JPH0822486B2 - Substrate holding device - Google Patents
Substrate holding deviceInfo
- Publication number
- JPH0822486B2 JPH0822486B2 JP61238121A JP23812186A JPH0822486B2 JP H0822486 B2 JPH0822486 B2 JP H0822486B2 JP 61238121 A JP61238121 A JP 61238121A JP 23812186 A JP23812186 A JP 23812186A JP H0822486 B2 JPH0822486 B2 JP H0822486B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- holder
- substrate
- mounting
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、板状の基板、特に半導体ウエハ等のように
薄くて可撓性を有する基板を真空作用下で平面に保持す
る装置に関する。Description: TECHNICAL FIELD The present invention relates to a device for holding a flat substrate, particularly a thin and flexible substrate such as a semiconductor wafer, on a flat surface under vacuum action.
半導体ウエハはフォトリソグラフィーの工程におい
て、その表面に光学的手段により高解像度のパターンが
露光されるものであるから、半導体ウエハを真空吸着に
より保持する装置に対しても当然に高精度の平面度が要
求される。ウエハの平面度を阻害する原因の１つとし
て、ウエハとその保持装置との間に塵埃粒子が介在する
ことが上げられる。そのため従来のウエハホルダーにあ
つては、特公昭60−15147号に示すように、ウエハを保
持する多数のピンの先端接触面積をできるだけ小さくす
る工夫がなされている。しかし、それでもピン先端に塵
埃が付着することは避けられないので、時々ピン先端を
清掃しなければならない。また、この従来技術のように
多数のピンをホルダーに植設する構成では、ホルダーの
平面度を出すのに大変である。Since the surface of a semiconductor wafer is exposed with a high-resolution pattern by an optical means in the photolithography process, the flatness with high precision is naturally obtained even for a device that holds the semiconductor wafer by vacuum suction. Required. One of the causes of impeding the flatness of the wafer is the presence of dust particles between the wafer and the holding device. Therefore, in the conventional wafer holder, as shown in Japanese Examined Patent Publication No. 60-15147, the tip contact areas of many pins for holding the wafer are designed to be as small as possible. However, it is still unavoidable that dust adheres to the pin tip, so the pin tip must be cleaned from time to time. Further, in the structure in which a large number of pins are implanted in the holder as in this conventional technique, it is difficult to obtain the flatness of the holder.
そこで、第５図に示すように、エツチング法によりウ
エハ載置面領域を作成する方式がとられている。すなわ
ち、ホルダー１の表面上にエツチングによりウエハ10の
載置面領域を画定する閉ループのシール部２と、ウエハ
10の載置部を構成する多数のピン状突起３を同時に作成
するものである。また、このようなシール部２及びピン
状突起３上に載置されたウエハ10を真空吸着により保持
するために、ピン状突起３を形成する凹部４の底部に真
空手段（図示せず）に連通する吸気孔５が設けられる。Therefore, as shown in FIG. 5, a method of creating a wafer mounting surface area by an etching method is adopted. That is, the closed loop seal portion 2 that defines the mounting surface area of the wafer 10 by etching on the surface of the holder 1 and the wafer
A large number of pin-shaped projections 3 constituting the mounting portion of 10 are simultaneously formed. Further, in order to hold the wafer 10 placed on the seal portion 2 and the pin-shaped protrusions 3 by vacuum suction, a vacuum means (not shown) is provided at the bottom of the concave portion 4 forming the pin-shaped protrusions 3. An air intake hole 5 that communicates is provided.
したがって、この方式によれば、ウエハ10の載置部を
構成する多数のピン状突起２の作成が容易であるばかり
でなく、それらの突起２の平面度も高精度に加工できる
ものである。Therefore, according to this method, not only the many pin-shaped projections 2 constituting the mounting portion of the wafer 10 can be easily formed, but also the flatness of these projections 2 can be processed with high accuracy.
しかしながら、上記のエツチングによるときは、ピン
状突起の先端周縁部はほぼ垂直に削除され、いわゆるエ
ツジが立つようになるため、清掃時に、例えば無塵紙が
引掛って極めて清掃がしにくいという問題がある。However, when the above-mentioned etching is performed, the tip peripheral edge portion of the pin-shaped projection is deleted almost vertically, so that a so-called edge is formed. is there.
したがって本発明は、加工が容易でかつ清掃も容易な
基板保持装置を得ることを目的とする。Therefore, an object of the present invention is to obtain a substrate holding device that is easy to process and easy to clean.
本発明に係る基板保持装置は、板状の基板を載置する
ホルダーと、前記基板の載置面領域を画定するように前
記ホルダーの表面に形成された閉ループのシール部と、
該シール部に囲われた凹部と、該凹部に連通する吸気孔
と、前記凹部内に複数形成されて前記基板の載置部を構
成する線状の突条部とを備え、該突条部上に前記凹部の
深さよりも浅い第２の凹部を形成したことを特徴とする
ものである。A substrate holding device according to the present invention, a holder for mounting a plate-shaped substrate, a closed-loop sealing portion formed on the surface of the holder so as to define a mounting surface area of the substrate,
The projection includes a recess surrounded by the seal portion, an air intake hole communicating with the recess, and a plurality of linear projections formed in the recess to form a mounting portion of the substrate. A second concave portion having a depth smaller than the depth of the concave portion is formed on the upper portion.
本発明においては、基板を保持する載置部表面が２つ
の深浅を異にする第１及び第２の凹部で形成されるた
め、ホルダーの清掃時には深い方の連続した第１の凹部
の方向に無塵紙を動かせば、その移動方向は第１の凹部
より深さの浅い第２の凹部が断続する方向であるので無
塵紙が引掛ることがなくスムースに清掃ができる。ま
た、真空手段に連通する吸気孔は深さの深い第１の凹部
内に開口するので基板の真空吸着を円滑迅速に行うこと
ができる。In the present invention, since the surface of the mounting portion that holds the substrate is formed by two first and second recesses having different depths, when cleaning the holder, the surface of the mounting portion is directed toward the deeper continuous first recess. When the dust-free paper is moved, the moving direction is the direction in which the second recess, which is shallower than the first recess, is intermittent, so that the dust-free paper can be smoothly cleaned without being caught. Further, since the suction hole communicating with the vacuum means opens in the first recess having a large depth, the vacuum suction of the substrate can be smoothly and quickly performed.
以下、本発明の実施例を図により説明する。第１図は
本発明の第１実施例を示す平面図で、第２図は第１図II
−II線における拡大断面図である。なお、第１図におい
ては簡単のため載置部表面のパターンを第３象限におい
てのみ示し、かつ載置部表面は理解を容易にするため黒
く塗りつぶしてある。この第１実施例では、ホルダー１
の表面にウエハ10で例示される基板の載置面領域を画定
する閉ループのシール部２と、複数の突条部６を形成す
るようにシール部２内部に囲われた同心円状の第１の凹
部７が作成される。加工方法は主として切削加工による
が、超音波加工も適用できる。凹部７の断面形状は、第
２図に示すように皿状をなしている。これらの同心円状
の凹部７によつて、連続した線状の載置部８が区画され
る。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing the first embodiment of the present invention, and FIG. 2 is FIG. 1 II.
It is an expanded sectional view in the II line. In FIG. 1, the pattern of the surface of the mounting portion is shown only in the third quadrant for simplification, and the surface of the mounting portion is painted black for easy understanding. In this first embodiment, the holder 1
A closed-loop seal part 2 that defines a mounting surface area of a substrate exemplified by a wafer 10 on the surface of the first part, and a concentric circular first part surrounded by the seal part 2 so as to form a plurality of protruding parts 6. The recess 7 is created. The processing method is mainly cutting, but ultrasonic processing can also be applied. The sectional shape of the recess 7 is dish-shaped as shown in FIG. These concentric concave portions 7 define a continuous linear mounting portion 8.
次に、これらの連続した線状の載置部８は半径方向に
伸びる第２の凹部９によつて断続的に形成される。第２
の凹部９は第１の凹部７に比べて深さが浅くなつてい
る。また、第２の凹部９の幅は切削加工を容易にするた
めすべて同一である。したがつて、載置部８の表面は外
周側に向かうほど周長が長くなる。そのため内周側で
は、ある範囲で第２の凹部９の中心角度をずらす必要が
ある。なお、第２の凹部９の断面形状も第１の凹部７と
同様に皿状をなしている。真空手段（図示せず）に連通
する吸気孔５は溝深さの深い第１の凹部７の底部に開口
されている。図中、11はホルダー１の中心に開口された
基板取出用の通気孔である。12はホルダー１の最外周部
に設けられた取手部である。Next, these continuous linear mounting portions 8 are intermittently formed by the second recesses 9 extending in the radial direction. Second
The recess 9 is shallower in depth than the first recess 7. The widths of the second recesses 9 are all the same in order to facilitate the cutting process. Therefore, the peripheral length of the surface of the mounting portion 8 becomes longer toward the outer peripheral side. Therefore, on the inner peripheral side, it is necessary to shift the central angle of the second recess 9 within a certain range. The cross-sectional shape of the second recess 9 is also dish-like, like the first recess 7. An intake hole 5 communicating with a vacuum means (not shown) is opened at the bottom of the first recess 7 having a deep groove depth. In the figure, 11 is a vent hole for taking out the substrate, which is opened in the center of the holder 1. Reference numeral 12 is a handle portion provided on the outermost peripheral portion of the holder 1.
以上のように加工することによって、第１図に示すよ
うな載置部表面8aのパターンが得られ、これらの載置部
表面8aがその上に載置されるウエハ10の多数の支持点を
構成する。また、これらの載置部表面8aは、第３図に示
すように第１の凹部７側への傾斜面8bと第２の凹部９側
への傾斜面9cとを有し、略角錐台形の上面をなす。そし
て、シール部２とこれらの載置部表面8aはすべて同一の
高さに精密にラツプ仕上げを施され、所定の平面度が出
される。By processing as described above, a pattern of the mounting portion surface 8a as shown in FIG. 1 is obtained, and these mounting portion surface 8a form a large number of supporting points of the wafer 10 to be mounted thereon. Configure. Further, these mounting portion surfaces 8a have an inclined surface 8b toward the first concave portion 7 side and an inclined surface 9c toward the second concave portion 9 side as shown in FIG. Make the top surface. Then, the seal portion 2 and the surface 8a of these mounting portions are all precisely lapped at the same height to give a predetermined flatness.
上記のように構成された第１実施例においては、ウエ
ハ10をシール部２及び載置部表面8a上に載置し、シール
部２の内部の空気を吸気孔５を通じて真空手段（図示せ
ず）により吸い出せば、ウエハ10はシール部２及び載置
部表面8a上に密着し平面に保持される。なお、吸気孔５
は第１図では１個しか示してないが、実際にはホルダー
１の突状部６の夫々の間に、円周方向に複数個が均等に
配設されている。In the first embodiment configured as described above, the wafer 10 is mounted on the seal portion 2 and the mounting portion surface 8a, and the air inside the seal portion 2 is evacuated through the suction holes 5 (not shown). ), The wafer 10 is brought into close contact with the seal portion 2 and the mounting portion surface 8a and is held flat. The intake hole 5
Although only one is shown in FIG. 1, a plurality of holders 1 are actually evenly arranged in the circumferential direction between the protrusions 6 of the holder 1.
次に、ホルダー１を清掃する場合は、無塵紙を第１の
凹部７の方向つまり円周方向に動かせばよい。円周方向
に断続して設けられる第２の凹部９が第１の凹部７に比
べて深さが浅いので無塵紙の引掛りがなくスムースに清
掃ができるのである。また、載置部表面8aは第２の凹部
９側へ傾斜面8cを有するので円周方向への清掃動作を一
層軽快にできる。Next, when cleaning the holder 1, the dust-free paper may be moved in the direction of the first recess 7, that is, in the circumferential direction. Since the second recesses 9 which are intermittently provided in the circumferential direction are shallower than the first recesses 7, the dust-free paper can be smoothly cleaned without being caught. Further, since the mounting surface 8a has the inclined surface 8c toward the second recess 9, the cleaning operation in the circumferential direction can be further facilitated.
次に、第４図は本発明の第２実施例を示す平面図であ
る。この第２実施例では突条部６が直線状に配列された
場合を示すものである。したがつて、第１の凹部７はホ
ルダー１の直径方向に平行に設けられ、これと直交方向
に第２の凹部９が設けられる。真空のための吸気孔は省
略されているが、第１実施例と同様に第１の凹部７の底
部に開口せしめられることはいうまでもない。断面積の
大きい凹部７側に設けることにより真空作用を円滑迅速
に行うものである。尚、吸気孔をホルダー１の中央付近
に設け、中央から周辺にかけてウエハ等の基板を平坦化
する場合、突条部６の高さは0.5mm以下が好ましい。さ
らに第２の凹部９はゴミの大きさとも関係するが、0.1
〜0.2mm程度が好ましい。Next, FIG. 4 is a plan view showing a second embodiment of the present invention. In the second embodiment, the case where the ridge portions 6 are linearly arranged is shown. Therefore, the first recess 7 is provided parallel to the diametrical direction of the holder 1, and the second recess 9 is provided in the direction orthogonal to this. Although the suction hole for vacuum is omitted, it goes without saying that the suction hole is opened at the bottom of the first recess 7 as in the first embodiment. The vacuum action is performed smoothly and quickly by providing it on the side of the concave portion 7 having a large cross-sectional area. When the suction hole is provided near the center of the holder 1 and a substrate such as a wafer is flattened from the center to the periphery, the height of the protrusion 6 is preferably 0.5 mm or less. Further, the second concave portion 9 is related to the size of dust,
It is preferably about 0.2 mm.
また、図示は省略するが、第１実施例の変形例とし
て、第１の凹部ないしそれによつて区画される連続した
線状の突条部を渦巻き状に設けることも可能である。Although illustration is omitted, as a modification of the first embodiment, it is possible to spirally provide the first concave portion or a continuous linear protrusion defined by the first concave portion.
以上のように本発明によれば、基板を保持する多数の
載置部表面が２つの深浅を異にする凹部により形成され
ているので、ホルダーの清掃時には深さの深い凹部の連
続する方向に無塵紙を動かせば引掛りもなくスムースに
清掃ができるものである。また、かかる載置部表面の構
成によれば一般的な切削加工を適用でき、したがつてホ
ルダーの製作が容易である。As described above, according to the present invention, the surface of a large number of mounting portions for holding the substrate is formed by the two recesses having different depths. If you move the dust-free paper, it can be cleaned smoothly without getting caught. Further, according to the structure of the surface of the mounting portion, general cutting can be applied, and thus the holder can be easily manufactured.
第１図は本発明の実施例の平面図、第２図は第１図II−
II線における拡大断面図、第３図は載置部の拡大斜視
図、第４図は本発明の他の実施例の平面図、第５図は従
来例の斜視図である。 １……ホルダー、２……シール部、５……吸気孔、 ６……突条部、７……第１の凹部、８……載置部、 ９……第２の凹部。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is FIG. 1 II-
An enlarged sectional view taken along line II, FIG. 3 is an enlarged perspective view of the mounting portion, FIG. 4 is a plan view of another embodiment of the present invention, and FIG. 5 is a perspective view of a conventional example. 1 ... Holder, 2 ... Seal part, 5 ... Intake hole, 6 ... Ridge part, 7 ... First recessed part, 8 ... Mounting part, 9 ... Second recessed part.
Claims (1)
板の載置面領域を画定するように前記ホルダーの表面に
形成された閉ループのシール部と、該シール部に囲われ
た凹部と、該凹部に連通する吸気孔と、前記凹部内に複
数形成されて前記基板の載置部を構成する線状の突条部
とを備え、該突条部上に前記凹部の深さよりも浅い第２
の凹部を形成したことを特徴とする基板保持装置。1. A holder for mounting a plate-shaped substrate, a closed-loop seal portion formed on a surface of the holder so as to define a mounting surface area of the substrate, and a recess surrounded by the seal portion. An intake hole communicating with the recess, and a plurality of linear ridges that are formed in the recess to form a mounting portion of the substrate, and the linear ridge is formed on the ridge more than the depth of the recess. Shallow second
A substrate holding device, characterized in that a concave portion is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61238121A JPH0822486B2 (en) | 1986-10-08 | 1986-10-08 | Substrate holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61238121A JPH0822486B2 (en) | 1986-10-08 | 1986-10-08 | Substrate holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6393536A JPS6393536A (en) | 1988-04-23 |
| JPH0822486B2 true JPH0822486B2 (en) | 1996-03-06 |
Family
ID=17025490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61238121A Expired - Fee Related JPH0822486B2 (en) | 1986-10-08 | 1986-10-08 | Substrate holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0822486B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0488045U (en) * | 1990-12-18 | 1992-07-30 | ||
| JPH11307619A (en) * | 1998-04-20 | 1999-11-05 | Yamatake Corp | Wafer fixing device |
| US6257564B1 (en) * | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60192445U (en) * | 1984-05-30 | 1985-12-20 | 富士通株式会社 | wafer chuck |
-
1986
- 1986-10-08 JP JP61238121A patent/JPH0822486B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6393536A (en) | 1988-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |