JPH08191041A - Semiconductor manufacturing device and display method thereof - Google Patents

Abstract

PURPOSE: To provide the title semiconductor manufacturing device and display method thereof capable of displaying if the individual wafer in a wafer cassette is acceptably finished or not to clearly discriminate the acceptable wafers and defective ones thereby enabling the confusion between the acceptable wafers and defective ones to be avoided. CONSTITUTION: A loader monitor 27 to detect the trench NO wherefrom wafers are carried out for giving proper NOs to wafers, a finished process monitor 22 judging if the whole process per individual wafer is acceptably finished or not to store the process results in a wafer status table 24 and a display processor 23 collecting display data specifying the display colors corresponding to the process results of respective wafers making reference to the wafer table 24 are provided thereby enabling if acceptable processing per respective wafers is finished or not to be discriminated by the display colors for display.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus such as a CVD apparatus and a display method therefor, and more particularly to displaying whether or not processing of individual wafers in a wafer cassette has been completed normally. The present invention relates to a semiconductor manufacturing apparatus and a display method in the same which can clearly distinguish between a wafer and a defective wafer and prevent confusion between a normal wafer and a defective wafer.

[0002]

2. Description of the Related Art Single wafer type CV for processing wafers one by one
Conventionally, as the D device, there is a device as shown in FIG. FIG. 11 is a plan view showing the structure of a conventional single-wafer CVD apparatus. As shown in FIG. 11, the conventional single wafer CVD
The apparatus is a cassette chamber (cassette chamber: CC) 5a (CC1) and 5b (CC2) for storing wafer cassettes.
And a reaction furnace (process chamber: PC) 6a for processing
(PC1) and 6b (PC2), and a transfer chamber (load lock chamber: LC) 7. In addition to the above configuration, the PC 3 may be connected as the reaction furnace 6c.

In the transfer chamber 7, a CC arm 71 for loading / unloading a wafer from the cassette chamber 5, a PC arm 72 for loading / unloading a wafer to / from the reaction furnace 6, and a storage cassette (SC) 73 for holding a wafer in standby. And an alignment unit (AU) 7 for aligning the wafer
And 4 are provided.

In the conventional CVD apparatus having the above structure, the wafer taken into the transfer chamber 7 from the cassette chamber 5a or 5b by the CC arm 71 is transferred to the PC arm 72 via the storage cassette 73. PC arm 72
Uses a wafer in a reaction furnace 6a according to a recipe designated in advance.
Or when the wafer is transferred to 6b and the designated processing is completed, the wafer is transferred to the storage cassette 7 by the PC arm 72.
3 is moved to the cassette chamber 5a or 5b by the CC arm 71. Here, a plurality of processes can be continuously performed without carrying out the wafer once taken into the transfer chamber to the cassette chamber.

Further, when the wafers are taken in and out of the cassette chambers 5a and 5b, a CC elevator 71 which moves the wafer cassette up and down (not shown) moves up and down in accordance with a predesignated recipe so that the CC arm 71 is placed in the wafer cassette. The wafer can be taken out from the predetermined position (groove) or returned to the predetermined position.

A display unit such as a CRT for displaying the status of the apparatus is provided on the front surface of the single-wafer CVD apparatus (not shown) to display the operation status of the apparatus and a recipe setting screen. It is like this.

Here, a display example in the above conventional single-wafer CVD apparatus will be described with reference to FIG. 12
FIG. 7 is an explanatory diagram showing an example of a display screen in a conventional single-wafer CVD apparatus. As shown in FIG. 12, in the conventional CVD apparatus, the apparatus image viewed from above is drawn on the monitor screen to inform the operator where the wafer is in the apparatus. In particular, beside the image of the cassette chamber 5, cassette display areas 8a and 8b for displaying the wafer mounting state of each cassette chamber 5 are provided to display the wafer mounting state in each cassette chamber 5. It was

Next, a display example in the cassette display area 8 will be described with reference to FIG. In the wafer cassette,
A “groove” for storing wafers is formed, and normally one wafer cassette can store 25 wafers. The cassette display areas 8a and 8b are assumed to be a wafer cassette containing 25 such wafers, and the wafer display areas 9-1 to 9-25 corresponding to the 25 grooves are provided in the display area 8a. In the display area 8b, wafer display areas 9-26 to 9-50 are provided. Then, the display is performed in each wafer display area 9 in accordance with the mounting state and the processing state of the wafer in the cassette.

For example, when there is a wafer in the groove of the wafer cassette, a horizontal line indicating that the wafer exists in the corresponding wafer display area 9 is displayed, and when there is no wafer, the horizontal line is not displayed. In the example of FIG. 12, no horizontal line is displayed in the display area 8b, which indicates that no wafer is mounted on the wafer cassette in the cassette chamber 5b. Further, when there is a wafer, "processed" has a display color A and "unprocessed" has a display color B, depending on the processing state of the wafer.
A horizontal line is displayed in order to show the processing status at a glance. The display colors A and B can be arbitrarily set by the user.

Next, a portion related to the display of the conventional semiconductor manufacturing apparatus for realizing the above display will be described with reference to FIG. FIG. 13 is a configuration block diagram showing a configuration example of a portion related to display of a conventional semiconductor manufacturing apparatus.
As shown in FIG. 13, the conventional semiconductor manufacturing apparatus includes a monitor screen control unit 1 that performs processing control associated with display data creation,
The monitor screen control unit 1 includes a display unit 17 and a display control unit 16 that controls display on the display unit 17. Further, the monitor screen control unit 1 includes a wafer detection unit 11 that detects in which groove of the wafer cassette the wafer is located. , Process end monitoring means 12 for detecting which groove the processed wafer has returned to
A display processing means 13 for creating display data, a wafer status table 14 for storing the presence / absence of wafers and the processing status corresponding to each groove, and a display memory 15 for storing the display data. There was something.

Next, each component will be specifically described. The wafer detection means 11 of the monitor screen control unit 1 detects which groove of the wafer cassette the wafer is in, and includes a wafer cassette (wafer cassette a) in the cassette chamber 5a and a cassette (wafer cassette) in the cassette chamber 5b. The presence / absence of a wafer is detected for each groove of b), and the data on the presence / absence of a wafer is stored in the wafer status table 14. At this time, a number (groove No.) is given to each groove in order from the bottom of the wafer cassette installed in the cassette chamber 5,
The groove number and the data regarding the presence or absence of the wafer are stored in association with each other. Further, for the wafer cassette a, groove numbers 1 to 25 are given, and for the wafer cassette b, 26 to 50 are given.

At this time, the wafer detecting means 11 outputs "1" when there is a wafer in the groove and "0" when there is no wafer.
Data for wafer status table 1
Store in “No Wafer” corresponding to the groove No. 4
Further, a display data creation instruction is sent to the display processing means 13.

Further, the process end monitoring means 12 detects in which groove of which cassette the wafer is stored when the wafer is returned from the transfer chamber 7 to the cassette chamber 5 after the processing, and the wafer status table is displayed. The flag “1” is stored in the “processed flag” corresponding to the groove number 14 and the display data creation instruction is sent to the display processing means 13. here,
The process end monitoring means 12 detects the position of the cassette elevator at the time of unloading from the transfer chamber 7 to the cassette chamber 5, and specifies the groove number of the wafer cassette. As a result, which groove No. wafer was unloaded,
That is, it is possible to manage which wafer has been processed.

The conventional wafer status table 14 will be described with reference to FIG. FIG. 14 is a schematic explanatory diagram of the wafer status table 14. As shown in FIG. 14, the wafer status table 14 corresponds to each groove of the wafer cassettes a and b, and "was present or absent" sent from the wafer detection means 11 and sent from the process end monitoring means 12. The “processed flag” is stored.

In the wafer status table 14, when "presence or absence of wafer" is "1", "wafer present",
In the case of "0", it indicates "no wafer", when the "processed flag" is "1", it indicates "processed", and when it is "0", it indicates "unprocessed". ing.

Then, the display processing means 13 shown in FIG.
Is for creating the display data of the wafer display area 9 by referring to the wafer status table 14, and the display area 9 corresponding to the groove Nos. 1 to 50 of the wafer cassettes a and b.
With respect to -1 to 9-50, display data designating the presence or absence of a wafer and, if there is a wafer, a display color indicating the processing status is created and stored in the display memory 15.

More specifically, the display processing means 13
Reads the “wafer presence / absence” and “processed flag” of each groove number from the wafer status table 14, and for the wafer display area 9 corresponding to the groove number whose “wafer presence / absence” is “0”, , "Background color" data is stored in the display memory 15 as no wafer. Further, for the groove No. for which "wafer presence / absence" is "1", the "processed flag" is further read.
Is stored, and if it is “0”, the display color B is stored as unprocessed. Then, the display instruction is output to the display control unit 16.

Then, the display controller 16 controls the display memory 1
The display data stored in No. 5 is read and output to the display unit 17 to be displayed in the designated display color.

[0019]

However, although the above-mentioned conventional semiconductor manufacturing apparatus and the display method therefor can display the processed / unprocessed state of each wafer, whether or not the processing has been normally completed is displayed. Therefore, if an abnormality occurs in the processing chamber and a defective wafer is collected, it is difficult to identify the defective wafer, and the operator may confuse the normal wafer with the defective wafer. was there.

Further, in the above-mentioned conventional semiconductor manufacturing apparatus and the display method therefor, the presence / absence of a wafer is displayed. However, since there is no display as to whether or not the wafer cassette itself is mounted, the operator cannot change the wafer cassette. There was a problem that you might forget to install it.

The present invention has been made in view of the above situation, and not only the processing / non-processing of each wafer but also whether or not the processing has been normally completed is displayed to clearly distinguish between a normal wafer and a defective wafer. It is possible to prevent confusion between a normal wafer and a defective wafer, and to provide a semiconductor manufacturing apparatus and a display method in the same in which an operator can surely mount a wafer cassette by displaying the presence or absence of a wafer cassette. To aim.

[0022]

According to the invention as set forth in claim 1 for solving the problems of the conventional example, according to the semiconductor manufacturing apparatus, the wafer is stored for each groove number of the wafer stored in the wafer cassette. Wafer detection means for detecting the presence / absence, process end monitoring means for monitoring the processing result of the process of the wafer corresponding to the groove number, presence / absence of the wafer detected by the wafer detection means, and monitoring by the process end monitoring means The wafer status table for storing the processing result of each process for each groove number, and the display data in the display color corresponding to the processing result of each process are displayed at the wafer position corresponding to the groove number on the display unit by referring to the wafer status table. It is characterized by comprising a display screen control section having a display processing means to be created.

According to a second aspect of the present invention for solving the problems of the conventional example, in the display method of the semiconductor manufacturing apparatus according to the first aspect, the wafer detection means of the display screen control section is in the wafer cassette. The presence / absence of a wafer is detected for each groove number of the stored wafers and written in the wafer status table, and the process end monitoring means monitors the processing result of the wafer on which the process is performed, and corresponds to the groove number of the wafer. The processing result is written in the wafer status table, and the display processing means refers to the wafer status table and creates display data in the display position corresponding to the processing result of each process at the wafer position corresponding to the groove number in the display section. It is characterized by doing.

According to the third aspect of the present invention for solving the problems of the conventional example, the semiconductor manufacturing apparatus according to the first aspect is provided with cassette detection means for detecting the presence / absence of a wafer cassette, and the display processing is performed. The means is a display processing means for creating display data indicating whether or not the wafer cassette is mounted on the display unit according to the detection result of the cassette detecting means.

According to the invention of claim 4 for solving the problems of the conventional example, in the display method in the semiconductor manufacturing apparatus of claim 3, the cassette detecting means detects whether or not the wafer cassette is mounted. The display processing means creates display data indicating whether or not the wafer cassette is mounted on the display unit according to the detection result of the cassette detection means.

[0026]

According to the present invention, the wafer detecting means of the display screen control unit detects the presence or absence of a wafer for each groove number of the wafer stored in the wafer cassette, writes the wafer in the wafer status table, and ends the process. The processing result of the wafer to be processed by the monitoring means is monitored, the processing result is written in the wafer status table corresponding to the groove number of the wafer, and the display processing means refers to the wafer status table to display in the display section. Since the semiconductor manufacturing apparatus and the display method therefor are used to create the display data in the display color corresponding to the processing result of each process at the wafer position corresponding to the groove number, the display of the processing result of the process corresponding to the wafer for each groove number is performed. It can be displayed in color, which makes it possible to clearly distinguish between a normal wafer and a defective wafer and prevent confusion.

According to the third and fourth aspects of the present invention, the presence / absence of mounting of the wafer cassette is detected by the cassette detecting means, and the presence / absence of mounting of the wafer cassette on the display unit is detected by the display processing means according to the detection result of the cassette detecting means. Since the display data to be displayed is created by the semiconductor manufacturing apparatus and the display method therefor according to claim 1, it is possible to clearly recognize whether or not the wafer cassette is mounted, and prevent the operator from forgetting to mount the cassette.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration explanatory view of a single-wafer CVD apparatus which is a semiconductor manufacturing apparatus according to an embodiment of the present invention. The single-wafer CVD apparatus of the present embodiment displays the presence / absence of wafer cassettes in the cassette chamber and the mounting status of the wafers on the monitor screen, and further, not only the processed / unprocessed individual wafers but also the normal processing. Whether or not it is displayed is distinguished by the color.

As shown in FIG. 1, the single-wafer CV of this embodiment
The basic configuration of the D apparatus is almost the same as that of the conventional single-wafer CVD apparatus shown in FIG. 11, and the cassette chambers 5a and 5b are
, A reaction chamber 6a (PC1) and 6b (PC2), a transfer chamber 7, and cooling chambers 31a and 31b for cooling the wafer taken out of the reaction chamber 6. Each cassette chamber 5 has a wafer. A cassette loader 32 for loading and unloading the cassette and a cassette elevator 33 for moving the wafer cassette up and down are provided. Further, a piping portion for supplying gas to the reaction furnace 6 and a control system for each reaction furnace 6 are provided, and a display unit 17 is provided on a panel on the front surface of the apparatus.

Further, in the CVD apparatus of the present embodiment, as in the conventional case, the reaction furnace 6 is used for the wafer once loaded into the apparatus.
And multiple treatments in the cooling chamber 15 (up to 4 treatments here)
Can be continuously performed. The order of conveyance and the contents of processing in each processing chamber are set in advance by a recipe, and the processing is performed according to the recipe.

Next, a display example in the CVD apparatus of this embodiment will be described with reference to FIG. FIG. 2 is an explanatory view showing a display example in the CVD apparatus of this embodiment. In the display example of the present embodiment, as shown in FIG. 2, a device image is drawn as in the conventional case, display areas 8a and 8b are provided next to the images of the cassette chambers 5a and 5b, and each cassette chamber 5
The wafer cassette and the mounting status of the wafer are displayed. Similar to the conventional example, wafer display areas 9-1 to 9-2 corresponding to individual wafers are provided inside the display area 8a.
5 is provided, and the wafer display area 9 is provided in the display area 8b.
-26 to 9-50 are provided.

As in the conventional case, a horizontal line is displayed in the corresponding wafer display area 9 for a groove having a wafer, and no horizontal line is displayed in the wafer display area 9 for a groove having no wafer. Further, as a feature of the present embodiment, "unprocessed" wafers are displayed in display color C, and among "processed" wafers, wafers that have been normally processed are displayed in display color D,
An abnormal wafer is displayed in the display color E. By clearly displaying the distinction between the normal wafer and the abnormal wafer in this way, confusion between the normal wafer and the abnormal wafer can be prevented.

Further, in this embodiment, only when the wafer cassette is mounted, a scale serving as a mark is displayed for every five wafers, that is, every five grooves, in order to make the processing condition of the wafer easy to understand. . That is, the presence or absence of the scale display can inform the operator whether or not the cassette is installed.

Next, the structure of the semiconductor manufacturing apparatus of this embodiment which realizes the above display example will be described with reference to FIG. FIG. 3 is a configuration block diagram showing the configuration of the semiconductor manufacturing apparatus of this embodiment. As shown in FIG. 3, the semiconductor manufacturing apparatus according to the present embodiment includes a monitor screen control unit 2, a display control unit 16, and a display unit 17, as in the conventional semiconductor manufacturing apparatus. Further, the monitor screen control unit 2 includes a wafer detection means 21 and a display memory 25, which are the same as those of the conventional one, and further, a process end monitoring means 22 for monitoring the processing result of each process and a wafer for each groove number. A wafer status table 24 storing presence / absence and processing results, display processing means 23 for creating display data, cassette detection means 26 for detecting the presence / absence of a wafer cassette, and which groove of which wafer cassette the wafer is transferred from the transfer chamber 7. It is composed of a loader monitoring means 27 for monitoring whether or not the wafer has been transferred, and a process management table 28 for storing the processing result of each process for each wafer.

Next, each component will be specifically described. The wafer detection means 21 is the same part as the conventional one,
The presence / absence of a wafer in each groove of the wafer cassettes a and b is detected at regular time intervals, and the result is stored in the “wafer presence / absence” of the wafer status table 24 for each groove number.
The display data creation instruction is sent to the display unit 3.

Next, the wafer status table 24 will be described with reference to FIG. FIG. 4 is a schematic explanatory view of the wafer status table 24 of this embodiment. As shown in FIG. 4, the wafer status table 24 of the present embodiment corresponds to "cassettes" indicating whether or not cassettes are mounted in the cassette chambers 5a and 5b, and individual grooves of the wafer cassettes. "Groove No." and each groove N
Corresponding to o., each area consists of "wafer presence / absence", "processed flag" indicating whether processing is completed, and "process result" indicating whether all processing is completed normally. ing. Among these areas, “groove No.”, “presence / absence of wafer” and “processed flag” are the same as those in the conventional wafer status table 14 shown in FIG.

In the wafer status table 24, in the "cassette", the portions corresponding to the groove numbers 1 to 25 are the wafer cassette a, and the portions corresponding to the groove numbers 26 to 50 are the wafer cassette b. . And "1" means "wafer cassette exists" and "0" means "wafer cassette not present".
Is shown. The "process result" is an area for storing the data of the process result sent from the process end monitoring means 22, and when all the processes of the wafer of each groove No. are normally completed, "normal ( OK) ”, and if there is even one abnormal process,“ abnormal (NG) ”
And This makes it possible to manage, for each groove number of the wafer cassette, whether or not the process of the wafer stored in the groove has been normally completed.

Next, the cassette detecting means 26, the loader monitoring means 27, the process monitoring means 22 and the display processing means 23, which are the characteristic parts of this embodiment, will be described with reference to FIG. The cassette detecting means 26 detects whether or not a wafer cassette is loaded in the cassette chambers 5a and 5b. Then, the detection data for each of the wafer cassettes a and b is stored in the “cassette” of the wafer status table 24, and the display data creating instruction is sent to the display processing means 23.

Further, the loader monitoring means 27
It is detected from which groove of the wafer cassette a or b the wafer has been transferred into the transfer chamber 7, the groove number is sent to the process end monitoring means 22, and a unique number is given to the wafer transferred to the transfer chamber 7. It is a thing. That is, in this embodiment, the groove No.
Is directly used for processing as the unique number of the wafer.

Further, the process end monitoring means 22 detects which groove of the wafer cassette the processed wafer has returned to, as in the conventional case, and features of this embodiment is that each processing chamber (reactor furnace 6a , 6b and cooling chambers 31a, 3
It is detected whether or not the process in 1b) has been normally completed, and the result is stored in the process management table 28. Further, it is judged whether or not all the processes have been normally completed for each wafer. It is stored in the wafer status table 24 as a processing result.

The process management table 28, which is a characteristic part of this embodiment, will be described with reference to FIG.
FIG. 5 is a schematic explanatory diagram of the process management table 28. As shown in FIG. 5, the process management table 28 is
The groove numbers of the wafer cassettes a and b are stored in association with the process result, and the process result is stored for each wafer taken out from each groove. In this embodiment, up to 4 consecutive treatments can be performed. Therefore, corresponding to the groove Nos. 1 to 50, the areas of "process 1", "process 2", "process 3" and "process 4" are provided. As a process result sent from the end monitoring means 22, "normal (OK)" or "abnormal (NG)" is stored.

Further, in the process management table 28,
A "current process" area is provided, and for wafers being processed, the numbers 1 to 4 of the processes currently being executed are indicated.

Then, the process end monitoring means 22 shown in FIG. 3 reads the process result from the process management table 28 for the wafer for which all the processes have been completed,
It is determined whether or not all the process results are "normal", and "normal (OK)" or "abnormal (NG)" is stored in the "processing result" of the wafer status table 24 and displayed on the display processing means 23. It sends a data creation instruction.
The process of the process end monitoring means 22 will be described later in detail.

Further, the display processing means 23 refers to the wafer status table 24 and creates display data of the display area 8 and stores it in the display memory 25. In this embodiment, the scale of the display area 8 is displayed corresponding to the "cassette" in the wafer status table 24. When the cassette is present, the scale is displayed, and when the cassette is not present, the scale is displayed. Do not display. When there is no cassette, of course, there are no wafers, so nothing is displayed in the display area 8.

Further, when there is a cassette, the display processing means 23 refers to the wafer status table 24 and refers to each groove.
Display data designating the display color of the wafer display area 9 corresponding to the No. is created and stored in the display memory 25. In other words, for each groove number, "wafer presence / absence", "processed flag", and "process result" are read from the wafer status table 24, and display color data corresponding to them are created, and the display memory 25 is displayed. To be stored in. In the present embodiment, regarding the groove in which the wafer is stored, "unprocessed" is the display color C, "processed, normal" is the display color D, and "processed, abnormal" according to the processing result of each wafer. Creates display data of display color E. The display processing means 23
The process will be described later in detail.

The display memory 25 will be described below with reference to FIG. FIG. 6 is a schematic explanatory diagram of the display memory 25. As shown in FIG. 6, the display memory 25 includes a display area 8a (display area a in FIG. 6) shown in FIG. 2, a “scale display” corresponding to the display area 8b (display area b), and a “wafer display”. The "area" and the "display color" corresponding to each "wafer display area" are stored.

The "scale display" is for designating the presence / absence of scale display (presence / absence of a wafer cassette) in the display areas 8a and 8b, and the "wafer display area" is
Wafer display area 9 provided in display areas a and b
Stores the number of. As mentioned above, the display area 9
Indicates the groove numbers in the wafer cassette a and the wafer cassette b.
Corresponding to, the status of the wafers stored in the individual grooves is displayed. In FIG. 6, the display area a corresponds to the wafer display areas 1 to 25, and the display area b corresponds to the wafers. The display areas 26 to 50 correspond. Also,
The "display color" stores the display color corresponding to each "wafer display area".

Then, the display control unit 16 reads the display data of the "display color" corresponding to the "scale display" and the "wafer display area" from the display memory 25 and outputs it to the display unit 17, as in the conventional case. , Is supposed to be displayed.

Next, the processing of the process end monitoring means 22 will be described with reference to FIGS. 7 and 8. FIG. 7 is a flow chart showing the process at the start of process monitoring in the process end monitoring means 22, and FIG. 8 is a flow chart showing the process when the end of the process is detected.
As shown in FIG. 7, when the process end monitoring means 22 receives the groove number from the loader monitoring means 27 (100), it becomes the “current process” corresponding to the groove number in the process management table 28 of FIG. "1" is stored (102). That is, this indicates that the wafer represented by the groove No. is undergoing the process 1. As a result, the process end monitoring means 22 enters the monitoring state of the wafer of the groove number.

Next, the process when the end of the process is detected will be described with reference to FIG. As shown in FIG. 8, when the process end monitoring means 22 detects a normal end or an abnormal end of the process i (i = 1 to 4) in the monitoring state (200), the process management table 28 of FIG. The groove No. whose "current process" is "i" is specified (202). Then, the detection result ("normal" or "abnormal") is stored as the "process result" of the process i of the groove No. (204), and it is determined whether all the processes are completed (206). When all the processes are not completed, 1 is added to the “current process” of the groove No. (208) and the monitoring is continued.

If it is determined in the process 206 that all the processes have been completed, the "current process" is set to blank (212) and the process management table 28 of FIG. It is determined whether all the process results of .. are "normal" (220).

If all the process results in the process 220 are “normal”, the “process result” in the wafer status table 24 is displayed.
“Normal” is stored in (222), and the process proceeds to step 226. In the process 220, if any one of the process results is “abnormal”, the “process result” in the wafer status table 24 is displayed.
“Abnormal” is stored in (224), and the process ends.

When the process completion monitoring means 22 detects the unloading of the processed wafer, the groove N of the wafer status table 24 shown in FIG.
“1” is stored in the “processed flag” corresponding to o., the display data creation instruction is sent to the display processing means 23, and the groove is processed.
The monitoring of the No. wafer is completed. In this way, the processing of the process end monitoring means 22 is performed.

Next, the processing of the display processing means 23 will be described with reference to FIGS. 9 and 10. 9 is a schematic flowchart of the display data creation process, and FIG.
FIG. 10 is a flowchart of the display data creation process for the wafer display area 9 shown in process 310 of FIG. As shown in FIG. 9, in the display data creation process of the scale display, the display processing means 23 first reads “cassette chamber” and “cassette” from the wafer status table 24 of FIG. 4 (300),
Determine if a cassette is loaded (30
2) If there is a cassette, display memory 25 of FIG.
The scale display “existence” is set to the “scale display” corresponding to the display area of the cassette chamber (304), and the display data of the wafer display area corresponding to the wafer cassette is created (310) and processed. Move to 316.

If there is no cassette in the process 302, the scale display "absent" is set in the "scale display" corresponding to the display area of the cassette chamber of the display memory 25 (312), and the display memory 25 is displayed. "Background color" in "Display color" of all wafer display areas corresponding to the cassette room
Is stored (314), it is judged whether or not the display data creation for both the display areas a and b is completed (316), and if not completed, the same processing is performed for the other. If both the display areas a and b are finished, a display instruction is sent to the display control unit 16 and the process is finished. In this way, the display data creation process is performed.

Next, the display data creating process of the wafer display area shown in process 310 of FIG. 9 will be described with reference to FIG. As shown in FIG. 10, the display processing means 23
The "groove number", "wafer presence / absence", "processed flag" and "processing result" are read from the wafer status table 24 of FIG. 4 for the leading groove number (400). Then, it is judged whether "presence or absence of wafer" is "0" or "1" (402), and "0"
If so, the “background color” is stored in the “display color” of the wafer display area corresponding to the groove number of the display memory 25 (40
4) and shifts to the processing 420. As a result, with respect to the groove having no wafer, the horizontal line indicating the wafer is displayed in the background color, which does not seem to be displayed.

If the "wafer presence / absence" is "1" in the process 402, it is judged whether the "processed flag" is "0" or "1" (406), and if it is "0". For example, the display color C is stored as unprocessed in the display memory 25 (408), and the process 420 is performed.

When the "processed flag" is "1" in the process 406, it is further judged whether the "process result" is "normal" or "abnormal" (410). If “normal”, the display color D is stored in the display memory 25 (412),
If "abnormal", the display color E is stored (414).

Then, it is judged whether or not the display data has been created for all the groove numbers (420). If the display data has been created, the processing is terminated.
Returning to 0, the same processing is repeated for the next groove No.
In this way, the processing in the display processing means 23 is performed.

According to the semiconductor manufacturing apparatus of this embodiment and the display method therefor, the loader monitoring means 27 that detects the groove number in which the wafer is carried out and gives a unique number to the wafer.
And the process end monitoring means 22 which determines whether or not all the processes have been normally completed for each wafer and stores the results in the wafer status table 24.
And the display processing means 23 for creating the display data for designating the display color corresponding to the process result of each wafer by referring to the wafer status table 24. Therefore, the wafer display area 9 within the display area 8 is provided. The wafer cassette groove N
Each o. can be displayed in the display color corresponding to the process result of the wafer stored in the groove, and there is an effect that the distinction between the normal wafer and the defective wafer can be made clear and confusion can be prevented. .

Further, according to the semiconductor manufacturing apparatus of this embodiment and the display method therefor, the cassette detecting means 26 for detecting whether or not the wafer cassette is mounted is provided, and the display processing means 23 corresponds to the presence or absence of the cassette. Since the display data of the scale display is created by
Only when the wafer cassette is installed, the scale can be displayed in the display area 8, and it is possible to clearly display whether or not the wafer cassette is installed, thereby preventing the operator from forgetting to install the cassette. is there.

[0062]

According to the first and second aspects of the present invention, the presence / absence of a wafer is detected by the wafer detection means of the display screen control unit for each groove number of the wafer storage in the wafer cassette, and written in the wafer status table. The process result is monitored with respect to the wafer to be processed by the process end monitoring means,
The processing result corresponding to the groove number of the wafer is written in the wafer status table, and the display processing means refers to the wafer status table to display the display color corresponding to the processing result of each process at the wafer position corresponding to the groove number in the display section. Since the semiconductor manufacturing apparatus that creates display data and the display method therefor are used, the processing result of the process can be displayed in the corresponding display color for the wafer for each groove number, and the distinction between normal wafers and defective wafers can be clarified and confused. There is an effect that can be prevented.

According to the third and fourth aspects of the present invention, the presence / absence of mounting of the wafer cassette is detected by the cassette detecting means, and the presence / absence of mounting of the wafer cassette on the display unit is detected by the display processing means according to the detection result of the cassette detecting means. Since the display data to be displayed is created by the semiconductor manufacturing apparatus and the display method thereof according to claim 1, it is possible to clearly recognize whether or not the wafer cassette is mounted, and to prevent the operator from forgetting to mount the cassette. is there.

[Brief description of drawings]

FIG. 1 is a schematic configuration explanatory diagram of a single-wafer CVD apparatus which is a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a display example in the CVD apparatus of the present embodiment.

FIG. 3 is a configuration block diagram showing a configuration of a semiconductor manufacturing apparatus of this embodiment.

FIG. 4 is a schematic explanatory diagram of a wafer status table 24 of this embodiment.

FIG. 5 is a schematic explanatory diagram of a process management table 28.

6 is a schematic explanatory diagram of a display memory 25. FIG.

FIG. 7 is a flow chart diagram showing processing at the start of process monitoring in the process end monitoring means 22.

FIG. 8 is a flowchart showing a process when the process end monitoring means 22 detects the end of the process.

FIG. 9 is a schematic flowchart of a display data creation process in the display processing means 23.

FIG. 10 is a flowchart of a display data creation process of the wafer display area 9 in the display processing means 23.

FIG. 11 is a plan view showing the configuration of a conventional single-wafer CVD apparatus.

FIG. 12 is an explanatory diagram showing an example of a display screen in a conventional single-wafer CVD apparatus.

FIG. 13 is a configuration block diagram showing a configuration example of a portion related to display of a conventional semiconductor manufacturing apparatus.

FIG. 14 is a schematic explanatory view of a conventional wafer status table 14.

[Explanation of symbols]

1, 2 ... Monitor screen control unit, 3 ..., 4 ..., 5 ... Cassette chamber, 6 ... Reactor, 7 ... Transfer chamber, 8 ... Display area, 9 ... Wafer display area, 11 ... Wafer detecting means, 12 ... Process End monitoring means, 13 ... Display processing means, 14 ... Wafer status table, 15 ... Display memory, 16 ... Display control section, 17 ... Display section, 21 ... Wafer detecting means, 22 ... Process end monitoring means, 23
Display processing means 24 Wafer status table 25
... display memory, 26 ... cassette detecting means, 27 ... loader monitoring means, 28 ... process management table, 31
... Cooling chamber, 32 ... Cassette loader, 33 ... Cassette elevator, 71 ... CC arm, 72 ... PC arm, 73 ... Storage cassette, 74 ... Alignment unit

Claims (4)

[Claims] 1. A wafer detecting means for detecting the presence / absence of a wafer for each groove number of a wafer stored in a wafer cassette, a process end monitoring means for monitoring a processing result of a wafer process corresponding to the groove number, and the wafer. Wafer status table for storing the presence or absence of the wafer detected by the detection means and the processing result of the process monitored by the process end monitoring means for each groove number, and corresponding to the groove number on the display unit by referring to the wafer status table A semiconductor manufacturing apparatus comprising: a display screen control unit having display processing means for creating display data in a display color corresponding to a processing result of each process at a wafer position. 2. The wafer detection means of the display screen control section detects the presence / absence of a wafer for each groove number of the wafer storage in the wafer cassette and writes it in the wafer status table, and the process end monitoring means carries out the process processing. The processing result of the wafer is monitored, the processing result is written in the wafer status table corresponding to the groove number of the wafer, and the display processing means refers to the wafer status table and corresponds to the groove number in the display section. The display method in a semiconductor manufacturing apparatus according to claim 1, wherein display data is created at a wafer position in a display color corresponding to a processing result of each process. 3. A display for providing display data for displaying the presence / absence of mounting of a wafer cassette on the display unit according to the detection result of the cassette detecting means, the cassette detecting means for detecting presence / absence of mounting of the wafer cassette. The semiconductor manufacturing apparatus according to claim 1, which is a processing means. 4. A cassette detecting means detects presence / absence of mounting of a wafer cassette, and a display processing means creates display data for displaying presence / absence of mounting of a wafer cassette on a display unit according to a detection result of the cassette detecting means. The display method in the semiconductor manufacturing apparatus according to claim 3, wherein