JPH08222360A - Equalized heater both for vacuum heating and for cooling - Google Patents

Abstract

PURPOSE: To provide a heater with which a film forming process can be achieved by heating or cooling of semiconductor material using one device by adopting a structure in which a sheath heater and a cooling plate are mounted on one side of a specific metal laminate. CONSTITUTION: This heater for vacuum heating as well as for vacuum cooling comprises a sheath heater 2 and a cooling plate 3, both brazed with a metal to one side of a disc-shaped metal laminate formed by stacking metallic plates A of good heat conductivity (e.g. a copper alloy) and metallic plates B of relatively bad heat conductivity (e.g. stainless steel) alternately in plural layers, the cooling plate 3 being almost perpendicular to the sheath heater 2 and forming a cooling water passage 13. The cooling water passage 13 of the cooling plate 3 is preferably shaped like plural petals since then cooling water cools the cooling plate uniformly and thoroughly, resulting in further improvement of heat uniformity during cooling. The heat of the sheath heater 2 or the heat absorbed by the cooling plate 3 on cooling dissipates while being transferred to the metal laminate, so that the opposite surface of the sheath heater 2 which heats or cools materials such as semiconductors is allowed to have a uniform temperature.

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a special heater for vacuum film formation used for manufacturing semiconductors.

2. Description of the Related Art Conventionally, a special heater for vacuum film formation used for manufacturing a semiconductor or the like usually deposits a semiconductor material on a ceramic thin plate of a semiconductor substrate in a heated state to form a film. However, depending on the material to be deposited, it is appropriate to cool the ceramic thin plate and vapor-deposit the vaporized semiconductor material on it to form the film.

As described above, in the case where there is one that is heated and vapor-deposited and one that is cooled and vapor-deposited, it is desirable that both can be used for film formation processing. However, such a special heater for vacuum film formation, which has a good thermal uniformity, has not been developed.
That is, when there is a heater for vapor deposition by heating and a heater for cooling vapor deposition, a vacuum film-forming heater that can perform film-forming processing by using both of them and has good thermal uniformity is desired.

[Means for Solving the Problems] The technical means in the present invention for solving these problems are as follows. That is, in order to make the temperature distribution of the heating surface or the cooling surface for heating the material uniform, a metal laminated plate formed by alternately laminating a plurality of metal plates having good heat conduction and metal plates having relatively poor heat conduction. This is a vacuum heating and cooling soaking heater in which a spiral-shaped sheathed heater and a cooling plate which forms a cooling water passage substantially orthogonal to the spiral heater are both metal-brazed on one surface. Further, the cooling water passage of the cooling plate is a multi-petal shape, which is a vacuum heating / cooling uniform heating heater having improved uniform heating during cooling.

As described above, the present invention is characterized in that the sheath heater is attached to one side of the metal laminated plate formed by alternately laminating a plurality of metal plates having good heat conduction and a metal plate having relatively poor heat conduction. With this configuration, the heat of the sheathed heater is dispersed while being transmitted through the metal laminated plate, and the surface temperature of the heating surface for heating the material such as the semiconductor on the opposite surface of the sheathed heater is made uniform. At the time of cooling, cooling water is made to flow through the cooling plate to cool materials such as semiconductors, but since the cooling water passage of the cooling plate is almost orthogonal to the spiral sheathed heater and there are few overlapping parts, heat transfer is good and uniform. Good heat. Further, since the cooling water passage of the cooling plate has a plurality of petal shapes, the cooling water evenly and uniformly cools the cooling plate, so that there is an effect that the soaking property during cooling is further improved.

EXAMPLE A vacuum heating / cooling soaking heater showing an example of the present invention will be described. As shown in detail in FIG. 2, the disk-shaped heating plate 1 for heating a material such as a semiconductor in FIGS. 1 and 2 is relatively poor in heat conduction with a metal plate A (for example, a copper alloy) having good heat conduction. A spiral sheathed heater 2 is attached to one surface of a metal laminated plate formed by alternately laminating a plurality of metal plates B (for example, stainless steel) by metal brazing or pressure bonding as shown in the figure. Therefore, the heating by the sheathed heater 2 and the cooling endotherm by the cooling plate 3 are dispersed while being transmitted through the metal laminated plate, and the surface of the processed surface 4 for mounting or heating a material such as a semiconductor on the reflective surface of the sheathed heater 2 for heating or cooling. The temperature is homogenized. A material to be processed is attached to the processed surface 4 and heated or cooled in a vacuum to perform metal sputtering processing or chemical vapor deposition coating generation processing. Reference numeral 5 is a screw hole for attaching a material to be processed. Further, the heating plate 1 and the cooling plate 3 are held inside the heater holding housing 6 via a heat insulating material 7 such as a heat resistant metal material in a suspended structure with respect to the heater holding housing 6 as shown in the figure. Further, behind the sheath heater 2, a radiant heat reflecting plate 8 formed of a heat resistant special steel plate is provided as shown in the figure. Therefore, the radiant heat emitted from the sheath heater 2 to the back side is radiated to the processed surface 4 side that heats the material to improve the thermal efficiency of the sheath heater 2 and to help protect the temperature rise of peripheral members such as the heater holding housing 6. There is. Reference numeral 9 is a temperature sensor for controlling the temperature of the heating plate 1. The means for controlling the temperature is omitted. Reference numeral 10 is a fluororubber packing for attaching the heater holding housing 6 to the vacuum device 11. 12 is a vacuum device 11 for the heater holding housing 6
It is a mounting screw for attaching to. As shown by the dotted line in FIG. 2, the cooling plate 3 has a plurality of petal-shaped cooling water passages 13 substantially orthogonal to the sheath heater 2. The upper surface of the cooling plate 3 is covered with a cooling plate lid 14 and brazed and welded.
A cooling water pipe 15 is connected to the cooling water inlet / outlet of the cooling water passage 13 as shown in the figure to send the cooling water. Therefore, when the material to be processed attached to the processing surface 4 is cooled in vacuum to perform metal sputtering processing or chemical vapor deposition film forming processing, water is passed through this cooling water pipe 15 to be processed. Form a film on the material.

As described above, according to the present invention, a sheathed heater and a cooling plate are provided on one side of a metal laminated plate formed by alternately laminating a plurality of metal plates having good heat conduction and a metal plate having relatively poor heat conduction. Due to the configuration characterized by being attached, the heating of the sheathed heater or the cooling endotherm of the cooling plate is dispersed while being transmitted through the metal laminated plate, and the heating surface for heating or cooling the material such as the semiconductor on the surface opposite to the sheathed heater. The surface temperature of is uniformized. Further, during cooling, cooling water is made to flow to cool materials such as semiconductors, but the cooling water passages of the cooling plate are almost orthogonal to the spiral-shaped sheathed heater and there are few overlapping portions, so that heat transfer is good and soaking is uniform. Good. Furthermore, since the cooling water passage of the cooling plate has a plurality of petal shapes, the cooling water uniformly cools the cooling plate, so that the temperature uniformity during cooling is further improved. Furthermore, a single apparatus can perform heating film formation processing and cooling film formation processing on semiconductor materials, and can provide an epoch-making vacuum heating and cooling soaking heater for film formation on semiconductors.

[Brief description of drawings]

FIG. 1 is a sectional view of a vacuum heating / cooling soaking heater showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line XY of FIG.

[Explanation of symbols]

 1 Heating Plate 2 Seas Heater 3 Cooling Plate 4 Processing Surface 5 Screw Hole 6 Heater Holding Housing 7 Heat Insulation Material 8 Radiant Heat Reflecting Plate 9 Temperature Sensor 10 Fluoro Rubber Packing 11 Vacuum Device 12 Mounting Screw 13 Cooling Water Passage 14 Cooling Plate Lid 15 Cooling Water pipe

Claims (2)

[Claims] 1. A spiral-shaped sheathed heater is provided on one side of a disc-shaped metal laminated plate formed by alternately laminating a plurality of metal plates having good heat conduction and a metal plate having relatively poor heat conduction, and is substantially orthogonal to the sheathed heater. A vacuum heating and cooling soaking heater, characterized in that the cooling plates forming the cooling water passages are brazed together. 2. The vacuum heating / cooling soaking heater according to claim 1, wherein the cooling water passage of the cooling plate has a plurality of petal shapes.