JPH08236739A - Sealing structure of ccd module - Google Patents

Abstract

PURPOSE: To provide a sealing structure of a CCD module for sufficiently protecting and covering the whole of a CCD chip, which is constructed such that a cover glass partly located on a resin sealing frame can be securely positioned at all times at a proper location upon resin sealing. CONSTITUTION: There is provided a sealing structure of a CCD module wherein a CCD chip 32 is placed on an insulating substrate 30 and a resin sealing frame 40 is disposed so as to surround the CCD chip, and a cover glass 36 is resin sealed on the resin seal ing frame through transparent resin 38 for protecting and covering an optical detection surface of the CCD chip. In the structure, the cover glass 36 is constructed and arranged such that part surrounded by the resin sealing frame is exposed to the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CCD (charge coupled device) module, and more particularly to a CCD module sealing structure in which a cover glass is resin-sealed with respect to a light receiving surface of a CCD chip.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a CCD module, as shown in FIGS. 8 and 9, a CCD chip 12 is mounted on a ceramic substrate 10 on which a required circuit pattern is formed. After a conductive connection is made between the substrate 10 and the substrate 10 by wire bonding 14, a cover glass 16 is provided on the light receiving surface side of the transparent resin 1 to protect the light receiving surface of the CCD chip 12.
It is sealed and fixed via 8.

However, in this case, in order to smoothly perform resin sealing, the CCD is mounted on the ceramic substrate 10.
A guard ring 20 as a resin sealing frame made of glass epoxy or the like is arranged so as to surround the chip 12, and the cover glass 16 is placed on the guard ring 20.

[0004]

However, the cover glass 16 may be configured so as to cover the entire guard ring 20, but in this case,
At the time of resin sealing, air bubbles generated when the resin is cured are accumulated on the inner surface of the cover glass 16 and it becomes difficult to remove them, and these air bubbles hinder the light receiving surface of the CCD chip 12.

When a space is provided above the resin and the cover glass 16 is hermetically arranged with respect to the guard ring 20, dew condensation occurs on the inner surface of the cover glass 16,
Similar to the above, it interferes with the light receiving surface of the CCD chip 12.

Therefore, for example, as shown in FIG. 10, by setting the size of the cover glass 16 to the minimum size necessary for protecting the light receiving surface of the CCD chip 12,
The advantage is that the material of the cover glass 16 can be saved.
However, in this case, if a glass material having a high specific gravity is used, the cover glass 16 may be displaced, for example, a part of the cover glass may sneak into the resin and come into contact with the wire bonding 14 to damage it.

As described above, the conventional CCD module is
Due to the various causes described above, there is a problem that the frequency of occurrence of defective products in which an appropriate image cannot be formed on the CCD chip 12 increases.

Therefore, an object of the present invention is to sufficiently protect and cover the whole of the CCD chip, and to remove air bubbles when sealing the cover glass partially located on the resin sealing frame. An object of the present invention is to provide a sealing structure for a CCD module, which is arranged so as to be smoothly achieved.

[0009]

In order to achieve the above object, the sealing structure for a CCD module according to the present invention is such that a CCD chip is placed on an insulating substrate and a resin is sealed so as to surround the CCD chip. A CCD in which a frame is arranged, and a cover glass for protecting and covering the light receiving surface of the CCD chip is resin-sealed on the resin sealing frame via a transparent resin.
In the module sealing structure, the cover glass is characterized in that the cover glass is configured and arranged so that a part surrounded by the resin sealing frame can be exposed to the outside.

In this case, the cover glass is formed in a rectangular shape in a plane, and the distance between the pair of opposed side edge portions is
The distance can be set shorter than the distance between the opposing inner surfaces of the resin sealing frame.

Further, the cover glass is formed in a polygonal shape of a quadrangle or more in a plane, and at least one of the resin sealing frames is formed.
It can also be configured and arranged so that the one corner can be exposed to the outside.

Further, a counterbore into which both ends of the cover glass can be fitted is provided in a part of the resin sealing frame, and a required distance can be provided between the inner surface of the counterbore and both ends of the cover glass. ..

In this case, the depth of the counterbore provided in a part of the resin sealing frame is set to a position higher than the highest position of wire bonding for connecting the conductors of the CCD chip.

Furthermore, in the resin sealing frame, CC
It is also possible to cover the entire D chip with a transparent resin and to mount and fix the cover glass above the transparent resin with a space therebetween.

[0015]

According to the CCD module sealing structure of the present invention, the cover glass is configured and arranged so that the part surrounded by the resin sealing frame can be exposed to the outside, so that the resin can be properly cured. The removal of bubbles can be smoothly achieved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of a CCD module sealing structure according to the present invention will be described in detail below with reference to the accompanying drawings.

1 and 2 show an embodiment of a sealing structure for a CCD module according to the present invention.
2 is a schematic plan view, and FIG. 2 is a sectional view taken along line II-II of the CCD module shown in FIG. That is, in FIGS. 1 and 2, reference numeral 30 is an insulating substrate made of ceramics or the like, 32 is a CCD chip, and 34 is the CCD chip 32.
And the ceramic substrate 30 are electrically connected by wire bonding, 36 is a cover glass provided on the light receiving surface side of the CCD chip 32 to protect the light receiving surface of the CCD chip 32, and 38 is the cover glass 36 of the CCD chip 3
Reference numeral 40 denotes a transparent resin for sealing and fixing on the upper surface of 2, and 40 denotes a guard ring made of glass epoxy or the like arranged on the ceramic substrate 30 so as to surround the CCD chip 32. The above configuration is
The structure is basically the same as that of the conventional CCD module.

However, in this embodiment, in the guard ring 40 forming the rectangular resin sealing frame, the pair of side edge portions facing each other are separated from the spacing distance of the inner surfaces of the resin sealing frame which face each other. A rectangular cover glass 36 having a short distance is arranged and arranged.

With this structure, a part of the resin filled in the resin sealing frame can be exposed to the outside without being sealed by the cover glass 36. Therefore, the part of the resin exposed to the outside can be exposed. As a result, it is possible to smoothly remove air bubbles generated when the resin is cured.

FIG. 3 is a schematic plan view showing another embodiment of the sealing structure of the CCD module according to the present invention. That is, in this embodiment, the rectangular cover glass 36 is used.
Instead, a cover glass 36 having an octagonal structure in a plane is used. In this case, in the corner portion of the resin sealing frame, a part of the resin filled in the sealing frame can be exposed to the outside.

With this structure, the bubbles generated during the curing of the resin can be smoothly removed just as in the above embodiment. Not only the octagonal structure, but also other polygonal shapes such as a quadrangle or more, if at least one corner of the resin sealing frame can be exposed to the outside, the desired purpose can be obtained. Can be achieved.

4 to 6 show still another embodiment of the sealing structure of the CCD module according to the present invention, and are schematic sectional views of the CCD module showing the respective sealing steps. It should be noted that, for convenience of explanation, the same components as those of the above-described embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

That is, in this embodiment, in the rectangular resin sealing frame 50, counterbores (step portions) 42, 42 having substantially the same width as the cover glass 36 are engraved in the opposing frame portions. In this case, the counterbore (step portion) 42, 4
The depth of 2 is set to be higher than the highest position of the wire bonding 34 connected to the CCD chip 32.

In the present embodiment, however, as shown in FIG. 4, at the time of resin sealing, the counterbore 42, 42 is first transparent in the frame of the guard ring 40 forming the resin sealing frame. Resin 38a is injected. Then
As shown in FIG. 5, the cover glass 36 is placed on the transparent resin 38 and the resin 38 is cured. In this case, by providing a required separation distance between the inner surfaces of the counterbores 42, 42 and both ends of the cover glass 36, it is possible to smoothly remove air bubbles generated at the time of curing the resin from this portion. it can. As a result, as shown in FIG. 6, the cover glass 36 can be stably placed and fixed on the bottom surfaces of the counterbores 42, 42 as the resin hardens.

FIG. 7 is a schematic sectional view showing still another embodiment of the sealing structure of the CCD module according to the present invention.

That is, in the present embodiment, CC is provided in the frame of the guard ring 40 forming the resin sealing frame.
A transparent resin 38 'is coated so as to surround the entire D chip 32, and a cover glass 36 configured as shown in FIGS. 1 to 3 is mounted above the transparent resin 38' with a space 44 therebetween. It has a fixed structure.

With this structure, as in the case of the above-described embodiment, it is possible to smoothly remove the air bubbles generated at the time of curing the resin and to prevent the occurrence of dew condensation on the inner surface of the cover glass 36. .

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and many design changes can be made without departing from the spirit of the present invention.

[0029]

As is apparent from the above-described embodiments, according to the sealing structure of the CCD module of the present invention, the CCD chip is placed on the insulating substrate and the resin is sealed so as to surround the CCD chip. A CCD in which a stop frame is arranged, and a cover glass for protecting and covering the light receiving surface of the CCD chip is resin-sealed on the resin sealing frame via a transparent resin.
In the module sealing structure, the cover glass is configured and arranged so that the portion surrounded by the resin sealing frame can be exposed to the outside, so that proper curing of the resin and smooth removal of bubbles can be achieved. can do.

In particular, according to the sealing structure of the CCD module of the present invention, it is possible to improve the productivity of this kind of CCD module with a simple structure, excellent degassing effect, and reducing the incidence of defective products. The effect of contribution is extremely large.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of a sealing structure of a CCD module according to the present invention.

FIG. 2 is a schematic sectional view taken along line II-II of the CCD module shown in FIG.

FIG. 3 is a schematic plan view showing another embodiment of the sealing structure of the CCD module according to the present invention.

FIG. 4 is a schematic cross-sectional view showing still another embodiment of the sealing structure of the CCD module according to the present invention.

5 is a schematic sectional view of a CCD module showing a sealing step of the sealing structure shown in FIG.

6 is a schematic cross-sectional view of a CCD module showing a sealing step of the sealing structure shown in FIG.

FIG. 7 is a schematic sectional view showing another embodiment of the sealing structure of the CCD module according to the present invention.

FIG. 8 is a schematic plan view showing a configuration of a conventional CCD module sealing structure.

9 is a schematic cross-sectional view taken along line IX-IX of the CCD module shown in FIG.

FIG. 10 is a schematic cross-sectional view showing another configuration example of the conventional CCD module sealing structure.

[Explanation of symbols]

 30 Insulating Substrate 32 CCD Chip 34 Wire Bonding 36 Cover Glass 38 Transparent Resin 40 Guide Ring 42 Counterbore (Step) 44 Space

Claims (6)

[Claims] 1. A CCD chip is placed on an insulating substrate, a resin sealing frame is arranged so as to surround the CCD chip, and the light receiving surface of the CCD chip is protected and covered on the resin sealing frame. In a sealing structure of a CCD module in which a cover glass is resin-sealed with a transparent resin, the cover glass is configured and arranged so that a part surrounded by a resin sealing frame can be exposed to the outside. CC
D module sealing structure. 2. The cover glass is formed in a rectangular shape in a plane, and a separation distance between a pair of opposed side edge portions is shorter than a separation distance between opposed inner surfaces of the resin sealing frame. A sealing structure for the described CCD module. 3. The cover glass is formed in a polygonal shape of a quadrangle or more in a plane and is arranged so that at least one corner of the resin sealing frame can be exposed to the outside. CCD module sealing structure. 4. A counterbore into which both ends of the cover glass can be fitted is provided in a part of the resin sealing frame, and a required distance is provided between the inner surface of the counterbore and both ends of the cover glass. Item 2. A sealing structure for a CCD module according to item 1. 5. The sealing of a CCD module according to claim 4, wherein the depth of the counterbore provided in a part of the resin sealing frame is set to a position higher than the highest position of wire bonding for connecting the conductors of the CCD chip. Stop structure. 6. The resin sealing frame is covered with a transparent resin so as to surround the entire CCD chip, and a cover glass is placed and fixed above the transparent resin via a space. 3. A sealing structure for a CCD module according to any one of 3 above.