JPH08174760A - Composite laminate - Google Patents
Composite laminateInfo
- Publication number
- JPH08174760A JPH08174760A JP6321105A JP32110594A JPH08174760A JP H08174760 A JPH08174760 A JP H08174760A JP 6321105 A JP6321105 A JP 6321105A JP 32110594 A JP32110594 A JP 32110594A JP H08174760 A JPH08174760 A JP H08174760A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- parts
- inorganic filler
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、打抜加工性が良好なコ
ンポジット積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite laminate having good punching workability.
【0002】[0002]
【従来の技術】近年、IC、LSI等の集積回路を使用
した電子機器の発達は目ざましいものがある。これら集
積回路を実装するプリント配線板には、銅張り積層板を
加工したものが使用されるが、前記発達に伴って銅張り
積層板にも特性の優れたものが要求されるようになって
きた。熱硬化性樹脂を含浸したガラス不織布を芯材層と
し、熱硬化性樹脂を含浸したガラス織布を表面層とし
て、これらが一体化されているコンポジット積層板は、
熱硬化性樹脂を含浸したガラス織布だけで構成される積
層板と比べると、同等の電気特性を保持しながら、スル
ーホール信頼性及び打抜加工性に優れており、また、安
価であることから、広く用いられている。上記、コンポ
ジット積層板の芯材層には、スルーホール信頼性及び寸
法安定性を目的として、その樹脂中に無機充填材が配合
されている。その配合量は、樹脂100重量部に対して
10〜60重量部が一般的であった。また、無機充填材
の配合量が60重量部を越える場合もあるが、その場合
には積層板のガラス転移温度が145℃よりも高くなっ
ており、打抜加工性が悪かった。2. Description of the Related Art In recent years, the development of electronic equipment using integrated circuits such as ICs and LSIs has been remarkable. As a printed wiring board for mounting these integrated circuits, a processed copper-clad laminate is used, but with the above development, a copper-clad laminate is also required to have excellent characteristics. It was A composite laminated board in which a glass nonwoven fabric impregnated with a thermosetting resin is used as a core material layer and a glass woven fabric impregnated with a thermosetting resin is used as a surface layer, and these are integrated,
Compared with a laminated board composed only of glass woven cloth impregnated with thermosetting resin, it has excellent through-hole reliability and punching workability while maintaining the same electrical characteristics, and it is also inexpensive. Widely used. In the core layer of the composite laminate, an inorganic filler is mixed in the resin for the purpose of through hole reliability and dimensional stability. The compounding amount was generally 10 to 60 parts by weight with respect to 100 parts by weight of the resin. In some cases, the compounding amount of the inorganic filler exceeds 60 parts by weight, but in that case, the glass transition temperature of the laminated plate is higher than 145 ° C., and the punching workability is poor.
【0003】[0003]
【本発明が解決しようとする課題】本発明が解決しよう
とする課題は、芯材層の樹脂中に無機充填材を多く配合
しながら、コンポジット積層板の打抜加工性を良好にす
ることである。The problem to be solved by the present invention is to improve the punching workability of a composite laminate while adding a large amount of an inorganic filler to the resin of the core layer. is there.
【0004】[0004]
【課題を解決するための手段】上記の課題を解決するた
めに本発明に係るコンポジット積層板は、芯材層の熱硬
化性樹脂中に当該樹脂100重量部に対し無機充填材が
70〜160重量部配合されており、積層板としてのガ
ラス転移温度が145℃以下であることを特徴とする。In order to solve the above-mentioned problems, the composite laminated board according to the present invention is such that the thermosetting resin of the core layer contains the inorganic filler in an amount of 70 to 160 per 100 parts by weight of the resin. It is blended in parts by weight, and the glass transition temperature of the laminate is 145 ° C. or lower.
【0005】[0005]
【作用】芯材層の無機充填材の配合量が樹脂100重量
部に対し70重量部以上の範囲であると、打抜の際の衝
撃をほどよく分散するため、クラックや目白を発生しな
い。しかし、無機充填材の配合量が樹脂100重量部に
対して70重量部未満であると、打抜の際の衝撃を分散
できずクラックが発生する。無機充填材の配合量が樹脂
100重量部に対して160重量部より多いと、樹脂が
脆くなりすぎるため、打抜で目白を発生する。また、無
機充填材の配合量が樹脂100重量部に対して70〜1
60重量部の範囲にあっても、積層板自体のガラス転移
温度が145℃以上であると、樹脂が脆いので、目白を
発生する。When the content of the inorganic filler in the core material layer is 70 parts by weight or more based on 100 parts by weight of the resin, the impact during punching is properly dispersed, so that cracks and whitening do not occur. However, if the compounding amount of the inorganic filler is less than 70 parts by weight with respect to 100 parts by weight of the resin, the impact during punching cannot be dispersed and cracks will occur. If the blending amount of the inorganic filler is more than 160 parts by weight with respect to 100 parts by weight of the resin, the resin becomes too brittle, resulting in whitening during punching. Moreover, the compounding amount of the inorganic filler is 70 to 1 relative to 100 parts by weight of the resin.
Even in the range of 60 parts by weight, when the glass transition temperature of the laminated plate itself is 145 ° C. or higher, the resin becomes brittle, so that whitening occurs.
【0006】[0006]
【実施例】本発明に使用する熱硬化性樹脂は、ポリブタ
ジエン樹脂、エポキシ樹脂、フェノール樹脂、メラミン
樹脂、ジアリルフタレート樹脂、ケイ素樹脂など、通常
使用されている樹脂であり特に限定しないが、ガラス転
移温度が145℃以下であると、積層板のガラス転移温
度も145℃以下にしやすいため、好ましくはガラス転
移温度が145℃以下のものを使用する。また、積層板
を難燃化するためにブロム化合物や三酸化アンチモン、
五酸化アンチモン、リン化合物などの難燃剤を使用して
もよい。本発明に使用する無機充填材は、電気絶縁性が
大きいものならなんでもよく、タルク、水酸化アルミニ
ウム、ガラス粉等を単体もしくは数種類混合して使用す
ることができる。本発明に使用するガラス織布及びガラ
ス不織布基材は、電気絶縁用に通常使用されているもの
ならばなんでもよいが、TガラスのようなSiO2とA
l2O3を多く含んだものは、硬度が大きいため打抜の際
の抵抗が大きくなる。好ましくはEガラスのようなCa
O等を含んだ硬度が小さいものの方が、より打抜加工性
が良くなる。本発明に係るコンポジット積層板は、表面
に金属箔が一体化されているものも含む。使用する金属
箔は、銅箔、ニッケル箔、アルミニウム箔などであるが
特に限定しない。Examples The thermosetting resin used in the present invention is a commonly used resin such as polybutadiene resin, epoxy resin, phenol resin, melamine resin, diallyl phthalate resin, silicon resin and the like, but is not particularly limited. When the temperature is 145 ° C. or lower, the glass transition temperature of the laminated plate is likely to be 145 ° C. or lower. Therefore, a glass transition temperature of 145 ° C. or lower is preferably used. In addition, bromine compounds and antimony trioxide to make the laminate flame-retardant,
A flame retardant such as antimony pentoxide or a phosphorus compound may be used. The inorganic filler used in the present invention may be any one having a large electric insulation property, and talc, aluminum hydroxide, glass powder and the like can be used alone or in combination of several kinds. The glass woven fabric and glass non-woven fabric substrate used in the present invention may be any of those commonly used for electrical insulation, such as SiO 2 and A such as T glass.
A material containing a large amount of l 2 O 3 has a large hardness, and therefore has a large resistance during punching. Ca, preferably E-glass
The one containing O or the like having a lower hardness has better punching workability. The composite laminated plate according to the present invention also includes one in which a metal foil is integrated on the surface. The metal foil used is a copper foil, a nickel foil, an aluminum foil or the like, but is not particularly limited.
【0007】実施例1 2官能エポキシ樹脂(油化シェル製「Ep−100
1」,エポキシ当量500eq/g)100gにジシア
ンジアミド3g、触媒として2−エチル4−メチルイミ
ダゾール0.2gを均一に溶かし、ワニスAを得た。ワ
ニスAをガラス織布(単位重量:215g/m2)に含
浸乾燥し、樹脂量が44重量%のプリプレグAを得た。
また、上記のワニスAに、樹脂100重量部に対し無機
充填材として水酸化アルミニウムとタルクの混合物(重
量比1:1)を70重量部加え、ワニスBを得た。ワニ
スBをガラス不織布(単位重量:100g/m2)に含
浸乾燥し、無機充填材を含む樹脂量が90重量%のプリ
プレグBを得た。プリプレグBを2枚重ね合わせて芯材
層とし、その両側にプリプレグAを各1枚置いて表面層
とし、最表面には銅箔(厚さ18μm)を載置して、温
度170℃、圧力40Kg/cm2で60分間加熱加圧成形
し板厚1.6mmの銅張り積層板を得た。作製した銅張り
積層板の打抜加工性を、芯材層の樹脂100重量部に対
する無機充填材の重量部及び積層板のガラス転移温度
(Tg)とともに表1に示す。積層板のTgはTMA法
で測定した。Example 1 Bifunctional epoxy resin ("Ep-100" manufactured by Yuka Shell Co., Ltd.
1 ", epoxy equivalent 500 eq / g) 100 g, dicyandiamide 3 g and 2-ethyl 4-methylimidazole 0.2 g as a catalyst were uniformly dissolved to obtain a varnish A. A woven glass cloth (unit weight: 215 g / m 2 ) was impregnated with the varnish A and dried to obtain a prepreg A having a resin amount of 44% by weight.
70 parts by weight of a mixture of aluminum hydroxide and talc (weight ratio of 1: 1) as an inorganic filler was added to 100 parts by weight of the resin, and a varnish B was obtained. The varnish B was impregnated into a glass nonwoven fabric (unit weight: 100 g / m 2 ) and dried to obtain a prepreg B containing 90% by weight of a resin containing an inorganic filler. Two prepregs B are stacked to form a core material layer, and one prepreg A is placed on each side of the core material layer to form a surface layer, and a copper foil (thickness 18 μm) is placed on the outermost surface at a temperature of 170 ° C. and pressure. It was heat-pressed and molded at 40 kg / cm 2 for 60 minutes to obtain a copper-clad laminate having a plate thickness of 1.6 mm. The punching workability of the produced copper-clad laminate is shown in Table 1 together with the parts by weight of the inorganic filler relative to 100 parts by weight of the resin of the core layer and the glass transition temperature (Tg) of the laminate. The Tg of the laminate was measured by the TMA method.
【0008】実施例2 実施例1において、ワニスBの無機充填材の配合量を樹
脂100重量部に対しし160重量部とした以外は同様
とした。Example 2 The same procedure as in Example 1 was carried out except that the amount of the inorganic filler in the varnish B was 160 parts by weight based on 100 parts by weight of the resin.
【0009】実施例3 2官能エポキシ樹脂(油化シェル製「Ep−100
1」,エポキシ当量500eq/g)60gと3官能エ
ポキシ樹脂(三井石油化学製「VG−3101」,エポ
キシ当量210eq/g)17gにジシアンジアミド3
g、触媒として2−エチル4−メチルイミダゾール0.
2gを均一に溶かし、ワニスA’を得た。ワニスA’を
ガラス織布(単位重量:215g/m2)に含浸乾燥
し、樹脂量が44重量%のプリプレグA’を得た。ま
た、上記ワニスA’に、樹脂100重量部に対し無機充
填材として水酸化アルミニウムとタルクの混合物(重量
比1:1)を120重量部加え、ワニスB’を得た。ワ
ニスB’をガラス不織布(単位重量:100g/m2)
に含浸乾燥し、無機充填材を含む樹脂量が90重量%の
プリプレグB’を得た。プリプレグB’を2枚重ね合わ
せて芯材層とし、その両側にプリプレグA’を各1枚置
いて表面層とし、最表面には銅箔(厚さ18μm)を載
置して、温度170℃、圧力40Kg/cm2で60分間加
熱加圧成形し板厚1.6mmの銅張り積層板を得た。作製
した銅張り積層板の打抜加工性を、芯材層の樹脂100
重量部に対する無機充填材の重量部及び積層板のガラス
転移温度(Tg)とともに表1に示す。Example 3 Bifunctional epoxy resin ("Ep-100" manufactured by Yuka Shell Co., Ltd.)
1 ", epoxy equivalent 500 eq / g) 60 g and trifunctional epoxy resin (Mitsui Petrochemical" VG-3101 ", epoxy equivalent 210 eq / g) 17 g dicyandiamide 3"
g, 2-ethyl 4-methylimidazole as a catalyst 0.
2g was melt | dissolved uniformly and the varnish A'was obtained. A woven glass cloth (unit weight: 215 g / m 2 ) was impregnated with the varnish A ′ and dried to obtain a prepreg A ′ having a resin amount of 44% by weight. Further, 120 parts by weight of a mixture of aluminum hydroxide and talc (weight ratio 1: 1) as an inorganic filler was added to 100 parts by weight of the resin in the above varnish A ′ to obtain a varnish B ′. Varnish B'is made of glass non-woven fabric (unit weight: 100 g / m 2 ).
Was impregnated and dried to obtain a prepreg B ′ containing 90% by weight of a resin containing an inorganic filler. Two prepregs B'are superposed on each other to form a core material layer, one prepreg A'is placed on each side of the core material layer to form a surface layer, and a copper foil (thickness 18 μm) is placed on the outermost surface at a temperature of 170 ° C The plate was heat-pressed at a pressure of 40 kg / cm 2 for 60 minutes to obtain a copper-clad laminate having a plate thickness of 1.6 mm. The punching workability of the produced copper-clad laminate was evaluated by the resin 100 of the core material layer.
It is shown in Table 1 together with the weight part of the inorganic filler with respect to the weight part and the glass transition temperature (Tg) of the laminate.
【0010】比較例1 実施例1において、ワニスBの無機充填材の配合量を樹
脂100重量部に対しし65重量部とした以外は同様と
した。Comparative Example 1 The procedure of Example 1 was repeated except that the amount of the inorganic filler in the varnish B was 65 parts by weight based on 100 parts by weight of the resin.
【0011】比較例2 実施例1において、ワニスBの無機充填材の配合量を樹
脂100重量部に対しし165重量部とした以外は同様
とした。Comparative Example 2 The procedure of Example 1 was repeated except that the amount of the inorganic filler in the varnish B was 165 parts by weight based on 100 parts by weight of the resin.
【0012】比較例3 2官能エポキシ樹脂(油化シェル製「Ep−100
1」,エポキシ当量500eq/g)50gと3官能エ
ポキシ樹脂(三井石油化学製「VG−3101」,エポ
キシ当量210eq/g)21gにジシアンジアミド3
g、触媒として2−エチル4−メチルイミダゾール0.
2gを均一に溶かし、ワニスA''を得た。ワニスA''を
ガラス織布(単位重量:215g/m2)に含浸乾燥
し、樹脂量が44重量%のプリプレグA''を得た。ま
た、上記ワニスA''に、樹脂100重量部に対し無機充
填材として水酸化アルミニウムとタルクの混合物(重量
比1:1)を120重量部加え、ワニスB''を得た。ワ
ニスB''をガラス不織布(単位重量:100g/m2)
に含浸乾燥し、無機充填材を含む樹脂量が90重量%の
プリプレグB''を得た。プリプレグB''を2枚重ね合わ
せて芯材層とし、その両側にプリプレグA''を各1枚置
いて表面層とし、最表面には銅箔(厚さ18μm)を載
置して、温度170℃、圧力40Kg/cm2で60分間加
熱加圧成形し板厚1.6mmの銅張り積層板を得た。作製
した銅張り積層板の打抜加工性を、芯材層の樹脂100
重量部に対する無機充填材の重量部及び積層板のガラス
転移温度(Tg)とともに表1に示す。Comparative Example 3 Bifunctional epoxy resin ("Ep-100" manufactured by Yuka Shell Co., Ltd.
1 ", epoxy equivalent 500 eq / g) 50 g and trifunctional epoxy resin (Mitsui Petrochemical" VG-3101 ", epoxy equivalent 210 eq / g) 21 g dicyandiamide 3"
g, 2-ethyl 4-methylimidazole as a catalyst 0.
2g was melt | dissolved uniformly and the varnish A '' was obtained. A woven glass cloth (unit weight: 215 g / m 2 ) was impregnated with the varnish A ″ and dried to obtain a prepreg A ″ having a resin amount of 44% by weight. Further, 120 parts by weight of a mixture of aluminum hydroxide and talc (weight ratio 1: 1) as an inorganic filler was added to 100 parts by weight of the resin in the above varnish A ″ to obtain a varnish B ″. Varnish B '' made of glass non-woven fabric (Unit weight: 100 g / m 2 )
Was impregnated and dried to obtain a prepreg B ″ containing 90% by weight of a resin containing an inorganic filler. Two pieces of prepreg B '' are laminated to form a core layer, and one piece of prepreg A '' is placed on each side of the core layer to form a surface layer. A copper foil (18 μm thick) is placed on the outermost surface and the temperature is set. It was heated and pressed at 170 ° C. for 60 minutes at a pressure of 40 kg / cm 2 to obtain a copper-clad laminate having a plate thickness of 1.6 mm. The punching workability of the produced copper-clad laminate was evaluated by the resin 100 of the core material layer.
It is shown in Table 1 together with the weight part of the inorganic filler with respect to the weight part and the glass transition temperature (Tg) of the laminate.
【0013】[0013]
【表1】 [Table 1]
【0014】[0014]
【発明の効果】上述のように、本発明に係るコンポジッ
ト積層板は、芯材層の樹脂中の無機充填材の配合量を特
定の範囲とし、かつ積層板としてのガラス転移温度を特
定温度以下とすることにより、打抜加工性を優れたもの
にすることができる。As described above, in the composite laminate according to the present invention, the compounding amount of the inorganic filler in the resin of the core material layer is within a specific range, and the glass transition temperature of the laminate is below a specific temperature. By this, the punching workability can be made excellent.
Claims (1)
材層とし、熱硬化性樹脂を含浸したガラス織布を表面層
とし、これらが一体化されているコンポジット積層板に
おいて、 芯材層には熱硬化性樹脂中に当該樹脂100重量部に対
し無機充填材が70〜160重量部配合されており、 積層板としてのガラス転移温度が145℃以下であるこ
とを特徴とするコンポジット積層板。1. A composite laminated plate in which a glass nonwoven fabric impregnated with a thermosetting resin is used as a core material layer, and a glass woven fabric impregnated with a thermosetting resin is used as a surface layer, and a core material layer is provided. 70 to 160 parts by weight of an inorganic filler is mixed with 100 parts by weight of the resin in a thermosetting resin, and the glass transition temperature of the laminated plate is 145 ° C. or lower. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6321105A JPH08174760A (en) | 1994-12-26 | 1994-12-26 | Composite laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6321105A JPH08174760A (en) | 1994-12-26 | 1994-12-26 | Composite laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08174760A true JPH08174760A (en) | 1996-07-09 |
Family
ID=18128882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6321105A Pending JPH08174760A (en) | 1994-12-26 | 1994-12-26 | Composite laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08174760A (en) |
-
1994
- 1994-12-26 JP JP6321105A patent/JPH08174760A/en active Pending
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