JPH0818310A - Semiconductor package - Google Patents

Abstract

PURPOSE:To extend the frequency band by sticking a film of a resistor to the cover or the like of the package of a circuit or a semiconductor device. CONSTITUTION:A film 2 of the resistor is formed in a part of a cover 1 of the package of a circuit or a semiconductor device which is used in the frequency band between resonance frequencies of the first-order mode and the second-order mode of the package used for micro waves and millimeter waves, and thereby, electromagnetic waves radiated in the cavity are absorbed to suppress the resonance. Consequently, the film 2 is formed to extend the frequency band which the package can use. Though it is effective that the film 2 is formed in a part of the cover 1, it is more effective that the film 2 is formed in all parts facing the cavity except the part of adhesion to the box body. Thus, the frequency band is extended to suppress the resonance without degrading the reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package, and more particularly to a package used for microwaves and millimeter waves.

[0002]

2. Description of the Related Art A conventional package, as shown in FIG. 8, has a terminal 11 for electrically connecting the circuit 9 inside the package and the outside, and a metal plate having an opening on the entire surface serving as a ceiling. It is composed of a box body 8 and a metal lid 7 shown in FIG. 7 that seals the opening thereof. In such a circuit module package, when the frequency of the signal flowing in the circuit 9 becomes high, the signal at the connection portion between the terminal 11 and the line 9a on the circuit board 10 or the connection portion between the line 9a and the semiconductor device 9b is changed. Scattering and radiation increase. Of the radiated signal, the frequency depending on the size of the cavity surrounded by the box 8 and the lid 7.

[0003]

[Equation 1]

A signal having "1" is stored as an electromagnetic wave in this cavity. When this electromagnetic wave is again absorbed by the line 9a and is transmitted to the semiconductor device 9b together with the signal, it causes abnormal oscillation and destruction, and when it is transmitted to the outside of the package through the terminal 11, it adversely affects the circuit connected to this circuit module. give.

[0005]

Therefore, the frequency band of the signals that can be input / output to / from the circuit module is limited to the frequency due to the volume inside the package that seals the circuit, that is, the frequency band excluding the resonance frequency. In order to suppress the resonance occurring in the cavity of this package, a radio wave absorber has been adhered to a portion of the box body 8 or the lid 7 facing the cavity (Japanese Utility Model Laid-Open No. 63-55545). However, in this case, the semiconductor device which is easily peeled off during use may be damaged, and there is a problem in reliability.

An object of the present invention is to provide a package of a circuit or a semiconductor device which can suppress resonance without spoiling reliability.

[0007]

In order to solve the above-mentioned problems, the present invention provides a semiconductor package in which a semiconductor element and a circuit board are mounted in a cavity and sealed with a metal cap. A resistor film was formed on at least a part of the region facing the. Further, a resistor film is formed on at least a part of the side surface of the cavity in the package.

[0008]

Since the present invention is configured as described above, the resonance that occurs in the cavity can be suppressed by the cavity or the film of the resistor formed in the portion facing the cavity.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an embodiment of the present invention. FIG.
FIG. 1 is a perspective view of a semiconductor package of a circuit module of the present invention, and FIGS. 1 and 2 show the structure of its lid. The semiconductor package has a terminal 6 for electrically connecting the circuit 4 inside the package that seals the circuit module and the outside, and a metal box 3 having an opening on the entire surface that serves as the ceiling. ,
The semiconductor film is formed by forming the resistor film 2 on the inside of the lid 1 made of metal which is adhered to the opening, which is the surface facing the cavity.

The resistor film 2 absorbs the electromagnetic wave radiated in the cavity and suppresses resonance. Therefore, by providing the resistor film 2, the frequency band in which the package can be used can be expanded. The film 2 of the resistor is effective even if it is formed on one part of the lid 1 as shown in FIG. 1, but is formed on all the parts facing the cavity except the box 3 and the adhesion part as shown in FIG. If it is done, a great effect can be obtained. The same effect can be obtained even if the resistance film is formed on the box body 3 instead of the lid 1.

4 to 6 show another embodiment. Figure 6
Is an MMIC (microwave semiconductor device) using the present invention.
4 and 5 show the structure of the lid 12 of the package for use in the present invention. The package for encapsulating the MMIC has a terminal 16 for electrically connecting the MMIC 15 inside the package and the outside, and a metal box 14 having an opening on the entire ceiling surface thereof and the opening 16 is bonded to the opening. Is formed of a metal lid 12 on which a resistive film 13 is formed.

Further, since the resistor film 13 can be formed by thick film printing or thin film printing, a strong adhesive force can be obtained and peeling does not damage the circuit. Further, since the space required for bonding the radio wave absorber is not required, it is possible to sufficiently cope with miniaturization.

[0013]

As described above, the present invention can be applied to a package of a circuit or a semiconductor device used in a frequency band between the resonance frequencies of the primary mode and the secondary mode of a package used in microwaves and millimeter waves. By attaching a resistor film to the lid, etc., it is possible to suppress the resonance of the package, so that the frequency band in which the package can be used can be expanded, and the reliability is not deteriorated by this, and the size can be reduced. Will also be possible.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a circuit package of the present invention.

FIG. 2 is a perspective view of a lid on which a resistor film is formed.

FIG. 3 is a perspective view of a lid on which a film of a plurality of resistors is formed.

FIG. 4 is a perspective view of an embodiment of the MMIC package of the present invention.

FIG. 5 is a perspective view of a lid on which a resistor film is formed.

FIG. 6 is a perspective view of a lid on which a film of a plurality of resistors is formed.

FIG. 7 is a perspective view of an example of a conventional circuit package.

FIG. 8 is a perspective view of a lid.

[Explanation of Codes] 1 Lid 2 Resistor Film 3 Box 4 Circuit 5 Circuit Board 6 Terminal 7 Lid 8 Box 9 Circuit 9a Line 9b Semiconductor Device 10 Circuit Board 11 Terminal 12 Lid 13 Resistor Film 14 Box 15 MMIC 16 terminal

Claims (2)

[Claims] 1. In a semiconductor package in which a semiconductor element and a circuit board are mounted in a cavity and sealed with a metal cap, a resistor film is formed on at least a part of a portion of the package facing the cavity. A semiconductor package characterized by 2. In a semiconductor package in which a semiconductor element and a circuit board are mounted in a cavity and sealed with a metal cap, a resistor film is formed on at least a part of a side surface of the cavity in the package. Characteristic semiconductor package