JPH08181466A - Electronic device - Google Patents

Abstract

PURPOSE: To improve noise characteristics by decreasing the number of electric components drastically, reducing production cost and decreasing the impedances of circuits with wiring, by forming conductor paths directly on a structure body that comprises a part of a case and fixing the components to the conductor paths. CONSTITUTION: Conductive paths 15 are formed directly on the inner surfaces of an external cover 12, a side plate 13 and a base 14 that constitute a case, and electric components 16 are connected and fixed to the conductor paths 15. The main component of the materials of a part of the case such as the external cover 12, the side plate 13 and the base 14, and supporters for internal devices is resin. Conductor paths 15 that are wired directly on a part of the external cover 12 are arranged basically in parallel but the number, the width, the length and the thickness of them are selected according to applications. IC ships, chip resistors and chip capacitors are the electric components 16 and these are connected and fixed to the conductor paths 15 by soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the field of office automation equipment such as copiers, printers and facsimiles, audio equipment, home appliances, etc., and is used for side plates, bottom plates, exterior covers, supports for internal devices, etc. The present invention relates to an electronic device having a body.

[0002]

2. Description of the Related Art In recent years, electronic devices such as copiers, printers, and audio devices have become smaller with the times. However, large-scale precision equipment such as copying machines requires manual work in order to assemble electrical parts using wires, connectors, wire harnesses, etc. in the processes of manufacturing and assembling, resulting in poor work efficiency and large equipment. Tend to change. In particular, electric wires and connectors are arranged within the electronic device in an infinite number of rows and columns, and are bulky both for maintenance and for assembly.
A dedicated space is required. In addition, when the wiring harness is laid out and laid out, burrs and the like of electric parts and sheet metal parts in the drive unit must be avoided, which leads to failure and damage, and thus requires a dedicated space.

In recent years, in the field of electronic equipment,
Safety standards and regulations related to noise are also becoming severe. E that regulates noise interference from electronic devices to the outside
EMS that regulates MI (Electro Magnetic Interference) and noise interference from the outside to the inside of electronic equipment
(Electro Magnetic Susceptibility) has a great influence on the design of a printed circuit board on which electric parts are mounted, a wire harness, etc., and noise countermeasures are required. As an example, when the wire harness is covered right above the printed circuit board on which the electric component is mounted, the harmonic noise generated from the electric component is induced in the wire harness and the noise is generated in all directions as an antenna. The generation of this noise may cause a malfunction or the like of electric parts inside the electronic device or may adversely affect other electronic devices arranged around the electronic device, resulting in failure or damage.

[0004]

Conventionally, as means for simplifying the work of assembling wire harnesses, electric wires, connectors, etc. and reducing the space for distribution,
It is general that these wire harnesses and the like are attached to a support member and the like for wiring (actually, Kaihei 1-1
23860, Japanese Utility Model Laid-Open No. 1-10964, etc.). However, since a supporting member for arranging the wire harness and the like is required, the number of parts increases, the size and weight of the device are inevitably increased, and the cost is inevitable. descend.

Further, the electric components are connected to the inside of a structural body such as a side plate which constitutes an electronic component by eliminating the supporting members such as the wire harness and simplifying the wiring structure and the wiring work. For this purpose, a plurality of power feeding paths are buried in a state where insulation is maintained (Japanese Patent Laid-Open No. 6-1.
94471). However, what is buried inside the structure is only the power supply path, and the electric parts are located on the outer surface of the structure, so the assembly work is troublesome and the assembly process is sufficiently simplified. I can't say that

[0006] Further, as measures for improving the work efficiency at the time of maintenance and assembling, JP-A-62-57266, JP-A-63-122349 and JP-A-63-
Although there are 236052 and Japanese Utility Model Laid-Open No. 2-64951, there is a limit to miniaturization of the device, and wiring work such as a wire harness has not been improved.

As a measure against noise, there is one in which the entire substrate on which electric parts are mounted is covered with a shield member (see Japanese Patent Laid-Open No. 2-181163, etc.), but the number of parts increases and the device becomes large, Weight and cost are inevitable.

[0008]

According to the first aspect of the present invention,
A conductive path to which an electric component for driving and controlling the device body is fixed is directly formed in the structure forming a part of the housing.

According to a second aspect of the invention, in the first aspect of the invention, the conductive path and the electric component are embedded inside the structure.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the base material of the structure is made of metal, and an insulating layer is provided between the structure made of the metal and the conductive paths and the electric parts. Intervened.

According to a fourth aspect of the present invention, in the first, second or third aspect of the invention, a metal material is formed on the outer peripheral surface of the structure including at least the electric component and the conductive path.

[0012]

According to the first aspect of the present invention, a wire harness, an electric wire, and a connector as in the prior art are provided by directly providing a conductive path and an electric component on a structure (for example, a side plate) that constitutes a part of a housing. Such wiring components are unnecessary, and the assembling property can be improved.

According to the second aspect of the present invention, by embedding the conductive path and the electric component inside the structure, the wiring component can be further simplified and the assembling property can be further improved. .

According to the third aspect of the present invention, the base material of the structure is made of metal, so that the structure itself becomes solid and the entire structure can be used as a shield.

According to the fourth aspect of the present invention, by forming a metal material on the outer peripheral surface of the structure, it is possible to obtain a perfect shielding effect, and further, mechanical protection of the electric component can be performed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. 1 to 6 (corresponding to the invention of claim 1). As an electronic device, here, a well-known printer that prints by an electrophotographic method is taken as an example. First, the outline of the overall configuration of the printer will be described with reference to FIG. Now, as the photoconductor 1 (image carrier) rotates, its surface is charged to a potential of a predetermined polarity by corona discharge of the charger 2. An optical signal corresponding to an image signal is applied to the surface of the charged photoconductor 1 by the exposure device 3 to form an electrostatic latent image. This electrostatic latent image is developed by the developing device 4. On the other hand, in synchronization with the rotation of the photoconductor 1, the transfer paper 6 is fed from the paper feed unit 5 by the paper feed roller 7 and reaches the position below the photoconductor 1. Then, the transfer paper 6 is transferred by being brought into contact with the photoconductor 1 after development, further fixed by a fixing device 8, and discharged by a paper discharge roller 9 to a paper discharge tray 10 outside the machine. The toner on the surface of the photoconductor 1 after the transfer is removed by the cleaning unit 11, and the photoconductor 1 returns to the initial state. It should be noted that the above description relates to the configuration of the device main body B of a known printer.

In this case, the conductive paths 15 are directly formed on the inner surfaces of the outer cover 12, the side plate 13, and the base 14 which form the housing. An electric component 16 is connected and fixed on the conductive path 15. In this case, a part of the casing such as the outer cover 12, the side plate 13, the base 14, and the members that form the support of each internal device are the structure A. The structure A is made of resin as a base material A here.
I am o. 2A and 2B are enlarged views of a part of the exterior cover 12 as the structure A. FIG. 3 is a plan view of FIG. Such a structure A
The plurality of conductive paths 15 directly wired on top are basically arranged in parallel, but depending on the application, the number, width, length,
The thickness can be changed freely. In addition, the electric component 16
For example, an IC chip, a chip resistor, a chip capacitor, etc. are used, and these respective parts are connected and fixed on the conductive path 15 via an adhesive such as solder (bump). The conductive path 15 provided with such an electric component 16 is connected to the device body B of the printer. The structure A is configured in this way.

4 to 6 show a conductive path 15 and an electric component 16.
A modified example of the structure A (for example, the outer cover 12) including the following is shown (however, the electric component 16 is not shown). First, in the example of FIG. 4, the conductive paths 15 that connect the electric components 16 are formed on both surfaces of the base material Ao of the structure A. By thus forming the conductive paths 15 on both sides of the conductive path 15, the integration degree of the wiring region can be increased. In addition, in the example of FIG. 5, the insulating resin layer 17 is applied to the surface of the conductive path 15 formed on one surface of the base material Ao of the structure A of FIG. 2B, and the example of FIG. Then, the structure A of FIG.
An insulating resin layer 17 is applied to the surfaces of the conductive paths 15 formed on both sides of the base material Ao. By applying the resin layer 17 on the surface in this way, the effect of noise reduction can be obtained.

As described above, the conductive path 15 is formed on the structure A.
By directly wiring and connecting and fixing the electric component 16 on the conductive path 15 to form a wiring board, the number of components can be significantly reduced as compared with the related art. This allows
The production cost is reduced, and a small and lightweight electronic device can be obtained. Further, since the electric component 16 is directly fixed to the structure A, the impedance on the wiring board due to the distribution of the electric wire or the like can be reduced, thereby improving the noise characteristic and eliminating the malfunction of the device. be able to.

As the material of the structure A, a thermosetting resin such as a phenol resin, an epoxy resin, a polyimide resin, a fluorine resin or a polyester resin can be used alone or as a mixture. Further, a thermoplastic resin such as a polycarbonate resin, a polybutylene terephthalate resin, a polyphenylene oxide resin, a polyphenylene safar side resin, a polyamide resin, a polyamideimide resin, ceramics, glass or the like may be used. Further, it is also possible to apply a material obtained by selectively mixing at least two kinds of materials such as paper, glass fiber, a base material such as ceramics, thermosetting resin, and thermoplastic resin. The material of such a structure A can also be applied as the material of the insulating resin layer 17. By using the same material for the structure A and the insulating resin layer 17,
Production, processing steps and equipment can be further reduced.

As the material of the conductive path 15, copper, aluminum, iron, nickel, zinc, tin alone or an alloy, a carbon-based conductor that can be used as a resistor, or a metal material surface-treated. Is used. As the surface treatment at this time, for example, a plating treatment with a material such as solder, nickel, gold or silver is optimal.

Next, a second embodiment of the present invention will be described with reference to FIGS.
A description will be given based on item 1 (corresponding to the invention of claim 3). In this embodiment, the description of the same parts as those in the first embodiment described above will be omitted and the same reference numerals will be used.

The structure A is composed of a metal as a base material Ao. Steel, aluminum, copper or the like can be used as the metal material. A coating film of the insulating layer 18 is formed on both surfaces of the structure A made of such a metal. A plurality of conductive paths 15 are wired on the one insulating layer 18. An electric component 16 is provided on the conductive path 15.
(See FIG. 3) is fixedly connected. The structure A is configured in this way.

8 to 11 show modified examples of the structure A having the conductive paths 15 and the electric components 16. First, in the example of FIG. 8, the insulating layer 18 is formed on one surface of the base material Ao of the structure A made of metal, and the conductive path 15 is formed on the insulating layer 18.
Is wired. In the example of FIG. 9, the insulating layers 18 are formed on both surfaces of the base material Ao of the structure A made of metal, and the conductive paths 15 are wired on the insulating layers 18 on both surfaces. Further, FIG. 10 shows an example in which the electric component 16 is connected and fixed to one surface of the base material Ao of the structure A of FIG. FIG. 11 shows an example in which the electric component 16 is connected and fixed to both surfaces of the base material Ao of the structure A of FIG.

As described above, the base material Ao of the structure A is made of metal, and the conductive path 15 and the electric component 16 are provided through the insulating layer 18.
By providing and, the structure A itself can have a robust structure. As a result, even if a heavy component is supported, deformation or displacement does not occur. Further, since it is a metal, the shield effect can be enhanced. As a result, noise intrusion and radiation can be reduced, and malfunction of the device can be eliminated.

The structure A comprises the outer cover 12, the side plate 13, the base 14 and the like of the first embodiment described above. The material of the insulating layer 18 is the same as that of the insulating resin layer 17 of the first embodiment described above, and the material of the conductive path 15 is also the conductive path 15 of the first embodiment described above.
The same material is used, and the surface is plated. The same applies to the structure A, the conductive path 15, and the insulating layer 18 in each of the following embodiments.

Next, a third embodiment of the present invention will be described with reference to FIGS. 12 to 17 (corresponding to the invention of claim 4). In this embodiment, the description of the same parts as those of the first and second embodiments described above will be omitted and the same reference numerals will be used.

A metal layer 19 as a metal material is formed on the outer peripheral surface of the structure A. As the metal layer 19, for example, a metal coating of copper or nickel alone or an alloy thereof can be used. As a method for forming the metal film, a liquid material may be sprayed, a roller may be used for coating, natural drying, baking, or the like.

Further, as the structure A, it is possible to use one in which the base material Ao is made of resin (first embodiment) or one made of metal (second embodiment). In the structure A in which the resin is the base material Ao, the metal layer 19 is formed on the outer surface including the conductive path 15 and the electric component 16 (or the resin layer 17), and in the structure A in which the metal is the base material Ao. A metal layer 19 is formed on the outer surface including the conductive path 15, the electric component 16, and the insulating layer 18. Hereinafter, an example of the structure A in which the metal layer 19 is formed as the metal material will be described based on FIGS. 12 to 17.

FIG. 12 shows a base material A of a structure A made of metal.
The insulating layer 18 is formed on both sides of the conductive layer 15.
Are also included). A metal layer 19 is formed on the conductive path 15 via an insulating layer 18.

FIG. 13 shows a base material A of a structure A made of metal.
The insulating layer 18 is formed on one surface of the conductive layer 1, and the conductive path 1 is formed on the insulating layer 18.
5, an insulating layer 18, including an electric component 16 (not shown),
The metal layer 19 is sequentially formed.

FIG. 14 shows a base material A of a structure A made of metal.
Insulating layer 18 is formed on both sides of
A conductive path 15 (including an electric component 16 (not shown)), an insulating layer 18, and a metal layer 19 are sequentially formed on the surface 8 as in FIG.

FIG. 15 shows a base material A of a structure A made of metal.
A conductive path 15 is formed on one surface of o via an insulating layer 18, an electric component 16 is connected and fixed on the conductive path, and the other outer surface is covered with a metal layer 19. FIG.
15 on both sides of the base material Ao of the structure A made of metal.
It is formed with the same substrate structure as.

FIG. 17 shows a base material A of a structure A made of metal.
An insulating layer 18 is formed on one surface of o, and a conductive path 15 (including an electric component 16 (not shown)) is embedded in the insulating layer 18. The outer surface of the insulating layer 18 is covered with the metal layer 19. Such a substrate structure can be easily mounted on both sides.

As described above, the electric component 16 and the conductive path 1
By forming the metal layer 19 on the outer peripheral surface of the structure A including 5 and the like, a complete shield effect can be obtained. As a result, it is possible to eliminate malfunctions and fully comply with safety standards and regulations regarding noise. Further, since the structure A itself is made solid by using the metal material, it is possible to mount a large-sized device. In the conductive path 15, it is desirable that the ground of the power source that is not the signal path is directly connected to the structure A without the insulating layer 18.
Further, it is desirable to directly form the metal film of the metal material, the conductive path 15 of the ground line of the power source, and the structure A made of metal.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 18 to 20 (corresponding to the invention of claim 2). It should be noted that the description of the same parts as those in the above-mentioned respective embodiments is omitted, and the same reference numerals are used for the same parts.

FIG. 18 shows the structure of a printer having a device body B similar to that shown in FIG. Here, the conductive path 15 and the electric component 16 are embedded inside the structure A. As the structure A, the outer cover 12 and the side plate 1
3, a part of the housing such as the base 14 and a support for each internal device, and is made of a resin (or metal) base material Ao.
Further, an IC, a resistor, an LSI, a capacitor, or the like is used as the electric component 16, and is connected to the waveguide 15 by a connecting means such as solder. In addition, such an electric component 16
In particular, the reliability of connection is improved by using leadless, SMD (surface mount component), bare chip and the like.

FIG. 19 shows an example in which the base material Ao of the structure A is made of an insulating resin layer 17. The conductive path 15 is wired in the resin layer 17, and the electric component 16 is connected and fixed on the conductive path 15. In addition, FIG. 20 shows another example, in which the conductive path 15 and the electric component 16 are vertically arranged in the base material Ao of the structure A made of the resin layer 17.
They are provided in steps, and the upper and lower surfaces are covered with another resin layer 20.

As described above, the conductive path 15 and the electric component 1
By embedding 6 inside the structure A, the wiring circuit inside the printer housing can be further simplified. As a result, the reliability of the device including the electrical connection of the electric component 16 can be further improved.

Next, a fifth embodiment of the present invention will be described with reference to FIGS. 21 and 22 (corresponding to the invention of claim 4). In this embodiment, the description of the same parts as those in the above-mentioned fourth embodiment is omitted and the same reference numerals are used.

The outer peripheral surface of the structure A in which the conductive paths 15 and the electric components 16 are embedded in the insulating resin layer 17 as the base material Ao is covered with the metal layer 19 as the metal material. As the metal layer 19, for example, a metal coating of copper or nickel alone or an alloy thereof can be used.
The structure A here may be of any form, as long as the outer periphery of the base material Ao is covered with the metal layer 19, whether it is an integral structure or a laminated structure, and can be selected depending on the setting of the manufacturing and assembling steps. Further, FIG. 22 shows a modified example. The metal layer 19 covers the outer peripheral surface of the base material Ao of the structure A in which the conductive path 15 and the electric component 16 are embedded in the resin layer 17 in two steps.

As described above, the conductive path 15 and the electric component 1
By covering the outer peripheral surface of the structure A in which 6 is buried with the metal layer 19, a complete shield effect can be obtained. This makes it possible to eliminate malfunctions and sufficiently comply with safety standards and regulations regarding noise. In addition, since the structure A itself is robust, a large device can be mounted. Although the base material Ao of the structure A is the resin layer 17 here, it may be made of a metal other than the resin layer 17, and in this case, the metal can be covered with an insulating resin or the like.

[0043]

According to the first aspect of the present invention, the conductive path is directly formed on the structure forming a part of the housing, and the electric parts are fixed on the conductive path. It is possible to significantly reduce the number of parts by eliminating such troublesomeness, and thereby it is possible to reduce the production cost and provide a small and lightweight electronic device. Further, since the electric parts are directly provided on the structure, impedance on the circuit due to the electric wire or the like can be reduced, noise characteristics can be improved, and malfunction of the device can be eliminated.

According to the second aspect of the present invention, since the conductive path and the electric component are embedded inside the structure, it is possible to further simplify the wiring circuit and thereby electrically connect the electric component. It is possible to further increase the reliability of the included equipment and further reduce the production cost.

According to the third aspect of the present invention, the base material of the structure is made of metal, and the insulating layer is interposed between the structure made of the metal and the conductive paths and the electric parts. It is possible to provide a device having a mechanically high reliability that does not cause deformation or displacement even when supporting a heavy component. Moreover, since the structure itself is made of metal, the shield effect can be further improved, which can reduce noise intrusion and radiation, prevent malfunction of the device, and improve electrical reliability.

According to the fourth aspect of the present invention, since the metal material is formed on the outer peripheral surface of the structure including at least the electric component and the conductive path, a perfect shielding effect can be obtained, thereby eliminating malfunction and safety regarding noise. It can fully comply with standards and regulations. Further, as a result, the structure itself becomes robust, so that a large-sized device can be mounted.

[Brief description of drawings]

FIG. 1 shows a first embodiment of the present invention and is a vertical cross-sectional front view showing the overall configuration of an electronic device.

FIG. 2A is a side view showing a structure of a structure provided with an electric component and a conductive path, and FIG. 2B is a vertical cross-sectional view of a base material portion made of the resin.

FIG. 3 is a plan view of FIG.

FIG. 4 is a vertical cross-sectional view showing a structure in which conductive paths are formed on both surfaces of the structure.

FIG. 5 is a vertical cross-sectional view showing a structure in which a conductive path and a resin layer are formed on a structure.

FIG. 6 is a vertical cross-sectional view showing a structure in which a conductive path and a resin layer are formed in two steps on a structure.

FIG. 7 shows a second embodiment of the present invention and is a vertical cross-sectional view when a metal is used as a base material of a structure.

FIG. 8 is a vertical cross-sectional view when a conductive path is formed on one surface of a structure made of metal.

FIG. 9 is a vertical cross-sectional view in which conductive paths are formed on both surfaces of a structure made of metal.

FIG. 10 is a side view showing a configuration in which an electric component and a conductive path are provided on one side of a structure made of metal.

FIG. 11 is a side view showing a configuration in which an electric component and a conductive path are provided on both sides of a structure made of metal.

FIG. 12 shows a third embodiment of the present invention, and is a vertical cross-sectional view of the outer peripheral surface of a structure made of a metal sandwiched by an insulating layer covered with a metal layer.

FIG. 13 is a vertical cross-sectional view in the case where an insulating layer is provided on one surface and the outer peripheral surface of a metal structure is covered with a metal layer.

FIG. 14 is a vertical cross-sectional view in which the outer peripheral surfaces of the upper and lower surfaces of a metal structure are covered with metal layers.

15A is a side view showing a structure in which an electric component and a conductive path are provided on one side of a structure made of metal, and FIG. 15B is a longitudinal section of a base material portion whose outer peripheral surface is covered with a metal layer. It is a side view.

FIG. 16 is a side view showing a configuration in which an electric component and a conductive path are provided on both sides of a structure made of metal.

FIG. 17 is a vertical cross-sectional view showing a structure in which a conductive path is surrounded by an insulating layer on a structure made of metal.

FIG. 18 shows a fourth embodiment of the present invention and is a vertical cross-sectional front view showing the overall configuration of the electronic device.

FIG. 19 (a) is a vertical cross-sectional view showing a structure in which an electric component and a conductive path are embedded in a structure made of resin.
(B) is a longitudinal cross-sectional view of the substrate portion.

20A is a vertical cross-sectional view showing a structure in which an electric component and a conductive path are embedded in a structure made of resin in two steps, and FIG. It is a side view.

FIG. 21 shows a fifth embodiment of the present invention,
(A) is a vertical cross-sectional view showing a structure in which a metal layer covers the outer peripheral surface of a structure made of a resin in which an electric component and a conductive path are embedded, and (b) is a vertical cross-sectional view of a base material portion thereof. is there.

FIG. 22 (a) is a vertical cross-sectional view showing a structure in which an outer peripheral surface of a resin-made structure in which an electric component and a conductive path are buried in two steps above and below is covered with a metal layer; FIG. 4 is a vertical cross-sectional view of the base material portion.

[Explanation of symbols]

 12 to 14 structure 15 conductive path 16 electric component 18 insulating layer 19 shield layer A structure Ao base material B device body

Claims (4)

[Claims] 1. In an electronic device including a structure that supports or covers a device body and forms a part of a housing, a conductive path to which an electric component for driving and controlling the device body is fixed is provided in the structure. An electronic device characterized by being formed directly on the body. 2. The electronic device according to claim 1, wherein the conductive path and the electric component are embedded inside the structure. 3. The electron according to claim 1, wherein the base material of the structure is made of a metal, and an insulating layer is interposed between the structure made of the metal and the conductive path and the electric component. machine. 4. The electronic device according to claim 1, wherein a metal material is formed on an outer peripheral surface of a structure including at least an electric component and a conductive path.