JPH0824095B2 - Multilayer film chip capacitors - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film chip capacitor provided with electrodes having good electrical contact.

[0002]

2. Description of the Related Art A conventional laminated film chip capacitor will be described below with reference to the drawings.

FIG. 3 is a diagram showing a schematic structure of a conventional laminated film chip capacitor. In FIG. 3, 31 is a dielectric layer made of a plastic film, 32 is a metal electrode layer formed by vacuum deposition, 33 is an electrode end surface,
Reference numeral 34 is an electrode lead layer formed by a metal spraying method.

The manufacturing method of the laminated film chip capacitor configured as described above will be described below with reference to the drawings.

As shown in FIG. 4, a plurality of dielectric layers 41 made of a plastic film and a plurality of metal electrode layers 42 formed by vacuum deposition are alternately stacked and bonded by a hot press method to have a plurality of capacitor elements. Obtain a wide base material. The base material is used as an electrode end face 43 of each capacitor element,
By cutting at 44, a long rod-shaped capacitor 45 as shown in FIG. 5 is obtained. Then, as shown in FIG. 6, the rod-shaped capacitors 45 and the separation plates 46 wider than the rod-shaped capacitors 45 are framed and fixed in a state of being alternately arranged, and after heat treatment is performed, metal electrodes are attached to the electrode end surfaces 43 and 44 of the rod-shaped capacitors 45. Was sprayed to form an electrode lead-out layer, the wide separation plate 46 was removed, and then cut to a predetermined size and an insulating coating was applied to the cut surface to obtain a laminated film chip capacitor as shown in FIG.

[0006]

The electrode lead-out layer in such a capacitor is formed by metal spraying, plating,
Although formed by a sputtering method or the like, they have various advantages and disadvantages.

In the metal spraying method, an electrode lead-out layer having a thickness of 0.2 to 1 mm can be formed in a short time. Therefore, a highly reliable component can be easily obtained, but the electrode lead-out layer has a large thickness. Unsuitable for chip components where very small dimensions are required.

On the other hand, the electrode lead-out layer formed by the plating method or the sputtering method is generally 5 to 2
Although it is as thin as 0 μm and is advantageous for chip parts, the former problem was corrosion of the internal metal electrodes, and the latter problem was that the adhesion between the electrode end face and the electrode lead layer was weak.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a laminated film chip capacitor excellent in shape and characteristics by enhancing the adhesion between the electrode end face and the electrode lead layer.

[0010]

In order to achieve this object, a laminated film chip capacitor according to the present invention is provided with an alcohol film from the end face of the electrode of the laminate to the upper and lower ends of the laminate.
Forming an organic metal layer composed of a cation and
It is provided with a U-shaped electrode lead layer on the layer.

[0011]

[Function] At least hydroxyl groups are present on the surface of the organic / inorganic material constituting the laminate. The organometallic layer is formed of several molecular layers containing at least a monolayer of alkoxide, and the reaction usually starts from the moment of contact, and the alkoxide undergoes a substitution reaction with the hydroxyl group on the surface of the laminate to directly chemically bond with it. Partly, the hydroxyl groups of the alcohol formed by the reaction of the alkoxide with the moisture in the air and the hydroxyl groups on the surface of the laminate are hydrogen-bonded to form a highly conductive contact.

Next, when a U-shaped electrode lead-out layer is formed by a sputtering method or a thermal spraying method, the energy released from the high energy state thermally decomposes the underlying alkoxide to cause a space between the organic metal layer and the electrode lead-out layer. Chemical bonding occurs.

In addition to the above mechanism, by providing the electrode lead-out layer not only in the electrode end face of the laminate but also in the upper and lower end portions in a U-shape, the adhesion area between the laminate and the electrode lead-out layer is increased. Expanded.

The introduction of the chemical bond and the expansion of the adhesion area enhance the adhesion between the laminate and the electrode lead layer.

[0015]

An embodiment of the present invention will be described below with reference to the drawings.

EXAMPLE FIG. 1 is a diagram showing a schematic structure of a laminated film chip capacitor of the present invention. In FIG. 1, 11 is a dielectric layer made of a plastic film, 12 is a metal electrode layer formed by vacuum deposition, 13 is an electrode end face, 14 is an organic metal layer made of an alkoxide, and 15 is a sputtering method. It is a U-shaped electrode lead layer.

First, a rod-shaped capacitor as shown in FIG. 5 was obtained by the same manufacturing method as the conventional one. Next, as shown in FIG. 2, the rod-shaped capacitors 21 and the separation plates 22 having a width narrower than the rod-shaped capacitors 21 were framed and fixed in a state of being alternately arranged, and heat-treated.
Then, the electrode end surfaces 23 and 24 of the rod-shaped capacitor 21 in which the internal electrodes are exposed in advance and the strip-shaped portions 25 and 2 protruding from the narrow separation plates 22 on the upper and lower sides of the rod-shaped capacitor 21.
Titanium diisopropoxybisacetylacetonate diluted with isopropyl alcohol was applied to 6, 27 and 28 and dried to form the organometallic layer 14.
That is, the end portions of the upper and lower surfaces of the laminate are
To form the organic metal layer 14. Subsequently, a U-shaped electrode lead-out layer 15 is provided by a sputtering method,
After removing the narrow separation plate 22, it is cut to a predetermined size and an insulating coating is applied to the cut surface to obtain a length 1.6 as shown in FIG.
A multilayer film chip capacitor having a width of 0.8 mm, a width of 0.8 mm and a height of 0.5 mm was obtained.

(Conventional Example) In the above-described embodiment, the electrode separation layer is formed only on the electrode end face of the laminated body without forming the organic metal layer 14 and using the wide separation plate 46 instead of the narrow separation plate 22. Then, a laminated film chip capacitor as shown in FIG. 3 was obtained.

(Comparative Example) A laminated film chip capacitor was obtained in the same manner as in the above-mentioned example except that the organic metal layer 14 was not formed.

Here, each of the laminated film chip capacitors 10 obtained in the above examples, conventional examples and comparative examples
A peel strength test was performed on 0 of the electrode lead layers by peeling them off under a load of 700 g. The results are shown in the following (Table 1).

[0021]

[Table 1]

As is clear from the above (Table 1), according to the present embodiment, the U-shaped electrode lead-out layer is provided through the organometallic layer to enhance the adhesive force between the laminate and the electrode lead-out layer. I found out that I could make it happen.

Although titanium alkoxide was used as the organic metal in the above examples, silane alkoxide,
Similar effects were obtained with tantalum alkoxide and the like.

Although the sputtering method is adopted as the method for forming the electrode lead-out layer, a similar effect can be obtained by a vacuum vapor deposition method, a chemical vapor deposition method or the like, and the result depends on the combination with the material constituting the laminate. Not allowed.

[0025]

The present invention as described above, according to the present invention is the electrode end face of the laminate and the strip-shaped part both upper and lower sides of the electrode end face side of the stack, A
By providing the U-shaped electrode lead-out layer via the organic metal layer made of lucoxide , the adhesion between the laminate and the electrode lead-out layer can be strengthened.

The organometallic layer is effective even if it is thin enough to obtain conduction due to the tunnel effect or the like. Furthermore, by providing an electrode lead-out layer in a U-shape not only on the electrode end face but also on the upper and lower end portions , a laminate Since the adhesion area between the electrode lead layer and the electrode extension layer is enlarged and the soldering area when the film chip capacitor is mounted on the substrate is enlarged, a laminated film chip capacitor having good electrical characteristics and mountability can be provided.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a laminated film chip capacitor of the present invention.

FIG. 2 is a perspective view showing an arrangement state of a rod-shaped capacitor and a narrow separation plate, which is one mode during the manufacturing process of the capacitor of the present invention.

FIG. 3 is a partially cutaway perspective view of a conventional laminated film chip capacitor.

FIG. 4 is a perspective view of a wide base material having a plurality of laminated film chip capacitor elements.

5 is a perspective view of a rod-shaped capacitor cut out from the wide base material of FIG.

6 is a perspective view showing an arrangement state of the rod-shaped capacitor and the wide separation plate of FIG.

[Explanation of symbols]

 11 Dielectric Layer 12 Metal Electrode Layer 13 Electrode End Face 14 Organic Metal Layer 15 Electrode Lead Layer

Claims (1)

[Claims] 1. Dielectric layers and metal electrode layers are stacked alternately.
A layered body, and the metal electrode layer inside the layered body is
Hook the exposed electrode end faces to the upper and lower end parts of the laminate.
To form an organic metal layer composed of alkoxide, and
A multilayer film chip capacitor characterized in that a U-shaped electrode lead layer is provided on the organic metal layer .