JPH08250842A - Manufacture of electric circuit board and electric circuit board - Google Patents

Abstract

PURPOSE: To provide a method of manufacturing an electric circuit board and the board that eliminates the need of excessive working processes and surely obtains conductivity by eliminating cleaning work for the surface of a wiring pattern which come into contact with a metallic member before tightening screws. CONSTITUTION: In order to electrically connect a circuit wiring pattern 5 formed on the surface of a board 1 to a conductor member 6 to be grounded by means of a joining means 2, the member 6 is retained on the pattern 5 by inserting the joining means 2 through a main through hole 1b formed through the board 1 and a pair of conductors 4 and 9 are held on the pattern 5 by means of the means 2 after the conductors 4 and 9 are passed through a pair of auxiliary through hole 1a and 5a formed through the board 1 from the rear surface of the board 1. Then the conductors 4 and 9 are soldered to the pattern 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit board manufacturing method and an electric circuit board, and more particularly to an electric circuit board for electrically connecting a conductive pattern and a conductive member on the electric circuit board. is there.

[0002]

2. Description of the Related Art Conventionally, in an electric circuit board for electrically connecting a conductive pattern and a conductive member on the electric circuit board, for example, when grounding a casing, a ground on the electric circuit board is used. The metal fitting was grounded by fixing the metal fitting to the pattern with screws.

A typical example of a conventional configuration will be described with reference to the drawings. FIG. 4 is a side view of a conventional electric circuit board.
In the figure, a copper wiring pattern 105 for a ground pattern is provided on an electric circuit board 101, and plating such as solder is applied on the copper wiring pattern 105 so as to obtain conductivity in a contact state. Through holes are formed in this pattern 105, and while the screw 102 is in a penetrating state as shown in the drawing, it is screwed into a female screw machined by a screw tap on the metal member 106 connected to the frame ground. In this manner, the screw 102 is tightened to obtain the contact pressure, and the pattern and the metal member 106 are held in the joined state.

[0004]

However, according to the above-mentioned electric circuit board, since there is a flux remaining on the wiring pattern 105 during the solder flow, the metal fitting 106 is fixed with this flux interposed. As a result, the connection state becomes considerably unstable electrically.

Therefore, in order to prevent the occurrence of such a situation, a work step for removing the flux by cleaning the surface of the wiring pattern, which is the portion in contact with the metal member 106, with alcohol before the screw 102 is tightened is indispensable. And required extra man-hours.

Therefore, the present invention has been made in view of the above circumstances, and eliminates the washing work for washing the surface of the wiring pattern, which is the portion that comes into contact with the metal member before tightening the screws, thereby eliminating the need for extra work steps. It is an object of the present invention to provide an electric circuit board manufacturing method and an electric circuit board that can achieve high reliability.

[0007]

[Means for Solving the Problems] and

In order to solve the above problems and achieve the object, according to the present invention, the circuit wiring pattern formed on the surface of the substrate and the electrically conductive member to be grounded are electrically connected by the fastening means. A method for manufacturing an electric circuit board, comprising: holding the conductor member on the circuit wiring pattern by inserting the fastening means through a main through hole formed in the board; On the pattern, a pair of conductive wires are inserted from the back surface of the substrate through a pair of sub-through holes that are formed with the main through hole in between and held by the fastening means, and the conductive wires are connected to the circuit wiring pattern. It is characterized by soldering on.

Further, there is provided a method of manufacturing an electric circuit board, wherein the frame ground pattern and the signal ground pattern formed on the surface of the board and the electric conductor member to be grounded are electrically connected by fastening means. Of the frame ground pattern, the fastening member is inserted through the main through hole to hold the conductor member on the frame ground pattern, and the main through hole is formed on the frame ground pattern and the signal ground pattern. A pair of conductive wires are inserted from the back surface of the substrate through a pair of sub-through holes that are formed with holes in between and held by the fastening means, and the conductive wires are soldered to the frame ground pattern and the signal ground pattern. It is characterized by attaching.

Further, the fastening means is a screw made of a good conductor and is screwed into a female screw portion formed on the conductor member, and the washer is inserted into the screw head so that the conductor is connected to the board. It is characterized in that it is configured to be held on the back surface.

An electric circuit board for electrically connecting a circuit wiring pattern formed on the surface of the board and an electric conductor member to be grounded by a fastening means, and a main hole formed in the board. The fastening member is inserted through the through hole to hold the conductor member on the circuit wiring pattern, and a pair of sub through holes are formed on the circuit wiring pattern with the main through hole in between. It is characterized in that a pair of conductive wires are inserted from the back surface of the substrate via the above to be held by the fastening means, and the conductive wires are soldered onto the circuit wiring pattern.

[0011] Further, the frame ground pattern of the board, wherein the frame ground pattern and the signal ground pattern formed on the surface of the board are electrically connected to the grounded conductor member by fastening means. The conductor member is held on the frame ground pattern by inserting the fastening means through the main through hole formed in the pattern, and the main through hole is provided between the frame ground pattern and the signal ground pattern. Inserting a pair of conducting wires from the back surface of the substrate through the pair of sub-through holes formed as described above and holding them by the fastening means, and soldering the conducting wires to the frame ground pattern and the signal ground pattern. Is characterized by.

The fastening means is a screw made of a good conductor and is screwed into a female screw portion formed on the conductor member, and the washer is inserted into the screw head so that the conductor is connected to the board. It is characterized in that it is configured to be held on the back surface.

According to the above structure, a stable electrical connection can be achieved by fixing the conductor wire connected to the circuit wiring pattern of the electric circuit board to the metal member of the conductor member with, for example, a highly conductive screw. Always work to make it possible.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side view (a) and a plan view (b) showing a main structure of an electric circuit board according to a first embodiment.
Is. Further, FIG. 2 is a three-dimensional exploded view for forming the configuration of FIG. 1, and common components are denoted by the same reference numerals.

In FIGS. 1 and 2, the electric circuit board 1 is a so-called single-sided mounting type board, and a copper wiring pattern 5 for a ground pattern is provided on the lower surface as shown. Further, pattern holes 5a to be formed in a penetrating state together with through holes 1a shown by broken lines on the substrate 1 side are formed in advance in the pattern 5 in total for four positions as shown in the drawing.

Further, a through hole 1b formed in the same manner as the substrate 1 is formed at a substantially central portion of the pattern 5,
After inserting the good conductive screw 2 as shown in the figure,
The metal fitting 6 connected to the frame ground is screwed into the female screw portion 6a shown by the broken line to bring it into a fixed state as shown.

On the other hand, in this state, when there is a flux remaining on the wiring pattern 5 during the solder flow, the metal fitting 6 is fixed with the flux intervening, and an electrically unstable connection is made. It will be in a state. Therefore, a washer 3 is inserted into the head of the screw 2, and both ends of the screw 2 are inserted into the pattern hole portion 5a by the washer 3 and a copper wire jumper wire plated with tin or solder is used. Excessive stress is not applied to 4 and 9 and unnecessary movement of the jumper wire is suppressed. After setting in this way, the tip portions of the jumper wires 4 and 9 are inserted into the respective hole portions 5a of the pattern 5, and then fixed by the solder 7.

As described above, the metal member metal fitting 6 connected to the frame ground is fixed by the screw 2 to achieve some electrical continuity, and the electric current flows in the direction of the arrow in the drawing while the screw 2 Since the jumper wires 4 and 9 are electrically connected to each other through the washer 3, even if the metal fitting 6 is in an electrically unstable state on the pattern 5, the electric circuit board 1 can be reliably connected. The wiring pattern 5 and the metal fitting are electrically connected by soldering, and as a result, electricity can flow in the direction of the arrow in the figure.

From the above, the wiring pattern 5 is used during the solder flow.
The work step of cleaning the flux remaining on the top with alcohol or the like to remove the flux becomes unnecessary.

Next, FIG. 3 is an external perspective view (a) and a plan view (b) showing the essential structure of the electric circuit board according to the second embodiment. In FIG. 3, an example of connection between the frame ground and the wiring pattern on the circuit board is shown in the description of the first embodiment, but according to the second embodiment, the frame ground 5 and the signal ground are connected by the screw 2. It is configured so that it can be connected to 10.

As shown in FIG. 3, the frame ground 5 is formed on the electric circuit board 1 so as to have a convex shape, while the jumper wire 9 is inserted into the hole and then electrically connected. Is carried by the solder 7. On the other hand, the signal ground 10 is formed with a notch 10a having a shape that avoids the convex portion of the frame ground 5 as shown in the drawing, and the jumper wire 4 similarly makes electrical connection by the solder 7.

With the above structure, the signal system ground wiring pattern and the frame ground wiring pattern are reliably connected. That is, by tightening the screws,
The frame ground and signal ground can be connected.

As described above, according to the first embodiment, the screw is screwed to the metal member such as the frame ground through the jumper wire of the circuit board to ensure the electrical continuity and to improve the productivity. It is possible to improve (reduce the cleaning process of the connection part in the assembly line) and reduce the cost. Further, according to the configuration of the second embodiment, it is possible to further improve the noise resistance performance.

[0024]

As described above, according to the present invention,
An electric circuit board manufacturing method and an electric circuit board capable of reliably obtaining conductivity by removing the cleaning work for cleaning the surface of the wiring pattern, which is the portion in contact with the metal member before tightening the screws A circuit board can be provided.

[0025]

[Brief description of drawings]

FIG. 1 is a side view (a) and a plan view (b) showing a configuration of a first embodiment of the present invention.

2 is a three-dimensional exploded view of FIG. 1. FIG.

FIG. 3 is an external perspective view (a) and a plan view (b) showing a configuration of a second embodiment of the present invention.

FIG. 4 is a side view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electric circuit board 2 Highly conductive screw (fastening means) 3 Washer 4 Jumper wire (conductor wire) 5 Frame ground (circuit pattern) 6 Metal member (conductor member) 7 Solder 9 Jumper wire (conductor wire) 10 Signal ground

Claims (6)

[Claims] 1. A method of manufacturing an electric circuit board for electrically connecting a circuit wiring pattern formed on a surface of a board and an electric conductor member to be grounded by fastening means, the method comprising: The conductor member is held on the circuit wiring pattern by inserting the fastening means through the provided main through hole, and a pair of holes formed on the circuit wiring pattern with the main through hole in between. A method of manufacturing an electric circuit board, wherein a pair of conducting wires are inserted from the back surface of the substrate through the sub through holes, held by the fastening means, and the conducting wires are soldered onto the circuit wiring pattern. 2. A method of manufacturing an electric circuit board, wherein electrical connection is established between a frame ground pattern and a signal ground pattern formed on a surface of a board, and an electric conductor member to be grounded by a fastening means. The fastening member is inserted through the main through hole formed in the frame ground pattern to hold the conductor member on the frame ground pattern, and the main through hole is formed on the frame ground pattern and the signal ground pattern. A pair of conductive wires are inserted from the back surface of the substrate through a pair of sub-through holes that are formed with holes in between and held by the fastening means, and the conductive wires are soldered to the frame ground pattern and the signal ground pattern. A method for manufacturing an electric circuit board, comprising: attaching. 3. The fastening means is a screw made of a good conductor and is screwed into a female screw portion formed on the conductor member, and the washer is inserted into the screw head to connect the conductive wire to the board. The method for manufacturing an electric circuit board according to claim 1 or 2, wherein the electric circuit board is held on the back surface. 4. An electric circuit board for electrically connecting a circuit wiring pattern formed on the surface of the board and an electric conductor member to be grounded by a fastening means, the main circuit being provided in the board. The fastening member is inserted through the through hole to hold the conductor member on the circuit wiring pattern, and a pair of sub through holes are formed on the circuit wiring pattern with the main through hole in between. An electric circuit board, characterized in that a pair of conducting wires are inserted from the backside of the board via the holding means by the fastening means, and the conducting wires are soldered onto the circuit wiring pattern. 5. An electric circuit board for electrically connecting a frame ground pattern and a signal ground pattern formed on a surface of a board and a grounded electric conductor member by fastening means, the frame ground of the board. The conductive member is held on the frame ground pattern by inserting the fastening means through a main through hole formed in a pattern, and the main through hole is provided between the frame ground pattern and the signal ground pattern. Inserting a pair of conducting wires from the back surface of the substrate through the pair of sub-through holes formed as described above and holding them by the fastening means, and soldering the conducting wires to the frame ground pattern and the signal ground pattern. An electric circuit board characterized by. 6. The fastening means is a screw made of a good conductor and is screwed into a female screw portion formed on the conductor member, and the conducting wire is fixed to the substrate by a washer inserted through a screw head. The electric circuit board according to claim 4 or 5, wherein the electric circuit board is configured to be held on the back surface.