホールの端面部に傾斜部を設けた後
スルーホール形成して、表裏の所定の配線パターンを導
通させるものである。In order to achieve this object, the present invention is to form a through hole after forming an inclined portion on the end face portion of the through hole and to conduct a predetermined wiring pattern on the front and back sides. .
【０００８】[0008]
【作用】この製造方法によって、スルーホール形成を行
ってもスルーホールを断線させることなく表裏の所定の
配線パターンを導通させることができる。According to this manufacturing method, even if the through hole is formed, the predetermined wiring patterns on the front and back can be electrically connected without breaking the through hole.
【０００９】[0009]
【実施例】以下に本発明の一実施例における電子回路装
置の製造方法について、図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an electronic circuit device according to an embodiment of the present invention will be described below with reference to the drawings.
【００１０】図１は本実施例の電子回路装置の断面図で
ある。図１において、Ａｌ2Ｏ3等を主成分とした絶縁基
板１上にスルーホール２ａを形成しようとする所に傾斜
部を設けて穴加工１ａをする。FIG. 1 is a sectional view of the electronic circuit device of this embodiment. In FIG. 1, an inclined portion is provided at a position where a through hole 2a is to be formed on an insulating substrate 1 containing Al 2 O 3 or the like as a main component, and a hole is formed 1a.
【００１１】次に、所定の配線パターン２と同時に傾斜
部を付けて穴加工１ａを施した部分にスルーホール２ａ
をＡｇＰｄ・Ａｇ・ＡｇＰｔ・ＡｇＰｄＰｔ等を主成分
とする厚膜導体材料（ペースト）を用いて、スクリーン
印刷によって膜形成乾燥し、焼成を行う。Next, a through hole 2a is formed in a portion having a hole 1a formed by forming an inclined portion at the same time as the predetermined wiring pattern 2.
Using a thick film conductor material (paste) containing AgPd / Ag / AgPt / AgPdPt as a main component, a film is formed by screen printing, dried, and baked.
【００１２】次に、次工程も同様に所定の印刷抵抗体３
もＲｕＯ2系・ＬａＢ6系・ＳｎＯ2系等を主成分とする
厚膜抵抗材料（ペースト）を用いて、スクリーン印刷で
膜形成乾燥し、焼成をする。Next, in the next step, similarly, a predetermined printed resistor 3 is formed.
Also, using a thick film resistance material (paste) whose main component is RuO 2 system, LaB 6 system, SnO 2 system, etc., a film is formed by screen printing, dried, and baked.
【００１３】最後に、保護ガラス４もＰｂＯ−Ｂ2Ｏ3−
ＳｉＯ2系・ＰｂＯ−Ｂ2Ｏ3−ＺｎＯ系等を主成分とす
る厚膜絶縁材料（ペースト）を絶縁基板１の全体にスク
リーン印刷で膜形成乾燥し、焼成を行って電子回路とす
るものである。Finally, the protective glass 4 is also made of PbO-B 2 O 3-.
A thick film insulating material (paste) mainly composed of SiO 2 system / PbO—B 2 O 3 —ZnO system is formed on the entire insulation substrate 1 by screen printing, dried, and baked to form an electronic circuit. Is.
【００１４】[0014]
【発明の効果】以上のように本発明は、端面部に傾斜を
付けて穴加工を施した部分にスルーホール形成して、表
裏の所定の配線パターンを導通させることにより、スル
ーホールを断線させることなく表裏の配線パターンを導
通させることができる電子回路を提供することができ
る。As described above, according to the present invention, a through hole is formed by forming a through hole in a portion in which an end face portion is inclined and a hole is formed and conducting a predetermined wiring pattern on the front and back sides. It is possible to provide an electronic circuit that can electrically connect the wiring patterns on the front and back sides of the circuit.
【図１】本発明の一実施例における電子回路装置の断面
図FIG. 1 is a sectional view of an electronic circuit device according to an embodiment of the present invention.
【図２】従来の電子回路装置の断面図FIG. 2 is a sectional view of a conventional electronic circuit device.
１ 絶縁基板 １ａ 傾斜部 ２ａ スルーホール 1 Insulating substrate 1a Slope 2a Through hole
Claims (1)
と、このスルーホールを介して前記絶縁基板の表裏の所
定の配線パターンに導通させる電子回路装置の製造方法
において、スルーホールの端面部に傾斜部を設けた後、
スルーホールを設けた電子回路装置の製造方法。1. A method of manufacturing an electronic circuit device in which a through hole is provided in an insulating substrate, and a predetermined wiring pattern on the front and back of the insulating substrate is electrically connected through the through hole, an inclined portion is provided at an end face portion of the through hole. After providing
A method of manufacturing an electronic circuit device having a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4845595A JPH08250854A (en) | 1995-03-08 | 1995-03-08 | Manufacture of electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4845595A JPH08250854A (en) | 1995-03-08 | 1995-03-08 | Manufacture of electronic circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08250854A true JPH08250854A (en) | 1996-09-27 |
Family
ID=12803837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4845595A Pending JPH08250854A (en) | 1995-03-08 | 1995-03-08 | Manufacture of electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08250854A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9494149B2 (en) | 2008-05-14 | 2016-11-15 | Mitsubishi Heavy Industries, Ltd. | Inverter-integrated electric compressor |
-
1995
- 1995-03-08 JP JP4845595A patent/JPH08250854A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9494149B2 (en) | 2008-05-14 | 2016-11-15 | Mitsubishi Heavy Industries, Ltd. | Inverter-integrated electric compressor |
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