JPH08241976A - Resin sealing method of ccd module - Google Patents
Resin sealing method of ccd moduleInfo
- Publication number
- JPH08241976A JPH08241976A JP7045218A JP4521895A JPH08241976A JP H08241976 A JPH08241976 A JP H08241976A JP 7045218 A JP7045218 A JP 7045218A JP 4521895 A JP4521895 A JP 4521895A JP H08241976 A JPH08241976 A JP H08241976A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing frame
- ccd
- cover glass
- ccd chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＣＣＤ（電荷結合素
子）モジュールに係り、特にＣＣＤチップの受光面に対
してカバーガラスを樹脂封止するＣＣＤモジュールの樹
脂封止方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CCD (charge coupled device) module, and more particularly to a resin sealing method for a CCD module in which a cover glass is resin-sealed on a light receiving surface of a CCD chip.
【０００２】[0002]
【従来の技術】従来、ＣＣＤモジュールを製造するに際
しては、図５および図６に示すように、所要の回路パタ
ーンを形成したセラミックス基板１０上にＣＣＤチップ
１２をマウントし、このＣＣＤチップ１２とセラミック
ス基板１０との間をワイヤーボンディング１４により導
通接続を行った後、ＣＣＤチップ１２の受光面を保護す
るため、その受光面側にカバーガラス１６を透明樹脂１
８を介して封止固定している。2. Description of the Related Art Conventionally, when manufacturing a CCD module, as shown in FIGS. 5 and 6, a CCD chip 12 is mounted on a ceramic substrate 10 on which a required circuit pattern is formed. After a conductive connection is made between the substrate 10 and the substrate 10 by wire bonding 14, a cover glass 16 is provided on the light receiving surface side of the transparent resin 1 to protect the light receiving surface of the CCD chip 12.
It is sealed and fixed via 8.
【０００３】しかるに、この場合、樹脂封止を円滑に行
うため、セラミックス基板１０上において、前記ＣＣＤ
チップ１２を取り囲むようにガラスエポキシ等で構成し
た樹脂封止枠としてのガードリング２０を配置し、この
ガードリング２０の上に前記カバーガラス１６を載置し
ている。However, in this case, in order to smoothly perform resin sealing, the CCD is mounted on the ceramic substrate 10.
A guard ring 20 as a resin sealing frame made of glass epoxy or the like is arranged so as to surround the chip 12, and the cover glass 16 is placed on the guard ring 20.
【０００４】しかるに、このカバーガラス１６は、一般
に前記ガードリング２０の全体を覆うように構成したも
のを使用し、封止用樹脂１８としてシリコーン（ケイ素
樹脂）を使用しているが、前記樹脂の硬化時に気泡が多
量に発生して、これら気泡がカバーガラス１６の内面に
滞留して除去することが困難となり、これら気泡の存在
がＣＣＤチップ１２の受光面に対して障害となる。However, this cover glass 16 is generally constructed so as to cover the entire guard ring 20, and silicone (silicon resin) is used as the sealing resin 18. A large amount of bubbles are generated during curing, and it becomes difficult for these bubbles to stay and be removed on the inner surface of the cover glass 16, and the existence of these bubbles hinders the light receiving surface of the CCD chip 12.
【０００５】このため、例えばカバーガラス１６の寸法
を、ＣＣＤチップ１２の受光面を保護するために必要最
少限の大きさとすることにより、カバーガラス１６の材
料の節約と共に、封止用樹脂に発生する気泡を外気に露
呈した部分より容易に脱泡することができるようにした
工夫もなされている。Therefore, for example, by setting the size of the cover glass 16 to the minimum size necessary for protecting the light receiving surface of the CCD chip 12, the material of the cover glass 16 is saved and the resin for sealing is generated. It is also devised to make it easier to remove air bubbles from the exposed air.
【０００６】[0006]
【発明が解決しようとする課題】しかるに、前述した封
止用樹脂として使用するシリコーンの硬化に際して、気
泡が多量に発生する原因としては、シリコーンに空気が
混入していること、およびガードリング２０である樹脂
封止枠やワイヤーボンディング１４のためのダイボンド
剤にシリコーンが含浸した場合に、前記封止枠やダイボ
ンド剤から気泡が発生することが考えられる。また、シ
リコーンは、硬化速度が速いため、気泡が抜けきらない
内に硬化してしまう。このため、ＣＣＤモジュールとし
て、ＣＣＤチップ１２において適正な像を結ぶことがで
きない不良品の発生頻度が高くなる等の難点がある。However, the reason why a large amount of air bubbles are generated when the silicone used as the sealing resin is cured is that air is mixed in the silicone and that the guard ring 20 is used. When silicone is impregnated in a resin bonding frame or a die bonding agent for the wire bonding 14, bubbles may be generated from the sealing frame or the die bonding agent. In addition, since silicone has a high curing speed, it cures before bubbles are completely removed. Therefore, as a CCD module, there is a problem in that the frequency of occurrence of defective products in which an appropriate image cannot be formed on the CCD chip 12 increases.
【０００７】そこで、本発明の目的は、ＣＣＤチップの
全体を十分に保護被覆するために、樹脂封止枠の上にカ
バーガラスを配置して樹脂封止を行うに際して、封止用
樹脂からの気泡の除去を円滑に達成すると共に、樹脂お
よびカバーガラスにおけるクラックの発生を確実に防止
することができるＣＣＤモジュールの樹脂封止方法を提
供することにある。Therefore, an object of the present invention is to dispose a cover glass on a resin sealing frame and perform resin sealing in order to sufficiently protect and protect the entire CCD chip. It is an object of the present invention to provide a resin sealing method for a CCD module, which can smoothly achieve the removal of bubbles and reliably prevent the generation of cracks in the resin and the cover glass.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するた
め、本発明に係るＣＣＤモジュールの樹脂封止方法は、
絶縁基板上にＣＣＤチップを載置すると共に、このＣＣ
Ｄチップを取り囲むように樹脂封止枠を配置し、この樹
脂封止枠の上に前記ＣＣＤチップの受光面を保護被覆す
るカバーガラスを透明樹脂を介して樹脂封止してなるＣ
ＣＤモジュールの樹脂封止方法において、樹脂封止枠内
において、透明樹脂を、前記封止枠内面とＣＣＤチップ
に対しコーティングするようにして充填すると共に、加
熱条件下に脱泡を行って仮硬化させ、次いで仮硬化した
樹脂の上部に透明樹脂を補充すると共に、加熱条件下に
脱泡を行い、その後前記樹脂の上部にカバーガラスを載
置して前記樹脂を硬化させることを特徴とする。In order to achieve the above-mentioned object, a resin sealing method for a CCD module according to the present invention comprises:
The CCD chip is placed on the insulating substrate and the CC
A resin sealing frame is arranged so as to surround the D chip, and a cover glass for protecting and covering the light receiving surface of the CCD chip is resin-sealed on the resin sealing frame through a transparent resin.
In a resin sealing method for a CD module, a transparent resin is filled in a resin sealing frame so as to coat the inner surface of the sealing frame and a CCD chip, and defoaming is performed under heating conditions to temporarily cure the resin. Then, the transparent resin is replenished to the upper portion of the temporarily cured resin, and defoaming is performed under heating conditions, and then the cover glass is placed on the upper portion of the resin to cure the resin.
【０００９】この場合、樹脂封止枠内において、透明樹
脂を、前記封止枠の最上部より低いレベルまで充填する
と共に、約５０〜７０℃において脱泡を行って仮硬化さ
せ、次いで仮硬化した樹脂の上部に対し、前記封止枠の
最上部のレベルまで透明樹脂を補充注入すると共に、約
５０〜７０℃において脱泡を行い、その後前記樹脂の上
部にカバーガラスを載置して前記樹脂を硬化させること
により、ＣＣＤモジュールの樹脂封止を行うことができ
る。In this case, in the resin encapsulation frame, the transparent resin is filled to a level lower than the uppermost part of the encapsulation frame, degassed at about 50 to 70 ° C. to temporarily cure, and then temporarily cure. The transparent resin was replenished and injected to the uppermost level of the sealing frame and defoamed at about 50 to 70 ° C., and then a cover glass was placed on the upper part of the resin. By curing the resin, the CCD module can be resin-sealed.
【００１０】[0010]
【作用】本発明に係るＣＣＤモジュールの樹脂封止方法
によれば、樹脂封止枠内において、透明樹脂を、前記封
止枠内面とＣＣＤチップに対しコーティングするように
して充填すると共に、加熱条件下に脱泡を行って仮硬化
させ、次いで仮硬化した樹脂の上部に透明樹脂を補充す
ると共に、加熱条件下に脱泡を行い、その後前記樹脂の
上部にカバーガラスを載置て前記樹脂を硬化させること
により、樹脂の気泡除去を円滑に達成し得ると共に、樹
脂の硬化後における熱収縮を十分許容することができ、
透明樹脂およびカバーガラスにおけるクラックの発生
を、確実に防止することができる。According to the resin sealing method of the CCD module of the present invention, the transparent resin is filled in the resin sealing frame so as to coat the inner surface of the sealing frame and the CCD chip, and the heating condition is set. Defoaming is performed below to temporarily cure, then the transparent resin is replenished on top of the temporarily cured resin, and defoaming is performed under heating conditions, and then a cover glass is placed on top of the resin to remove the resin. By curing, it is possible to smoothly achieve the removal of air bubbles in the resin, and it is possible to sufficiently allow the heat shrinkage of the resin after curing,
It is possible to reliably prevent the occurrence of cracks in the transparent resin and the cover glass.
【００１１】[0011]
【実施例】次に、本発明に係るＣＣＤモジュールの樹脂
封止方法の実施例につき、添付図面を参照しながら以下
詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a resin sealing method for a CCD module according to the present invention will be described in detail below with reference to the accompanying drawings.
【００１２】図１ないし図３は、本発明に係るＣＣＤモ
ジュールの樹脂封止方法の一実施例を示すものであり、
それぞれ樹脂封止工程を示す概略断面図である。すなわ
ち、図１ないし図３において、参照符号３０はセラミッ
クス等からなる絶縁基板、３２はＣＣＤチップ、３４は
前記ＣＣＤチップ３２とセラミックス基板３０との間を
導通接続するためのワイヤーボンディング、３６は前記
ＣＣＤチップ３２の受光面を保護するためにその受光面
側に設けられるカバーガラス、３８および３９は前記カ
バーガラス３６をＣＣＤチップ３２の上面において封止
固定するための透明樹脂、４０は前記セラミックス基板
３０上において前記ＣＣＤチップ３２を取り囲むように
配置したガラスエポキシ等で構成してなるガードリング
をそれぞれ示す。1 to 3 show an embodiment of a resin sealing method for a CCD module according to the present invention,
It is a schematic sectional drawing which shows each resin sealing process. That is, in FIG. 1 to FIG. 3, reference numeral 30 is an insulating substrate made of ceramics or the like, 32 is a CCD chip, 34 is wire bonding for electrically connecting the CCD chip 32 and the ceramics substrate 30, and 36 is the above-mentioned. A cover glass provided on the light receiving surface side for protecting the light receiving surface of the CCD chip 32, 38 and 39 are transparent resins for sealing and fixing the cover glass 36 on the upper surface of the CCD chip 32, and 40 is the ceramic substrate. The guard rings formed of glass epoxy or the like are arranged on 30 so as to surround the CCD chip 32.
【００１３】しかるに、本発明においては、樹脂封止枠
を形成するガードリング４０の枠内において、図１に示
すように、シリコーン等の透明樹脂３８を、前記封止枠
の最上部より低いレベルで、前記封止枠の内面およびＣ
ＣＤチップ３２をコーティングし得るように初期充填
し、約５０〜７０℃の加熱条件下に脱泡する。このよう
にして十分脱泡を行った後、約１２０〜１５０℃で、約
１０〜３０分間保持して樹脂３８を仮硬化させる。次い
で、図２に示すように、仮硬化した樹脂３８の上部に対
し、前記封止枠の最上部のレベルまでシリコーン等の透
明樹脂３９を補充注入し、約５０〜７０℃の加熱条件下
に脱泡する。その後、前記樹脂３９の上部にカバーガラ
ス３６を載置して、約１５０℃で、約１〜４時間保持す
ることにより前記樹脂３９を硬化させる（図３参照）。However, in the present invention, as shown in FIG. 1, the transparent resin 38 of silicone or the like is applied to a level lower than the uppermost portion of the sealing frame in the frame of the guard ring 40 forming the resin sealing frame. And the inner surface of the sealing frame and C
The CD chip 32 is initially filled so that it can be coated, and degassed under heating conditions of about 50 to 70 ° C. After sufficiently defoaming in this way, the resin 38 is temporarily cured by holding at about 120 to 150 ° C. for about 10 to 30 minutes. Then, as shown in FIG. 2, a transparent resin 39 such as silicone is refilled and injected into the upper portion of the temporarily cured resin 38 up to the level of the uppermost part of the sealing frame, and is heated to about 50 to 70 ° C. Defoam. After that, the cover glass 36 is placed on the resin 39, and the resin 39 is cured by holding it at about 150 ° C. for about 1 to 4 hours (see FIG. 3).
【００１４】このように構成することにより、本実施例
における樹脂封止方法によれば、図４に示すように、樹
脂の気泡除去を円滑に達成し得ると共に、樹脂の硬化後
における熱収縮を十分許容することができ、透明樹脂３
８、３９およびカバーガラス３６におけるクラックの発
生を、確実に防止することができる。With this structure, according to the resin sealing method of the present embodiment, as shown in FIG. 4, removal of air bubbles in the resin can be achieved smoothly, and heat shrinkage of the resin after curing is achieved. Can be sufficiently tolerated, transparent resin 3
It is possible to reliably prevent the occurrence of cracks in the cover glass 36 and the cover glass 36.
【００１５】以上、本発明の好適な実施例について説明
したが、本発明は前記実施例に限定されることなく、本
発明の精神を逸脱しない範囲内において多くの設計変更
をすることができる。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and many design changes can be made without departing from the spirit of the present invention.
【００１６】[0016]
【発明の効果】前述した実施例から明らかなように、本
発明に係るＣＣＤモジュールの樹脂封止方法によれば、
絶縁基板上にＣＣＤチップを載置すると共に、このＣＣ
Ｄチップを取り囲むように樹脂封止枠を配置し、この樹
脂封止枠の上に前記ＣＣＤチップの受光面を保護被覆す
るカバーガラスを透明樹脂を介して樹脂封止してなるＣ
ＣＤモジュールの樹脂封止方法において、樹脂封止枠内
において、透明樹脂を、前記封止枠内面とＣＣＤチップ
に対しをコーティングするようにして充填すると共に、
加熱条件下に脱泡を行って仮硬化させ、次いで仮硬化し
た樹脂の上部に透明樹脂を補充すると共に、加熱条件下
に脱泡を行い、その後前記樹脂の上部にカバーガラスを
載置して前記樹脂を硬化させることにより、樹脂の気泡
除去を強制的にしかも円滑に達成し得ると共に、樹脂の
硬化後における熱収縮を十分許容することができ、透明
樹脂およびカバーガラスにおけるクラックの発生を、確
実に防止することができる。As is apparent from the above-described embodiments, according to the resin sealing method for the CCD module of the present invention,
The CCD chip is placed on the insulating substrate and the CC
A resin sealing frame is arranged so as to surround the D chip, and a cover glass for protecting and covering the light receiving surface of the CCD chip is resin-sealed on the resin sealing frame through a transparent resin.
In a resin sealing method for a CD module, a transparent resin is filled in a resin sealing frame so as to coat the inner surface of the sealing frame and a CCD chip, and
Defoam under heating conditions to temporarily cure, then refill transparent resin on top of the temporarily cured resin, defoam under heating conditions, and then place a cover glass on top of the resin. By curing the resin, it is possible to forcibly and smoothly achieve bubble removal of the resin, heat shrinkage of the resin after curing can be sufficiently allowed, and the occurrence of cracks in the transparent resin and the cover glass, It can be surely prevented.
【００１７】特に、本発明によるＣＣＤモジュールの封
止構造によれば、簡単な構成で、しかも気泡の除去を確
実に達成し、不良品の発生率を低減して、この種ＣＣＤ
モジュールの生産性の向上に寄与する効果は極めて大き
い。Particularly, according to the sealing structure of the CCD module of the present invention, the removal of bubbles can be surely achieved with a simple structure, the rate of defective products can be reduced, and this type of CCD can be obtained.
The effect of contributing to the improvement of module productivity is extremely large.
【図１】本発明に係るＣＣＤモジュールの樹脂封止方法
の一実施例を示す概略断面図である。FIG. 1 is a schematic sectional view showing an embodiment of a resin sealing method for a CCD module according to the present invention.
【図２】図１に示すＣＣＤモジュールの樹脂封止工程を
示す線概略断面図である。FIG. 2 is a schematic line sectional view showing a resin sealing step of the CCD module shown in FIG.
【図３】図１に示すＣＣＤモジュールの樹脂封止工程を
示す線概略断面図である。FIG. 3 is a schematic line sectional view showing a resin sealing step of the CCD module shown in FIG.
【図４】図３に示す樹脂封止を行ったＣＣＤモジュール
の概略断面図である。FIG. 4 is a schematic cross-sectional view of the CCD module shown in FIG. 3, which is resin-sealed.
【図５】従来のＣＣＤモジュールの封止構造の構成を示
す概略平面図である。FIG. 5 is a schematic plan view showing a structure of a conventional CCD module sealing structure.
【図６】図５に示すＣＣＤモジュールのVI−VI線概略断
面図である。6 is a schematic sectional view of the CCD module shown in FIG. 5, taken along line VI-VI.
３０ 絶縁基板 ３２ ＣＣＤチップ ３４ ワイヤーボンディング ３６ カバーガラス ３８ 透明樹脂（初期充填） ３９ 透明樹脂（補充注入） ４０ ガイドリング 30 Insulating Substrate 32 CCD Chip 34 Wire Bonding 36 Cover Glass 38 Transparent Resin (Initial Filling) 39 Transparent Resin (Replenishment Injection) 40 Guide Ring
Claims (2)
共に、このＣＣＤチップを取り囲むように樹脂封止枠を
配置し、この樹脂封止枠の上に前記ＣＣＤチップの受光
面を保護被覆するカバーガラスを透明樹脂を介して樹脂
封止してなるＣＣＤモジュールの樹脂封止方法におい
て、 樹脂封止枠内において、透明樹脂を、前記封止枠内面と
ＣＣＤチップに対しコーティングするようにして充填す
ると共に、加熱条件下に脱泡を行って仮硬化させ、次い
で仮硬化した樹脂の上部に透明樹脂を補充すると共に、
加熱条件下に脱泡を行い、その後前記樹脂の上部にカバ
ーガラスを載置して前記樹脂を硬化させることを特徴と
するＣＣＤモジュールの樹脂封止方法。1. A CCD chip is placed on an insulating substrate, a resin sealing frame is arranged so as to surround the CCD chip, and the light receiving surface of the CCD chip is protected and covered on the resin sealing frame. In a resin sealing method for a CCD module in which a cover glass is resin-sealed with a transparent resin, a transparent resin is filled in a resin sealing frame so as to coat the inner surface of the sealing frame and the CCD chip. In addition to defoaming under heating conditions to temporarily cure, and then refill the transparent resin on top of the temporarily cured resin,
A resin encapsulation method for a CCD module, comprising defoaming under a heating condition, and then placing a cover glass on the resin to cure the resin.
記封止枠の最上部より低いレベルまで充填すると共に、
約５０〜７０℃において脱泡を行って仮硬化させ、次い
で仮硬化した樹脂の上部に対し、前記封止枠の最上部の
レベルまで透明樹脂を補充注入すると共に、約５０〜７
０℃において脱泡を行い、その後前記樹脂の上部にカバ
ーガラスを載置して前記樹脂を硬化させてなる請求項１
記載のＣＣＤモジュールの樹脂封止方法。2. The resin sealing frame is filled with transparent resin to a level lower than the uppermost part of the sealing frame, and
Defoaming is performed at about 50 to 70 ° C. to temporarily cure, and then transparent resin is replenished and injected to the uppermost level of the sealing frame to the top of the temporarily cured resin, and about 50 to 7
The defoaming is performed at 0 ° C., and then a cover glass is placed on the resin to cure the resin.
7. A method for sealing a CCD module with a resin as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04521895A JP3168859B2 (en) | 1995-03-06 | 1995-03-06 | Resin sealing method for CCD module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04521895A JP3168859B2 (en) | 1995-03-06 | 1995-03-06 | Resin sealing method for CCD module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08241976A true JPH08241976A (en) | 1996-09-17 |
| JP3168859B2 JP3168859B2 (en) | 2001-05-21 |
Family
ID=12713137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04521895A Expired - Fee Related JP3168859B2 (en) | 1995-03-06 | 1995-03-06 | Resin sealing method for CCD module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3168859B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774481B2 (en) * | 2000-08-28 | 2004-08-10 | Canon Kabushiki Kaisha | Solid-state image pickup device |
| WO2004044877A3 (en) * | 2002-11-11 | 2004-12-02 | Cotco Internat Ltd | A display device and method for making same |
| US6861683B2 (en) | 2001-04-11 | 2005-03-01 | Dr. Johannes Heidenhain Gmbh | Optoelectronic component using two encapsulating materials and the method of making the same |
| JP2014222695A (en) * | 2013-05-13 | 2014-11-27 | アオイ電子株式会社 | Semiconductor device and method for manufacturing the same |
| WO2022118535A1 (en) * | 2020-12-03 | 2022-06-09 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor module and method for manufacturing same |
-
1995
- 1995-03-06 JP JP04521895A patent/JP3168859B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774481B2 (en) * | 2000-08-28 | 2004-08-10 | Canon Kabushiki Kaisha | Solid-state image pickup device |
| US6861683B2 (en) | 2001-04-11 | 2005-03-01 | Dr. Johannes Heidenhain Gmbh | Optoelectronic component using two encapsulating materials and the method of making the same |
| WO2004044877A3 (en) * | 2002-11-11 | 2004-12-02 | Cotco Internat Ltd | A display device and method for making same |
| JP2014222695A (en) * | 2013-05-13 | 2014-11-27 | アオイ電子株式会社 | Semiconductor device and method for manufacturing the same |
| WO2022118535A1 (en) * | 2020-12-03 | 2022-06-09 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor module and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3168859B2 (en) | 2001-05-21 |
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