JP5166575B2 - Display method in semiconductor manufacturing apparatus and semiconductor manufacturing apparatus - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus such as a CVD apparatus, and in particular, displays whether or not the processing of individual wafers in a wafer cassette has been completed normally, and clearly distinguishes between normal and defective wafers. The present invention relates to a display method and a semiconductor manufacturing apparatus in a semiconductor manufacturing apparatus capable of preventing confusion of defective wafers.

  Conventionally, as shown in FIG. 11, there has been a single-wafer CVD apparatus for processing wafers one by one. FIG. 11 is a plan view showing a configuration of a conventional single wafer CVD apparatus. As shown in FIG. 11, a conventional single wafer CVD apparatus includes a cassette chamber (cassette chamber: CC) 5a (CC1) and 5b (CC2) for storing wafer cassettes, and a reaction furnace (process chamber: PC) for processing. ) 6a (PC1) and 6b (PC2), and a transfer chamber (load lock chamber: LC) 7. In addition to the above configuration, the PC 3 may be connected as the reaction furnace 6c.

  In the transfer chamber 7, a CC arm 71 for loading / unloading wafers from / from the cassette chamber 5, a PC arm 72 for loading / unloading wafers into / from the reaction furnace 6, a storage cassette (SC) 73 for holding wafers, and wafers And an alignment unit (AU) 74 that performs the above-described alignment.

  In the conventional CVD apparatus configured as described above, the wafer taken into the transfer chamber 7 from the cassette chamber 5 a or 5 b by the CC arm 71 is transferred to the PC arm 72 via the storage cassette 73. The PC arm 72 transports the wafer to the reaction furnace 6a or 6b in accordance with a predesignated recipe, and when the designated processing is completed, the wafer is transferred to the storage cassette 73 by the PC arm 72, and is transferred to the cassette chamber by the CC arm 71. It is carried out to 5a or 5b. Here, a plurality of processes can be continuously performed without carrying the wafer once taken into the transfer chamber into the cassette chamber.

  In addition, wafers are taken in and out of the cassette chambers 5a and 5b by moving a cassette elevator (not shown) that moves the wafer cassette up and down in accordance with a pre-specified recipe, so that the CC arm 71 moves to a predetermined position in the wafer cassette. The wafer can be taken out from the (groove) or returned to a predetermined position.

  The front surface of the single-wafer CVD apparatus is provided with a display unit (not shown) such as a CRT for displaying the status of the apparatus, and displays the operation status of the apparatus and a recipe setting screen. ing.

  Here, a display example in the conventional single-wafer CVD apparatus will be described with reference to FIG. FIG. 12 is an explanatory diagram showing an example of a display screen in a conventional single wafer CVD apparatus. As shown in FIG. 12, in the conventional CVD apparatus, an apparatus image viewed from above is drawn on a monitor screen to inform the operator where the wafer exists in the apparatus. In particular, cassette display areas 8a and 8b for displaying the wafer loading status of each cassette chamber 5 are provided beside the image of the cassette chamber 5 so that the wafer loading status in each cassette chamber 5 is displayed. It was.

  Next, a display example in the cassette display area 8 will be described with reference to FIG. The wafer cassette is formed with “grooves” for storing wafers, and normally, one wafer cassette can store 25 wafers. The cassette display areas 8a and 8b are assumed to be such 25 wafer cassettes. In the display area 8a, wafer display areas 9-1 to 9-25 corresponding to 25 grooves are provided. In the display area 8b, wafer display areas 9-26 to 9-50 are provided. Then, display is performed in each wafer display area 9 in accordance with the mounting state and processing state of the wafer in the cassette.

  For example, when there is a wafer in the groove of the wafer cassette, a horizontal line indicating that the wafer is present is displayed in the corresponding wafer display area 9, and when there is no wafer, the horizontal line is not displayed. In the example of FIG. 12, there is no horizontal line display in the display area 8b, indicating that no wafer is mounted on the wafer cassette in the cassette chamber 5b. If there is a wafer, a horizontal line is displayed with a display color A for "processed" and a display color B for "unprocessed" so that the processing status can be seen at a glance. ing. The display colors A and B can be arbitrarily set by the user.

  Next, the part related to the display of the conventional semiconductor manufacturing apparatus for realizing the above display will be described with reference to FIG. FIG. 13 is a block diagram showing a configuration example of a part related to display of a conventional semiconductor manufacturing apparatus. As shown in FIG. 13, the conventional semiconductor manufacturing apparatus includes a monitor screen control unit 1 that performs processing control associated with display data creation, a display unit 17, and a display control unit 16 that controls display on the display unit 17. Further, the monitor screen control unit 1 further includes a wafer detection unit 11 that detects in which groove of the wafer cassette the wafer is present, and a process end monitoring unit 12 that detects in which groove the processed wafer has returned. Display processing means 13 for creating display data, a wafer status table 14 for storing the presence / absence of a wafer, processing status, etc. corresponding to each groove, and a display memory 15 for storing display data. There was a thing.

  Next, each component will be specifically described. The wafer detection means 11 of the monitor screen controller 1 detects in which groove of the wafer cassette the wafer is present. The wafer cassette (wafer cassette a) in the cassette chamber 5a and the cassette (wafer cassette in the cassette chamber 5b). The presence / absence of a wafer is detected for each groove b), and data on the presence / absence of a wafer is stored in the wafer status table 14. At this time, a number (groove number) is assigned to each groove in order from the bottom of the wafer cassette installed in the cassette chamber 5, and the groove number and the presence / absence data of the wafer are stored in correspondence with each other. Yes. For wafer cassette a, 1 to 25 are given as groove numbers, and for wafer cassette b, 26 to 50 are given.

  At that time, the wafer detection means 11 corresponds to the groove number of the wafer status table 14 corresponding to the cassette, with data “1” when there is a wafer in the groove and “0” when there is no wafer. Is stored in “Wafer presence / absence”, and a display data creation instruction is sent to the display processing means 13.

  Further, the process end monitoring means 12 detects in which groove of which cassette the wafer is stored when the wafer returns from the transfer chamber 7 to the cassette chamber 5 after the completion of processing. The flag “1” is stored in the “processed flag” corresponding to the groove No., and a display data creation instruction is sent to the display processing means 13. Here, the process end monitoring means 12 detects the position of the cassette elevator when unloading from the transfer chamber 7 to the cassette chamber 5, and identifies the groove number of the wafer cassette. As a result, it is possible to manage which groove No. wafer has been unloaded, that is, which wafer has been processed.

  Here, a conventional wafer status table 14 will be described with reference to FIG. FIG. 14 is a schematic explanatory diagram of the wafer status table 14. As shown in FIG. 14, the wafer status table 14 is sent from the “wafer presence / absence” sent from the wafer detection means 11 and the process end monitoring means 12 corresponding to each groove of the wafer cassettes a and b. The “processed flag” is stored.

  In the wafer status table 14, “Wafer present” is “1”, “Wafer present”, “0” indicates “No wafer”, and “Processed flag” is “1”. In this case, “processed” is indicated, and in the case of “0”, “unprocessed” is indicated.

  The display processing means 13 shown in FIG. 13 creates display data for the wafer display area 9 with reference to the wafer status table 14 and corresponds to the groove Nos. 1 to 50 of the wafer cassettes a and b. For the display areas 9-1 to 9-50 to be displayed, display data for designating the presence / absence of a wafer and the display color indicating the processing status when a wafer is present is created and stored in the display memory 15.

  Specifically, the display processing means 13 reads the “wafer presence / absence” and “processed flag” of each groove No. from the wafer status table 14, and the “wafer presence / absence” is “0”. For the wafer display area 9 corresponding to No., “background color” data is stored in the display memory 15 as no wafer. Further, for the groove No. in which “wafer presence / absence” is “1”, the “processed flag” is further read, and if it is “1”, the display color A is stored as “processed”. For example, the display color B is stored as unprocessed. Then, a display instruction is output to the display control unit 16.

  The display control unit 16 reads the display data stored in the display memory 15 and outputs it to the display unit 17 for display in a designated display color.

  However, in the conventional semiconductor manufacturing apparatus and the display method therefor, it is possible to display whether each wafer is processed / unprocessed, but it is not possible to indicate whether the processing has been completed normally, so an abnormality occurs in the processing chamber. When the defective wafer is collected, it is difficult to identify the defective wafer, and there is a problem that the operator may confuse the normal wafer with the defective wafer.

  In the conventional semiconductor manufacturing apparatus and the display method therefor, the presence / absence of a wafer is displayed. However, since there is no indication as to whether or not the wafer cassette itself is mounted, the operator forgets to mount the wafer cassette. There was a problem of fear.

  The present invention has been made in view of the above circumstances, not only processing / unprocessing of each wafer, but also displaying whether the processing has been completed normally, and clearly distinguishing between normal wafers and defective wafers. An object of the present invention is to provide a display method and a semiconductor manufacturing apparatus in a semiconductor manufacturing apparatus capable of preventing confusion between a wafer and a defective wafer, and displaying the presence / absence of a wafer cassette and allowing an operator to securely mount the wafer cassette. And

The present invention for solving the problems of the conventional example includes at least a cassette chamber for storing a cassette , a process chamber for processing wafers, a transfer chamber for transferring wafers in the cassette to the process chamber, A display method in a semiconductor manufacturing apparatus comprising a display unit provided with a cassette display area for displaying the presence / absence of mounting of a cassette in a cassette chamber , wherein the display unit displays a semiconductor manufacturing apparatus image and is displayed in the cassette display area. Is characterized in that nothing is displayed when no cassette is mounted, and the presence or absence of a wafer and the processing status of the wafer are displayed when a cassette is mounted.

According to the present invention, in the display method in the semiconductor manufacturing apparatus , when a cassette is mounted in the cassette display area, a plurality of wafer display areas are provided in the cassette display area. Whether a wafer is present in the groove is displayed.

The present invention provides a display method in the semiconductor manufacturing device, characterized in that the upper blade is made different display color of the wafer by either treated or untreated.

The present invention provides a display method in the semiconductor manufacturing device, characterized in that the processing result of the upper blade is made different display color of the wafer by either normal or abnormal.

The present invention displays at least a cassette chamber for storing a cassette , a process chamber for processing a wafer, a transfer chamber for transferring a wafer in the cassette to the process chamber, and whether or not the cassette is mounted in at least the cassette chamber. A semiconductor manufacturing apparatus including a display unit provided with a cassette display area, and displaying a semiconductor manufacturing apparatus image on the display unit and displaying nothing when no cassette is mounted in the cassette display area. When the cassette is mounted, the presence / absence of a wafer and the processing status of the wafer are displayed.

According to the present invention, at least the cassette chamber for storing the cassette, the process chamber for processing the wafer, the transfer chamber for transferring the wafer in the cassette to the process chamber, and whether or not the cassette is mounted in at least the cassette chamber. A display method in a semiconductor manufacturing apparatus comprising a display unit provided with a cassette display area for displaying, wherein a semiconductor manufacturing apparatus image is displayed on the display unit and no cassette is mounted in the cassette display area The display method in the semiconductor manufacturing apparatus in which nothing is displayed and the presence / absence of the wafer and the processing status of the wafer are displayed when the cassette is mounted. The effect that can be displayed.

According to the present invention, at least the cassette chamber for storing the cassette, the process chamber for processing the wafer, the transfer chamber for transferring the wafer in the cassette to the process chamber, and whether or not the cassette is mounted in at least the cassette chamber. A semiconductor manufacturing apparatus including a display unit provided with a cassette display area for displaying, and displaying a semiconductor manufacturing apparatus image on the display unit and displaying nothing when no cassette is mounted in the cassette display area. Since the semiconductor manufacturing apparatus is configured to display the presence / absence of a wafer and the processing status of the wafer when the cassette is mounted, there is an effect that the mounting status of the wafer cassette and the wafer can be displayed.

BRIEF DESCRIPTION OF THE DRAWINGS It is schematic structure explanatory drawing of the single wafer type CVD apparatus which is a semiconductor manufacturing apparatus based on one Example of this invention. It is explanatory drawing which shows the example of a display in the CVD apparatus of a present Example. It is a block diagram which shows the structure of the semiconductor manufacturing apparatus of a present Example. It is a model explanatory drawing of the wafer condition table 24 of a present Example. 4 is a schematic explanatory diagram of a process management table 28. FIG. 3 is a schematic explanatory diagram of a display memory 25. FIG. FIG. 6 is a flowchart showing processing at the time of starting process monitoring in the process end monitoring means 22. It is a flowchart figure which shows a process when the process completion | finish monitoring means 22 detects the completion | finish of a process. 6 is a schematic flowchart of display data creation processing in display processing means 23. FIG. 6 is a flowchart of display data creation processing for a wafer display area 9 in the display processing means 23. FIG. It is a top view which shows the structure of the conventional single wafer type CVD apparatus. It is explanatory drawing which shows the example of the display screen in the conventional single wafer type CVD apparatus. It is a block diagram which shows the structural example of the part related to the display of the conventional semiconductor manufacturing apparatus. FIG. 10 is a schematic explanatory diagram of a conventional wafer status table 14.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration explanatory diagram of a single wafer CVD apparatus which is a semiconductor manufacturing apparatus according to an embodiment of the present invention. The single wafer CVD apparatus according to the present embodiment displays the presence / absence of a wafer cassette in the cassette chamber and the wafer loading status on the monitor screen, and not only processing / unprocessing of each wafer but also normal processing. Whether or not it has been done is distinguished and displayed by color.

  As shown in FIG. 1, the basic configuration of the single-wafer CVD apparatus of the present embodiment is almost the same as that of the conventional single-wafer CVD apparatus shown in FIG. 11, and the cassette chambers 5a and 5b are reacted with each other. It is composed of furnaces 6a (PC1) and 6b (PC2), a transfer chamber 7, and cooling chambers 31a and 31b for cooling wafers taken out from the reaction furnace 6. Each cassette chamber 5 is loaded and unloaded with wafer cassettes. A cassette loader 32 for moving the wafer cassette and a cassette elevator 33 for moving the wafer cassette up and down are provided. Furthermore, a piping part for supplying gas to the reaction furnace 6 and a control system for each reaction furnace 6 are provided, and a display part 17 is provided on a panel on the front side of the apparatus.

  Also, the CVD apparatus according to the present embodiment continuously performs a plurality of processes (up to four processes in this case) in the reaction furnace 6 and the cooling chamber 15 on the wafer once carried into the apparatus, as in the conventional case. It is something that can be done. The order of conveyance, the contents of processing in each processing chamber, and the like are set in advance by a recipe, and processing is performed according to the recipe.

  Next, a display example in the CVD apparatus of this embodiment will be described with reference to FIG. FIG. 2 is an explanatory view showing a display example in the CVD apparatus of the present embodiment. In the display example of the present embodiment, as shown in FIG. 2, an apparatus image is drawn as in the conventional case, display areas 8a and 8b are provided beside the images of the cassette chambers 5a and 5b, The wafer cassette and wafer loading status are displayed. As in the conventional example, wafer display areas 9-1 to 9-25 corresponding to individual wafers are provided in the display area 8a, and wafer display areas 9-26 to 9-50 are provided in the display area 8b. ing.

  As in the prior art, a horizontal line is displayed in the corresponding wafer display area 9 for a groove with a wafer, and a horizontal line is not displayed in the wafer display area 9 for a groove without a wafer. Further, as a feature of the present embodiment, “unprocessed” wafers are displayed in display color C, and among “processed” wafers, wafers that have been processed normally are displayed in display color D. The existing wafer is displayed in display color E. Thus, by clearly displaying the distinction between the normal wafer and the abnormal wafer, confusion between the normal wafer and the abnormal wafer can be prevented.

  Furthermore, in this embodiment, only when a wafer cassette is mounted, a scale serving as a mark is displayed for every five wafers, that is, five grooves, in order to make it easy to understand the processing status of the wafer. That is, it is possible to notify the operator whether or not a cassette is mounted by the presence or absence of a scale display.

  Next, the configuration of the semiconductor manufacturing apparatus of the present embodiment that realizes the display example will be described with reference to FIG. FIG. 3 is a configuration block diagram showing the configuration of the semiconductor manufacturing apparatus of the present embodiment. As shown in FIG. 3, the semiconductor manufacturing apparatus according to the present embodiment includes a monitor screen control unit 2, a display control unit 16, and a display unit 17, similarly to the conventional semiconductor manufacturing apparatus. Further, the monitor screen control unit 2 includes a wafer detection unit 21 and a display memory 25 which are the same as those in the prior art, and further includes a process end monitoring unit 22 for monitoring the processing result of each process, and a wafer number for each groove number. Wafer status table 24 for storing presence / absence and processing result, display processing means 23 for creating display data, cassette detection means 26 for detecting presence / absence of wafer cassette, and wafer from which groove in which wafer cassette 7 The loader monitoring means 27 for monitoring whether the wafer has been transferred into the wafer and the process management table 28 for storing the processing results of each process for each wafer.

  Next, each component will be specifically described. The wafer detection means 21 is a part similar to the conventional one, detects the presence / absence of a wafer in each groove of the wafer cassettes a and b at regular time intervals, and sets the result in the “wafer presence / absence” of the wafer status table 24. This is stored for each number, and a display data creation instruction is sent to the display processing means 23.

  Next, the wafer status table 24 will be described with reference to FIG. FIG. 4 is a schematic explanatory diagram of the wafer status table 24 of the present embodiment. As shown in FIG. 4, the wafer status table 24 according to the present embodiment corresponds to “cassette” indicating whether or not a cassette is mounted for each of the cassette chamber 5a and the cassette chamber 5b, and individual grooves of the wafer cassette. “Groove No.”, “whether there is a wafer”, “processed flag” indicating whether or not processing is completed, and whether or not all processing has been completed normally. It consists of each area of “processing result” shown. Of these areas, “groove No.”, “wafer presence / absence”, and “processed flag” are the same as those in the conventional wafer status table 14 shown in FIG.

  In the wafer status table 24, the “cassette” is the detection result of the wafer cassette a in the portion corresponding to the groove Nos. 1 to 25 and the wafer cassette b in the portion corresponding to the grooves No. 26 to 50. “1” indicates “with wafer cassette” and “0” indicates “without wafer cassette”. The “processing result” is an area for storing data of the processing result sent from the process end monitoring means 22, and “normal ( OK) ”, and“ abnormal (NG) ”if there is even one abnormal process. Thereby, it is possible to manage whether or not the process of the wafer stored in the groove is normally completed for each groove number of the wafer cassette.

  Next, the cassette detection means 26, the loader monitoring means 27, the process monitoring means 22, and the display processing means 23, which are characteristic parts of the present embodiment, will be described with reference to FIG. The cassette detection means 26 detects whether or not a wafer cassette is mounted in the cassette chambers 5a and 5b. Then, the detection data for each of the wafer cassettes a and b is stored in the “cassette” of the wafer status table 24, and a display data creation instruction is sent to the display processing means 23.

  The loader monitoring means 27 detects from which groove of the wafer cassette a or b the wafer has been transferred into the transfer chamber 7, and sends the groove number to the process end monitoring means 22. A unique number is given to the wafer transferred to the wafer. In other words, in this embodiment, the groove number is used as it is for the processing as the unique number of the wafer.

  Further, the process end monitoring means 22 detects in which groove of the wafer cassette the wafer that has been processed has returned, as in the prior art, and as a feature of the present embodiment, each process chamber (reactors 6a and 6b). And whether or not the processes in the cooling chambers 31a and 31b) are normally completed and stored in the process management table 28 as process results, and whether or not all processes have been normally completed for each wafer. Is stored in the wafer status table 24 as a processing result.

  Here, the process management table 28 which is a characteristic part of the present embodiment will be described with reference to FIG. FIG. 5 is a schematic explanatory diagram of the process management table 28. As shown in FIG. 5, the process management table 28 stores the groove Nos. Of the wafer cassettes a and b in association with the process results. The process results are stored for each wafer taken out from each groove. It comes to remember. In the present embodiment, up to four continuous treatments can be performed, so areas corresponding to groove Nos. 1 to 50 are provided for “Process 1”, “Process 2”, “Process 3”, and “Process 4”. “Normal (OK)” or “abnormal (NG)” is stored as a process result sent from the process end monitoring means 22.

  Further, the process management table 28 is provided with an area of “current process”, and for the wafer being processed, the numbers 1 to 4 of the processes currently being executed are shown.

  Then, the process end monitoring means 22 shown in FIG. 3 reads the process results from the process management table 28 for the wafers for which all the processes have been completed, and determines whether all the process results are “normal”. Whether “normal (OK)” or “abnormal (NG)” is stored in “processing result” of the wafer status table 24, and a display data creation instruction is sent to the display processing means 23. The process of the process end monitoring unit 22 will be described later in detail.

  The display processing means 23 refers to the wafer status table 24 and creates display data for the display area 8 and stores it in the display memory 25. In the present embodiment, the scale display of the display area 8 is performed in correspondence with the “cassette” in the wafer status table 24. When the cassette is present, the scale is displayed. When no cassette is present, the scale is displayed. Does not display scale. When there is no cassette, naturally there is no wafer, so nothing is displayed in the display area 8.

  Further, when there is a cassette, the display processing means 23 refers to the wafer status table 24 and creates display data for designating the display color of the wafer display area 9 corresponding to each groove number. To store. That is, for each groove number, the “wafer presence / absence”, “processed flag”, and “process result” are read from the wafer status table 24 to generate display color data corresponding to the read data. To be stored. In the present embodiment, for the groove in which the wafer is stored, “unprocessed” indicates display color C, “processed, normal” indicates display color D, and “processed, abnormal” according to the processing result of each wafer. "" Creates display data of display color E. The processing of the display processing unit 23 will be described in detail later.

  Here, the display memory 25 will be described with reference to FIG. FIG. 6 is a schematic explanatory diagram of the display memory 25. As shown in FIG. 6, the display memory 25 includes a display area 8a (display area a in FIG. 6) shown in FIG. 2, a “scale display” corresponding to the display area 8b (display area b), and a “wafer display”. The “area” and “display color” corresponding to each “wafer display area” are stored.

  “Scale display” designates the presence / absence of scale display in the display areas 8a and 8b (the presence or absence of a wafer cassette), and the “wafer display area” is a wafer display area 9 provided in the display areas a and b. Is stored. As described above, the display area 9 displays the status of the wafers stored in the individual grooves corresponding to the groove numbers in the wafer cassette a and the wafer cassette b. In FIG. The display area a corresponds to the wafer display areas 1 to 25, and the display area b corresponds to the wafer display areas 26 to 50. The “display color” stores the display color corresponding to each “wafer display area”.

  Then, the display control unit 16 reads the display data of “display color” corresponding to the “scale display” and the “wafer display area” from the display memory 25 and outputs the display data to the display unit 17 for display as in the conventional case. It is like that.

  Next, the process of the process end monitoring unit 22 will be described with reference to FIGS. FIG. 7 is a flowchart showing the process at the start of process monitoring in the process end monitoring means 22, and FIG. 8 is a flowchart showing the process when the end of the process is detected. As shown in FIG. 7, when the process end monitoring unit 22 receives the groove number from the loader monitoring unit 27 (100), the process end monitoring unit 22 sets the “current process” corresponding to the groove number in the process management table 28 of FIG. “1” is stored (102). That is, the wafer represented by the groove number indicates that the process 1 is being executed. Thereby, the process end monitoring means 22 enters the monitoring state of the wafer in the groove No.

  Next, processing when the end of the process is detected will be described with reference to FIG. As shown in FIG. 8, in the monitoring state, when the process end monitoring means 22 detects the normal end or abnormal end of the process i (i = 1 to 4) (200), the process management table 28 of FIG. The groove number in which “current process” is “i” is identified (202). Then, the detection result (“normal” or “abnormal”) is stored as the “process result” of the process i of the groove No. (204), and it is determined whether all the processes have been completed (206). If all the processes have not been completed, 1 is added to the “current process” of the groove No. (208), and the monitoring is continued.

  If it is determined in process 206 that all processes have been completed, “current process” is set to blank (212), and all of the groove numbers are referenced with reference to the process management table 28 of FIG. It is determined whether or not the process result is “normal” (220).

  If all the process results are “normal” in process 220, “normal” is stored in “process result” of the wafer status table 24 (222), and the process proceeds to process 226. If there is even one “abnormal” in the process result in the process 220, “abnormal” is stored in the “process result” of the wafer status table 24 (224), and the process is terminated.

  When the process end monitoring means 22 detects the unloading of the processed wafer, the “processed flag” corresponding to the groove number in the wafer status table 24 of FIG. “1” is stored, a display data creation instruction is sent to the display processing means 23, and the monitoring of the wafer in the groove No. is terminated. In this way, the process end monitoring means 22 is processed.

  Next, the processing of the display processing means 23 will be described using FIG. 9 and FIG. FIG. 9 is a schematic flowchart of the display data creation process, and FIG. 10 is a flowchart of the display data creation process for the wafer display area 9 shown in process 310 of FIG. As shown in FIG. 9, in the display data creation process of the scale display, first, the display processing unit 23 reads “cassette chamber” and “cassette” from the wafer status table 24 of FIG. 4 (300), and the cassette is mounted. If there is a cassette, the scale display “present” is set in the “scale display” corresponding to the display area of the cassette chamber in the display memory 25 of FIG. 6 (304). Then, display data creation processing of the wafer display area corresponding to the wafer cassette is performed (310), and the processing proceeds to processing 316.

  In the case of no cassette in the process 302, the scale display “none” is set in “scale display” corresponding to the display area of the cassette chamber in the display memory 25 (312), and the cassette chamber in the display memory 25 is set. “Background color” is stored in “Display color” of all wafer display areas corresponding to (314), and it is determined whether or not the display data creation of both display areas a and b is completed (316). For example, the same processing is performed on the other side. If both display areas a and b have been completed, a display instruction is sent to the display control unit 16 and the process is terminated. In this way, display data creation processing is performed.

  Next, the display data creation processing of the wafer display area shown in processing 310 of FIG. 9 will be described with reference to FIG. As shown in FIG. 10, the display processing means 23 displays “groove number”, “wafer presence / absence”, “processed flag”, and “processing result” for the first groove number from the wafer status table 24 of FIG. Read (400). Then, it is determined whether the “wafer presence / absence” is “0” or “1” (402). If “0”, the “display color” of the wafer display area corresponding to the groove No. of the display memory 25 is set to “background”. Color "is stored (404), and the process proceeds to processing 420. As a result, for the groove without a wafer, the horizontal line indicating the wafer is displayed in the background color, and it appears as if it is not displayed.

  Also, if the “wafer presence / absence” is “1” in the process 402, it is determined whether the “processed flag” is “0” or “1” (406). The display color C is stored in the display memory 25 (408), and the process proceeds to processing 420.

  If the “processed flag” is “1” in the process 406, it is further determined whether the “process result” is “normal” or “abnormal” (410). If “normal”, display color D is stored in display memory 25 (412), and if “abnormal”, display color E is stored (414).

  Then, it is determined whether or not display data has been created for all the groove numbers (420). If it has been created, the process ends. If not, the process returns to process 400 to return to the next groove number. Repeat the same process for. In this way, processing in the display processing means 23 is performed.

  According to the semiconductor manufacturing apparatus and the display method therefor according to the present embodiment, the loader monitoring means 27 for detecting the groove number in which the wafer is carried out and giving a unique number to the wafer, and all the processes for each wafer are performed. It is determined whether or not the process has been normally completed, and the process end monitoring unit 22 that stores the process result in the wafer status table 24 and the wafer status table 24 are referred to, and a display color is designated corresponding to the process result of each wafer. Display processing means 23 for generating display data to be displayed, so that the wafer display area 9 in the display area 8 corresponds to the wafer process result stored in the groove for each groove number of the wafer cassette. The display color can be displayed, and the distinction between the normal wafer and the defective wafer can be made clear and confusion can be prevented.

  Further, according to the semiconductor manufacturing apparatus and the display method therefor according to the present embodiment, the cassette detection means 26 for detecting whether or not the wafer cassette is mounted is provided, and the display processing means 23 is scaled according to the presence or absence of the cassette. Since the display data for display is created, only when the wafer cassette is mounted, the scale display can be performed in the display area 8, and it is clearly displayed whether the wafer cassette is mounted, This has the effect of preventing the operator from forgetting to mount the cassette.

  The present invention displays not only the processing / non-processing of each wafer but also whether or not the processing has been completed normally, to clarify the distinction between the normal wafer and the defective wafer, and to prevent confusion between the normal wafer and the defective wafer. In addition, the present invention is suitable for a display method and a semiconductor manufacturing apparatus in a semiconductor manufacturing apparatus in which the presence / absence of a wafer cassette is displayed and an operator can securely mount the wafer cassette.

  1, 2 ... Monitor screen control unit, 5 ... Cassette room, 6 ... Reactor, 7 ... Transfer chamber, 8 ... Display area, 9 ... Wafer display area, 11. Wafer detection means, 12 ... process end monitoring means, 13 ... display processing means, 14 ... wafer status table, 15 ... display memory, 16 ... display control unit, 17 ... display , 21 ... wafer detection means, 22 ... process end monitoring means, 23 ... display processing means, 24 ... wafer status table, 25 ... display memory, 26 ... cassette detection means, 27 ... Loader monitoring means, 28 ... Process management table, 31 ... Cooling chamber, 32 ... Cassette loader, 33 ... Cassette elevator, 71 ... CC arm, 72 ... PC arm 73 ... Storage cassette, 74 ... Alignment unit

Claims (18)

Cassette for displaying a cassette chamber for storing at least the cassette, and the process chamber for processing the wafer, the conveying chamber for transferring wafers in said cassette to said process chamber, the presence or absence of mounting of the cassette in at least said cassette chamber A display method in a semiconductor manufacturing apparatus comprising a display unit provided with a display area,
In the display unit, the image of the semiconductor manufacturing apparatus is displayed, and the cassette display area is configured so that nothing is displayed when the cassette is not mounted, and when the cassette is mounted, A display method in a semiconductor manufacturing apparatus, wherein the presence / absence of the wafer and the processing status of the wafer are displayed. In the cassette display area, when the cassette is mounted, a plurality of wafer display areas are provided in the cassette display area,
2. A display method in a semiconductor manufacturing apparatus according to claim 1, wherein whether or not the wafer is present in a groove in the cassette is displayed in the wafer display area.   3. A display method in a semiconductor manufacturing apparatus according to claim 1, wherein the display color of the wafer is different depending on whether the wafer has been processed or not processed.   4. A display method in a semiconductor manufacturing apparatus according to claim 1, wherein the display color of the wafer is different depending on whether the processing result of the wafer is normal or abnormal. Cassette for displaying a cassette chamber for storing at least the cassette, and the process chamber for processing the wafer, the conveying chamber for transferring wafers in said cassette to said process chamber, the presence or absence of mounting of the cassette in at least said cassette chamber A semiconductor manufacturing apparatus comprising a display unit provided with a display area,
The display unit displays the image of the semiconductor manufacturing apparatus and the cassette display area is configured to display nothing when the cassette is not mounted, and when the cassette is mounted, A semiconductor manufacturing apparatus configured to display presence / absence of a wafer and processing status of the wafer. In the cassette display area, when the cassette is mounted, a plurality of wafer display areas are provided in the cassette display area,
6. The semiconductor manufacturing apparatus according to claim 5, wherein the wafer display area displays whether or not the wafer is present in a groove in the cassette.   7. The semiconductor manufacturing apparatus according to claim 5, wherein a display color of the wafer is different depending on whether the wafer has been processed or not processed.   8. The semiconductor manufacturing apparatus according to claim 5, wherein a display color of the wafer is different depending on whether the processing result of the wafer is normal or abnormal. A method for manufacturing a semiconductor device, comprising: a processing step of processing a wafer in a process chamber; a transfer step of transferring a wafer in a cassette to the process chamber; and a display step of displaying whether or not the cassette is mounted in at least a cassette chamber. Because
In the display step, an image of a semiconductor manufacturing apparatus is displayed and nothing is displayed when the cassette is not mounted. When the cassette is mounted, the presence / absence of the wafer and the wafer A method for manufacturing a semiconductor device, characterized in that a processing status is displayed. Cassette for displaying a cassette chamber for storing at least the cassette, and the process chamber for processing the wafer, the conveying chamber for transferring wafers in said cassette to said process chamber, the presence or absence of mounting of the cassette in at least said cassette chamber A semiconductor manufacturing apparatus comprising a display unit provided with a display area,
In the cassette display area, nothing is displayed when the cassette is not mounted, and when the cassette is mounted, the presence / absence of the wafer and the processing status of the wafer are displayed. A semiconductor manufacturing apparatus characterized by comprising. In the cassette display area, when the cassette is mounted, a plurality of wafer display areas are provided in the cassette display area,
11. The semiconductor manufacturing apparatus according to claim 10, wherein the wafer display area displays whether the wafer is present in a groove in the cassette.   12. The semiconductor manufacturing apparatus according to claim 10, wherein the display color of the wafer is different depending on whether the wafer has been processed or not processed.   13. The semiconductor manufacturing apparatus according to claim 10, wherein a display color of the wafer is different depending on whether the processing result of the wafer is normal or abnormal. Cassette for displaying a cassette chamber for storing at least the cassette, and the process chamber for processing the wafer, the conveying chamber for transferring wafers in said cassette to said process chamber, the presence or absence of mounting of the cassette in at least said cassette chamber A display method of a semiconductor manufacturing apparatus comprising a display unit provided with a display area,
In the cassette display area, nothing is displayed when the cassette is not loaded, and the presence or absence of the wafer and the processing status of the wafer are displayed when the cassette is loaded. A display method in a semiconductor manufacturing apparatus. In the cassette display area, when the cassette is mounted, a plurality of wafer display areas are provided in the cassette display area,
15. The display method in the semiconductor manufacturing apparatus according to claim 14, wherein whether or not the wafer is present in a groove in the cassette is displayed in the wafer display area.   16. The display method in the semiconductor manufacturing apparatus according to claim 14, wherein the display color of the wafer is different depending on whether the wafer has been processed or not processed.   17. A display method in a semiconductor manufacturing apparatus according to claim 14, wherein the display color of the wafer is different depending on whether the processing result of the wafer is normal or abnormal. A method for manufacturing a semiconductor device, comprising: a processing step of processing a wafer in a process chamber; a transfer step of transferring a wafer in a cassette to the process chamber; and a display step of displaying whether or not the cassette is mounted in at least a cassette chamber. Because
In the display step, nothing is displayed when the cassette is not mounted, and the presence or absence of the wafer and the processing status of the wafer are displayed when the cassette is mounted. A method of manufacturing a semiconductor device.

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