JPH08203641A - Ic socket - Google Patents

Abstract

PURPOSE: To precisely connect the external connecting terminal of an IC package to a prescribed wiring of a printed wiring board. CONSTITUTION: An IC package 10 having a plurality of external connecting terminals 12 which are arranged in grid at a prescribed arrangement pitch on the lower surface is mounted on a printed wiring board. This IC socket is formed of a housing part 3a for housing the IC package 10 and a socket body 1 having contacts 4 arranged in conformation to the arrangement of the external connecting terminals 12 of the IC package 10, and a multilayer wiring board 2 for loading load the socket body 1. The multilayer wiring board 2 has a pad 8a for connecting the contacts 4 of the socket body 1 on the upper surface, and connecting pins 9 having an arrangement pitch larger than the arrangement pitch of the external connecting terminals 12 of the IC package on the lower surface, and the pad 8a and the connecting pins 9 are mutually connected by a wiring conductor 8 formed in the inner part of the multilayer wiring board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to an IC socket for mounting a C package.

[0002]

2. Description of the Related Art An IC (integrated circuit) is used by being housed in an IC package for protecting the IC, and is connected to an external electric circuit via an external connection terminal provided in the IC package.

An IC housed in the IC package
Is subjected to tests such as an electrical test and a burn-in test for confirming its operating state before it is actually used, and initial defective products are removed by the test.

The test is an IC in which the IC is housed.
It is performed by connecting the package to a test printed wiring board through an IC socket.

As shown in FIG. 2, as the IC package, an external connection terminal 1 is provided on the lower surface of an insulating container 11 for housing the IC.
There is known a grid array type IC package 10 in which a plurality of 2 are arranged in a grid at a predetermined arrangement pitch.

As shown in FIG. 3, the IC socket for the grid array type IC package has an IC package 10
Housing 21 having a recess 21a for accommodating
And a row corresponding to the row of the external connection terminals 12 of the IC package 10, the upper end of which is the recess 2 of the housing 21.
1a is composed of a plurality of contacts 22 that are erected and held upright on the housing 21 such that the lower ends thereof project from the lower surface of the housing 21, and a lid body 23 pivotally attached to the upper surface of the housing 21. The IC package 10 is housed in the recess 21a of the housing 21, the lid 23 is closed, and the IC package 10 is pressed downward by the lid 23, whereby the external connection terminals 12 and the contacts 22 of the IC package 10 are separated. The upper end is in contact with the lower end of the contactor 22, and the external connection terminals 12 of the IC package are printed via the contactor 22 by inserting the lower end of the contactor 22 into a connection hole provided in a printed wiring board (not shown). It will be connected to the wiring board.

Circuit wiring connected to a test device is arranged on the test printed circuit board so as to lead out into the connection hole.

[0008]

However, in this conventional IC socket, the arrangement pitch of the contacts is the same as the arrangement pitch of the external connection terminals of the IC package.
The arrangement pitch of the connection holes of the printed wiring board into which the lower ends of the contacts are inserted also needs to be the same as the arrangement pitch of the external connection terminals of the IC package.

Therefore, when the conventional IC socket is applied to an IC package which has recently been made smaller and higher in density and the arrangement pitch of the external connection terminals has become narrower, the arrangement pitch of the connection holes provided in the printed wiring board must be narrower. As a result, the width between the adjacent connection holes of the printed wiring board becomes narrow, and it becomes extremely difficult to arrange the circuit wiring leading to each connection hole on the printed wiring board. As a result, it was impossible to connect to the printed wiring board, which caused a drawback.

[0010]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to provide a grid array type IC package, even if the external connection terminals are arranged at a narrow pitch. It is to provide an IC socket connectable to a printed wiring board.

[0011]

The present invention provides an IC socket for mounting on a printed wiring board an IC package in which a plurality of external connection terminals are arranged on a lower surface in a grid pattern at a predetermined arrangement pitch. The multi-layer wiring board includes a socket body having an accommodating portion for accommodating the IC package and contacts having an arrangement corresponding to the arrangement of external connection terminals of the IC package, and a multilayer wiring board on which the socket body is mounted. A pad to which the contact of the socket body is connected is attached to the upper surface, and a connecting pin having an arrangement pitch larger than the arrangement pitch of the external connection terminals of the IC package is attached to the lower surface, and the pad and the connection pin are attached. It is characterized in that they are connected by a wiring conductor formed inside the multilayer wiring board.

[0012]

According to the IC socket of the present invention, the socket body has contacts in an arrangement corresponding to the arrangement of the external connection terminals of the IC package, and the multilayer wiring board on which the socket body is mounted is provided on the upper surface of the socket body. Of the IC package and connecting pins with an arrangement pitch larger than the arrangement pitch of the external connection terminals of the IC package, and the pads and the connecting pins are connected by a wiring conductor. Therefore, the arrangement pitch of the insertion holes is narrowed by bringing the external connection terminals of the IC package into contact with the contacts of the socket body and inserting the connection pins of the multilayer wiring board into the connection holes provided in the printed wiring board. It is possible to connect the IC package to the printed wiring board without doing so.

[0013]

The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing an embodiment of an IC socket of the present invention, in which 1 is a socket body and 2 is a multilayer wiring board.

The socket body 1 is mainly composed of a housing 3, contacts 4 and a lid 5.

The housing 3 is made of a plastic such as polyether imide, polyether sulfone, polyphenylene sulfide, etc., and an accommodating portion 3a for accommodating the IC package 10 is formed on the upper surface of the accommodating portion 3a. The IC package 10 is housed in the package with the external connection terminal 12 facing downward.

Further, the housing 3 is arranged so as to correspond to the external connection terminals 12 of the IC package 10 so that the upper end thereof projects into the housing portion 3a and the lower end thereof projects from the lower surface of the housing 3. A plurality of pin-shaped contacts 4 are erected and held.

The contact 4 is the IC package 10
The external connection pins 12 of the above are electrically connected to the wiring conductors 8 of the multilayer wiring board 2 which will be described later, the upper ends of which are in contact with the external connection terminals 12 of the IC package 10, and the lower ends thereof. The wiring conductor 8 is connected to the wiring conductor 8 through an electric connection means such as soldering.

The contact 4 is made of phosphor bronze or beryllium.
It is made of a conductive material having elasticity such as copper alloy, conductive plastic, etc., and its upper end is held so that it can be elastically displaced up and down. After the IC package 10 is housed in the housing portion 3a of the housing 3, a lid body described later By pressing the IC package 10 downward by 5, the external connection terminal 12 of the IC package 10 and the upper end of the contactor 4 are pressed and electrically connected to each other.

Like the housing 3, the lid 5 is made of plastic such as polyetherimide, polyethersulfone, polyphenylene sulfide, and is pivotally attached to one end of the housing 1.

The lid 5 is a housing portion 3a of the housing 3.
The IC package 10 housed in the housing 3 is pressed downward, the IC package 10 is housed in the housing portion 3a of the housing 3, and the lid 5 is attached to the IC package 10.
The IC package 10 is pressed downward by being covered with a cover, and the hook 6 provided on the lid 5 is hooked on the housing 3 to hold the IC package 10 in a pressed state downward. The external connection terminal 12 of the IC package 10 is held in pressure contact with the upper end of the contactor 4.

A multilayer wiring board 2 is arranged below the socket body 1, and the multilayer wiring board 2 is mainly composed of an insulating substrate 7, wiring conductors 8 and connection pins 9.

The insulating substrate 7 is an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body,
It is made of an electrically insulating material such as a silicon carbide sintered body, glass ceramics, epoxy resin, BT resin, or polyimide resin, and acts as a support substrate for supporting the socket body 1.

When the insulating substrate 7 is made of, for example, an aluminum oxide sintered body, a powdery raw material such as aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, etc. is mixed with an appropriate organic binder, solvent, etc., and mixed in a slurry form. It is made into a sheet-shaped ceramic green sheet by adopting the well-known doctor blade method or calender roll method, and then the ceramic green sheet is appropriately cut and punched. Are laminated on top and bottom to obtain a ceramic green body, and finally the ceramic green body is fired in a reducing atmosphere at a temperature of about 1600 ° C.

Further, a plurality of wiring conductors 8 extending from the upper surface to the lower surface of the insulating base 7 are adhered and formed.

The wiring conductor 8 serves to electrically connect the contactor 4 of the socket body 1 to the connecting pin 9, and the socket body 1 is provided at a portion led out to the upper surface of the insulating base 7.
A pad 8a to which the contact 1 of
The contactor 4 of the socket body 1 is connected to the pad 8a through an electrical connection means such as soldering, and the insulating base 1
Connection pins 9 connected to the printed wiring board are erected on the portion led out to the lower surface via a brazing material such as silver brazing.

The wiring conductor 8 is, for example, tungsten,
A high melting point metal powder such as molybdenum, an organic solvent suitable for the high melting point metal powder such as tungsten or molybdenum,
The metal paste obtained by adding and mixing a solvent or the like is applied to the insulating substrate 7 by using a conventionally known thick film technique such as screen printing.
By pre-printing and coating on a ceramic green sheet to be formed, the insulating green base 7 is adhered and formed so as to extend from the upper surface to the lower surface.

The connecting pins 9 erected on the lower surface of the insulating base 7 of the wiring conductor 8 via a brazing material serve to electrically connect the wiring conductor 8 to a printed wiring board (not shown). By inserting the connecting pin 9 into a connecting hole provided in the printed wiring board, the external connecting terminal 12 of the IC package 10 becomes the connector 4, the wiring conductor 8 and the connecting pin 9.
It will be electrically connected to the printed wiring board via.

The connecting pins 7 are made of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and the arrangement pitch thereof is larger than the arrangement pitch of the external connection terminals 12 of the IC package 10. .

The arrangement pitch of the connecting pins 7 is I.
Since the C packages 10 are erected at a pitch larger than the arrangement pitch of the external connection terminals 12, the connection holes provided in the printed wiring board by inserting the connection pins 9 into the connection holes provided in the printed wiring board. It is possible to connect an IC package having a narrow arrangement pitch of the external connection terminals 12 to the printed wiring board without making the arrangement pitch narrow.

Thus, according to the IC socket of the present invention, the IC package 10 is housed in the recess 1a of the housing 3, the lid 5 is closed, and the external connection pin 12 of the IC package 10 and the contact 4 are pressed against each other. By inserting the connection pins 9 into the connection holes of the printed wiring board, the IC package 10 is connected to the printed wiring board.

The IC socket of the present invention is not limited to the above-mentioned embodiment, but various modifications can be made without departing from the gist of the present invention. Child 4 is phosphor bronze or beryllium-copper alloy,
Although it was formed in the shape of a pin made of a conductive material having elasticity such as a conductive plastic, the contactor 4 has an anisotropic conductive sheet having a large area arranged on the upper surface of the multilayer wiring board 2 and the anisotropic conductive material. It may be formed by pressing the external connection terminal 12 of the IC package 10 against the conductive sheet to make the pressed portion of the anisotropic conductive sheet conductive.

Further, in the above embodiment, only the wiring conductor 8 is formed on the multilayer wiring board 2, but the multilayer wiring board 2
Is formed with a ground plane connected to the ground potential, a power plane connected to the power potential, or wiring conductors 8 and ground planes thereof, and circuit elements such as resistors, capacitors, and inductors connected to the power plane. May be.

[0033]

According to the IC socket of the present invention, the socket main body has the contacts of the arrangement corresponding to the arrangement of the external connection terminals of the IC package, and the multilayer wiring board on which the socket main body is mounted is provided on the upper surface. The pad has a pad to be connected to the contact of the socket body, and the lower surface has connecting pins having an arrangement pitch larger than the arrangement pitch of the external connection terminals of the IC package, and the pad and the connecting pin are connected by a wiring conductor. Since the external connection terminals of the IC package are brought into contact with the contacts of the socket body and the connection pins of the multilayer wiring board are inserted into the connection holes provided in the printed wiring board, the arrangement pitch of the insertion holes is changed. The IC package can be connected to the printed wiring board without making it narrow, and therefore the arrangement pitch of the external connection terminals It is connectable narrow grid array type IC package to a printed wiring board.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an IC socket of the present invention.

FIG. 2 is a perspective view showing an example of an IC package to which the IC socket of the present invention is applied.

FIG. 3 is a sectional view showing a conventional IC socket.

[Explanation of symbols]

 1 ・ ・ Socket body 2 ・ ・ ・ Multi-layer wiring board 3a ・ ・ ・ Accommodation part 4 ・ ・ ・ ・ Contacts 8 ・ ・ ・ ・ Wiring conductor 8a ・ ・ ・ ・・ Pad 9 ・ ・ ・ ・ Connecting pin 10 ・ ・ ・ ・ ・ ・ ・ ・ IC package 12 ・ ・ ・ ・ ・ ・ External connection terminal

Claims (1)

[Claims] 1. An IC socket for mounting an IC package, in which a plurality of external connection terminals are arrayed in a grid pattern on a lower surface at a predetermined array pitch, on a printed wiring board, the housing including the IC package. And a socket body having contacts in an arrangement corresponding to the arrangement of the external connection terminals of the IC package, and a multilayer wiring board on which the socket body is mounted, the multilayer wiring board having contacts on the top surface of the socket body. A pad connected to
Connection pins having an arrangement pitch larger than the arrangement pitch of the external connection terminals of the C package are attached to each other, and the pads and the connection pins are connected by a wiring conductor formed inside the multilayer wiring board. IC socket.