JPH08183683A - Conductor paste for metallizing - Google Patents
Conductor paste for metallizingInfo
- Publication number
- JPH08183683A JPH08183683A JP34034794A JP34034794A JPH08183683A JP H08183683 A JPH08183683 A JP H08183683A JP 34034794 A JP34034794 A JP 34034794A JP 34034794 A JP34034794 A JP 34034794A JP H08183683 A JPH08183683 A JP H08183683A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- ceramic substrate
- conductor
- conductor pattern
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、メタライズ用導体ペー
ストに係り、より詳細には、セラミック基板上に後付け
メタライズ法により導体パターンを形成するために使用
されるメタライズ用導体ペーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metallizing conductor paste, and more particularly to a metallizing conductor paste used for forming a conductor pattern on a ceramic substrate by a post-metallizing method.
【０００２】[0002]
【従来の技術】近年、電子機器の小型化、高密度化に伴
って、これらに実装される電子部品の狭ピッチ多ピン化
や、マルチチップ化も急速に進められ、ＬＳＩ、ＩＣチ
ップのボンディング法も従前のワイヤボンディング法か
ら、マルチチップ化や高密度実装に適したＴＡＢ（Tape
Automated Bonding）方式やＣ４（Controlled Collaps
e Chip Connection ）方式が採用されるようになってい
る。2. Description of the Related Art In recent years, with the miniaturization and high density of electronic devices, electronic parts mounted on these devices have been rapidly made to have a narrower pitch and a larger number of pins, and have a multi-chip structure. The TAB (Tape) method is suitable for multi-chip and high-density mounting
Automated Bonding) method and C4 (Controlled Collaps)
e Chip Connection) method has been adopted.
【０００３】このような電子機器の高密度化に伴い、セ
ラミック基板上に、線幅が１００μｍ以下の微細配線
や、直径が１００μｍ以下のバンプ等の導体パターンを
形成する技術が要求されるようになってきている。ま
た、演算素子の動作周波数も高まり、高速動作時の伝播
遅延を低減するために導体パターンの導通性を向上させ
る必要がある。セラミック基板の材質としては、強度、
絶縁性等の基板特性をバランスよく満足し、製造コスト
が安価なアルミナが主に使用されている。With the increasing density of such electronic devices, a technique for forming fine wiring having a line width of 100 μm or less and a conductor pattern such as a bump having a diameter of 100 μm or less on a ceramic substrate is required. It has become to. Further, the operating frequency of the arithmetic element also increases, and it is necessary to improve the conductivity of the conductor pattern in order to reduce the propagation delay during high speed operation. As the material of the ceramic substrate, strength,
Alumina, which satisfies the substrate characteristics such as insulation properties in a well-balanced manner and is inexpensive to manufacture, is mainly used.
【０００４】このような観点に対応できる微細導体パタ
ーンは、セラミック生基板焼結による収縮バラツキの発
生を考えると、焼結後のセラミック基板上に後付けによ
り導体パターンを形成する手法を取らざるを得ない。し
かし、この手法の場合、導体ペーストとセラミック基板
との接合強度を確保することが困難であるという課題が
ある。Considering the occurrence of shrinkage variation due to sintering of the ceramic raw substrate, the fine conductor pattern that can cope with such a viewpoint has to take a method of forming the conductor pattern by post-mounting on the sintered ceramic substrate. Absent. However, this method has a problem that it is difficult to secure the bonding strength between the conductor paste and the ceramic substrate.
【０００５】ところで、焼結後のセラミック基板に導体
パターンを後付けするためのメタライズ用導体ペースト
としては、『ビヒクル中に、粒径が５μｍ以下のＷ粉
末、Ｍｎ粉末、Ｍｏ粉末のうちの一種または２種以上か
らなる高融点金属粉末：８０〜９５重量％、粒径が５μ
ｍ以下のＳｉＯ2 粉末：５〜２０重量％を含有分散させ
たペースト』が知られている（特開昭５６−９６７９４
号公報参照）。By the way, as a metallizing conductor paste for attaching a conductor pattern to a ceramic substrate after sintering, "one kind of W powder, Mn powder and Mo powder having a particle size of 5 μm or less in a vehicle or Refractory metal powder consisting of two or more: 80 to 95% by weight, particle size 5 μ
m 2 or less SiO 2 powder: 5 to 20% by weight of a dispersed paste ”is known (Japanese Patent Laid-Open No. 56-96794).
(See the official gazette).
【０００６】[0006]
【発明が解決しようとする課題】しかし、このメタライ
ズ用導体ペーストにおいて、前記高融点金属粉末のうち
のＭｏ粉末とＭｎ粉末を混合したペーストの場合、その
配合割合によっては、セラミック基板と十分な接合強度
が得られなかったり、セラミック基板上に配した導体パ
ターンの収縮が大きくなり、前述したＴＡＢやＣ４等に
おける微細な導体パターンとして対応できないという課
題がある。However, in the conductor paste for metallization, in the case of a paste obtained by mixing Mo powder and Mn powder among the refractory metal powders, depending on the mixing ratio, sufficient bonding to the ceramic substrate can be achieved. There is a problem in that the strength cannot be obtained, or the contraction of the conductor pattern arranged on the ceramic substrate becomes large, so that the conductor pattern cannot be applied as a fine conductor pattern in the above-mentioned TAB or C4.
【０００７】そこで、本発明者は、このような観点に立
脚し、種々、研究・試験をした結果、高融点金属粉末の
うち、Ｍｏ粉末とＭｎ粉末を混合した高融点金属粉末を
ベースとした導体ペーストにおいて、その粉末として所
定の粒径の微粉末を用いると共に、ある特定の配合割合
とすることにより、収縮が小さく、かつセラミック基板
との十分な接合強度が得られることを究明した。Therefore, the present inventor has made various studies and tests based on such a viewpoint, and as a result, among the high melting point metal powders, a high melting point metal powder obtained by mixing Mo powder and Mn powder is used as a base. It has been clarified that by using a fine powder having a predetermined particle size as the powder in the conductor paste and by setting a specific mixing ratio, the shrinkage is small and sufficient bonding strength with the ceramic substrate can be obtained.
【０００８】本発明は、以上のような課題に対処して創
作したものであって、その目的とする処は、後付けメタ
ライズでセラミック基板との接合強度を確保できるセラ
ミック基板用導体ペーストを提供することにある。The present invention has been made in view of the above problems, and its object is to provide a conductor paste for a ceramic substrate which can secure the bonding strength with a ceramic substrate by post-metallization. Especially.
【０００９】[0009]
【課題を解決するための手段】そして、上記目的を達成
するための手段としての本発明の請求項１のセラミック
基板用導体ペーストは、セラミック基板に導体パターン
を形成するためのセラミック基板用導体ペーストにおい
て、平均粒径が５．０μｍ以下のＭｏ粉末：７０〜９０
重量％、平均粒径が５．０μｍ以下のＭｎ粉末：１０〜
３０重量％、平均粒径が５．０μｍ以下のＴｉＯ2 粉末
及びＳｉＯ2 粉末をそれぞれ：１〜１０重量％を含む固
形物粉末がビヒクル中に分散されている構成としてい
る。A conductor paste for a ceramic substrate according to claim 1 of the present invention as a means for achieving the above object is a conductor paste for a ceramic substrate for forming a conductor pattern on a ceramic substrate. In, Mo powder having an average particle size of 5.0 μm or less: 70 to 90
% Mn powder having an average particle size of 5.0 μm or less: 10 to 10
A solid powder containing 30% by weight and 1 to 10% by weight of TiO 2 powder and SiO 2 powder having an average particle diameter of 5.0 μm or less, respectively, is dispersed in the vehicle.
【００１０】ここで、Ｍｏ粉末、Ｍｎ粉末、添加剤を、
前記した配合割合としたのは、本発明の課題で説明した
ように、試験の結果得られたものであって、Ｍｏ粉末の
含有量が、７０重量％未満の場合は、本発明の導体ペー
ストをセラミック基板上に印刷法やフォトリソグラフィ
法により配して導体パターンを焼成した際、該導体パタ
ーンの収縮が大きくなり、９０重量％を越える場合は、
セラミック基板との接合強度が低下し、またＭｎ粉末の
含有量が１０重量％未満、添加剤としてのＳｉＯ2 粉末
の含有量が１重量％未満、ＴｉＯ2 粉末が１重量％未満
であると、焼成後の導体パターンとセラミック基板との
接合強度が低下し、Ｍｎ粉末の含有量が３０重量％を超
え、ＳｉＯ2 粉末の含有量が１０重量％を超え、ＴｉＯ
2 粉末が１０重量％を超える場合は、導体パターンの収
縮が大きくなるということによる。Here, the Mo powder, the Mn powder, and the additive are
The above-mentioned blending ratio is obtained as a result of the test as described in the problem of the present invention, and when the content of Mo powder is less than 70% by weight, the conductor paste of the present invention is obtained. When the conductor pattern is fired by arranging on a ceramic substrate by a printing method or a photolithography method, the contraction of the conductor pattern becomes large, and when the conductor pattern exceeds 90% by weight,
When the bonding strength with the ceramic substrate is reduced, the content of Mn powder is less than 10% by weight, the content of SiO 2 powder as an additive is less than 1% by weight, and the content of TiO 2 powder is less than 1% by weight, The bonding strength between the conductor pattern and the ceramic substrate after firing is lowered, the content of Mn powder exceeds 30% by weight, the content of SiO 2 powder exceeds 10% by weight, and TiO 2
When the content of 2 powders exceeds 10% by weight, the shrinkage of the conductor pattern becomes large.
【００１１】また、Ｍｏ粉末、Ｍｎ粉末、および添加剤
としてのＴｉＯ2 粉末とＳｉＯ2 粉末の平均粒径をいず
れも５．０μｍ以下としたのは、この平均粒径が５．０
μｍを越えると、焼成後のセラミック基板に後付けメタ
ライズ法で微細な導体パターンを形成した場合に、Ｍ
ｏ、Ｍｎ等の粒子が均一に分散しなくなってセラミック
基板と導体パターンとの接合強度が低下するということ
による。The average particle size of Mo powder, Mn powder, and TiO 2 powder as an additive and SiO 2 powder is 5.0 μm or less.
If it exceeds μm, when a fine conductor pattern is formed on the fired ceramic substrate by a post-metallization method, M
This is because the particles such as o and Mn are not uniformly dispersed and the bonding strength between the ceramic substrate and the conductor pattern is reduced.
【００１２】[0012]
【作用】本発明のセラミック基板用導体ペーストは、前
述した組成を有するので、Ｍｏ、Ｍｎ、ＴｉＯ2 粉末及
びＳｉＯ2 粉末の混合した粒子が、セラミック基板上に
導体パターンを形成した際、各パターンに均一に分散し
てセラミック基板との接合強度が向上して、後付けメタ
ライズで微細な導体パターンを形成することができる。
特にＴｉＯ2 粉末を添加することによって、セラミック
基板と導体パターンとの接合強度を高めることができ、
ＳｉＯ2 粉末を添加することによって、基板へのガラス
分を補給することができ、高寸法精度のパッケージを得
ることができる。Since the conductor paste for a ceramic substrate of the present invention has the above-mentioned composition, when mixed particles of Mo, Mn, TiO 2 powder and SiO 2 powder form a conductor pattern on the ceramic substrate, each pattern And the bonding strength with the ceramic substrate is improved, and a fine conductor pattern can be formed by post-metallization.
In particular, by adding TiO 2 powder, it is possible to increase the bonding strength between the ceramic substrate and the conductor pattern,
By adding the SiO 2 powder, the glass component can be replenished to the substrate, and a package with high dimensional accuracy can be obtained.
【００１３】[0013]
【実施例】以下、本発明を具体化した実施例について説
明する。本実施例のセラミック基板用導体ペーストは、
Ｍｏ粉末を７０〜９０重量％、Ｍｎ粉末を１０〜３０重
量％、添加剤としてのＴｉＯ2 粉末およびＳｉＯ2 粉末
を２〜２０重量％を混合し、この混合物を、遊星ミルで
粉砕し、平均粒径が５．０μｍ以下の混合微粉末を得
て、この粉末をビヒクル中に分散させてペースト化して
いる。Embodiments of the present invention will be described below. The conductor paste for a ceramic substrate of this example is
70 to 90% by weight of Mo powder, 10 to 30% by weight of Mn powder, and 2 to 20% by weight of TiO 2 powder and SiO 2 powder as additives were mixed, and this mixture was pulverized by a planetary mill, and averaged. A mixed fine powder having a particle size of 5.0 μm or less is obtained, and this powder is dispersed in a vehicle to form a paste.
【００１４】ここで、ビヒクル中の、前記Ｍｏ粉末、Ｍ
ｎ粉末、ＴｉＯ2 粉末、およびＳｉＯ2 粉末の平均粒径
が５．０μｍ以下の範囲のものとし、かつこれらの粉末
を前記組成割合としたのは、後述する表１に示す実施例
１〜２、比較例１〜６の導体ペーストを用いて、セラミ
ック基板上に導体パターンを形成し、それぞれについ
て、メタライズ強度を測定・評価した結果得られた数値
である。なお、これらの粉末をペーストにするためのビ
ヒクルとしては、有機樹脂および溶剤を用いている。こ
の有機樹脂としては、エチルセルロース、アクリル樹
脂、メタクリル樹脂等の非水溶性樹脂が好ましい。また
溶剤としては、トルエン、キシレン等を用いる。Here, the above-mentioned Mo powder, M in the vehicle
The average particle diameter of the n powder, the TiO 2 powder, and the SiO 2 powder was in the range of 5.0 μm or less, and these powders were used as the composition ratios in Examples 1 and 2 shown in Table 1 described later. The conductor pastes of Comparative Examples 1 to 6 were used to form conductor patterns on a ceramic substrate, and the metallization strengths of the respective conductor patterns were measured and evaluated. An organic resin and a solvent are used as a vehicle for making these powders into a paste. The organic resin is preferably a water-insoluble resin such as ethyl cellulose, acrylic resin, methacrylic resin. As the solvent, toluene, xylene or the like is used.
【００１５】[0015]
【表１】 [Table 1]
【００１６】これらの実施例１〜２、および比較例１〜
６の各ペーストを用いてセラミック焼結基板上に微細パ
ターン（φ０．１３ｍｍ）を印刷して焼成を行い、更に
その上に、Ｎｉメッキ、Ａｕメッキを施して、セラミッ
ク基板との接着強度−メタライズ強度−を評価した。そ
して、この評価結果を表２に示す。なお、その評価は、
前記メッキ処理後の導体パターン上に錫被覆銅線を共晶
Ｐｂ−Ｓｎハンダにて垂直にハンダ付けし、セラミック
基板を固定した状態で引っ張り試験機により、垂直方向
に引張り、錫被覆銅線がセラミック基板から剥がれたと
きの接着強度（ｋｇ／ｍｍ2 ）を測定する方法で行っ
た。Examples 1 and 2 and Comparative Examples 1 and 2
A fine pattern (φ0.13 mm) is printed on a ceramic sintered substrate using each of the pastes of No. 6 and fired, and Ni plating and Au plating are further applied thereon to bond strength with the ceramic substrate-metallization The strength was evaluated. The evaluation results are shown in Table 2. The evaluation is
A tin-coated copper wire was vertically soldered on the conductor pattern after the plating treatment with eutectic Pb-Sn solder, and the ceramic substrate was fixed and pulled vertically by a tensile tester to obtain a tin-coated copper wire. The adhesive strength (kg / mm 2 ) when peeled from the ceramic substrate was measured.
【００１７】[0017]
【表２】 [Table 2]
【００１８】そして、この表１から分るように、実施例
１〜２の導体ペーストを用いた場合には、平均４．０ｋ
ｇ／ｍｍ2 以上のメタライズ強度が得られ、比較例１〜
６の導体ペーストを用いた場合には、平均１．６〜２．
７ｋｇ／ｍｍ2 程度のメタライズ強度しか得られないこ
とが確認できた。これは、本実施例の場合、前述した粉
末粒径とし、かつ配合割合としたことにより、セラミッ
ク基板の接合強度が増大したものであることが確認でき
る。また、導体ペースト中に、添加剤としてＴｉＯ2 粉
末ＳｉＯ2 粉末を前記配合で添加することにより、接合
強度を向上させ得ることも確認できる。As can be seen from Table 1, when the conductor pastes of Examples 1 and 2 were used, the average value was 4.0 k.
A metallization strength of g / mm 2 or more was obtained, and Comparative Examples 1 to 1
When the conductor paste of No. 6 is used, the average of 1.6 to 2.
It was confirmed that only a metallizing strength of about 7 kg / mm 2 was obtained. It can be confirmed that, in the case of the present embodiment, this is because the bonding strength of the ceramic substrate is increased by setting the powder particle size and the mixing ratio as described above. It can also be confirmed that the bonding strength can be improved by adding the TiO 2 powder SiO 2 powder as an additive in the conductor paste in the above-mentioned composition.
【００１９】ところで、同じ市販のＭｏ粉末やＭｎ粉末
を粉砕するして微粉末化する場合でも、遊星ミルを用い
た方が、ライカイ機を用いる場合に比べて粉砕機として
は遊星ミルが適している。これは、該遊星ミルを用いて
微粉末化した場合、ライカ粉砕機を用いた場合に比べ
て、図１、図２に示す金属組織を示す写真から分かるよ
うに、その微粉末化した粉末の粒径に均一性を付与でき
ることによるものと考えられる。従って、メタライズ強
度を効果的に大きくすることが出来る。By the way, even when the same commercially available Mo powder and Mn powder are crushed into fine powders, the planet mill is more suitable as a crusher than the one using the Laikai machine. There is. This is because, when finely pulverized using the planetary mill, as compared with the case where the Leica crusher is used, as can be seen from the photographs showing the metal structures shown in FIGS. It is considered that this is because the particle size can be made uniform. Therefore, the metallization strength can be effectively increased.
【００２０】なお、本発明は上述した実施例に限定され
るものではなく、本発明の要旨を変更しない範囲内で変
形実施できる構成を含むものである。It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within a range that does not change the gist of the present invention.
【００２１】[0021]
【発明の効果】以上の説明より明らかなように、本発明
の請求項１のセラミック基板用導体ペーストによれば、
平均粒径が５．０μｍ以下のＭｏ粉末を７０〜９０重量
％、平均粒径が５．０μｍ以下のＭｎ粉末を１０〜３０
重量％、平均粒径が５．０μｍ以下のＴｉＯ2 粉末及び
ＳｉＯ2 粉末をそれぞれ１〜１０重量％含有するので、
導体パターンとセラミック基板との接合強度が向上し
て、後付けメタライズで微細な導体パターンを形成する
ことができ、高寸法精度のパッケージの得ることができ
るという効果を有する。As is apparent from the above description, according to the conductor paste for a ceramic substrate of claim 1 of the present invention,
70 to 90% by weight of Mo powder having an average particle diameter of 5.0 μm or less and 10 to 30 of Mn powder having an average particle diameter of 5.0 μm or less
1% to 10% by weight of TiO 2 powder and SiO 2 powder having an average particle size of 5.0 μm or less are contained,
This has the effect that the bonding strength between the conductor pattern and the ceramic substrate is improved, a fine conductor pattern can be formed by post-metallization, and a package with high dimensional accuracy can be obtained.
【図１】 金属粉末を遊星ミルを用いて微粉末化した状
態を示す拡大図である。FIG. 1 is an enlarged view showing a state in which metal powder is made into fine powder using a planetary mill.
【図２】 金属粉末をライカ粉砕機を用いて微粉末化し
た状態を示す拡大図である。FIG. 2 is an enlarged view showing a state in which metal powder is made into fine powder using a Leica crusher.
Claims (1)
るためのセラミック基板用導体ペーストにおいて、平均
粒径が５．０μｍ以下のＭｏ粉末：７０〜９０重量％、
平均粒径が５．０μｍ以下のＭｎ粉末：１０〜３０重量
％、平均粒径が５．０μｍ以下のＴｉＯ2 粉末及びＳｉ
Ｏ2 粉末をそれぞれ：１〜１０重量％を含む固形物粉末
がビヒクル中に分散されていることを特徴とするメタラ
イズ用導体ペースト。1. A conductor paste for a ceramic substrate for forming a conductor pattern on a ceramic substrate, wherein Mo powder having an average particle size of 5.0 μm or less: 70 to 90% by weight,
Mn powder having an average particle size of 5.0 μm or less: 10 to 30% by weight, TiO 2 powder having an average particle size of 5.0 μm or less and Si
A conductor paste for metallization, characterized in that a solid powder containing 1 to 10% by weight of O 2 powder is dispersed in a vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34034794A JPH08183683A (en) | 1994-12-27 | 1994-12-27 | Conductor paste for metallizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34034794A JPH08183683A (en) | 1994-12-27 | 1994-12-27 | Conductor paste for metallizing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08183683A true JPH08183683A (en) | 1996-07-16 |
Family
ID=18336071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34034794A Pending JPH08183683A (en) | 1994-12-27 | 1994-12-27 | Conductor paste for metallizing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08183683A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613254B1 (en) * | 2001-12-22 | 2006-09-25 | 재단법인 포항산업과학연구원 | Composition of metallizing paste and metallizing method |
| US7956138B2 (en) | 2007-05-16 | 2011-06-07 | Exxonmobil Chemical Patents Inc. | Catalyst system for olefin polymerization and polymers produced therefrom |
| WO2012009044A1 (en) | 2010-07-16 | 2012-01-19 | Exxonmobil Chemical Patents Inc. | Adhesive extrusion for dynamically vulcanized thermoplastic elastomer laminates |
-
1994
- 1994-12-27 JP JP34034794A patent/JPH08183683A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613254B1 (en) * | 2001-12-22 | 2006-09-25 | 재단법인 포항산업과학연구원 | Composition of metallizing paste and metallizing method |
| US7956138B2 (en) | 2007-05-16 | 2011-06-07 | Exxonmobil Chemical Patents Inc. | Catalyst system for olefin polymerization and polymers produced therefrom |
| WO2012009044A1 (en) | 2010-07-16 | 2012-01-19 | Exxonmobil Chemical Patents Inc. | Adhesive extrusion for dynamically vulcanized thermoplastic elastomer laminates |
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