JPH08181200A - Fixing equipment of material to be treated - Google Patents

Fixing equipment of material to be treated

Info

Publication number
JPH08181200A
JPH08181200A JP32074194A JP32074194A JPH08181200A JP H08181200 A JPH08181200 A JP H08181200A JP 32074194 A JP32074194 A JP 32074194A JP 32074194 A JP32074194 A JP 32074194A JP H08181200 A JPH08181200 A JP H08181200A
Authority
JP
Japan
Prior art keywords
processed
fixing
stage
end surface
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32074194A
Other languages
Japanese (ja)
Inventor
Akira Iwase
昭 岩瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP32074194A priority Critical patent/JPH08181200A/en
Publication of JPH08181200A publication Critical patent/JPH08181200A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To provide a fixing equipment of material to be treated wherein material to be treated can be surely fixed so as not to shift on account of acceleration and decelation at the time of moving a stage, without damaging the flatness of the material to be treated, and treatment precision can be improved. CONSTITUTION: A plurality of retaining parts 12... and vacuum chucks 22, 22 are arranged on the upper surface of a stage 1. Material 6 to be treated is three-point supported in a horizontal state with the retaining parts 12.... An end surface 6a which does not damage the flatness of the material 6 to be treated is vacuum-sucked with the vacuum chucks 22, 22.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、マスク検査装置等に適
用され、マスクブランクス等の被処理材をステージ上に
固定する被処理材の固定装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for fixing a material to be processed, which is applied to a mask inspection device or the like and fixes a material to be processed such as mask blanks on a stage.

【０００２】[0002]

【従来の技術】マスク検査装置においては、被処理材で
あるマスクブランクスをステージ上に位置決め固定し、
ステージを移動させながらマスクブランクスの検査を行
うようになっている。2. Description of the Related Art In a mask inspection apparatus, a mask blank as a material to be processed is positioned and fixed on a stage,
The mask blanks are inspected while moving the stage.

【０００３】従来、マスクブランクス等の被処理材をス
テージ上に固定する場合、ステージ上に複数の真空チャ
ックを配設し、これら真空チャックにより被処理材の重
力方向（Ｚ方向）の位置決めと、水平方向（Ｘ，Ｙ方
向）の位置ずれを防止するようにしていた。Conventionally, when a material to be processed such as a mask blank is fixed on a stage, a plurality of vacuum chucks are arranged on the stage, and the vacuum chuck positions the material to be processed in the gravity direction (Z direction). The position shift in the horizontal direction (X, Y direction) is prevented.

【０００４】すなわち、図５に示すように、Ｘ，Ｙ方向
に位置測定用のレーザミラーａ，ｂが配設されたＸ−Ｙ
ステージｃの上面に、被処理材ｄの側端面と当接して
Ｘ，Ｙ方向の位置決めを行う３つの位置決めピンｅ…を
配設すると共に、被処理材ｄの下面の３点（４点の場合
もある）を支承する状態に複数の真空チャック（Ｚ真空
チャック）ｆ…を設けたものとなっている。That is, as shown in FIG. 5, XY having position measuring laser mirrors a and b arranged in the X and Y directions.
On the upper surface of the stage c, three positioning pins e ... Which contact the side end surface of the material to be processed d and perform positioning in the X and Y directions are arranged, and three points (four points of the four points) on the lower surface of the material d are processed. In some cases), a plurality of vacuum chucks (Z vacuum chucks) f ... Are provided.

【０００５】前記真空チャックｆ…は、その上面が１μ
ｍ以下に平面度良く加工されている。また、真空チャッ
クｆ…は、図示しない真空源に接続されている。そし
て、真空チャックｆ…で下面を支承され、かつ、位置決
めピンｅ…によりＸ，Ｙ方向の位置決めがなされた被処
理材ｄを、真空チャックｆ…により真空吸着すること
で、被処理材ｄの上下方向（Ｚ方向）の位置決めと、水
平方向（Ｘ，Ｙ方向）の位置ずれを防止するようにして
いた。The upper surfaces of the vacuum chucks f ...
It is processed to a flatness of m or less. The vacuum chucks f ... Are connected to a vacuum source (not shown). Then, the workpiece d, whose lower surface is supported by the vacuum chucks f ... And which is positioned in the X and Y directions by the positioning pins e ..., is vacuum-sucked by the vacuum chucks f. Positioning in the vertical direction (Z direction) and displacement in the horizontal direction (X, Y directions) have been prevented.

【０００６】しかし、真空チャックｆ…は、被処理材ｄ
のＸ−Ｙ方向の位置ずれ防止のための吸着力を出すため
には、一定の面積が必要であり、これら真空チャックｆ
…により下面を真空吸着された被処理材ｄに曲げモーメ
ントが発生し、平面度が１μｍ〜２μｍ以下に加工され
ている被処理材ｄの平面度を損ない、結果として、装置
の処理精度を低下させるといった問題があった。However, the vacuum chucks f ...
In order to exert a suction force for preventing the displacement of the X-Y direction, a certain area is required.
As a result, a bending moment is generated in the material to be processed d whose lower surface is vacuum-sucked, and the flatness of the material to be processed d processed to have a flatness of 1 μm to 2 μm or less is impaired, resulting in a reduction in the processing accuracy of the apparatus. There was a problem of causing it.

【０００７】処理精度の低下は、ｔ：被処理材の厚さ、
δ：被処理材の高さ方向の位置変化、Ｌ：被処理材の長
さ、ΔＬ：水平方向の変化量（マスク表面の伸縮量）と
した場合、次式で表される。The deterioration of the processing accuracy is caused by t: the thickness of the material to be processed,
Where δ is the position change of the material to be processed in the height direction, L is the length of the material to be processed, and ΔL is the amount of change in the horizontal direction (the amount of expansion and contraction of the mask surface), it is expressed by the following equation.

【０００８】（４ｔδ）／Ｌ＝ΔＬ たとえば、縦横６インチ（１３０ｍｍ）の正方形で、厚
さが０．２５インチ（６．３５ｍｍ）の被処理材の平面
度が０．５μｍ損なわれると、上記式より、（４×６．
３５ｍｍ×０．５μｍ）／１３０ｍｍ＝約０．１μｍと
なり、１３０ｍｍで約０．１μｍの処理精度の低下とな
る。(4tδ) / L = ΔL For example, if the flatness of a workpiece having a square length of 6 inches (130 mm) and a thickness of 0.25 inches (6.35 mm) is impaired by 0.5 μm, From the formula, (4 × 6.
35 mm × 0.5 μm) / 130 mm = about 0.1 μm, and a processing accuracy of about 0.1 μm is reduced at 130 mm.

【０００９】[0009]

【発明が解決しようとする課題】上記のように、従来の
被処理材の固定装置にあっては、被処理材の下面を複数
の真空チャックにより吸着して固定するために、被処理
材に曲げモーメントが生じて平面度が損なわれ、これが
装置の処理精度の低下を招くといった問題があった。As described above, in the conventional apparatus for fixing a material to be processed, since the lower surface of the material to be processed is sucked and fixed by a plurality of vacuum chucks, the material to be processed is fixed to the material to be processed. There is a problem that a bending moment is generated and flatness is impaired, which causes a reduction in processing accuracy of the device.

【００１０】本発明は、上記事情に基づきなされたもの
で、被処理材の平面度を損なうことなく、また、ステー
ジの移動時の加減速度でずれることがないように、被処
理材を確実に固定でき、処理精度の向上を可能とした被
処理材の固定装置を提供することを目的とする。The present invention has been made based on the above-mentioned circumstances, and ensures that the material to be processed can be securely treated without impairing the flatness of the material to be processed and from being displaced by the acceleration / deceleration when the stage is moved. It is an object of the present invention to provide a device for fixing a material to be processed which can be fixed and whose processing accuracy can be improved.

【００１１】[0011]

【課題を解決するための手段】本発明は、上記課題を解
決するための第１の手段として、矩形平板状の被処理材
を、ステージ上に固定する被処理材の固定装置であっ
て、前記ステージ上、かつ前記被処理材の下面の少なく
とも３点を支持する状態に配設された複数の支持部を有
し、前記被処理材をその重力方向の位置決めを行った状
態で水平に支持する支持手段と、この支持手段により支
持された前記被処理材の端面に対向する位置に配設され
た吸着固定部材を有し、前記被処理材の端面を吸着固定
して被処理材の動きを規制する吸着固定手段とを具備し
てなる構成としたものである。As a first means for solving the above-mentioned problems, the present invention provides a device for fixing a material to be processed, which fixes a material to be processed in the form of a rectangular flat plate on a stage. It has a plurality of support portions arranged on the stage and in a state of supporting at least three points on the lower surface of the material to be processed, and horizontally supports the material to be processed while positioning the material in the gravity direction. And a suction fixing member arranged at a position facing the end surface of the material to be processed supported by the supporting means, and the end surface of the material to be processed is sucked and fixed to move the material to be processed. It is configured to include a suction fixing means that regulates.

【００１２】また、第２の手段として、矩形平板状の被
処理材を、ステージ上に固定する被処理材の固定装置で
あって、前記ステージ上、かつ前記被処理材の下面の少
なくとも３点を支持する状態に配設された複数の支持部
を有し、前記被処理材をその重力方向の位置決めを行っ
た状態で水平に支持する支持手段と、この支持手段によ
り支持された前記被処理材の端面に対向する位置に配設
された真空チャックを有し、前記被処理材の端面を吸着
固定して被処理材の動きを規制する真空吸着固定手段と
を具備してなる構成としたものである。As a second means, there is provided a device for fixing a material to be processed, which fixes a material to be processed in the form of a rectangular flat plate on a stage, and at least three points on the stage and the lower surface of the material to be processed. A plurality of supporting portions arranged so as to support the object, the supporting means horizontally supporting the material to be processed in a state of being positioned in the direction of gravity, and the object to be processed supported by the supporting means. It has a vacuum chuck arranged at a position facing the end surface of the material, and is provided with a vacuum adsorption fixing means for adsorbing and fixing the end surface of the material to be processed to regulate the movement of the material to be processed. It is a thing.

【００１３】また、第３の手段として、矩形平板状か
つ、少なくとも端面が導電性を有する被処理材を、ステ
ージ上に固定する被処理材の固定装置であって、前記ス
テージ上、かつ前記被処理材の下面の少なくとも３点を
支持する状態に配設された複数の支持部を有し、前記被
処理材をその重力方向の位置決めを行った状態で水平に
支持する支持手段と、この支持手段により支持された前
記被処理材の端面に対向する位置に配設された静電チャ
ックを有し、前記被処理材の端面を吸着固定して被処理
材の動きを規制する静電吸着固定手段とを具備してなる
構成としたものである。As a third means, there is provided a device for fixing a material to be processed, which has a rectangular flat plate shape and at least an end surface of which is conductive, and which is fixed on the stage. Supporting means having a plurality of supporting portions arranged to support at least three points on the lower surface of the processing material, and supporting the processing material horizontally in a state in which the processing material is positioned in the direction of gravity, and the supporting means. An electrostatic chuck fixed to the end surface of the material to be processed supported by a means, and electrostatically adsorbing and fixing the end surface of the material to be processed by suction and fixing the movement of the material to be processed. Means and means.

【００１４】[0014]

【作用】上記第１の手段の被処理材の固定装置によれ
ば、被処理材を複数の支持部により、理想的な３点支持
状態で支持でき、重力方向の位置決めがなされると共
に、この重力方向の位置決めがなされた被処理材の端面
を、吸着固定部材で吸着することにより、水平方向及び
重力方向とは逆の上方向の動きを規制する状態に位置決
め固定することができる。これにより、被処理材を、ス
テージ上の所定位置に上下方向及び水平方向の動きを規
制した状態に固定することができ、ステージの移動時の
加減速度でずれることがなく、また、被処理材の端面を
吸着固定するため、被処理材の平面度を損なうことな
く、処理精度の向上が可能となる。According to the apparatus for fixing a material to be treated of the first means, the material to be treated can be supported by the plurality of supporting portions in an ideal three-point supporting state, and the positioning in the direction of gravity is performed. By adsorbing the end surface of the material to be processed, which has been positioned in the direction of gravity, by the suction fixing member, it is possible to position and fix the material in a state in which the upward movement opposite to the horizontal direction and the direction of gravity is restricted. As a result, the material to be processed can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and the material does not shift due to acceleration / deceleration during movement of the stage. Since the end surface of the object is fixed by suction, the processing accuracy can be improved without impairing the flatness of the material to be processed.

【００１５】また、第２の手段の被処理材の固定装置に
よれば、被処理材を複数の支持部により、理想的な３点
支持状態で支持でき、重力方向の位置決めがなされると
共に、この重力方向の位置決めがなされた被処理材の端
面を、真空チャックで吸着することにより、水平方向及
び重力方向とは逆の上方向の動きを規制する状態に位置
決め固定することができる。これにより、被処理材を、
ステージ上の所定位置に上下方向及び水平方向の動きを
規制した状態に固定することができ、ステージの移動時
の加減速度でずれることがなく、また、被処理材の端面
を吸着固定するため、被処理材の平面度を損なうことな
く、処理精度の向上が可能となる。Further, according to the apparatus for fixing a material to be processed of the second means, the material to be processed can be supported by the plurality of supporting portions in an ideal three-point supporting state, and the positioning in the direction of gravity can be performed. By sucking the end surface of the material to be processed, which has been positioned in the direction of gravity, with a vacuum chuck, it is possible to position and fix the material in a state in which the movement in the horizontal direction and the upward direction opposite to the direction of gravity is restricted. This allows the material to be treated to
It can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and it does not shift due to acceleration / deceleration when the stage moves, and because the end surface of the material to be processed is fixed by suction, Processing accuracy can be improved without impairing the flatness of the material to be processed.

【００１６】また、第３の手段の被処理材の固定装置に
よれば、被処理材を複数の支持部により、理想的な３点
支持状態で支持でき、重力方向の位置決めがなされると
共に、この重力方向の位置決めがなされた被処理材の端
面を、静電チャックで吸着することにより、水平方向及
び重力方向とは逆の上方向の動きを規制する状態に位置
決め固定することができる。これにより、被処理材を、
ステージ上の所定位置に上下方向及び水平方向の動きを
規制した状態に固定することができ、ステージの移動時
の加減速度でずれることがなく、また、被処理材の端面
を吸着固定するため、被処理材の平面度を損なうことな
く、処理精度の向上が可能となる。Further, according to the apparatus for fixing a material to be treated of the third means, the material to be treated can be supported by the plurality of supporting portions in an ideal three-point supporting state, and the positioning in the direction of gravity can be performed. By adsorbing the end surface of the material to be processed, which has been positioned in the direction of gravity, by the electrostatic chuck, it is possible to position and fix the material in a state in which the movement in the horizontal direction and the upward direction opposite to the direction of gravity is restricted. This allows the material to be treated to
It can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and it does not shift due to acceleration / deceleration when the stage moves, and because the end surface of the material to be processed is fixed by suction, Processing accuracy can be improved without impairing the flatness of the material to be processed.

【００１７】[0017]

【実施例】以下、本発明の第１の実施例について、図１
および図２を参照して説明する。図中１は、Ｘ，Ｙ方向
に移動可能なステージであり、このステージ１の上面部
には、直交する２辺に沿って位置測定用の２本のレーザ
ミラー２，４が配設されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG.
The description will be made with reference to FIG. In the figure, reference numeral 1 denotes a stage movable in X and Y directions. Two laser mirrors 2 and 4 for position measurement are arranged on the upper surface of the stage 1 along two orthogonal sides. There is.

【００１８】また、ステージ１の上面には、ステージ１
の中央部に、マスクブランクス等の被処理材６を固定す
るための被処理材固定装置１０が設けられている。この
被処理材固定装置１０は、前記ステージ１上に前記被処
理材６の下面の少なくとも３点を支持する状態に配設さ
れた複数（実施例では３つ）の支持部１２…を有し、前
記被処理材６をその重力方向の位置決めを行った状態で
水平に支持する支持手段１４を有する。On the upper surface of the stage 1, the stage 1
In the central part of the above, a material-to-be-treated fixing device 10 for fixing a material to be treated 6 such as a mask blank is provided. The workpiece fixing device 10 has a plurality of (three in the embodiment) supporting portions 12 arranged on the stage 1 so as to support at least three points on the lower surface of the workpiece 6. It has a supporting means 14 for horizontally supporting the material 6 to be processed in a state of being positioned in the direction of gravity.

【００１９】また、この支持手段１４により支持された
前記被処理材６の端面に対向する位置に配設された吸着
固定部材１６，１６を有し、前記被処理材６の端面６ａ
を吸着固定して被処理材６の動きを規制する吸着固定手
段１８を有する。Further, there are adsorption fixing members 16 and 16 arranged at positions facing the end surface of the material 6 to be processed supported by the supporting means 14, and the end surface 6a of the material 6 to be processed is provided.
It has suction-fixing means 18 for suction-fixing and fixing the movement of the processed material 6.

【００２０】さらに、被処理材６の前記端面６ａと直交
する端面６ｂと当接する位置決めピン２０が設けられ、
被処理材６は、端面６ａを前記吸着固定部材１６，１６
に、また、前記端面６ａと直交する端面６ｂを位置決め
ピン２０に突き当ることにより、Ｘ，Ｙ方向の位置決め
がなされるようになっている。Further, there is provided a positioning pin 20 which comes into contact with the end surface 6b of the workpiece 6 which is orthogonal to the end surface 6a,
The processed material 6 has the end surface 6a having the suction fixing members 16, 16
In addition, the end face 6b orthogonal to the end face 6a is brought into contact with the positioning pin 20 to perform positioning in the X and Y directions.

【００２１】吸着固定部材１６は、真空チャック２２か
らなり、図２に示すように、真空源２４に接続されてい
る。つぎに、被処理材６をステージ１上に固定する動作
について説明する。The suction fixing member 16 comprises a vacuum chuck 22 and is connected to a vacuum source 24 as shown in FIG. Next, an operation of fixing the processing target material 6 on the stage 1 will be described.

【００２２】真空チャック２２，２２をＯＦＦ状態（大
気状態）において、被処理材６を支持部１２…上に載置
し、これら支持部１２…により水平状態に３点支持す
る。この時、被処理材６の端面６ａ，６ｂを、吸着固定
部材１６，１６である真空チャック２２，２２と位置決
めピン２０とに突当てて、Ｘ，Ｙ方向の位置決めをす
る。With the vacuum chucks 22 and 22 in the OFF state (atmosphere), the material 6 to be processed is placed on the supporting portions 12 ..., and these supporting portions 12 support three points in a horizontal state. At this time, the end surfaces 6a and 6b of the processing target material 6 are abutted against the vacuum chucks 22 and 22 which are the suction fixing members 16 and 16 and the positioning pin 20 to perform positioning in the X and Y directions.

【００２３】この後、真空チャック２２，２２をＯＮ状
態（負圧状態）として、被処理材６の端面６ａを真空吸
着する。これにより、支持部１２…により水平状態に３
点支持された被処理材６は、真空チャック２２，２２の
真空吸着力により、上方向の動きと水平方向（Ｘ，Ｙ方
向）の動きが拘束され、確実に固定されることになる。After that, the vacuum chucks 22 and 22 are turned on (negative pressure state), and the end surface 6a of the workpiece 6 is vacuum-sucked. As a result, the supporting portions 12 ...
The point-supported material 6 is securely fixed by restraining the upward movement and the horizontal (X, Y direction) movement by the vacuum suction force of the vacuum chucks 22, 22.

【００２４】これにより、ステージ１の移動時の加減速
度で被処理材６がずれることがなく、また、被処理材６
の端面を吸着固定するため、被処理材６の平面度を損な
うことがなく、処理精度の向上が可能となる。As a result, the material 6 to be processed is not displaced by the acceleration / deceleration when the stage 1 is moved, and the material 6 to be processed is not displaced.
Since the end surface of the workpiece 6 is fixed by suction, the flatness of the workpiece 6 is not impaired, and the processing accuracy can be improved.

【００２５】つぎに、本発明の第２の実施例について図
３及び図４を参照して説明する。この第２の実施例は、
被処理材６の端面６ａにクロム膜などの導電体が存在す
る場合であって、吸着固定部材１６として静電チャック
３０を適用したものとなっている。Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4. This second embodiment is
In the case where a conductor such as a chromium film is present on the end surface 6a of the material 6 to be processed, the electrostatic chuck 30 is applied as the suction fixing member 16.

【００２６】図中１は、Ｘ，Ｙ方向に移動可能なステー
ジであり、このステージ１の上面部には、直交する２辺
に沿って位置測定用の２本のレーザミラー２，４が配設
されている。In the figure, reference numeral 1 denotes a stage movable in X and Y directions. Two laser mirrors 2 and 4 for position measurement are arranged on the upper surface of the stage 1 along two orthogonal sides. It is set up.

【００２７】また、ステージ１の上面には、ステージ１
の中央部に、マスクブランクス等の被処理材６を固定す
るための被処理材固定装置１０が設けられている。この
被処理材固定装置１０は、前記ステージ１上に前記被処
理材６の下面の少なくとも３点を支持する状態に配設さ
れた複数（実施例では３つ）の支持部１２…を有し、前
記被処理材６をその重力方向の位置決めを行った状態で
水平に支持する支持手段１４を有する。On the upper surface of the stage 1, the stage 1
In the central part of the above, a material-to-be-treated fixing device 10 for fixing a material to be treated 6 such as a mask blank is provided. The workpiece fixing device 10 has a plurality of (three in the embodiment) supporting portions 12 arranged on the stage 1 so as to support at least three points on the lower surface of the workpiece 6. It has a supporting means 14 for horizontally supporting the material 6 to be processed in a state of being positioned in the direction of gravity.

【００２８】また、この支持手段１４により支持された
前記被処理材６の端面６ａ，６ｂに対向する位置に配設
された吸着固定部材１６，１６としての静電チャック３
０，３０を有し、前記被処理材６の導電性端面６ａ，６
ｂを静電的に吸着固定して被処理材６の動きを規制する
静電吸着固定手段１８′を有する。Further, the electrostatic chuck 3 as the suction fixing members 16 and 16 arranged at the positions facing the end surfaces 6a and 6b of the material 6 to be processed supported by the supporting means 14.
0, 30 and the conductive end surfaces 6a, 6 of the workpiece 6
It has electrostatic attraction fixing means 18 'for electrostatically attracting and fixing b to regulate the movement of the material 6 to be processed.

【００２９】静電チャック３０は、図４に示すように、
チャック本体であるブロック３０ａと、このブロック３
０ａの表面に形成された平板状の内部電極３０ｂと、こ
の内部電極３０ｂの上面を覆う絶縁層からなる膜状の強
誘電体３０ｃと、内部電極３０ｂに一端を連通し他端を
ブロック３０ａを貫通して外部に導出した給電用のリー
ド線３０ｄとからなる。The electrostatic chuck 30, as shown in FIG.
Block 30a, which is the chuck body, and this block 3
0a in the form of a flat plate, a film-like ferroelectric 30c made of an insulating layer covering the upper surface of the internal electrode 30b, one end communicating with the internal electrode 30b, and the other end in the block 30a. It is composed of a lead wire 30d for power supply that penetrates through and is led to the outside.

【００３０】そして、複数の静電チャック３０，３０
を、強誘電体３０ｃ，３０ｃが被処理材６の導電性端面
６ａ，６ｂに対向するように横向き状態に配設したもの
となっている。A plurality of electrostatic chucks 30, 30
Are arranged in a lateral direction so that the ferroelectrics 30c, 30c face the conductive end surfaces 6a, 6b of the material 6 to be processed.

【００３１】静電チャック３０…の各リード線３０ｄ
は、スイッチ３２を介して直流電源からなるチャック電
源３４のプラス側に接続され、チャック電源３４のマイ
ナス側は接地されている。また、ステージ１の上面に
は、接地されたアースピン３６が突設されており、被処
理材６と接触するようになっている。Each lead wire 30d of the electrostatic chuck 30 ...
Is connected to the positive side of a chuck power source 34, which is a DC power source, via a switch 32, and the negative side of the chuck power source 34 is grounded. A grounding ground pin 36 is provided on the upper surface of the stage 1 so as to come into contact therewith.

【００３２】つぎに、被処理材６をステージ１上に固定
する動作について説明する。静電チャック３０，３０を
ＯＦＦ状態とした状態において、被処理材６を支持部１
２…上に載置し、これら支持部１２…により水平状態に
３点支持する。この時、導電性を有するホルダ接地用の
アースピン３６と接触した状態となる。Next, the operation of fixing the material 6 to be processed on the stage 1 will be described. With the electrostatic chucks 30 and 30 in the OFF state, the workpiece 6 is supported by the support portion 1.
2 ..., and these supporting portions 12 ... Support three points in a horizontal state. At this time, it is in a state of being in contact with the ground pin 36 for grounding the holder, which is conductive.

【００３３】また、被処理材６の端面６ａ，６ｂを、静
電チャック３０，３０に突当てて、Ｘ，Ｙ方向の位置決
めをする。この後、スイッチ３２を閉（ＯＮ）状態とす
ることにより、静電チャック３０，３０が吸着動作状態
となり、被処理材６の端面６ａを静電吸着する。Further, the end surfaces 6a and 6b of the material 6 to be processed are brought into contact with the electrostatic chucks 30 and 30 to perform positioning in the X and Y directions. After that, by closing the switch 32 (ON), the electrostatic chucks 30, 30 are brought into the adsorption operation state, and the end surface 6a of the processing target material 6 is electrostatically adsorbed.

【００３４】すなわち、スイッチ３２が閉（ＯＮ）状態
となると、強誘電体３０ｃの表面に置かれた導電性の被
処理材６と内部電極３０ｂとの間に直流電流が流れて両
者間に電位差が生じ静電吸引力が発生する。そして、被
処理材６の端面６ａを静電吸着する。That is, when the switch 32 is closed (ON), a direct current flows between the conductive material 6 to be treated placed on the surface of the ferroelectric 30c and the internal electrode 30b, and a potential difference is generated between the two. Occurs and electrostatic attraction force is generated. Then, the end surface 6a of the processing target material 6 is electrostatically adsorbed.

【００３５】これにより、支持部１２…により水平状態
に３点支持された被処理材６は、静電チャック３０，３
０の静電吸着力により、上方向の動きと水平方向（Ｘ，
Ｙ方向）の動きが拘束され、確実に固定されることにな
る。As a result, the workpiece 6 supported horizontally at three points by the supporting portions 12 ...
With the electrostatic attraction force of 0, the upward movement and the horizontal direction (X,
The movement in the Y direction) is restricted, and the movement is securely fixed.

【００３６】これにより、ステージ１の移動時の加減速
度で被処理材６がずれることがなく、また、被処理材６
の端面を吸着固定するため、被処理材６の平面度を損な
うことがなく、処理精度の向上が可能となる。As a result, the workpiece 6 does not shift at the acceleration / deceleration when the stage 1 moves, and the workpiece 6 is not displaced.
Since the end surface of the workpiece 6 is fixed by suction, the flatness of the workpiece 6 is not impaired, and the processing accuracy can be improved.

【００３７】なお、静電チャックそのものについては、
例えば特公平６−１５１３０号公報等において公知であ
り、詳細な説明は省略する。その他、本発明は上記実施
例に限らず、要旨を変えない範囲で種々変形実施可能な
ことは勿論である。Regarding the electrostatic chuck itself,
For example, it is publicly known in Japanese Examined Patent Publication No. 6-15130, and the detailed description thereof is omitted. In addition, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

【００３８】[0038]

【発明の効果】以上説明したように、本発明によれば、
つぎのような効果を奏する。請求項１記載の被処理材の
固定装置によれば、被処理材を複数の支持部により、理
想的な３点支持状態で支持でき、重力方向の位置決めが
なされると共に、この重力方向の位置決めがなされた被
処理材の端面を、吸着固定部材で吸着することにより、
水平方向及び重力方向とは逆の上方向の動きを規制する
状態に位置決め固定することができる。これにより、被
処理材を、ステージ上の所定位置に上下方向及び水平方
向の動きを規制した状態に固定することができ、ステー
ジの移動時の加減速度でずれることがなく、また、被処
理材の端面を吸着固定するため、被処理材の平面度を損
なうことなく、処理精度の向上が図れる。As described above, according to the present invention,
The following effects are obtained. According to the apparatus for fixing a material to be treated according to claim 1, the material to be treated can be supported by the plurality of supporting portions in an ideal three-point supporting state, and the positioning in the direction of gravity is performed, and the positioning in the direction of gravity is performed. By adsorbing the end surface of the processed material that has been subjected to adsorption with the adsorption fixing member,
It can be positioned and fixed in a state in which the upward movement opposite to the horizontal direction and the gravity direction is restricted. As a result, the material to be processed can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and the material does not shift due to acceleration / deceleration during movement of the stage. Since the end surface of the workpiece is fixed by suction, the processing accuracy can be improved without impairing the flatness of the material to be treated.

【００３９】また、請求項２記載の被処理材の固定装置
によれば、被処理材を複数の支持部により、理想的な３
点支持状態で支持でき、重力方向の位置決めがなされる
と共に、この重力方向の位置決めがなされた被処理材の
端面を、真空チャックで吸着することにより、水平方向
及び重力方向とは逆の上方向の動きを規制する状態に位
置決め固定することができる。これにより、被処理材
を、ステージ上の所定位置に上下方向及び水平方向の動
きを規制した状態に固定することができ、ステージの移
動時の加減速度でずれることがなく、また、被処理材の
端面を吸着固定するため、被処理材の平面度を損なうこ
となく、処理精度の向上が図れる。According to the apparatus for fixing a material to be treated according to the second aspect, the material to be treated is ideally configured by a plurality of supporting portions.
It can be supported in the point support state and is positioned in the direction of gravity, and the end surface of the material to be processed, which has been positioned in the direction of gravity, is adsorbed by a vacuum chuck, so that the horizontal direction and the upward direction opposite to the gravity direction. Can be positioned and fixed in a state in which the movement of the is restricted. As a result, the material to be processed can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and the material does not shift due to acceleration / deceleration during movement of the stage. Since the end surface of the workpiece is fixed by suction, the processing accuracy can be improved without impairing the flatness of the material to be treated.

【００４０】また、請求項３記載の被処理材の固定装置
によれば、被処理材を複数の支持部により、理想的な３
点支持状態で支持でき、重力方向の位置決めがなされる
と共に、この重力方向の位置決めがなされた被処理材の
端面を、静電チャックで吸着することにより、水平方向
及び重力方向とは逆の上方向の動きを規制する状態に位
置決め固定することができる。これにより、被処理材
を、ステージ上の所定位置に上下方向及び水平方向の動
きを規制した状態に固定することができ、ステージの移
動時の加減速度でずれることがなく、また、被処理材の
端面を吸着固定するため、被処理材の平面度を損なうこ
となく、処理精度の向上が図れる。According to the apparatus for fixing a material to be treated according to the third aspect, the material to be treated is ideally supported by a plurality of supporting portions.
It can be supported in a point support state and is positioned in the direction of gravity, and the end surface of the material to be processed that has been positioned in the direction of gravity is attracted by an electrostatic chuck, so that it is opposite to the horizontal and gravity directions. It can be positioned and fixed so as to regulate the movement in the direction. As a result, the material to be processed can be fixed at a predetermined position on the stage in a state in which vertical and horizontal movements are restricted, and the material does not shift due to acceleration / deceleration during movement of the stage. Since the end surface of the workpiece is fixed by suction, the processing accuracy can be improved without impairing the flatness of the material to be treated.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１の実施例の被処理材固定動作状態
を示す概略的平面図。FIG. 1 is a schematic plan view showing a fixing operation state of a material to be treated according to a first embodiment of the present invention.

【図２】同実施例の被処理材固定動作状態を示す要部の
概略的側面図。FIG. 2 is a schematic side view of a main part showing an operation state of fixing a material to be processed of the embodiment.

【図３】本発明の第２の実施例の被処理材固定動作状態
を示す概略的平面図。FIG. 3 is a schematic plan view showing an operation state of fixing a material to be processed according to the second embodiment of the present invention.

【図４】同実施例の被処理材固定動作状態を示す要部の
概略的側面図。FIG. 4 is a schematic side view of a main part showing an operation state of fixing a material to be processed of the embodiment.

【図５】従来例の被処理材固定動作状態を示す概略的平
面図。FIG. 5 is a schematic plan view showing an operation state of fixing a material to be treated in a conventional example.

【符号の説明】[Explanation of symbols]

１…ステージ、６…被処理材、６ａ，６ｂ…端面、１０
…被処理材固定装置、１２…支持部、１４…支持手段、
１６…吸着固定部材、１８…吸着固定手段、１８′…静
電吸着固定手段、２０…位置決めピン、２２…真空チャ
ック、３０…静電チャック。1 ... Stage, 6 ... Processing object, 6a, 6b ... End surface, 10
... processing target material fixing device, 12 ... support portion, 14 ... support means,
16 ... adsorption fixing member, 18 ... adsorption fixing means, 18 '... electrostatic adsorption fixing means, 20 ... positioning pin, 22 ... vacuum chuck, 30 ... electrostatic chuck.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】矩形平板状の被処理材を、ステージ上に固
定する被処理材の固定装置であって、 前記ステージ上、かつ前記被処理材の下面の少なくとも
３点を支持する状態に配設された複数の支持部を有し、
前記被処理材をその重力方向の位置決めを行った状態で
水平に支持する支持手段と、 この支持手段により支持された前記被処理材の端面に対
向する位置に配設された吸着固定部材を有し、前記被処
理材の端面を吸着固定して被処理材の動きを規制する吸
着固定手段と、を具備してなることを特徴とする被処理
材の固定装置。1. A device for fixing a material to be processed, which fixes a material to be processed in the form of a rectangular flat plate on a stage, the device being arranged so as to support at least three points on the stage and the lower surface of the material to be processed. Having a plurality of supporting portions provided,
There is provided a supporting means for horizontally supporting the material to be processed in a state of being positioned in the direction of gravity, and a suction fixing member arranged at a position facing the end surface of the material to be processed supported by the supporting means. Then, the apparatus for fixing a material to be processed, comprising: an adsorption fixing means for adsorbing and fixing the end surface of the material to be processed to regulate the movement of the material to be processed. 【請求項２】矩形平板状の被処理材を、ステージ上に固
定する被処理材の固定装置であって、 前記ステージ上、かつ前記被処理材の下面の少なくとも
３点を支持する状態に配設された複数の支持部を有し、
前記被処理材をその重力方向の位置決めを行った状態で
水平に支持する支持手段と、 この支持手段により支持された前記被処理材の端面に対
向する位置に配設された真空チャックを有し、前記被処
理材の端面を吸着固定して被処理材の動きを規制する真
空吸着固定手段と、を具備してなることを特徴とする被
処理材の固定装置。2. An apparatus for fixing a material to be processed, which fixes a material to be processed in the form of a rectangular flat plate on a stage, the apparatus being arranged so as to support at least three points on the stage and the lower surface of the material to be processed. Having a plurality of supporting portions provided,
Supporting means for horizontally supporting the material to be processed in a state of being positioned in the direction of gravity, and a vacuum chuck arranged at a position facing the end surface of the material to be processed supported by the supporting means. A vacuum adsorption fixing means for adsorbing and fixing the end surface of the material to be processed to regulate the movement of the material to be processed, the apparatus for fixing the material to be processed. 【請求項３】矩形平板状かつ少なくとも端面が導電性を
有する被処理材を、ステージ上に固定する被処理材の固
定装置であって、 前記ステージ上、かつ前記被処理材の下面の少なくとも
３点を支持する状態に配設された複数の支持部を有し、
前記被処理材をその重力方向の位置決めを行った状態で
水平に支持する支持手段と、 この支持手段により支持された前記被処理材の端面に対
向する位置に配設された静電チャックを有し、前記被処
理材の端面を吸着固定して被処理材の動きを規制する静
電吸着固定手段と、を具備してなることを特徴とする被
処理材の固定装置。3. A material fixing device for fixing a material to be processed, which has a rectangular flat plate shape and at least an end surface of which is conductive, onto a stage, wherein at least 3 of the surface of the material to be processed and the lower surface of the material to be processed are provided. Having a plurality of supporting portions arranged to support the points,
A support means for horizontally supporting the material to be processed in a state of being positioned in the gravity direction and an electrostatic chuck arranged at a position facing the end surface of the material to be processed supported by the support means are provided. And an electrostatic adsorption fixing means for adsorbing and fixing the end surface of the material to be processed to regulate the movement of the material to be processed, the apparatus for fixing the material to be processed.
JP32074194A 1994-12-22 1994-12-22 Fixing equipment of material to be treated Pending JPH08181200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32074194A JPH08181200A (en) 1994-12-22 1994-12-22 Fixing equipment of material to be treated

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32074194A JPH08181200A (en) 1994-12-22 1994-12-22 Fixing equipment of material to be treated

Publications (1)

Publication Number Publication Date
JPH08181200A true JPH08181200A (en) 1996-07-12

Family

ID=18124782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32074194A Pending JPH08181200A (en) 1994-12-22 1994-12-22 Fixing equipment of material to be treated

Country Status (1)

Country Link
JP (1) JPH08181200A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358193A (en) * 2000-06-13 2001-12-26 Ulvac Japan Ltd Electrostatic chucking system, substrate-conveying device, vacuum processing device and substrate-holding method
JP2017022226A (en) * 2015-07-09 2017-01-26 株式会社デンソー Substrate processing apparatus and substrate processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358193A (en) * 2000-06-13 2001-12-26 Ulvac Japan Ltd Electrostatic chucking system, substrate-conveying device, vacuum processing device and substrate-holding method
JP4640876B2 (en) * 2000-06-13 2011-03-02 株式会社アルバック Substrate transfer device
JP2017022226A (en) * 2015-07-09 2017-01-26 株式会社デンソー Substrate processing apparatus and substrate processing method

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