JPH08195593A - Electronic part mounting device - Google Patents

Abstract

PURPOSE: To mount an electronic part on a specified position of a printed board without stop while attracting two electronic parts simultaneously by providing an electronic part suction head with a mirror movement mechanism which moves a side mirror to a position wherein it does not interfere with a suction nozzle when the nozzle sucks an electronic part. CONSTITUTION: An electronic part suction head 8 is provided with an illumination light source 23 for illuminating an electronic part sucked by suction nozzles 10, 11. Illumination light emitted from the illumination light source 23 is injected to a beam splitter provided below an imaging device 15 after reflected from a mirror 24 sucked to the electronic part suction head 8 in a horizontal direction. Illumination light injected to a beam splitter is projected from a lower surface of a beam splitter and is reflected at a reflection surface 22a or 22b of a center mirror 22. A movement mechanism which moves side mirrors 20, 21 and the center mirror 22 is provided to a rear side of a head base 8a of the suction head.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component such as an IC at a predetermined position on a printed board.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounting apparatus of this type has sucked an electronic component by a suction nozzle provided on an electronic component suction head so as to be able to move up and down, and then the electronic component suction head is moved onto a printed circuit board by a head transfer mechanism. It is configured to transfer and lower the suction nozzle that sucks the electronic component to mount the electronic component at a predetermined position on the printed circuit board. In addition, this type of electronic component mounting apparatus uses a CCD to attach the electronic component sucked by the suction nozzle before mounting the electronic component on the printed circuit board.
An image pickup device such as a camera picks up an image, and the image signal of the electronic component obtained by this image pickup device is subjected to image processing to obtain the position correction amount of the electronic component. The position of the electronic component is corrected by rotating it around the core.

However, in the above-described conventional electronic component mounting apparatus, since the image pickup device is installed between the suction position and the mounting position of the electronic component, the electronic component suction head is attached to the image pickup device after sucking the electronic component. There has been a problem in that it has to be stopped once, and it takes time from when the electronic component is sucked to when it is mounted.

Therefore, in order to shorten the time from the suction of electronic components to the mounting, a mirror box is provided below the electronic component suction head having two suction nozzles so as to be horizontally movable. The optical image of the electronic component sucked by the suction nozzle is shown by the two mirrors provided.
An electronic component mounting device that is made to enter an image pickup device provided between suction nozzles of a book is disclosed in Japanese Patent Laid-Open No. 4-346297.
No., published in Japanese Unexamined Patent Publication No.

[0005]

According to the electronic component mounting apparatus as described above, the electronic component can be mounted on the printed circuit board without stopping the electronic component suction head between the suction position and the mounting position. However, there were the following problems. That is, in the electronic component mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 4-346297, when one of the two mirrors provided in the mirror box is located below the imaging device, the other mirror is Since it is located below the suction nozzle, it was not possible to suction two electronic components at the same time. For this reason, there is a problem that a waiting time occurs because one of the suction nozzles sucks the electronic component and then the other suction nozzle descends to suck the electronic component.

The present invention has been made in view of the above-mentioned problems, and it is possible to suck two electronic components at the same time, and the electronic component can be sucked without stopping the electronic component suction head between the suction position and the mounting position. It is an object of the present invention to provide an electronic component mounting apparatus capable of mounting the electronic component at a predetermined position on the printed circuit board and further shortening the time from the suction of the electronic component to the mounting.

[0007]

In order to solve the above-mentioned problems, the present invention relates to an electronic component suction head having two suction nozzles for sucking an electronic component, and the electronic component is mounted on the electronic component suction head. A head transfer mechanism for moving the suction nozzle to a predetermined position on the printed circuit board, a suction nozzle elevating mechanism for vertically moving the suction nozzle, an imaging device provided between the suction nozzles, and an image signal from the imaging device. In an electronic component mounting apparatus including a position correction unit that processes and corrects a position of an electronic component sucked by the suction nozzle, a horizontal optical image of the electronic component sucked by the suction nozzle is provided below the suction nozzle. And a center mirror that reflects light from the side mirrors toward the image pickup device between the side mirrors. And a mirror moving mechanism for moving the side mirror to a position that does not interfere with the suction nozzle when the suction nozzle sucks the electronic component, is provided in the electronic component suction head. is there.

[0008]

According to the above construction, when the electronic components are sucked, the side mirrors provided below the two suction nozzles are moved to positions where they do not interfere with the suction nozzles by the mirror moving mechanism. The suction nozzle can be lowered to the suction position by the suction nozzle lifting mechanism.
Thus, two electronic components can be sucked at the same time, and the electronic component can be mounted at a predetermined position on the printed board without stopping the electronic component suction head between the suction position and the mounting position.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to. 1 and 2 are respectively a front view and a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. As shown in FIGS. 1 and 2, a printed board carrying mechanism 3 for carrying the printed board 2 in a predetermined direction is provided on a base 1 of the electronic component mounting apparatus, and the printed board carrying mechanism is also provided. A printed circuit board supply mechanism 4 for supplying the printed circuit boards 2 one by one and a printed circuit board storage mechanism 5 for receiving the printed circuit boards 2 from the printed circuit board transport mechanism 3 and storing the printed circuit boards 2 are mounted.

Further, an electronic component suction head 8 for sucking the electronic component 7 supplied to the suction position by the electronic component supply mechanism 6 is provided on the base 1, and the electronic component suction head 8 is also provided. A head transfer mechanism 9 is mounted to transfer the above to the printed circuit board 2 which is transferred in a predetermined direction by the printed circuit board transfer mechanism 3. The head transfer mechanism 9 moves the electronic component suction head 8 in the x direction in FIG. 2, and an x-direction moving mechanism portion 9a, and the electronic component suction head 8 in FIG. 2 via the x-direction moving mechanism portion 9a. It is composed of a y-direction moving mechanism 9b for moving in the y-direction.

FIG. 3 is a front view of the electronic component suction head 8. As shown in FIG. 3, the electronic component suction head 8
Is provided with a pair of suction nozzles 10 and 11 for sucking the electronic component 7 and an image pickup device 15 such as a CCD camera on the front surface side of the base plate 8a.

The suction nozzles 10 and 11 are independently moved up and down by suction nozzle elevating mechanisms 12 and 13 provided on the electronic component suction head 8, and the upper ends of the suction nozzles 10 and 11 are A suction hose 14 connected to a vacuum suction device such as a vacuum pump is connected to each. Further, the suction nozzles 10 and 11 are independently rotated around their axes by suction nozzle rotating mechanisms 18 and 19 provided in the electronic component suction head 8, whereby the suction nozzles 10 and 11 are rotated. The position of the sucked electronic component can be corrected.

The image pickup device 15 is provided between the suction nozzle 10 and the suction nozzle 11, and the image pickup device 15 is provided.
The image signal sent from the image processing apparatus 1 shown in FIG.
6 is supplied.

The image processing device 16 processes the image signal from the image pickup device 13 to obtain the position correction amount of the electronic component sucked by the suction nozzles 10 and 11, and is sent from the image processing device 16. The signal is supplied to the position correcting controller 17 and the main controller 40 as shown in FIG. The image processing device 16 supplied to the position correction controller 17
The signal from the suction nozzle rotation mechanism 18, 19
It is supplied to.

The electronic component suction head 8 is shown in FIG.
As shown in FIG. 2, a pair of side mirrors 20 and 21 are provided below the suction nozzles 10 and 11, and a center mirror 22 is provided between the side mirrors 20 and 21.

The side mirrors 20 and 21 have reflecting surfaces 20a and 21a inclined at an angle of about 45 degrees with respect to the horizontal direction. The reflecting surfaces 20a and 21a reflect light from above in the horizontal direction. The light from the horizontal direction is reflected upward.

On the other hand, the center mirror 22 has reflecting surfaces 22a, 22b on the side facing the side mirror 20 and the side mirror 21 and inclined at approximately 45 degrees with respect to the vertical direction. The light from the side mirrors 20 and 21 is reflected upward at 22b, and the light from above is reflected toward the side mirrors 20 and 21.

The electronic component suction head 8 is shown in FIG.
As shown in FIG. 2, the light source 23 for illuminating the electronic components sucked by the suction nozzles 10 and 11 is provided, and the illumination light emitted from the light source 23 for illumination is attached to the electronic component suction head 8. After being reflected in the horizontal direction by the provided mirror 24, it is incident on a beam splitter 25 provided below the imaging device 15. The illumination light that has entered the beam splitter 25 is emitted from the lower surface of the beam splitter 25 and is reflected by the reflecting surface 22a or 22b of the center mirror 22.

FIG. 4 shows a rear view of the electronic component suction head 8. As shown in FIG. 4, the electronic component suction head 8
On the back side of the head base 8a, the side mirror 20,
A mirror moving mechanism 26 for moving the 21 and the center mirror 22 in the horizontal direction is provided. This mirror moving mechanism 26
Is a motor 27, a cam plate 28 attached to the rotary shaft of the motor 27, and arms 30, 31 each having a roller 29 that comes into rolling contact with a side surface of the cam plate 28, and the arms 30, 31. Pin 32, 33 for rotatably supporting 31 in a vertical plane, and said arm 30 and arm 31 are connected to each other by a tension coil spring 39.

Further, the mirror moving mechanism 26 includes slide members 34 and 35 connected to one ends of the arms 30 and 31 via pins, respectively, and these slide members 3
4, 35, and a slide guide 36 for supporting the slide members 3 and 4 in a horizontal direction so that the side mirror 20 is attached to the slide member 34 via a connecting member 37.
The side mirror 21 and the center mirror 22 are respectively connected to 5 via a connecting member 38. The motor 27 of the mirror moving mechanism 26 is driven based on the signal sent from the main controller 40 shown in FIG.

In the above structure, the motor 27 of the mirror moving mechanism 26 is driven by a signal from the main controller 40.
Is rotated clockwise, for example, in FIG. 4, the arm 30 of the mirror moving mechanism 26 is rotated by the pin 32 as the motor 27 rotates.
It rotates clockwise in FIG. 4 with the fulcrum as a fulcrum. As a result, the slide member 34 of the mirror moving mechanism 26 slides to the right side in FIG. 4, and moves the side mirror 20 located below the suction nozzle 10 to a position where it does not interfere with the suction nozzle 10 (see FIG. 6A).

Then, the motor 27 of the mirror moving mechanism 26
4 further rotates in the clockwise direction in FIG. 4, the arm 31 of the mirror moving mechanism 26 moves with the pin 33 as the motor 27 rotates.
Rotate counterclockwise in FIG. As a result, the slide member 35 of the mirror moving mechanism 26 slides to the left side in FIG. 4, and moves the side mirror 21 located below the suction nozzle 11 to a position where it does not interfere with the suction nozzle 11 (see FIG. 6B).

In this way, the side mirror 20 and the side mirror 21 are attached to the suction nozzle 10 and the suction nozzle 11.
When it moves to a position where it does not interfere with, the rotation of the motor 27 of the mirror moving mechanism 26 stops. Then, as shown in (c) and (d) of FIG. 6, the suction nozzles 10 and 11 are lowered to suck the electronic component 7, respectively.

Next, the suction nozzles 10 and 11 are connected to the electronic component 7.
When it is adsorbed and rises to a predetermined position, the mirror moving mechanism 26
4 rotates counterclockwise in FIG. 4, and the arm 30 of the mirror moving mechanism 26 rotates as the motor 27 rotates.
Rotates counterclockwise in FIG. 4 with the pin 32 as a fulcrum.
As a result, the slide member 34 of the mirror moving mechanism 26 slides to the left side in FIG. 4, and moves the side mirror 20 below the suction nozzle 10 (see FIG. 6E).

At this time, the illumination light source 23 provided in the electronic component suction head 8 is turned on, and the illumination light emitted from the illumination light source 23 is reflected by the mirror 24 and the beam splitter 2.
5, the reflection surface 22a of the center mirror 22 and the side mirror 20, and the lower surface of the electronic component 7 sucked by the suction nozzle 10. Then, the illumination light that hits the lower surface of the electronic component 7 is reflected downward, passes through the side mirror 20, the center mirror 22, and the beam splitter 25, and enters the imaging device 15 as image light of the electronic component 7.

When the motor 27 of the mirror moving mechanism 26 further rotates counterclockwise in FIG. 4, the arm 31 of the mirror moving mechanism 26 is rotated by the pin 33 as the motor 27 rotates.
It rotates clockwise in FIG. 4 with the fulcrum as a fulcrum. As a result, the slide member 34 of the mirror moving mechanism 26 slides to the right in FIG. 4, and moves the side mirror 21 below the suction nozzle 11 (see FIG. 6F).

At this time, the illumination light source 23 provided on the electronic component suction head 8 is turned on again, and the illumination light source 23 is turned on.
The illumination light emitted from the electronic component 7 passes through the mirror 24, the beam splitter 25, the reflecting surface 22b of the center mirror 22, and the side mirror 21, and strikes the lower surface of the electronic component 7 adsorbed by the adsorption nozzle 11. Then, the illumination light that strikes the lower surface of the electronic component 7 is reflected downward, passes through the side mirror 21, the center mirror 22, and the beam splitter 25 and enters the imaging device 15 as image light of the electronic component 7.

The suction nozzles 10 and 11 are electronic components 7
When it is sucked up and moved up to a predetermined position, the head transfer mechanism 9 operates to transfer the electronic component suction head 8 onto the printed circuit board 2 which has been transferred to the predetermined position by the printed circuit board transfer mechanism 3. Then, when the position of the electronic component 7 sucked by the suction nozzles 10, 11 is corrected to a regular position by the suction nozzle rotation mechanisms 18, 19 and the head transfer mechanism 9 based on the image signal from the image pickup device 15, the suction is performed. Nozzle 10,
11 is lowered to mount the electronic component 7 at a predetermined position on the printed circuit board 3.

Therefore, in the electronic component mounting apparatus according to the embodiment of the present invention, two electronic components 7 can be sucked at the same time, and the electronic component suction head 8 is stopped between the suction position and the mounting position. The electronic component 7 can be mounted at a predetermined position on the printed circuit board 2 without using the electronic component 7. Therefore, the time from the suction of the electronic component 7 to the mounting thereof can be further shortened.

In the above-described embodiment, the image pickup device 1 uses the light reflected on the lower surface of the electronic component 7 as the image light of the electronic component 7.
Although it is designed to be taken into 5, the suction nozzles 10, 1
It is also possible to provide a reflection plate at the lower end of 1 and to take the light reflected by this reflection plate into the imaging device 15 as the image light of the electronic component 7.

Further, in the above-mentioned embodiment, the cam plate 2
With the mirror moving mechanism 26 using 8, side mirrors 20, 2
Although the first mirror and the center mirror 22 are moved, the side mirrors 20, 21 and the center mirror 22 may be moved by a mirror moving mechanism using a feed screw or a mirror moving mechanism using an air cylinder, for example.

In the above-described embodiment, the image processing device 1
Although the signal from 6 is supplied to the position correction controller 17 and the main controller 40, the signal from the image processing device 16 is supplied to the main controller 40 and the signal for correcting the position of the electronic component is supplied from the main controller 40. May be sent to the suction nozzle rotation mechanisms 18 and 19 and the head transfer mechanism 9.

[0033]

As described above, according to the present invention, two electronic components can be sucked at the same time, and the electronic component can be picked up without stopping the electronic component suction head between the suction position and the mounting position. It is possible to provide an electronic component mounting apparatus that can be mounted at a predetermined position on a printed circuit board and that can further shorten the time from suction of electronic components to mounting.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the embodiment.

FIG. 3 is a front view of the electronic component suction head according to the embodiment.

FIG. 4 is a rear view of the electronic component suction head according to the embodiment.

FIG. 5 is a block diagram showing a schematic configuration of an electronic component mounting apparatus according to the embodiment.

FIG. 6 is an explanatory diagram showing movements of a side mirror and a center mirror of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Printed circuit board 3 ... Printed circuit board conveyance mechanism 6 ... Electronic component supply mechanism 7 ... Electronic component 8 ... Electronic component suction head 9 ... Head transfer mechanism 10, 11 ... Suction nozzle 13, 14 ... Suction nozzle elevating mechanism 15 ... Imaging device 16 ... Image processing device 18, 19 ... Suction nozzle rotating mechanism 20, 21 ... Side mirror 22 ... Center mirror 23 ... Illumination light source 25 ... Beam splitter 26 ... Mirror moving mechanism

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshifumi Yamada 2121 Nawa, Asahi-cho, Mie-gun, Mie Incorporated company Toshiba Mie Factory (72) Inventor Junichi Kojima 2121 Nawau, Asahi-machi, Mie-gun, Mie Share-type Company Toshiba Mie Factory (72) Inventor Toshimasa Hirate 2121 Nawa, Asahi-cho, Mie-gun, Mie Stock Company Toshiba Mie Factory (72) Inventor Kaji Ogawa 1-1-1, Shibaura, Minato-ku, Tokyo Toshiba headquarters office

Claims (2)

[Claims] 1. An electronic component suction head having two suction nozzles for sucking an electronic component, and a head transfer mechanism for moving the electronic component suction head to a predetermined position on a printed circuit board on which the electronic component is mounted. A suction nozzle elevating mechanism that drives the suction nozzle up and down, an image pickup device provided between the suction nozzles, and an image signal from the image pickup device is processed to correct the position of the electronic component sucked by the suction nozzle. In the electronic component mounting apparatus including the position correcting means, a side mirror that horizontally reflects an optical image of the electronic component sucked by the suction nozzle is provided below the suction nozzle, and the side mirrors of these side mirrors are provided. A center mirror that reflects the light from the side mirror toward the image pickup device is provided therebetween, and the suction nozzle sucks the electronic component. Electronic component mounting apparatus, wherein the side mirror to a mirror moving mechanism for moving to a position where it does not interfere with the suction nozzle provided in the electronic component suction head when. 2. The electronic component suction head has an illumination light source for illuminating the electronic component sucked by the suction nozzle, and light emitted from the illumination light source passes through the center mirror and the side mirror. The electronic component mounting apparatus according to claim 1, wherein the electronic component is sucked by the suction nozzle and then irradiated onto the electronic component.