JPH08191180A - Manufacture of board for mounting electronic components - Google Patents
Manufacture of board for mounting electronic componentsInfo
- Publication number
- JPH08191180A JPH08191180A JP7016465A JP1646595A JPH08191180A JP H08191180 A JPH08191180 A JP H08191180A JP 7016465 A JP7016465 A JP 7016465A JP 1646595 A JP1646595 A JP 1646595A JP H08191180 A JPH08191180 A JP H08191180A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- substrate
- solder balls
- ball
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，電子部品搭載用基板の
製造方法に関し，特に，基板上の接続パッドにマザーボ
ード固定用の半田ボールを接合する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a board for mounting electronic parts, and more particularly to a method for joining a solder ball for fixing a mother board to a connection pad on the board.
【０００２】[0002]
【従来技術】従来，電子部品搭載用基板としては，図９
に示すごとく，絶縁性の基板９６の表面に，電子部品搭
載用の電子部品搭載部９６０と導体パターン９５と接続
パッド９３とを有するものがある。上記接続パッド９３
は，図１０に示すごとく，複数個設けられており，これ
らの上には半田９２０が接合されている。この半田９２
０は，電子部品搭載用基板９をマザーボード８に固定す
るためのものである。そして，半田９２０は，図９に示
すごとく，接続パッド９３の上に半田ボール９２を載置
し，加熱によりリフローさせて，接続パッド９３に接合
される。2. Description of the Related Art Conventionally, as a board for mounting electronic parts, FIG.
As shown in FIG. 5, there is a substrate having an electronic component mounting portion 960 for mounting electronic components, a conductor pattern 95, and a connection pad 93 on the surface of an insulating substrate 96. The connection pad 93
As shown in FIG. 10, a plurality of are provided, and the solder 920 is bonded onto these. This solder 92
0 is for fixing the electronic component mounting substrate 9 to the motherboard 8. Then, as shown in FIG. 9, the solder 920 is bonded to the connection pad 93 by placing the solder ball 92 on the connection pad 93 and reflowing it by heating.
【０００３】[0003]
【解決しようとする課題】しかしながら，上記電子部品
搭載用基板９においては，基板９６に反りが発生してい
る場合がある。特に，基板９６が多層基板である場合に
は，大きな反りが発生しやすい。However, in the electronic component mounting board 9, the board 96 may be warped. Particularly when the substrate 96 is a multi-layer substrate, a large warp is likely to occur.
【０００４】かかる基板９６を用いた電子部品搭載用基
板９においては，図１０に示すごとく，マザーボード８
に対する基板９６の平坦性が得られず，両者間の間隔
が，不均一となる。そのため，両者を接合する半田９２
０がマザーボード８に接触しない場合があり，接合不良
を生じるおそれがある。かかる接合不良を防止するため
には，基板９６自体が反りの無いものでなければならな
い。しかし，そのためには，基板の材質及び特性を改良
する必要があり，非常に困難性を伴う。In the electronic component mounting board 9 using the board 96, as shown in FIG.
The flatness of the substrate 96 with respect to that of the substrate 96 cannot be obtained, and the distance between the two becomes non-uniform. Therefore, the solder 92 for joining the two
There is a case where 0 does not come into contact with the mother board 8 and there is a possibility that a defective connection may occur. In order to prevent such a joint failure, the substrate 96 itself must be warped. However, for that purpose, it is necessary to improve the material and characteristics of the substrate, which is extremely difficult.
【０００５】本発明はかかる従来の問題点に鑑み，マザ
ーボードとの接合を確実に行うことができる，電子部品
搭載用基板の製造方法を提供しようとするものである。In view of the above conventional problems, the present invention is to provide a method of manufacturing an electronic component mounting substrate which can be reliably joined to a mother board.
【０００６】[0006]
【課題の解決手段】本発明は，基板の表面に電子部品搭
載部と複数の接続パッドとを設けた電子部品搭載用基板
において，上記接続パッド上に半田ボールを接合するに
当たり，まず，上記接続パッド上に，上記半田ボールよ
りも融点が低い半田ペーストを配置し，一方，上記複数
の接続パッドに対応する位置に複数のボール溝を有し，
かつ該ボール溝の底面が同一平面上に位置する定盤を用
い，上記複数のボール溝の中に，上記複数の半田ボール
をそれぞれ投入し，次いで，上記定盤に配置した上記半
田ボールの上に上記接続パッド上の半田ペーストを対向
させて配置し，次いで，加熱することにより，上記半田
ペーストをリフローさせて上記半田ボールを上記接続パ
ッドに接合し，その後，上記定盤を除去することを特徴
とする電子部品搭載用基板の製造方法にある。According to the present invention, an electronic component mounting board having an electronic component mounting portion and a plurality of connection pads provided on the surface of the substrate, the solder balls are first bonded to the connection pads. A solder paste having a melting point lower than that of the solder balls is arranged on the pad, while a plurality of ball grooves are provided at positions corresponding to the plurality of connection pads,
Also, using a surface plate in which the bottom surface of the ball groove is located on the same plane, the plurality of solder balls are respectively put into the plurality of ball grooves, and then the solder balls are arranged on the surface plate. Then, the solder paste on the connection pad is arranged so as to face each other, and then the solder paste is reflowed by heating to bond the solder ball to the connection pad, and then the surface plate is removed. This is a method for manufacturing a characteristic electronic component mounting substrate.
【０００７】本発明において最も注目すべきことは，上
記接続パッド上に半田ボールよりも融点の低い半田ペー
ストを配置すること，定盤に設けた同一平面上の底面を
有する複数のボール溝の中に半田ボールを投入するこ
と，該半田ボールの上に上記半田ペーストを対向させて
配置し，これらを加熱することである。What is most noticeable in the present invention is to arrange a solder paste having a melting point lower than that of the solder balls on the connection pads, and to arrange a plurality of ball grooves having a bottom surface on the same plane provided on the surface plate. That is, a solder ball is put into the solder ball, the solder paste is placed on the solder ball so as to face each other, and these are heated.
【０００８】上記半田ペーストは，半田をフラックスと
混合してペースト状にしたものである。半田の組成は，
５５〜７０重量％の錫と，３０〜４５重量％の鉛とより
なることが好ましい。これにより，半田ペーストを最も
低い温度でリフローさせることができる。The solder paste is prepared by mixing solder with flux to form a paste. The composition of the solder is
It is preferably composed of 55 to 70% by weight of tin and 30 to 45% by weight of lead. As a result, the solder paste can be reflowed at the lowest temperature.
【０００９】上記半田ボールは，上記半田ペーストより
も融点が高い半田をボール状にしたものである。複数の
半田ボールの大きさは，すべて同一であることが好まし
いが，互いに若干異なっていてもよい。これは，定盤の
ボール溝の底面が同一平面に形成してあるため，その底
面に接触する半田ボールの頂面が，半田ボールの大きさ
に拘わらず，同一平面上に揃う。そのため，全ての半田
ボールとマザーボードとの間隔が一定となり，両者を確
実に接合することができるからである。The solder ball is a ball-shaped solder having a higher melting point than the solder paste. The sizes of the plurality of solder balls are preferably the same, but may be slightly different from each other. This is because the bottom surface of the ball groove of the surface plate is formed on the same plane, so that the top surfaces of the solder balls contacting the bottom surface are aligned on the same plane regardless of the size of the solder balls. Therefore, the distance between all the solder balls and the mother board becomes constant, and the two can be reliably joined.
【００１０】上記定盤には，上記接続パッドに対応した
位置に複数のボール溝を設けている。各ボール溝の底面
は，同一平面状にある。ボール溝の底面は，平面状であ
ることが好ましい。これにより，ボール溝を，その底面
が互いに同一平面上に位置するように，精度良く容易に
加工形成することができる。上記定盤は，半田ペースト
のリフロー温度に対して耐熱性を有するものであり，か
つリフローした半田と接合しないものである。かかる定
盤としては，例えば，耐熱性セラミック等を用いたもの
がある。A plurality of ball grooves are provided on the surface plate at positions corresponding to the connection pads. The bottom surface of each ball groove is coplanar. The bottom surface of the ball groove is preferably flat. Thus, the ball groove can be easily and accurately formed so that the bottom surfaces thereof are located on the same plane. The platen has heat resistance against the reflow temperature of the solder paste and does not bond to the reflowed solder. As such a surface plate, there is, for example, one using a heat resistant ceramic or the like.
【００１１】上記半田ボールを接続パッド上の半田ペー
ストに接合するに当たっては，上記ボール溝の中に半田
ボールを投入し，該半田ボールの上に上記半田ペースト
を対向させて，上記基板を配置し，その後これらを加熱
する。加熱温度は，半田ペーストの融点よりも高く，か
つ半田ボールの融点よりも低い温度とする。In joining the solder ball to the solder paste on the connection pad, the solder ball is put into the ball groove, and the solder paste is opposed to the solder ball and the substrate is placed. , Then heat these. The heating temperature is higher than the melting point of the solder paste and lower than the melting point of the solder balls.
【００１２】[0012]
【作用及び効果】本発明の電子部品搭載用基板の製造方
法においては，定盤に設けた同一平面上の底面を有する
複数のボール溝の中に半田ボールを投入している。これ
により，ボール溝の底面と接触する半田ボールの頂面
が，互いに同一平面上に揃う。In the method of manufacturing the electronic component mounting board according to the present invention, the solder balls are put into a plurality of ball grooves provided on the surface plate and having bottom surfaces on the same plane. As a result, the top surfaces of the solder balls that are in contact with the bottom surface of the ball groove are flush with each other.
【００１３】そのため，基板に反りが発生していても，
半田ペーストの厚みにより基板の凹凸が補正されて，半
田ボールの頂面が同一平面上に揃ったまま，接続パッド
に接合される。従って，半田ボールの頂面とマザーボー
ドとの間隔は，一定となり，両者間に接合不良が生じる
こともない。Therefore, even if the substrate is warped,
The unevenness of the substrate is corrected by the thickness of the solder paste, and the solder balls are bonded to the connection pads with the top surfaces of the solder balls aligned on the same plane. Therefore, the distance between the top surface of the solder ball and the mother board is constant, and no joint failure occurs between the two.
【００１４】また，上記半田ペーストは半田ボールより
も融点が低いため，加熱時に半田ボールを溶融させるこ
となく，半田ボールと接続パッドとを接合することがで
きる。Further, since the melting point of the solder paste is lower than that of the solder balls, the solder balls and the connection pads can be joined without melting the solder balls during heating.
【００１５】本発明によれば，マザーボードとの接合を
確実に行うことができる，電子部品搭載用基板の製造方
法を提供することができる。According to the present invention, it is possible to provide a method of manufacturing an electronic component mounting substrate which can surely bond to a mother board.
【００１６】[0016]
実施例１ 本発明の実施例に係る電子部品搭載用基板の製造方法に
ついて，図１〜図７を用いて説明する。まず，本例によ
り製造される電子部品搭載用基板は，図１に示すごと
く，絶縁性の基板６の表面に，凹状の電子部品搭載部６
０と複数の接続パッド３とを設けたものである。電子部
品搭載部６０の周囲には，導体パターン５が設けられて
いる。なお，本例においては，説明を分かり易くするた
め，基板６の反りの状態を大きく示してある。実際に
は，例えば，基板６の一片が４０ｍｍの場合，その反り
の高さは０．０５〜０．１ｍｍ程度である。Example 1 A method of manufacturing an electronic component mounting board according to an example of the present invention will be described with reference to FIGS. First, as shown in FIG. 1, the electronic component mounting substrate manufactured by this example has a concave electronic component mounting portion 6 on the surface of an insulating substrate 6.
0 and a plurality of connection pads 3 are provided. A conductor pattern 5 is provided around the electronic component mounting portion 60. In the present example, the warped state of the substrate 6 is shown large in order to make the explanation easy to understand. Actually, for example, when one piece of the substrate 6 is 40 mm, the warp height is about 0.05 to 0.1 mm.
【００１７】基板６における電子部品搭載部６０を設け
た側と反対側には，図２に示すごとく，複数の接続パッ
ド３が設けられている。接続パッド３は，図示しないス
ルーホールを介して上記導体パターン５と接続してい
る。各接続パッド３の上には，半田ペースト１により半
田ボール２が接合されている。接続パッド３は，図１に
示すごとく，半田ボール２を介してマザーボード８と接
合される。As shown in FIG. 2, a plurality of connection pads 3 are provided on the side of the substrate 6 opposite to the side where the electronic component mounting portion 60 is provided. The connection pad 3 is connected to the conductor pattern 5 via a through hole (not shown). Solder balls 2 are bonded onto each connection pad 3 by a solder paste 1. The connection pad 3 is joined to the mother board 8 via the solder ball 2 as shown in FIG.
【００１８】次に，上記電子部品搭載用基板１０の製造
方法について説明する。まず，その製造方法の概要につ
き説明すると，接続パッド３の上に，半田ボールよりも
融点が低い半田ペースト１を配置する（図３）。一方，
複数の接続パッド３に対応する位置に複数のボール溝７
０を有し，かつ該ボール溝７０の底面が同一面状に形成
してある定盤７を準備する（図４）。次に，ボール溝７
０の中に，複数の半田ボール２をそれぞれ投入する（図
６）。次いで，定盤７に配置した半田ボール２の上に接
続パッド３上の半田ペースト１を対向させて配置する
（図７）。次いで，これらを加熱することにより，半田
ペースト１をリフローさせて半田ボール２を接続パッド
３に接合し，その後定盤７を除去する。Next, a method of manufacturing the electronic component mounting board 10 will be described. First, an outline of the manufacturing method will be described. The solder paste 1 having a melting point lower than that of the solder ball is arranged on the connection pad 3 (FIG. 3). on the other hand,
A plurality of ball grooves 7 are provided at positions corresponding to the plurality of connection pads 3.
A surface plate 7 having 0 and the bottom surface of the ball groove 70 formed in the same plane is prepared (FIG. 4). Next, the ball groove 7
A plurality of solder balls 2 are placed in each 0 (FIG. 6). Next, the solder paste 1 on the connection pad 3 is placed facing the solder balls 2 placed on the surface plate 7 (FIG. 7). Next, by heating these, the solder paste 1 is reflowed to bond the solder balls 2 to the connection pads 3, and then the surface plate 7 is removed.
【００１９】以下，これを詳説する。まず，図３に示す
ごとく，基板６の裏側面に凹状の電子部品搭載部６０を
形成する。また，基板６を貫通するスルーホールを形成
する。次いで，めっき処理及びエッチング等の手段によ
り，電子部品搭載部６０の周囲には導体パターン５を，
基板の表側面には複数の接続パッド３を形成する。次
に，接続パッド３の上に半田ペースト１を印刷形成す
る。半田ペースト１は，錫６３重量％と鉛３７重量％と
よりなる半田を，フラックスと混合してペースト状にし
たものであり，融点は１８３℃である。This will be described in detail below. First, as shown in FIG. 3, a concave electronic component mounting portion 60 is formed on the back side surface of the substrate 6. In addition, a through hole penetrating the substrate 6 is formed. Next, the conductor pattern 5 is provided around the electronic component mounting portion 60 by means such as plating and etching.
A plurality of connection pads 3 are formed on the front surface of the substrate. Next, the solder paste 1 is printed and formed on the connection pads 3. The solder paste 1 is a mixture of 63 wt.% Tin and 37 wt.
【００２０】一方，図４，図５に示すごとく，上記複数
の接続パッドに対応する位置に複数のボール溝７０を有
する定盤７を準備する。これらのボール溝７０の底面７
００は，図５に示すごとく，平面であり，すべて同一平
面上に形成してある。定盤７は，半田ペーストのリフロ
ー温度に対して耐熱性を有するセラミック製である。On the other hand, as shown in FIGS. 4 and 5, a surface plate 7 having a plurality of ball grooves 70 at positions corresponding to the plurality of connection pads is prepared. The bottom surface 7 of these ball grooves 70
00 is a plane as shown in FIG. 5, and all are formed on the same plane. The platen 7 is made of ceramic having heat resistance against the reflow temperature of the solder paste.
【００２１】次に，図６に示すごとく，上記ボール溝７
０の中に，複数の半田ボール２をそれぞれ投入する。半
田ボール２の大きさは，すべて同一である。半田ボール
２は，錫１０重量％と鉛９０重量％とよりなり，その融
点は３００℃である。次に，図７に示すごとく，定盤７
に配置した半田ボール２の上に，上記のごとく作製した
基板６の接続パッド３の上の半田ペースト１を対向させ
て，上記基板６を配置する。Next, as shown in FIG. 6, the ball groove 7
A plurality of solder balls 2 are placed in each 0. The sizes of the solder balls 2 are all the same. The solder ball 2 is composed of 10% by weight of tin and 90% by weight of lead, and its melting point is 300 ° C. Next, as shown in FIG.
The substrate 6 is placed on the solder balls 2 arranged in step 1 above so that the solder paste 1 on the connection pads 3 of the substrate 6 manufactured as described above faces the solder ball 2.
【００２２】次いで，定盤７を下側に配置したまま，こ
れらをリフロー炉に入れて１８３℃で加熱する。これに
より，半田ペースト１をリフローさせて半田ボール２を
接続パッド３に接合する。その後，上記定盤７を基板６
から除去して，図１に示す上記電子部品搭載用基板１０
を得る。電子部品搭載用基板１０は，電子部品搭載部６
０に電子部品８１を搭載した後，マザーボード８の上
に，上記半田ボール２を介して接合される。Next, while keeping the platen 7 on the lower side, these are placed in a reflow furnace and heated at 183.degree. As a result, the solder paste 1 is reflowed to bond the solder balls 2 to the connection pads 3. After that, the surface plate 7 is placed on the substrate 6
The electronic component mounting substrate 10 shown in FIG.
Get. The electronic component mounting board 10 includes an electronic component mounting portion 6
After mounting the electronic component 81 on the motherboard 0, it is bonded onto the mother board 8 via the solder balls 2.
【００２３】次に，本例の作用効果について説明する。
本例の電子部品搭載用基板の製造方法においては，図６
に示すごとく，定盤７に設けた同一平面上の底面７００
を有する複数のボール溝７０の中に半田ボール２を投入
している。これにより，ボール溝７０の底面７００と接
触する半田ボール２の頂面２１が，互いに同一平面上に
揃う。Next, the function and effect of this example will be described.
In the method of manufacturing the electronic component mounting substrate of this example,
As shown in, the bottom surface 700 provided on the surface plate 7 on the same plane
The solder balls 2 are put into the plurality of ball grooves 70 having As a result, the top surfaces 21 of the solder balls 2 that come into contact with the bottom surfaces 700 of the ball grooves 70 are flush with each other.
【００２４】そのため，図１に示すごとく，基板６に反
りが発生していても，半田ペースト１の厚みにより基板
６の凹凸が補正されて，半田ボール２の頂面２１が同一
平面上に揃ったまま，接続パッド３に接合される。従っ
て，半田ボール２の頂面２１とマザーボード８との間隔
は，一定となり，接合不良が生じることもない。Therefore, as shown in FIG. 1, even if the substrate 6 is warped, the unevenness of the substrate 6 is corrected by the thickness of the solder paste 1 and the top surfaces 21 of the solder balls 2 are aligned on the same plane. It is bonded to the connection pad 3 as it is. Therefore, the distance between the top surface 21 of the solder ball 2 and the mother board 8 is constant, and no joint failure occurs.
【００２５】また，上記半田ペースト１は半田ボール２
よりも融点が低いため，加熱時に半田ボール２を溶融さ
せることなく，半田ボール２と接続パッド３とを接合す
ることができる。The solder paste 1 is a solder ball 2
Since the melting point is lower than that, the solder ball 2 and the connection pad 3 can be joined without melting the solder ball 2 during heating.
【００２６】実施例２ 本例の電子部品搭載用基板は，図８に示すごとく，２枚
の絶縁基材６１，６２を積層した多層基板６９を基板と
して用いたものである。絶縁基材６１，６２の間には，
導体パターン５１が設けられている。また，多層基板６
９におけるマザーボードと対向する側には，電子部品搭
載部６０が設けられている。この電子部品搭載部６０
は，絶縁基材６１，６２に形成した開口部６１０，６２
０と，開口部６１０を覆う放熱板４とより構成されてい
る。放熱板４は，絶縁基材６１の凹部６１４に接合され
ている。上記電子部品搭載用基板１００は，絶縁基材６
１，６２を積層して多層基板６９としたものである。そ
の他は，実施例１と同様である。Example 2 As shown in FIG. 8, the electronic component mounting substrate of this example uses a multilayer substrate 69 in which two insulating base materials 61 and 62 are laminated as a substrate. Between the insulating base materials 61 and 62,
A conductor pattern 51 is provided. In addition, the multilayer substrate 6
An electronic component mounting portion 60 is provided on the side of the board 9 facing the mother board. This electronic component mounting unit 60
Are openings 610 and 62 formed in the insulating base materials 61 and 62.
0 and the heat dissipation plate 4 that covers the opening 610. The heat dissipation plate 4 is joined to the recess 614 of the insulating base material 61. The electronic component mounting substrate 100 has an insulating base material 6
1, 62 are laminated to form a multilayer substrate 69. Others are the same as in the first embodiment.
【００２７】本例においては，多層基板６９が２枚の絶
縁基材６１，６２よりなり，実施例１よりも厚みが大き
い。そのため，多層基板６９は，実施例１の基板よりも
反りが大きい。しかし，本例においても図８に示すごと
く，定盤７のボール溝７０内に半田ボール２を投入し，
この半田ボール２の上に接合パッド３上の半田ペースト
１を対向させて多層基板６９を配置しているため，多層
基板６９の凹凸に拘わらず半田ボール２の頂面２１が同
一平面上に配置することができる。従って，本例により
得られた電子部品搭載用基板１００によれば，接続パッ
ド３を半田ボール２を介してマザーボード８に確実に接
合することができる。In this example, the multilayer substrate 69 is composed of two insulating base materials 61 and 62, and is thicker than that of the first embodiment. Therefore, the multilayer substrate 69 has a larger warp than the substrate of the first embodiment. However, also in this example, as shown in FIG. 8, the solder balls 2 are put into the ball grooves 70 of the surface plate 7,
Since the multilayer substrate 69 is arranged on the solder balls 2 so that the solder paste 1 on the bonding pad 3 faces each other, the top surface 21 of the solder balls 2 is arranged on the same plane regardless of the unevenness of the multilayer substrate 69. can do. Therefore, according to the electronic component mounting substrate 100 obtained in this example, the connection pad 3 can be reliably bonded to the motherboard 8 via the solder ball 2.
【図１】実施例１の電子部品搭載用基板の断面図。FIG. 1 is a sectional view of an electronic component mounting board according to a first embodiment.
【図２】実施例１の電子部品搭載用基板の接続パッドの
配置状態を示す説明図。FIG. 2 is an explanatory diagram showing an arrangement state of connection pads of the electronic component mounting board according to the first embodiment.
【図３】実施例１の，接続パッド上に半田ペーストを印
刷した基板の断面図。FIG. 3 is a cross-sectional view of a substrate in which a solder paste is printed on a connection pad according to the first embodiment.
【図４】実施例１の，定盤の斜視図。FIG. 4 is a perspective view of a surface plate according to the first embodiment.
【図５】実施例１の，定盤の拡大断面図。FIG. 5 is an enlarged sectional view of a surface plate according to the first embodiment.
【図６】実施例１の，半田ボールを投入した定盤の拡大
断面図。FIG. 6 is an enlarged cross-sectional view of a surface plate into which solder balls are placed according to the first embodiment.
【図７】実施例１の，ボール溝内に投入した半田ボール
上に接続パッドを対向させて配置した基板の説明図。FIG. 7 is an explanatory diagram of a substrate of Example 1 in which connection pads are arranged so as to oppose each other on a solder ball put into a ball groove.
【図８】実施例２の，ボール溝内に配置した半田ボール
上に接続パッドを対向させて配置した多層基板の説明
図。FIG. 8 is an explanatory diagram of a multi-layer substrate of Example 2 in which connection pads are arranged so as to face solder balls arranged in ball grooves.
【図９】従来例の電子部品搭載用基板の断面図。FIG. 9 is a cross-sectional view of a conventional electronic component mounting substrate.
【図１０】従来例の電子部品搭載用基板の問題点を示す
説明図。FIG. 10 is an explanatory diagram showing a problem of a conventional electronic component mounting substrate.
１．．．半田ペースト， １０，１００．．．電子部品搭載用基板， ２．．．半田ボール， ３．．．接続パッド， ５．．．導体パターン， ６．．．基板， ６０．．．電子部品搭載部， ６９．．．多層基板， ７．．．定盤， ７０．．．ボール溝， ８．．．マザーボード， 1. . . Solder paste, 10,100. . . Substrate for mounting electronic components, 2. . . Solder balls, 3. . . Connection pad, 5. . . Conductor pattern, 6. . . Substrate, 60. . . Electronic component mounting part, 69. . . Multilayer substrate, 7. . . Surface plate, 70. . . Ball groove, 8. . . Motherboard,
Claims (3)
続パッドとを設けた電子部品搭載用基板において，上記
接続パッド上に半田ボールを接合するに当たり，まず，
上記接続パッド上に，上記半田ボールよりも融点が低い
半田ペーストを配置し，一方，上記複数の接続パッドに
対応する位置に複数のボール溝を有し，かつ該ボール溝
の底面が同一平面上に位置する定盤を用い，上記複数の
ボール溝の中に，上記複数の半田ボールをそれぞれ投入
し，次いで，上記定盤に配置した上記半田ボールの上に
上記接続パッド上の半田ペーストを対向させて配置し，
次いで，加熱することにより，上記半田ペーストをリフ
ローさせて上記半田ボールを上記接続パッドに接合し，
その後，上記定盤を除去することを特徴とする電子部品
搭載用基板の製造方法。1. In an electronic component mounting substrate having an electronic component mounting portion and a plurality of connection pads provided on the surface of the substrate, when solder balls are bonded onto the connection pads, first,
A solder paste having a melting point lower than that of the solder balls is arranged on the connection pads, while a plurality of ball grooves are provided at positions corresponding to the plurality of connection pads, and the bottom surfaces of the ball grooves are on the same plane. Using the surface plate located at, insert the solder balls into the ball grooves, and then place the solder paste on the connection pad on the solder balls arranged on the surface plate. Let me place it,
Then, by heating, the solder paste is reflowed to bond the solder balls to the connection pads,
After that, the method for manufacturing a substrate for mounting electronic parts, characterized in that the platen is removed.
板であることを特徴とする電子部品搭載用基板の製造方
法。2. The method for manufacturing an electronic component mounting substrate according to claim 1, wherein the substrate is a multilayer substrate.
の底面は，平面状であることを特徴とする電子部品搭載
用基板の製造方法。3. The method of manufacturing an electronic component mounting substrate according to claim 1, wherein the bottom surface of the ball groove is flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7016465A JPH08191180A (en) | 1995-01-06 | 1995-01-06 | Manufacture of board for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7016465A JPH08191180A (en) | 1995-01-06 | 1995-01-06 | Manufacture of board for mounting electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08191180A true JPH08191180A (en) | 1996-07-23 |
Family
ID=11917013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7016465A Pending JPH08191180A (en) | 1995-01-06 | 1995-01-06 | Manufacture of board for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08191180A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2845520A1 (en) * | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
-
1995
- 1995-01-06 JP JP7016465A patent/JPH08191180A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2845520A1 (en) * | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
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